Table of Contents
- 1. Product Overview
- 1.1 General Description
- 1.2 Features
- 1.3 Applications
- 2. Technical Parameter Analysis
- 2.1 Electrical/Optical Characteristics (Ts=25°C, IF=3mA)
- 2.2 Absolute Maximum Ratings (Ts=25°C)
- 2.3 Binning System (IF=3mA)
- 3. Performance Curve Analysis
- 4. Mechanical & Packaging Information
- 4.1 Package Dimensions
- 4.2 Carrier Tape & Reel
- 4.3 Moisture Barrier Packaging
- 5. Soldering & Assembly Guidelines
- 5.1 Reflow Soldering Profile
- 5.2 Hand Soldering & Repair
- 5.3 Handling Cautions
- 6. Packaging & Ordering Information
- 7. Application Recommendations
- 8. Technical Comparison
- 9. Frequently Asked Questions
- 10. Practical Application Cases
- 11. Working Principle
- 12. Development Trends
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
1.1 General Description
This white LED is fabricated using a blue chip and phosphor to produce white light. The package dimensions are 3.50mm x 2.80mm x 1.84mm (PLCC2 package). It is designed for surface mount technology (SMT) assembly and is suitable for various soldering processes.
1.2 Features
- PLCC2 package
- Extremely wide viewing angle (120°)
- Suitable for all SMT assembly and solder processes
- Available on tape and reel (2000pcs/reel)
- Moisture Sensitivity Level: Level 2
- Compliant with RoHS and REACH
- Qualified according to AEC-Q101 stress test guidelines for automotive grade discrete semiconductors
1.3 Applications
Typical applications include automotive interior lighting and switches due to its high reliability and wide viewing angle.
2. Technical Parameter Analysis
2.1 Electrical/Optical Characteristics (Ts=25°C, IF=3mA)
| Parameter | Symbol | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Forward Voltage | VF | 2.5 | 2.7 | 3.1 | V |
| Reverse Current | IR | - | - | 10 | µA |
| Luminous Intensity | IV | 23 | 37 | 53 | mcd |
| Viewing Angle | 2θ1/2 | - | 120 | - | deg |
| Thermal Resistance | RTHJ-S | - | - | 300 | °C/W |
2.2 Absolute Maximum Ratings (Ts=25°C)
| Parameter | Symbol | Value | Unit |
|---|---|---|---|
| Power Dissipation | PD | 91 | mW |
| Forward Current | IF | 30 | mA |
| Peak Forward Current | IFP | 100 | mA |
| Reverse Voltage | VR | 5 | V |
| Electrostatic Discharge (HBM) | ESD | 2000 | V |
| Operating Temperature | TOPR | -40 ~ +100 | °C |
| Storage Temperature | TOPR | -40 ~ +100 | °C |
| Junction Temperature | TJ | 120 | °C |
Notes: Pulse width 10ms, duty cycle 1/10 for peak current. Measurement tolerance: VF ±0.1V, chromaticity ±0.005, luminous intensity ±10%. ESD yield >90% at 2000V HBM.
2.3 Binning System (IF=3mA)
Forward voltage bins range from E2 (2.5-2.6V) to H1 (3.0-3.1V). Luminous intensity bins range from C20 (23-28mcd) to E10 (43-53mcd). CIE chromaticity bins available: M02, M03, P02, P03. See datasheet for exact coordinates.
3. Performance Curve Analysis
The typical optical characteristics curves provide insight into the LED behavior under various conditions:
- Forward Voltage vs. Forward Current: Shows exponential relationship, typical at 2.7V for 3mA.
- Forward Current vs. Relative Intensity: Linear increase up to 5mA, then saturation.
- Solder Temperature vs. Relative Intensity: Slight decrease at higher temperatures (about 20% drop from 25°C to 120°C).
- Forward Current vs. Solder Temperature: Derating needed above 80°C.
- Forward Voltage vs. Solder Temperature: Negative temperature coefficient (~-2mV/°C).
- Radiation Diagram: Wide viewing angle with symmetrical pattern.
- Color Shift vs. Forward Current: Minimal change in chromaticity coordinates.
- Spectrum Distribution: Broad peak around 450nm (blue) and 550nm (yellow) typical for phosphor-converted white LED.
4. Mechanical & Packaging Information
4.1 Package Dimensions
Top view: 3.50mm x 2.80mm. Side view height: 1.84mm. Bottom view shows polarity mark. Recommended soldering pattern: 2.40mm x 1.25mm pads with 4.45mm overall length. All dimensions in mm, tolerance ±0.2mm unless noted.
4.2 Carrier Tape & Reel
Carrier tape pitch 8.0mm, reel diameter 178mm, hub diameter 60mm. Tape width 8.0mm. Reel contains 2000pcs per reel. Label includes part number, spec number, lot number, bin code, quantity, and date.
4.3 Moisture Barrier Packaging
LEDs are packed in moisture barrier bag with desiccant and humidity indicator card. MSL level 2 requires baking if storage conditions are exceeded.
5. Soldering & Assembly Guidelines
5.1 Reflow Soldering Profile
Recommended reflow parameters: preheat from 150°C to 200°C for 60-120 seconds, temperature above 217°C for max 60 seconds, peak temperature 260°C for max 10 seconds (within 5°C of peak for max 30 seconds). Cooling rate max 6°C/s. Total time from 25°C to peak max 8 minutes. Do not reflow more than twice.
5.2 Hand Soldering & Repair
Hand soldering: iron tip temperature <300°C, time <3 seconds, only one time. Repair with double-head soldering iron if unavoidable. Do not apply pressure on silicone surface during heating.
5.3 Handling Cautions
The encapsulant is silicone (soft). Avoid mechanical stress on the lens. Do not mount on warped PCB. Do not cool rapidly after soldering. Use proper pick-and-place nozzles to avoid damage.
6. Packaging & Ordering Information
Standard packaging: 2000pcs per reel in carrier tape. Moisture barrier bag with label. Outer cardboard box (standard dimensions). Storage conditions before opening: ≤30°C, ≤75% RH for up to 1 year. After opening: use within 24 hours at ≤30°C, ≤60% RH. If exceeded, bake at 60±5°C for >24 hours.
7. Application Recommendations
This LED is ideal for automotive interior lighting and switches. When designing, ensure current does not exceed 30mA. Use a current-limiting resistor to prevent burn-out. Thermal management is critical: junction temperature must not exceed 120°C. Provide adequate heat sinking. Driving circuit must not apply reverse voltage. Avoid sulfur-containing materials (S <100ppm). Bromine and chlorine content should be limited.
8. Technical Comparison
Compared to standard incandescent bulbs, this white LED offers longer lifetime (>50,000 hours), lower power consumption (91mW vs 1-2W), and smaller footprint. Within LED categories, the AEC-Q101 qualification ensures high reliability for automotive applications, making it superior to non-qualified general-purpose LEDs. The wide 120° viewing angle is advantageous for interior ambient lighting.
9. Frequently Asked Questions
Q: What is the maximum forward current? A: 30mA (100mA peak with 10% duty cycle).
Q: Can I operate without a resistor? A: No, a current-limiting resistor is required to prevent drift and damage.
Q: What is the storage life? A: 1 year if unopened in correct conditions. After opening, use within 24 hours or bake.
Q: Is this LED ESD sensitive? A: Yes, ESD protection is required. HBM threshold 2000V.
Q: Can it be used in outdoor applications? A: Designed for interior, but with proper sealing may be possible. Not recommended for direct exposure.
10. Practical Application Cases
In automotive interior lighting, these LEDs are used for dashboard backlighting, ambient footwell lighting, and switch illumination. Due to AEC-Q101 qualification, they withstand vibration and thermal cycling. Example: illuminated buttons in center console using 3mA drive current for uniform brightness.
11. Working Principle
The white LED operates by electroluminescence from a blue InGaN chip. The blue light (peak ~450nm) excites a yellow phosphor (cerium-doped YAG) which emits broad yellow light (peak ~550nm). The combination of blue and yellow appears white to the human eye. The phosphor is coated directly on the chip, achieving uniform color.
12. Development Trends
Automotive LED lighting is evolving toward higher efficacy, smaller packages, and enhanced reliability. Future developments include chip-scale packages (CSP) and flip-chip designs for better thermal performance. Integration with smart lighting systems (e.g., matrix headlights) is driving demand for compact and qualified LEDs. This PLCC2 package remains popular for interior applications due to its balance of performance and cost.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |