SMD LED Orange AlInGaP 120° Viewing Angle - Electrical & Optical Characteristics Datasheet - English Technical Document

1. Product Overview

This document provides the complete technical specifications for a surface-mount device (SMD) Light Emitting Diode (LED) utilizing an Aluminum Indium Gallium Phosphide (AlInGaP) semiconductor material to produce an orange light output. The device is designed in a compact, industry-standard package suitable for automated printed circuit board (PCB) assembly processes, including infrared reflow soldering. Its primary function is to serve as a highly reliable and efficient indicator or light source in space-constrained electronic applications.

1.1 Core Advantages and Target Market

The LED offers several key advantages for modern electronics manufacturing. Its miniature size allows for high-density PCB layouts, maximizing board space utilization. Compatibility with automated pick-and-place equipment and standard infrared reflow profiles streamlines the assembly process, reducing production time and cost. The device is also compliant with relevant environmental regulations. These features make it ideally suited for a broad range of applications including, but not limited to, status indicators and backlighting in telecommunications equipment, office automation devices, home appliances, industrial control panels, and various consumer electronics where clear visual signaling is required.

2. Technical Parameters: In-Depth Objective Interpretation

This section details the critical performance boundaries and operational characteristics of the LED, providing the essential data for circuit design and reliability assessment.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation under or at these limits is not guaranteed. Key parameters include: a maximum continuous forward current (I_F) of 30 mA, a peak forward current of 80 mA (under pulsed conditions with a 1/10 duty cycle and 0.1 ms pulse width), a maximum reverse voltage (V_R) of 5 V, and a maximum power dissipation of 72 mW. The device is rated for operation within an ambient temperature (T_a) range of -40°C to +85°C and can be stored in temperatures from -40°C to +100°C.

2.2 Electrical and Optical Characteristics

These are the typical performance parameters measured under standard test conditions (T_a=25°C, I_F=20mA). The optical output is characterized by a luminous flux (Φ_v) ranging from 0.42 to 1.35 lumens (lm), which corresponds to a luminous intensity (I_v) between 140 and 450 millicandelas (mcd). The light distribution is very wide, with a typical viewing angle (2θ_1/2) of 120 degrees. Electrically, the forward voltage (V_F) typically falls between 1.8 and 2.4 volts. The color is defined by a dominant wavelength (λ_d) in the range of 600 to 612 nanometers (nm), placing it firmly in the orange spectrum, with a typical spectral half-width (Δλ) of approximately 17 nm. The reverse current (I_R) is typically very low, with a maximum of 10 μA at the full 5 V reverse bias.

3. Binning System Explanation

To ensure consistency in production and application, LEDs are sorted into performance bins. This allows designers to select parts that meet specific requirements for voltage, brightness, and color.

3.1 Forward Voltage (V_F) Binning

The LEDs are categorized into three voltage bins (D2, D3, D4) based on their forward voltage drop at 20 mA. For example, bin D2 includes LEDs with V_F between 1.8V and 2.0V, while bin D4 includes those from 2.2V to 2.4V. Each bin has a tolerance of ±0.1V. Selecting a specific bin can help in designing more predictable power supply circuits, especially in battery-operated devices.

3.2 Luminous Flux/Intensity Binning

The optical output is binned into five categories (C2, D1, D2, E1, E2), each defining a minimum and maximum luminous flux and its corresponding luminous intensity reference. For instance, bin C2 covers a flux range of 0.42 to 0.54 lm (140-180 mcd), while bin E2 covers 1.07 to 1.35 lm (355-450 mcd). The tolerance on each intensity bin is ±11%. This binning is crucial for applications requiring uniform brightness across multiple indicators.

3.3 Hue (Dominant Wavelength) Binning

The color hue is controlled by binning the dominant wavelength into four groups: P (600.0-603.0 nm), Q (603.0-606.0 nm), R (606.0-609.0 nm), and S (609.0-612.0 nm). The tolerance for each bin is ±1 nm. This precise control ensures color consistency, which is vital for applications where color coding or specific aesthetic requirements are important.

4. Performance Curve Analysis

Graphical representations of device characteristics provide deeper insight into performance under varying conditions, beyond the single-point data in the tables.

4.1 Current vs. Voltage (I-V) and Optical Output

The typical I-V curve illustrates the non-linear relationship between forward current and forward voltage. Initially, very little current flows until the forward voltage reaches the diode's turn-on threshold (around 1.8V for this device). Beyond this point, current increases exponentially with a small increase in voltage. This curve is essential for designing the current-limiting circuitry. Accompanying curves typically show how luminous intensity or flux increases with forward current, demonstrating the device's efficiency across its operating range.

4.2 Temperature Dependence

LED performance is significantly affected by temperature. Typical curves show the relationship between forward voltage and junction temperature, where V_F decreases linearly with increasing temperature (a negative temperature coefficient). More critically, curves depicting luminous intensity versus ambient temperature show a decrease in light output as temperature rises. Understanding this derating is fundamental for applications operating in high-temperature environments to ensure sufficient brightness is maintained.

4.3 Spectral Distribution

The spectral power distribution curve plots relative light intensity against wavelength. For this AlInGaP orange LED, the curve will show a distinct peak at the peak emission wavelength (λ_P, typically 611 nm) and a relatively narrow bandwidth, defined by the 17 nm half-width. This curve confirms the color purity and is used to calculate the dominant wavelength and color coordinates.

5. Mechanical and Package Information

5.1 Package Dimensions and Polarity Identification

The LED is housed in a standard SMD package. The dimensional drawing provides all critical measurements including length, width, height, and the placement of the solder pads. The cathode (negative terminal) is typically identified by a visual marker on the package, such as a notch, a dot, or a green marking, which must be correctly aligned with the corresponding marking on the PCB footprint to ensure proper operation.

5.2 Recommended PCB Attachment Pad Design

A land pattern diagram is provided to guide PCB layout. This pattern shows the recommended size, shape, and spacing of the copper pads on the PCB. Adhering to this design ensures reliable solder joint formation during reflow, proper mechanical stability, and optimal heat dissipation from the LED die through the pads into the PCB.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Parameters

The device is compatible with lead-free infrared (IR) reflow soldering processes. A detailed temperature profile is recommended, compliant with standards like J-STD-020. Key parameters include a preheat stage (typically 150-200°C for up to 120 seconds), a controlled ramp to a peak temperature not exceeding 260°C, and a time above liquidus (TAL) sufficient for proper solder joint formation. The total time at peak temperature should be limited, and reflow should ideally be performed only once to minimize thermal stress on the component.

6.2 Cleaning and Storage Conditions

If cleaning after soldering is necessary, only specified alcohol-based solvents like isopropyl alcohol (IPA) or ethyl alcohol should be used. Unspecified chemicals may damage the LED package. For storage, unopened moisture-sensitive bags should be kept at ≤30°C and ≤70% Relative Humidity (RH). Once the bag is opened, components should be stored at ≤30°C and ≤60% RH and are recommended to be processed within 168 hours (JEDEC Level 3). Components stored beyond this period may require a baking procedure (e.g., 60°C for 48 hours) before soldering to remove absorbed moisture and prevent \"popcorning\" during reflow.

7. Packaging and Ordering Information

The LEDs are supplied in a tape-and-reel format compatible with automated assembly equipment. The tape is 12 mm wide and wound onto a standard 7-inch (178 mm) diameter reel. Each reel contains 3000 pieces. The packaging conforms to ANSI/EIA-481 specifications, ensuring reliable feeding in placement machines. The tape has a cover to protect the components, and specific rules govern the maximum number of consecutive missing components in the reel.

8. Application Suggestions

8.1 Typical Application Scenarios

This LED is well-suited for status indication (power on/off, mode selection, network activity), backlighting for front panels or membrane switches, and symbolic illumination in low-to-moderate ambient light conditions. Its wide viewing angle makes it effective for indicators that need to be seen from various angles.

8.2 Design Considerations

When integrating this LED, designers must include a current-limiting resistor in series with the LED to prevent exceeding the maximum forward current. The resistor value is calculated using Ohm's Law: R = (V_supply - V_F) / I_F. Using the maximum V_F from the datasheet ensures the current does not exceed the desired value even with part-to-part variation. For applications requiring consistent brightness, consider driving the LED with a constant current source rather than a constant voltage. Thermal management should also be considered if the LED is to be operated at high currents or in high ambient temperatures, as excessive heat reduces light output and lifespan.

9. Technical Comparison and Differentiation

Compared to older technologies like Gallium Phosphide (GaP) red/orange LEDs, this AlInGaP device offers significantly higher luminous efficiency, resulting in brighter output at the same drive current. Its wide 120-degree viewing angle is a key differentiator from narrower-angle LEDs, making it preferable for applications where the viewing position is not fixed directly in front of the device. The standardized SMD package and compatibility with reflow soldering offer advantages over through-hole LEDs in terms of assembly speed, cost, and board space savings.

10. Frequently Asked Questions Based on Technical Parameters

Q: What resistor do I need for a 5V supply and 20mA current?

A: Using the maximum V_F of 2.4V for safety: R = (5V - 2.4V) / 0.020A = 130 Ohms. A standard 130Ω or 150Ω resistor would be suitable.

Q: Can I drive this LED with 3.3V?

A: Yes. The forward voltage (1.8-2.4V) is below 3.3V. A current-limiting resistor is still required: R ≈ (3.3V - 2.2V_typ) / 0.020A ≈ 55 Ohms.

Q: Why is the luminous intensity given as a range with bins?

A> Due to inherent variations in semiconductor manufacturing, the light output varies. Binning sorts LEDs into consistent groups, allowing designers to choose a brightness level suitable for their application and ensure uniformity if using multiple LEDs.

Q: Is a heat sink required?

A> For operation at the maximum continuous current (30mA) and within the specified temperature range, a dedicated heat sink is typically not required for a single LED. However, thermal design becomes important for arrays of LEDs or operation in high ambient temperatures.

11. Practical Design and Usage Case

Case: Designing a Multi-Indicator Status Panel

A designer is creating a control panel with four orange status LEDs. To ensure uniform appearance, they specify LEDs from the same luminous flux bin (e.g., E1) and the same hue bin (e.g., R). They design the PCB using the recommended land pattern. The circuit uses a 5V rail. To drive each LED at approximately 20mA, they calculate the resistor value using the maximum V_F from the selected voltage bin (e.g., D3: 2.2V max). R = (5V - 2.2V) / 0.020A = 140Ω. They use 140Ω, 1% tolerance resistors for precision. During assembly, they follow the provided reflow profile. This approach results in a panel with four indicators that are consistently bright and identical in color.

12. Principle Introduction

This LED is based on an Aluminum Indium Gallium Phosphide (AlInGaP) semiconductor. When a forward voltage is applied across the p-n junction, electrons and holes are injected into the active region. When these charge carriers recombine, they release energy in the form of photons (light). The specific composition of the AlInGaP alloy determines the bandgap energy of the semiconductor, which directly dictates the wavelength (color) of the emitted light—in this case, orange. The epoxy lens encapsulating the semiconductor die is water-clear, allowing the intrinsic color of the light to be seen, and is shaped to achieve the specified 120-degree viewing angle.

13. Development Trends

The general trend in indicator LEDs like this one continues towards higher efficiency (more lumens per watt), enabling brighter output at lower currents for improved energy efficiency. There is also a drive for even smaller package sizes to enable further miniaturization of electronics. While not the primary focus for such devices, color rendering and saturation can be refined. Manufacturing processes are continuously optimized for higher yield and tighter performance distributions, reducing the spread within bins and potentially increasing the number of bin grades available for finer application-specific selection. The underlying push for compliance with evolving environmental and safety standards remains constant.