Table of Contents
- 1. Product Overview
- 2. Technical Specifications Deep Dive
- 2.1 Electro-Optical Characteristics
- 2.2 Electrical Parameters
- 2.3 Thermal and Absolute Maximum Ratings
- 3. Binning System Explanation
- 3.1 Luminous Intensity Binning
- 3.2 Dominant Wavelength Binning
- 3.3 Forward Voltage Binning
- 4. Performance Curve Analysis
- 5. Mechanical and Package Information
- 6. Soldering and Assembly Guidelines
- 6.1 Reflow Soldering Parameters
- 6.2 Storage and Moisture Sensitivity
- 6.3 Hand Soldering and Rework
- 7. Packaging and Ordering Information
- 8. Application Recommendations
- 8.1 Typical Application Scenarios
- 8.2 Critical Design Considerations
- 9. Compliance and Environmental Standards
- 10. Application Restrictions and Reliability Note
- 11. Technical Principle Introduction
- 12. Common Questions Based on Technical Parameters
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
The 19-217/S2C-AL1M2VY/3T is a surface-mount device (SMD) LED designed for modern electronic applications requiring reliable, compact, and efficient indicator lighting. This component utilizes AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor technology to produce a brilliant orange light output. Its primary design goals are miniaturization, compatibility with automated assembly processes, and adherence to stringent environmental and safety standards.
The core advantages of this LED stem from its SMD package. It is significantly smaller than traditional lead-frame type LEDs, enabling higher component packing density on printed circuit boards (PCBs). This leads to reduced overall board size, minimized storage space requirements, and ultimately contributes to the development of smaller and lighter end-user equipment. The lightweight nature of the package makes it particularly suitable for miniature and portable applications where space and weight are critical constraints.
The target market for this product is broad, encompassing general electronics, consumer devices, and industrial equipment. It is engineered to meet the needs of designers looking for a dependable, RoHS-compliant, and halogen-free orange indicator solution that can be integrated using standard surface-mount technology (SMT) lines.
2. Technical Specifications Deep Dive
2.1 Electro-Optical Characteristics
The electro-optical performance is specified at a standard test condition of an ambient temperature (Ta) of 25°C and a forward current (IF) of 5mA. The key parameters define the light output and color quality.
- Luminous Intensity (Iv): The radiant power adjusted for the sensitivity of the human eye. The typical value is not specified as a single number; instead, the product is sorted into bins (L1, L2, M1, M2) with minimum values ranging from 11.5 mcd to 22.5 mcd. The maximum for the highest bin (M2) is 28.5 mcd. A tolerance of ±11% applies to the luminous intensity.
- Viewing Angle (2θ1/2): This is the angle at which the luminous intensity is half of the intensity at 0 degrees (on-axis). This LED features a very wide viewing angle of 120 degrees, making it suitable for applications where the light needs to be visible from a broad range of perspectives.
- Peak Wavelength (λp): The wavelength at which the spectral emission is maximum. The typical value is 611 nanometers (nm), placing it firmly in the orange region of the visible spectrum.
- Dominant Wavelength (λd): This is the single wavelength that the human eye perceives as the color of the light. It ranges from 600.5 nm to 612.5 nm, with a tight tolerance of ±1 nm. The dominant wavelength is also sorted into bins (D8 to D11).
- Spectral Bandwidth (Δλ): The width of the emitted spectrum at half its maximum power. The typical value is 17 nm, indicating a relatively pure color emission characteristic of AlGaInP technology.
2.2 Electrical Parameters
The electrical characteristics define the operating limits and conditions for reliable performance.
- Forward Voltage (VF): The voltage drop across the LED when operating at the specified current. At IF=5mA, it ranges from a minimum of 1.70V to a maximum of 2.20V, with a tolerance of ±0.05V. This low forward voltage is advantageous for low-power and battery-operated devices. The voltage is also binned (codes 19 to 23).
- Reverse Voltage (VR): The maximum voltage that can be applied in the reverse direction without damaging the device. The absolute maximum rating is 5V.
- Reverse Current (IR): The leakage current when the maximum reverse voltage (5V) is applied. It has a maximum value of 10 µA.
- Forward Current (IF): The recommended continuous operating current is 25 mA.
- Peak Forward Current (IFP): For pulsed operation (duty cycle 1/10 at 1 kHz), the LED can handle a peak current of up to 60 mA.
2.3 Thermal and Absolute Maximum Ratings
These ratings define the environmental and stress limits beyond which permanent damage may occur.
- Power Dissipation (Pd): The maximum allowable power dissipation is 60 mW.
- Operating Temperature (Topr): The ambient temperature range for reliable operation is from -40°C to +85°C.
- Storage Temperature (Tstg): The temperature range for non-operational storage is from -40°C to +90°C.
- Electrostatic Discharge (ESD): The device can withstand 2000V using the Human Body Model (HBM), which is a standard level of protection for handling in an ESD-controlled environment.
- Soldering Temperature: The package is compatible with both reflow and hand soldering.
- Reflow Soldering: Maximum peak temperature of 260°C for up to 10 seconds.
- Hand Soldering: Iron tip temperature up to 350°C for a maximum of 3 seconds per terminal.
3. Binning System Explanation
To ensure color and brightness consistency in production, LEDs are sorted into bins based on key parameters. This allows designers to select parts that meet specific application requirements.
3.1 Luminous Intensity Binning
LEDs are categorized into four bins (L1, L2, M1, M2) based on their measured luminous intensity at 5mA. This allows selection for applications requiring different brightness levels while maintaining predictable performance.
3.2 Dominant Wavelength Binning
The color (hue) is tightly controlled through four wavelength bins (D8, D9, D10, D11), each covering a 3nm range from 600.5nm to 612.5nm. This ensures visual color consistency across multiple units in an assembly.
3.3 Forward Voltage Binning
Forward voltage is sorted into five bins (19 to 23), each spanning a 0.1V range from 1.70V to 2.20V. This is particularly useful for designers who need to manage power supply design and current-limiting resistor calculations precisely, especially in large arrays where voltage drop can be a concern.
4. Performance Curve Analysis
While specific graphical curves are referenced in the datasheet, their implications can be described based on standard LED behavior and the provided parameters.
The Current vs. Voltage (I-V) curve would show the exponential relationship typical of a diode. The specified forward voltage range (1.7-2.2V at 5mA) indicates the "knee" of this curve. Operating significantly above 5mA would require a higher forward voltage, moving up the exponential slope. This underscores the importance of using a current-limiting resistor or constant-current driver, as a small increase in voltage can cause a large, potentially destructive increase in current.
The Luminous Intensity vs. Forward Current (L-I) curve is generally linear over a range. Operating at the maximum continuous current (25mA) would produce significantly higher light output than at the test current of 5mA, but it would also increase power dissipation and junction temperature, which must be managed through proper PCB thermal design.
The Temperature Dependence characteristics are critical. For AlGaInP LEDs, luminous intensity typically decreases as the junction temperature increases. While the exact derating curve is not provided, the wide operating temperature range (-40°C to +85°C) confirms the device's robustness. Designers must account for intensity drop in high-temperature environments. The forward voltage also has a negative temperature coefficient, meaning it decreases slightly as temperature rises.
The Spectral Distribution curve would show a single, relatively narrow peak centered around 611 nm (typical), with the 17 nm bandwidth defining its width. This confirms the monochromatic nature of the output, suitable for applications requiring a specific, saturated orange color.
5. Mechanical and Package Information
The 19-217 LED comes in a standard SMD package. The exact dimensions are provided in a detailed drawing within the datasheet, with standard tolerances of ±0.1mm unless otherwise noted. Key mechanical features include:
- Package Outline: The drawing specifies the length, width, and height of the LED body, as well as the dimensions and spacing of the solderable terminals (pads).
- Pad Design: The footprint on the PCB must match the recommended pad layout to ensure proper soldering, mechanical stability, and potentially some heat dissipation.
- Polarity Identification: The datasheet drawing clearly indicates the anode and cathode terminals. Correct polarity is essential for device operation. Typically, one pad may be marked or shaped differently (e.g., a notch or a beveled corner on the LED package itself) to indicate the cathode.
- Material: The lens (resin) color is specified as "Water Clear," meaning the orange light is emitted through a transparent encapsulant, which contributes to the wide 120-degree viewing angle.
6. Soldering and Assembly Guidelines
Proper handling and soldering are crucial for reliability. The LED is supplied in moisture-resistant packaging (tape on reel) compatible with automatic pick-and-place equipment.
6.1 Reflow Soldering Parameters
A lead-free (Pb-free) reflow soldering profile is recommended. The profile includes:
- Pre-heating: Ramp from ambient to 150-200°C over 60-120 seconds.
- Soak/Reflow: Time above liquidus (217°C) should be 60-150 seconds. The peak temperature must not exceed 260°C, and the time at or above 255°C must be limited to a maximum of 30 seconds.
- Cooling: The maximum cooling rate should be 6°C per second.
Critical Note: Reflow soldering should not be performed more than two times on the same LED assembly to avoid thermal stress damage.
6.2 Storage and Moisture Sensitivity
The components are packaged in a moisture-barrier bag with desiccant.
- Before Opening: Store at ≤30°C and ≤90% Relative Humidity (RH).
- After Opening: The "floor life" (time components can be exposed to ambient factory air) is 1 year at ≤30°C and ≤60% RH. Unused parts should be resealed in moisture-proof packaging.
- Baking: If the desiccant indicates saturation or the storage time is exceeded, a bake at 60±5°C for 24 hours is required before reflow to prevent "popcorn" cracking during soldering.
6.3 Hand Soldering and Rework
If hand soldering is necessary:
- Use a soldering iron with a tip temperature ≤350°C.
- Limit contact time to ≤3 seconds per terminal.
- Use an iron with a power rating ≤25W.
- Allow a minimum 2-second interval between soldering each terminal.
Rework is strongly discouraged. If absolutely unavoidable, a specialized double-head soldering iron must be used to simultaneously heat both terminals and lift the component without applying mechanical stress. The impact on LED characteristics must be verified after any rework.
7. Packaging and Ordering Information
The standard shipping package is an 8mm wide carrier tape wound on a 7-inch diameter reel. Each reel contains 3000 pieces.
The reel and carrier tape have specific dimensions provided in the datasheet drawings to ensure compatibility with automated assembly equipment.
The packaging label contains critical information for traceability and correct application:
- CPN: Customer's Product Number (if assigned).
- P/N: The manufacturer's part number (19-217/S2C-AL1M2VY/3T).
- QTY: Packing quantity (3000 pcs/reel).
- CAT: Luminous Intensity bin code (e.g., L1, M2).
- HUE: Dominant Wavelength bin code (e.g., D9, D11).
- REF: Forward Voltage bin code (e.g., 20, 22).
- LOT No: Manufacturing lot number for traceability.
8. Application Recommendations
8.1 Typical Application Scenarios
- Backlighting: Ideal for backlighting dashboard icons, membrane switches, and control panels where a wide viewing angle is beneficial.
- Telecommunication Equipment: Serves as status indicators, message waiting lights, or keypad backlights in telephones, fax machines, and networking hardware.
- LCD Panel Backlighting: Can be used for flat, edge-lit backlighting in small monochrome LCD displays or for illuminating specific symbols.
- General Indicator Use: Power-on indicators, mode selectors, alarm signals, and status lights in a vast array of consumer and industrial electronic products.
8.2 Critical Design Considerations
- Current Limiting is Mandatory: An external current-limiting resistor must always be used in series with the LED. The forward voltage has tolerance and a negative temperature coefficient. A slight increase in supply voltage or a decrease in VF due to heating can cause a large, destructive current surge if not properly limited. The resistor value (R) is calculated as R = (V_supply - VF_LED) / I_desired.
- Thermal Management: While the package is small, the 60mW maximum power dissipation must be respected. Operating at high currents (e.g., 25mA) generates heat. The PCB layout should provide adequate copper area around the LED pads to act as a heat sink, especially in high ambient temperature environments or when multiple LEDs are clustered.
- ESD Precautions: Although rated for 2000V HBM, standard ESD handling procedures should be followed during assembly and handling to prevent latent damage.
- Optical Design: The 120-degree viewing angle provides a very wide, diffuse emission pattern. For applications requiring a more focused beam, an external lens or light guide may be necessary.
- Waveform for Pulsed Operation: If using the peak forward current (60mA) in pulsed mode, ensure the duty cycle does not exceed 10% and the frequency is 1kHz as specified. The average current must still be within the 25mA continuous rating.
9. Compliance and Environmental Standards
This product is designed to meet key global environmental and safety regulations, which is a significant advantage for market access.
- RoHS Compliant: The product is free of restricted hazardous substances as per the EU Restriction of Hazardous Substances directive.
- Pb-Free: The soldering finishes and materials do not contain lead.
- EU REACH Compliance: Adheres to the Registration, Evaluation, Authorisation and Restriction of Chemicals regulation.
- Halogen-Free: Meets strict limits on bromine (Br) and chlorine (Cl) content: Br < 900 ppm, Cl < 900 ppm, and Br+Cl < 1500 ppm. This is important for reducing toxic emissions in case of fire.
10. Application Restrictions and Reliability Note
It is explicitly stated that this product, as specified in this datasheet, is not intended for high-reliability or safety-critical applications without prior consultation. This includes:
- Military and aerospace systems.
- Automotive safety or security systems (e.g., airbag controls, brake lights).
- Medical life-support or critical diagnostic equipment.
For such applications, different product grades with more extensive testing, wider temperature ranges, and longer lifetime guarantees may be required. The specification guarantees the quality and performance of the LED as an individual component under the defined test conditions. Using the product outside these specified limits voids this guarantee.
11. Technical Principle Introduction
The 19-217 LED is based on AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor material grown on a substrate. When a forward voltage is applied, electrons and holes are injected into the active region of the semiconductor junction. Their recombination releases energy in the form of photons (light). The specific composition of the AlGaInP alloy determines the bandgap energy, which directly corresponds to the wavelength (color) of the emitted light. In this case, the composition is tuned to produce photons in the orange spectrum (~611 nm). The "water clear" epoxy resin encapsulant protects the semiconductor die, acts as a lens to shape the light output (achieving the 120-degree pattern), and provides mechanical and environmental protection. The surface-mount package features two metal terminals (anode and cathode) that are soldered directly to the PCB, eliminating the need for through-holes and wires.
12. Common Questions Based on Technical Parameters
- Q: What resistor do I need for a 5V supply? A: Using the worst-case maximum VF of 2.2V and a desired current of 5mA: R = (5V - 2.2V) / 0.005A = 560 Ohms. Using a standard 560Ω resistor, the actual current would range from ~5mA (if VF=2.2V) to ~5.9mA (if VF=1.7V). A 470Ω resistor is also common, providing slightly higher brightness but ensuring current stays below 25mA even with minimum VF.
- Q: Can I drive it directly from a microcontroller pin? A: Possibly, but with caution. A typical MCU pin can source/sink 20-25mA, which is at the absolute maximum limit of the LED. This leaves no margin and stresses both the MCU and LED. It is always better to use the MCU pin to drive a transistor (e.g., a MOSFET) which then controls the LED current.
- Q: Why is the viewing angle so wide? A: The "water clear" dome-shaped encapsulant acts as a lens that refracts light from the small semiconductor chip over a very broad area. This is ideal for indicator applications where the LED needs to be seen from many angles.
- Q: What does the bin code "S2C-AL1M2VY/3T" mean? A: This is the manufacturer's internal product code. It likely encodes specific attributes like package type (SMD), chip technology (AlGaInP), color (Orange/Yellow), brightness bin, and other manufacturing variants. The exact decoding is proprietary, but the key performance parameters are fully defined in the datasheet tables.
- Q: How long will the LED last? A: While a specific L70/L50 lifetime (hours to 70% or 50% of initial brightness) is not provided in this datasheet, AlGaInP LEDs are known for very long operational lifetimes (often tens of thousands of hours) when operated within their specified electrical and thermal limits. The primary lifetime degradation mechanism is a gradual decrease in luminous output due to defects in the semiconductor material and packaging under high temperature and current stress.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |