SMD LED Kuasa Sederhana Merah Pekat 67-21S - Pakej PLCC-2 - 2.0x1.25x0.7mm - 2.0-2.9V - 60mA - 40-100mW - Dokumen Teknikal

1. Gambaran Keseluruhan Produk

Dokumen ini memperincikan spesifikasi untuk Peranti Permukaan Dipasang (SMD) LED Kuasa Sederhana yang menggunakan teknologi cip AlGaInP untuk memancarkan cahaya merah pekat. Komponen ini dibungkus dalam pakej PLCC-2 (Pembawa Cip Berpimpin Plastik) yang padat, direka untuk proses pemasangan automatik. Kelebihan utamanya termasuk kecekapan bercahaya yang tinggi, penggunaan kuasa sederhana sesuai untuk operasi berpanjangan, dan sudut pandangan yang sangat luas yang memastikan taburan cahaya sekata. Ciri-ciri ini menjadikannya pilihan serba boleh untuk pelbagai aplikasi pencahayaan di luar penggunaan penunjuk mudah.

1.1 Ciri Utama dan Pematuhan

• Pakej:Bentuk faktor PLCC-2 standard untuk penempatan SMT yang boleh dipercayai.
• Warna Dipancarkan:Merah Pekat (panjang gelombang puncak 650-680 nm).
• Sudut Pandangan:120 darjah (tipikal), menyediakan corak sinaran yang luas.
• Pematuhan Alam Sekitar:Produk ini bebas Pb (bebas plumbum), mematuhi arahan EU RoHS (Sekatan Bahan Berbahaya), mematuhi peraturan EU REACH, dan memenuhi piawaian bebas halogen (Br <900ppm, Cl <900ppm, Br+Cl <1500ppm).
• Pengelasan:Mengikuti piawaian ANSI (Institut Piawaian Kebangsaan Amerika) untuk keluaran warna dan fluks yang konsisten, memastikan keseragaman dalam kelompok pengeluaran.

1.2 Aplikasi Sasaran

LED ini direka untuk aplikasi pencahayaan yang memerlukan pancaran merah yang cekap. Kes penggunaan tipikal termasuk:

• Pencahayaan Hiasan dan Hiburan:Pencahayaan aksen seni bina, pencahayaan pentas, dan pencahayaan suasana di mana titik warna tertentu adalah kritikal.
• Pencahayaan Pertanian:Pencahayaan tambahan dalam hortikultur dan pertanian menegak, terutamanya dalam proses fotomorfogenesis di mana cahaya merah mempengaruhi pertumbuhan dan pembungaan tumbuhan.
• Pencahayaan Am:Integrasi ke dalam luminer yang memerlukan komponen merah untuk cahaya putih boleh ditala atau kesan suhu warna tertentu.

2. Penarafan Maksimum Mutlak

Penarafan ini menentukan had di mana kerosakan kekal pada peranti mungkin berlaku. Operasi di bawah atau pada had ini tidak dijamin.

350°C selama 3 saat.Nota Penting:

Peranti ini sensitif kepada nyahcas elektrostatik (ESD). Prosedur pengendalian ESD yang betul mesti diikuti semasa pemasangan dan pengendalian untuk mengelakkan kegagalan laten atau bencana.

3. Ciri Elektro-Optik_{Parameter ini diukur pada suhu titik pateri (T_solder) 25°C dan mewakili prestasi tipikal di bawah keadaan yang ditentukan.}Parameter

µA
V_R = 5V
Nota:

1. Toleransi pada Kuasa Radiometrik ialah ±11%.

2. Toleransi pada Voltan Hadapan ialah ±0.1V.

4. Penjelasan Sistem Pengelasan

Untuk memastikan konsistensi warna dan prestasi dalam pengeluaran, LED disusun ke dalam kelas. Peranti ini menggunakan tiga kriteria pengelasan bebas.

B3

50

80

C1

4.3 Pengelasan Panjang Gelombang PuncakIni menentukan warna spektrum cahaya merah pekat yang dipancarkan, kritikal untuk aplikasi di mana panjang gelombang tertentu diperlukan (contohnya, tindak balas fotoreseptor tumbuhan).

Kod Kelas

Panjang Gelombang Min.

Panjang Gelombang Maks.

Unit

Keadaan

DA2_F650_j660_Fnm

I_F = 60mA

DA3

660

670_jDA4₆₇₀680

Nota:

Toleransi pengukuran panjang gelombang dominan/puncak ialah ±1nm.

5. Analisis Lengkung Prestasi

Graf berikut, diperoleh daripada data tipikal, menggambarkan bagaimana parameter utama berubah dengan keadaan operasi. Ini penting untuk reka bentuk sistem yang teguh.

5.1 Taburan Spektrum

Lengkung spektrum yang disediakan menunjukkan puncak yang sempit dan jelas ditakrifkan dalam kawasan merah pekat (lebih kurang 660-670nm untuk bahagian tipikal), ciri teknologi AlGaInP. Terdapat pancaran minimum dalam jalur spektrum lain, menghasilkan warna merah tepu.

5.2 Voltan Hadapan vs. Suhu Sambungan (Rajah.1)

Voltan hadapan (V_F) LED semikonduktor mempunyai pekali suhu negatif. Apabila suhu sambungan (T_j) meningkat dari 25°C ke 115°C, V_F berkurangan secara linear lebih kurang 0.25V. Ciri ini penting untuk pampasan suhu dalam litar pemacu dan boleh digunakan untuk pemantauan suhu sambungan tidak langsung.

5.3 Kuasa Radiometrik Relatif vs. Arus Hadapan (Rajah.2)
Kuasa output optik meningkat secara sub-linear dengan arus hadapan. Walaupun memacu pada arus yang lebih tinggi menghasilkan lebih banyak cahaya, ia juga menjana lebih banyak haba, mengurangkan kecekapan (lumen per watt) dan berpotensi memendekkan jangka hayat. Lengkung ini membantu pereka mengimbangi output terhadap kecekapan dan kebolehpercayaan.
5.4 Fluks Bercahaya Relatif vs. Suhu Sambungan (Rajah.3)
Seperti kebanyakan LED, output cahaya peranti ini berkurangan apabila suhu sambungan meningkat. Graf menunjukkan fluks bercahaya relatif jatuh kepada kira-kira 80% daripada nilai suhu bilik apabila T_j mencapai 115°C. Pengurusan terma yang berkesan (R_th rendah) adalah penting untuk mengekalkan output cahaya yang stabil.
5.5 Arus Hadapan vs. Voltan Hadapan (Lengkung IV) (Rajah.4)
Ini adalah ciri IV asas. Ia menunjukkan hubungan eksponen pada arus rendah beralih kepada tingkah laku lebih rintangan pada arus operasi dinilai (~60mA). Cerun dalam kawasan operasi berkaitan dengan rintangan dinamik LED.
5.6 Arus Pemanduan Maksimum vs. Suhu Pateri (Rajah.5)

Lengkung penurunan nilai ini adalah penting untuk kebolehpercayaan. Ia menunjukkan arus hadapan maksimum yang dibenarkan untuk mengekalkan suhu sambungan di bawah had 115°C, berdasarkan suhu titik pateri (yang dipengaruhi oleh suhu PCB). Sebagai contoh, jika titik pateri mencapai 70°C, arus berterusan selamat maksimum diturunkan nilai kepada lebih kurang 45mA.

5.7 Corak Sinaran (Rajah.6)

. Soldering and Assembly Guidelines

.1 Reflow Soldering Parameters

The device is rated for standard infrared or convection reflow soldering. The recommended profile has a peak temperature of 260°C (+0/-5°C) measured on the package body, with the time above 240°C not exceeding 10 seconds. A single reflow cycle is recommended.

.2 Hand Soldering

If manual soldering is necessary, it should be performed with a temperature-controlled iron set to a maximum tip temperature of 350°C. Contact time per lead should be limited to 3 seconds or less to prevent thermal damage to the plastic package and the internal die bond.

.3 Storage Conditions

As a moisture-sensitive device (MSD), the LEDs are packed in a moisture-resistant bag with desiccant. Once the sealed bag is opened, the components must be used within a specified time frame (typically 168 hours at <30°C/60%RH) or baked before reflow to prevent \"popcorning\" damage during soldering.

. Packaging and Ordering Information

.1 Reel and Tape Specifications

The components are supplied on embossed carrier tape for automated pick-and-place machines. Standard reel dimensions are provided (e.g., 13-inch reel). Available quantities per reel include 500, 1000, 1500, 2000, 2500, 3000, 3500, and 4000 pieces.

.2 Label Explanation

The reel label contains critical information for traceability and verification:
- P/N:Full product number, encoding the specific bin codes for Flux, Wavelength, and Voltage.
- QTY:Quantity of pieces on the reel.
- LOT No.:Manufacturing lot number for quality control.

.3 Moisture-Resistant Packing

The shipping unit consists of the reel placed inside an aluminum laminated moisture-proof bag along with desiccant and a humidity indicator card. The bag is then sealed.

. Reliability Testing

The product undergoes a comprehensive suite of reliability tests conducted with a 90% confidence level and 10% LTPD (Lot Tolerance Percent Defective). Key test items include:
- Reflow Soldering Resistance:°C for 10 seconds.
- Thermal Shock: cycles between -10°C and +100°C.
- Temperature Cycling: cycles between -40°C and +100°C.
- High Temperature/Humidity Storage & Operation: hours at 85°C/85%RH.
- High/Low Temperature Storage: hours at 85°C and -40°C.
- High/Low Temperature Operation Life: hours at various temperatures (25°C, 55°C, 85°C, -40°C) under specified drive currents.
These tests validate the long-term stability and robustness of the LED under harsh environmental and operational stresses.

. Application Design Considerations

.1 Thermal Management

With a thermal resistance (R_{th J-S}) of 50°C/W, managing heat is paramount. For continuous operation at 60mA (V_F~2.5V, P_d~150mW), the junction will be 7.5°C hotter than the solder point. Use a PCB with adequate thermal vias and copper area under the pads to dissipate heat to the ambient environment. Refer to the derating curve (Fig.5) to adjust maximum current based on the expected PCB temperature.

.2 Electrical Drive

Always drive LEDs with a constant current source, not a constant voltage. This ensures stable light output and prevents thermal runaway. The driver should be designed to accommodate the forward voltage bin range (2.0V to 2.9V). Consider implementing pulse-width modulation (PWM) for dimming to avoid color shift associated with analog (current reduction) dimming.

.3 Optical Integration

The wide 120° viewing angle may require secondary optics (lenses, diffusers) if a more directed beam is needed. The water-clear resin lens minimizes light absorption. For multi-LED arrays, ensure adequate spacing to prevent thermal coupling between adjacent devices.

. Technical Comparison and Differentiation

This Middle Power LED occupies a specific niche. Compared to low-power indicator LEDs, it offers significantly higher radiant flux and is designed for continuous illumination. Compared to high-power LEDs, it operates at lower current and has a simpler package without a metal-core PCB, making it more cost-effective for applications requiring many distributed points of light. Its key differentiators are the combination of AlGaInP deep red efficiency, the standardized PLCC-2 package for manufacturing ease, and comprehensive ANSI binning for color consistency.

. Frequently Asked Questions (FAQ)

Q: Can I drive this LED at 120mA continuously?
A: No. The Absolute Maximum Rating for continuous forward current is 60mA. The 120mA rating is for pulsed operation only (10% duty cycle, 10ms pulse width). Exceeding the continuous current rating will overheat the junction, leading to rapid lumen depreciation and premature failure.

Q: What is the difference between Radiometric Power (mW) and Luminous Flux (lm)?
A: Radiometric power measures the total optical power emitted in watts. Luminous flux measures the perceived power of light adjusted for the sensitivity of the human eye (photopic curve). For deep red LEDs, the luminous flux value will be relatively low because the human eye is less sensitive to red light, but the radiometric power (important for plant growth or sensing) is high.

Q: How do I interpret the product code 67-21S/NDR2C-P5080B2C12029Z6/2T?
A: The code encodes the package type (67-21S), the color (NDR = Deep Red), and the specific bin codes for various parameters (e.g., B2 for flux, C1 for flux, 29 for voltage, Z6 for wavelength). The exact decoding should be confirmed with the manufacturer's bin code chart.

Q: Is a heatsink required?
A> For a single LED on a standard FR4 PCB with moderate copper, a dedicated heatsink may not be necessary at 60mA. However, for arrays of LEDs or operation in high ambient temperatures, thermal analysis is required. The derating curve (Fig.5) provides guidance. Improving the PCB thermal design is often more effective than adding a separate heatsink to such a small package.

. Practical Design Case Study

Scenario:Designing a supplemental lighting bar for indoor lettuce cultivation. The bar is 1 meter long and requires an even coverage of deep red light (660nm) to stimulate photosynthesis.

Design Steps:
1. Target Illuminance:Determine the required Photosynthetic Photon Flux Density (PPFD) at the plant canopy.
2. LED Selection:This LED, in bin DA3 (660-670nm), is ideal due to its spectral match with chlorophyll absorption peaks.
3. Array Design:Calculate the number of LEDs needed based on the radiometric output per LED (e.g., 70mW from bin B4) and the efficiency of the optical system. Space them evenly along the bar.
4. Thermal Design:Mount the LEDs on an aluminum PCB (MCPCB) to manage the collective heat from the array, keeping the solder point temperature low to maximize light output and longevity (per Fig.3 & 5).
5. Driver Design:Use a constant current driver capable of supplying the total current (number of LEDs * 60mA) with a voltage compliance that covers the sum of the maximum V_Fof the series string. Include PWM dimming for daily light integral control.

. Operating Principle

This LED is based on Aluminum Gallium Indium Phosphide (AlGaInP) semiconductor material. When a forward voltage exceeding the diode's turn-on voltage (~2.0V) is applied, electrons and holes are injected into the active region from the n-type and p-type layers, respectively. They recombine radiatively, releasing energy in the form of photons. The specific bandgap energy of the AlGaInP alloy determines the wavelength of the emitted photons, which is in the deep red spectrum (650-680 nm). The epoxy resin lens encapsulates the chip, provides mechanical protection, and shapes the light output beam.

. Technology Trends

The trend in Middle Power LEDs like this one is towards ever-increasing efficacy (more light output per electrical watt input) and improved reliability at higher operating temperatures. Advances in epitaxial growth and chip design continue to reduce efficiency droop (the decline in efficacy at higher currents). Packaging innovations focus on improving thermal pathways to lower R_thand using more robust, high-temperature resins. Furthermore, tighter binning tolerances are becoming standard to meet the demands of color-critical applications in horticulture and high-end architectural lighting, where consistency across thousands of LEDs is essential.