LED Lamp Bead 6324-15SUBC/S400-X10 Datasheet - Blue - 3.3V Forward Voltage - 20mA Operating Current - Technical Documentation

1. Product Overview

Hii hati hutoa maelezo kamili ya kiufundi ya taa ya LED ya bluu yenye mwangaza mkubwa yenye nambari ya mfano 6324-15SUBC/S400-X10. Kifaa hiki ni sehemu ya mfululizo wa bidhaa zilizoundwa mahsusi kwa matumizi yanayohitaji utoaji wa mwanga bora. LED inatumia muundo wa kawaida wa ufungashaji wa taa, unaofaa kwa mchakato mwingi wa usanikishaji wa elektroniki. Ubunifu wake wa msingi unapendelea uaminifu na uthabiti katika mazingira mbalimbali ya uendeshaji.

Kifaa hiki kinakidhi maagizo makuu ya kimazingira na usalama, ikiwa ni pamoja na RoHS (Vizuizi vya Vitu Vinavyoweza Kuumiza), Kanuni za REACH za Umoja wa Ulaya, na hutengenezwa kama kipengele kisicho na halojeni. Uzingatifu huu unahakikisha bidhaa inakidhi viwango vikali vya kimataifa vya vipengele vya elektroniki. LED inasambazwa katika umbo la mkanda na diski, linalofaa kwa usanikishaji wa kiotomatiki wa SMT, na hivyo kuimarisha ufanisi katika mazingira ya uzalishaji kwa wingi.

1.1 Core Advantages and Target Market

Ubora mkuu wa LED hii unatokana na mchanganyiko wa nguvu ya mwanga ya juu na ufungaji thabiti. Chini ya mkondo wa kawaida wa kuendesha wa 20mA, nguvu yake ya kawaida ya mwanga ni 500 millicandela (mcd), ikitoa mwangaza unaoonekana kwa ukubwa wake. Bidhaa hii imebuniwa hasa kwa matumizi ya viashiria vya jumla na taa za nyuma katika elektroniki za watumiaji na viwanda. Soko kuu lengwa linajumuisha watengenezaji wa televisheni, vionyeshi vya kompyuta, simu, na vifaa mbalimbali vya ziada vya kompyuta, ambapo matumizi hayo yanahitaji kiashiria au taa ya bluu thabiti na yenye mwangaza. Chaguo la pembe mbalimbali za mtazamo huruhusu mbuni kuchagua muundo bora wa mionzi ya mwanga kulingana na matumizi yao maalum, kwa kusawazisha kati ya eneo pana la mwanga na nguvu ya mhimili.

2. Maelezo ya Vigezo vya Kiufundi

Sehemu hii inachambua kwa kina na kwa uwazi vigezo muhimu vya kiufundi vilivyobainishwa katika hati ya maelezo. Kuelewa vigezo hivi ni muhimu kwa usanisi sahihi wa saketi na kuhakikisha uimara wa muda mrefu.

2.1 Viwango vya Juu Kabisa

Absolute Maximum Ratings hufafanua mipaka ya mkazo inayoweza kusababisha uharibifu wa kudumu wa kifaa. Hizi sio hali za kufanya kazi.

• Continuous Forward Current (I_F)): 25 mA. This is the maximum DC current that can be continuously applied to the LED.
• Peak Forward Current (I_FP)): 100 mA. This pulse current rating (duty cycle 1/10, frequency 1 kHz) allows short-term overdrive, suitable for multiplexing or stroboscopic applications.
• Reverse Voltage (V_R)): 5 V. Exceeding this voltage under reverse bias may cause junction breakdown.
• Power Dissipation (P_d)): 90 mW. Hii ndiyo nguvu ya juu ambayo kifurushi kinaweza kutawanya kwa namna ya joto, ikikokotolewa kwa kuzidisha voltage ya mbele na mkondo wa mbele.
• Halijoto ya kufanya kazi na kuhifadhi: Kifaa kinaweza kufanya kazi kwenye -40°C hadi +85°C na kuhifadhiwa kwenye -40°C hadi +100°C.
• Halijoto ya kuchomelea: The pins can withstand 260°C for 5 seconds, which is compatible with standard lead-free reflow soldering temperature profiles.

2.2 Electro-Optical Characteristics

These parameters are measured at an ambient temperature of 25°C and a forward current (I_F) measured under standard test conditions, unless otherwise specified.

• Luminous intensity (I_v)): Typical value is 500 mcd, minimum value is 250 mcd. This specifies the LED brightness as perceived by the human eye.
• Viewing angle (2θ_1/2)): 60 degrees (typical). This is the full angle at which the luminous intensity drops to half of its peak axial value.
• Peak wavelength (λ_p)): 468 nm (typical). This is the wavelength at which the spectral power distribution of the emitted light reaches its maximum.
• Dominant wavelength (λ_d)): 470 nm (typical value). Hii ni urefu wa wimbi moja unaotambuliwa na jicho la mwanadamu, unaofafanua "bluu" ya LED.
• Upana wa mionzi ya wigo (Δλ): 35 nm (typical value). Hii inaonyesha upana wa wigo wa mwanga unaotolewa, unapimwa kwenye upana wa nusu ya urefu kamili (FWHM).
• Voltage ya mbele (V_F)): Inasindikia kutoka 2.7V (kiwango cha chini) hadi 3.7V (kiwango cha juu), na thamani ya kawaida ya 3.3V kwenye 20mA. Hii ni muhimu sana kwa kubuni saketi za kudhibiti mkondo wa umeme.
• Mkondo wa nyuma (I_R)): Hadi kiwango cha juu cha 50 μA wakati voltage ya nyuma ya 5V inatumika.

Mwongozo pia unabainisha kutokuwa na uhakika wa kipimo: V_Fni ±0.1V, I_vni ±10%, λ_d.

ni ±1.0nm.

3. Mfumo wa Uainishaji Maelezo

• CATThis product employs a binning system that classifies units based on key optical and electrical parameters. This ensures consistency within production batches, making it suitable for applications requiring strict color or brightness matching. The packaging label includes codes for these bins:
• HUELuminous Intensity Bin. Units are binned according to measured light output.
• REFDominant Wavelength Bin. LEDs are binned according to their specific blue hue.

Forward Voltage Bin. LEDs are grouped according to their forward voltage drop at test current.

Designers should consult the supplier for specific bin code definitions and availability to ensure the selected bin meets the application requirements for color consistency and electrical performance.

4. Uchambuzi wa Mviringo wa Utendaji

The datasheet provides several characteristic curves illustrating the device's behavior under various conditions. This is crucial for understanding performance beyond the single-point specification at 25°C/20mA.

4.1 Relationship Between Relative Intensity and Wavelength

This curve graphically displays the spectral power distribution, with a peak at approximately 468 nm and a typical full width at half maximum of 35 nm, confirming the monochromatic blue emission of the InGaN chip.

4.2 Directivity Pattern

Mchoro wa kuratibu polar unaonyesha usambazaji wa anga wa mwanga, unaolingana na pembe ya maono ya digrii 60. Ukubwa wa mwanga ni mkubwa zaidi kwenye mhimili wa kati (0°) na hupungua kwa ulinganifu kuelekea kwenye kingo.

4.3 Uhusiano wa Mkondo wa Mbele na Voltage ya Mbele (Mkunjo wa I-V)_FMkunjo huu unaonyesha uhusiano wa kielelezo wa kawaida wa diode. Voltage ya mwelekeo huongezeka kwa logarithimu kadri mkondo unavyoongezeka. Katika sehemu ya kufanya kazi ya 20mA inayopendekezwa, thamani ya kawaida ya voltage ni 3.3V. Mkunjo huu ni muhimu sana kwa usimamizi wa joto kwa sababu V

ina mgawo hasi wa joto.

4.4 Uhusiano wa Nguvu ya Jamaa na Mkondo wa Mwelekeo

Mchoro huu unaonyesha kuwa, katika safu ya kawaida ya uendeshaji, pato la mwanga na mkondo zina uhusiano takriban wa mstari. Kuendesha LED zaidi ya kiwango chake cha juu cha kawaida hakiongezi pato la mwanga kwa uwiano, bali hutoa joto la ziada.

4.5 Mkunjo wa Kutegemea Joto_aMikondo miwili muhimu inaonyesha joto la mazingira (T

• ) Impact:Relationship between Relative Intensity and Ambient Temperature
• : As the ambient temperature increases, the light output decreases. This derating must be considered in designs operating at high temperatures.Uhusiano wa Mkondo wa Mwelekeo na Joto la Mazingira_F: Kwa voltage maalum, kutokana na mgawo hasi wa joto wa V

mkondo wa mwelekeo utaongezeka kadiri joto linavyoongezeka. Hii inasisitiza umuhimu mkubwa wa kutumia kichocheo cha mkondo wa kudumu badala ya chanzo cha voltage ya kudumu ili kuzuia kukosekana kwa udhibiti wa joto.

5. Taarifa za Mitambo na Ufungaji

• LED imefungwa kwenye kifuniko cha kawaida cha taa. Mchoro wa ufungaji hutoa vipimo muhimu kwa muundo wa pedi za PCB na ukaguzi wa nafasi.
• Vipimo vyote vinatolewa kwenye milimita.
• Maelezo muhimu yanabainisha kuwa urefu wa flange lazima uwe chini ya 1.5mm (0.059 inchi).
• Toleransi chaguomsingi kwa vipimo visivyobainishwa ni ±0.25mm.

Michoro kwa kawaida huonyesha umbali wa pini, vipimo vya kifurushi, umbo la lenzi, na eneo la kiashiria cha cathode (kwa kawaida ni uso wa gorofa au pini fupi).

Wabunifu lazima wafuate kwa uangalifu vipimo hivi wakati wa kuunda muundo wa pedi za PCB ili kuhakikisha ununuzi na uunganisho sahihi.

6. Mwongozo wa Uchomaji na Usanikishaji

Uendeshaji sahihi ni muhimu kudumisha uhakika. Mwongozo wa maelezo hutoa maelezo ya kina.

• 6.1 Uundaji wa Pini
• Sehemu ya kupinda lazima iwe angalau 3mm kutoka kwa msingi wa mwili wa taa ya epoxy.
• Unda pini kabla ya kuchomelea.
• Epuka kutumia mkazo kwenye kifurushi; kata pini kwenye halijoto ya kawaida.

Vipengele vya LED vinapaswa kusawazishwa kikamilifu na mashimo ya PCB ili kuepuka mkazo wa usakinishaji.

• 6.2 Storage
• Masharti ya uhifadhi: Joto ≤30°C, unyevu wa hewa ≤70%. Maisha ya rafiki: Miezi 3 kuanzia tarehe ya usafirishaji.
• Kwa uhifadhi wa muda mrefu (hadi mwaka 1), tumia chombo kilichotiwa muhuri chenye nitrojeni na vikaushi.

Epuka mabadiliko ya ghafla ya joto katika mazingira yenye unyevunyevu ili kuzuia umande.

6.3 Welding ProcessManual solderingSoldering iron tip temperature ≤300°C (max 30W), time ≤3 seconds, solder joint distance from lamp body ≥3mm.Wave soldering/Dip soldering

Preheat ≤100°C (≤60 seconds), solder bath ≤260°C for ≤5 seconds, solder joint distance from lamp body ≥3mm. A recommended soldering temperature profile is provided, showing a gradual temperature rise, a plateau within the 260°C limit, and a controlled cooling slope. Rapid cooling is not recommended. Avoid multiple soldering cycles and applying mechanical stress while the LED is hot.

6.4 Cleaning

If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute. Avoid ultrasonic cleaning unless pre-verified, as it may damage the chip or bonding wires.

6.5 Thermal Management

Uundani sahihi wa joto ni muhimu sana. Katika hali ya joto ya juu ya mazingira, sasa ya uendeshaji lazima ipunguzwe (tazama mkunjo wa kupunguza). Joto linalozunguka LED katika matumizi ya mwisho lazima lisiweke ndani ya udhibiti ili kudumisha utendaji na maisha ya huduma.

6.6 Ulinzi dhidi ya Kutokwa kwa Umeme tuli (ESD)

LED ni nyeti kwa ESD na voltage ya mawimbi, ambayo inaweza kuharibu chip ya semiconductor. Ni lazima kufuata taratibu za kawaida za usindikaji wa ESD (kwa mfano, kituo cha kazi kilichogunduliwa, mkanda wa mkono) wakati wa usanikishaji na uendeshaji.

7. Ufungaji na Taarifa za Kuagiza

7.1 Vipimo vya Ufungaji

• LED hufungwa kwa njia ifuatayo ili kutoa ulinzi na urahisishaji wa uendeshaji wa otomatiki:
• Weka kwenye mfuko wa kuzuia umeme.
• Mfuko wa kuzuia umeme uwekwe kwenye kisanduku cha ndani.
• Kisanduku cha ndani kiwekwe kwenye kisanduku cha nje.Packing Quantity

: Minimum 200 to 500 pieces per bag. 5 bags per inner box. 10 inner boxes per outer carton.

7.2 Labeling Instructions

• CPNThe packaging label includes:
• : Customer Part Number.P/N
• QTY: Manufacturer Part Number (6324-15SUBC/S400-X10).
• : Quantity per Package.CAT/HUE/REF
• Binning code for intensity, wavelength, and voltage.LOT No

Traceable production batch number.

8. Application Recommendations

8.1 Mandhari ya Kawaida ya Utumizi

• Kama ilivyoorodheshwa hapo awali, matumizi makuu ni kama kiashiria cha hali au taa ya nyuma ya vifaa vifuatavyo:
• Runinga na vionyeshi (kiashiria cha umeme, chanzo cha ingizo).
• Simu (kungojea ujumbe, hali ya mstari).

Kompyuta na vifaa vya ziada (Umeme umewashwa, shughuli ya diski ngumu).

Mwangaza wake mkubwa pia unaufanya ufawe kwa taa za paneli katika mazingira yenye mwanga wa kutosha.

• 8.2 Design ConsiderationsDrive circuit_F: Always use a series current-limiting resistor or a constant current driver. Use the formula R = (Supply Voltage - V_F) / I_Fto calculate the resistor value. Use the maximum V
• value from the datasheet to ensure the current does not exceed the limit under all conditions.Usimamizi wa joto
• : Kwenye PCB, hakikisha eneo la kutosha la shaba karibu na pini za LED kama jokofu, haswa wakati wa kuendesha karibu na sasa ya juu zaidi.Mtazamo
• Chagua aina inayofaa ya mtazamo kwa matumizi. Mtazamo wa digrii 60 hutoa usawa mzuri kati ya mwangaza wa axial na uwazi wa anuwai pana.ESD protection

Katika mazingira nyeti, fikiria kuongeza diode ya kuzuia voltage ya muda mfupi (TVS) au capacitor ndogo sambamba na LED (kwa mfululizo na resistor), ili kuzuia misokoto ya voltage.

9. Technical Comparison and Differentiation

• Ingawa kulinganisha moja kwa moja na washindani kunahitaji aina mahususi mbadala, kulingana na maelezo yake ya uainishaji, sifa muhimu za kitofauti za LED hii ni pamoja na:Mwangaza wa Juu
• : Thamani ya kawaida ya 500 mcd kwenye 20mA, ni pato la kuvutia kwa ufungashaji wa kawaida wa taa.Uzingatiaji kamili wa viwango.
• Inakidhi viwango vya RoHS, REACH na vya kutokuwa na halojeni, faida kubwa kwa soko la kimataifa na miundo inayozingatia mazingira.Vipimo thabiti.
• Clear absolute maximum ratings and detailed operating instructions reduce application risks.Tape and reel supply

Supports high-speed automated assembly, reducing manufacturing costs for mass production.

10. Maswali Yanayoulizwa Mara kwa Mara (Kulingana na Vigezo vya Teknolojia)Q1: Je, naweza kutumia chanzo cha umeme cha 5V kuendesha LED hii moja kwa moja?_FA: Hapana. Voltage yake ya kawaida ya mbele ni 3.3V. Kuunganisha moja kwa moja kwenye 5V kutasababisha mkondo mkubwa kupita kiasi, ambao unaweza kuharibu LED. Lazima utumie upinzani wa kudhibiti mkondo. Kwa mfano, ukichukulia chanzo cha 5V, mkondo unaolengwa wa 20mA, na kutumia V ya juu zaidi ya usalama

ya 3.7V: R = (5V - 3.7V) / 0.020A = ohms 65. Upinzani wa ohms 68 utakuwa chaguo la kawaida.Q2: Why does the luminous intensity decrease when the ambient temperature increases?

A: This is a fundamental characteristic of semiconductor LEDs. As temperature increases, the efficiency of the radiative recombination process that generates light inside the InGaN chip decreases, resulting in lower light output for the same electrical input. The derating curve quantifies this effect.Q3: What is the difference between peak wavelength and dominant wavelength?

A: Peak wavelength (468 nm) is the physical peak of the emission spectrum. Dominant wavelength (470 nm) is a calculated value representing the single wavelength of pure monochromatic light that is perceived by the human eye as having the same color as the LED output. They are typically close but not identical.Q4: How critical is the 3mm distance for soldering and lead bending?

A: Extremely critical. The epoxy lamp body is sensitive to thermal and mechanical stress. Maintaining a 3mm distance ensures that soldering heat does not cause thermal shock to the epoxy (leading to cracking or delamination) and that bending stress is not transferred to the fragile internal bond wires connected to the semiconductor chip.

11. Mifano ya Uundaji na Matumizi Halisi Scenario: Designing a front panel power indicator for a desktop computer.RequirementsVisible in a brightly lit room, powered by the system's 5V standby power rail, ensuring reliable long-term operation.Design Steps:Uchaguzi wa Vipengele: Kutokana na mwangaza wake mkubwa (kawaida 500 mcd), LED hii ya bluu inafaa.Uhesabuji wa Sakiti_F: Tumia njia ya umeme ya 5V ya kusubiri. Chukulia V ya uhafidhina_FFor 3.5V, the desired I²is 15mA (for longer lifespan and lower heat generation), the resistance value is R = (5V - 3.5V) / 0.015A = 100 ohms. The resistor's power rating: P = I²R = (0.015)* 100 = 0.0225W. A standard 1/8W (0.125W) resistor is more than sufficient.PCB Layout: Place the LED at the front panel location. Arrange large-area copper pour around the cathode and anode pins as a heat sink. Design the pad pattern according to the package dimensions.Assembly

: If the PCB is assembled via wave soldering process, follow wave soldering guidelines to ensure the LED is placed last or shielded as much as possible to minimize thermal exposure.

12. Introduction to Working Principles

As shown in the materials section, this LED is based on an indium gallium nitride (InGaN) semiconductor chip. When a forward voltage exceeding the diode threshold (approximately 2.7V) is applied, electrons and holes are injected into the chip's active region. When these carriers recombine, they release energy in the form of photons (light). The specific composition of the InGaN alloy determines the bandgap energy, which directly defines the wavelength (color) of the emitted light—in this case, blue (~470 nm). The epoxy resin lens is used to protect the chip, shape the light output beam (60-degree viewing angle), and enhance light extraction efficiency from the semiconductor material.

13. Technology Trends

• Teknolojia ya LED inaendelea kukua. Ingawa kijenzi hiki kinawakilisha bidhaa ya kawaida iliyokomaa, mienendo pana ya tasnia inayoathiri vifaa kama hivi inajumuisha:Uboreshaji wa ufanisi
• : Utafiti endelevu wa sayansi ya nyenzo unalenga kuongeza lumens kwa watt (ufanisi wa mwanga) wa LED, na hivyo kupunguza matumizi ya nishati kwa pato sawa la mwanga.Miniaturization
• The drive for smaller electronic devices is pushing LED package sizes to continuously shrink while maintaining or increasing brightness.Enhanced Reliability
• Improvements in packaging materials and die-attach technology continue to extend operational lifespan and tolerance to harsh environments.Ujumuishaji wa Akili

Mwelekeo ni kuelekea LED zinazojumuisha kiendeshi, kudhibiti na hata sensor ndani ya kifungo, ingawa hii ni ya kawaida zaidi katika moduli za taa za hali ya juu kuliko katika viashiria vya msingi.