Table of Contents
- 1. Product Overview
- 1.1 Core Advantages and Target Market
- 2. Uchambuzi wa kina wa Vigezo vya Kiufundi
- 2.1 Viwango vya Juu Kabisa
- 2.2 Electro-Optical Characteristics
- 4.1 Relative Intensity vs. Wavelength
- 4.2 Directivity Pattern
- 4.3 Mkondo wa Mwelekeo dhidi ya Voltage ya Mwelekeo (Mkunjo wa I-V)
- 4.4 Uimara wa Jamaa dhidi ya Mkondo wa Mwelekeo (Mkunjo wa L-I)
- 4.5 Thermal Characteristics
- 5.1 Package Dimensions and Drawings
- 5.2 Polarity Identification
- 6.1 Lead Forming
- 6.2 Storage Conditions
- 6.3 Welding Process
- 6.4 Usafi
- 6.5 Usimamizi wa Joto
- 6.6 Ulinzi dhidi ya Utoaji Umeme wa Tuli (ESD)
- 7.1 Vipimo vya Ufungaji
- 7.2 Labeling Instructions
- 8.1 Typical Application Scenarios
- 8.2 Key Design Considerations
1. Product Overview
Waraka huu unatoa maelezo kamili ya kiufundi ya taa ya LED yenye rangi ya manjano-kijani inayong'aa kwa kiwango cha juu. Kifaa hiki kimetengenezwa kwa kutumia teknolojia ya chip ya AlGaInP, na kimefungwa ndani ya resini ya kijani inayosambaza mwanga, na imebuniwa hasa kwa matumizi yanayohitaji taa thabiti na imara na kutoa chaguzi mbalimbali za pembe ya kuona. Bidhaa hii inalingana na viwango vinavyohusiana via mazingira.
1.1 Core Advantages and Target Market
Faida kuu za mfululizo huu wa LED ni pamoja na nguvu yake ya juu ya kutolea mwanga, kutoa chaguo mbalimbali za rangi na nguvu, na chaguo la ufungaji wa mkanda unaofaa kwa usanikishaji wa otomatiki. Imebuniwa hasa kwa matumizi yanayohitaji mwangaza bora. Soko lengwa na matumizi ya kawaida ni pamoja na vionyeshi vya vifaa vya matumizi ya kaya, viashiria vya mwanga, na mifumo ya taa ya nyuma ya vifaa kama vile televisheni, vionyeshi vya kompyuta, simu na vifaa vingine vya kompyuta.
2. Uchambuzi wa kina wa Vigezo vya Kiufundi
Sehemu hii inatoa ufafanuzi wa kina na usio na upendeleo wa vigezo muhimu vya umeme, vya nuru na vya joto vya kifaa, kulingana na hali ya kawaida ya majaribio (Ta=25°C).
2.1 Viwango vya Juu Kabisa
Absolute maximum ratings define the stress limits that may cause permanent damage to the device. These are not recommended operating conditions.
- Continuous Forward Current (IF):25 mA. Continuously exceeding this current will shorten the LED's lifespan and reduce light output.
- Peak Forward Current (IFP):60 mA. This is the maximum allowable pulse current, typically specified under conditions of a 1 kHz frequency and a 1/10 duty cycle. It is crucial for applications involving brief, high-current pulses.
- Reverse Voltage (VR):5 V. Kutumiwa kwa voltage ya nyuma inayozidi thamani hii kunaweza kusababisha kushindwa kwa haraka kwa kiungo cha LED.
- Matumizi ya nguvu (Pd):60 mW. Hii ndiyo nguvu ya juu ambayo kifurushi kinaweza kutawanya bila kuzidi joto lake la juu la kiungo, ikikokotolewa kama voltage ya mbele (VF) ikizidishwa na mkondo wa mbele (IF).
- Joto la uendeshaji na uhifadhi:The device's rated operating temperature is -40°C to +85°C, and the storage temperature is -40°C to +100°C. These ranges ensure the mechanical and chemical stability of the epoxy resin and semiconductor materials.
- Soldering Temperature (Tsol):260°C for 5 seconds. This defines the maximum thermal profile that the LED package can withstand during wave soldering or reflow soldering processes.
2.2 Electro-Optical Characteristics
Vigezo hivi vinabainisha utendakazi wa kifaa chini ya hali za kawaida za uendeshaji (IF=20mA). Safu ya "Thamani ya Kawaida" inawakilisha thamani ya katikati inayotarajiwa, wakati "Thamani ya Chini" na "Thamani ya Juu" zinabainisha anuwai inayokubalika ya usambazaji wa uzalishaji.
- Nguvu ya Mwanga (Iv):40-80 mcd (typical 80 mcd). This is the perceived brightness of the LED measured in millicandelas. The wide range indicates a binning process; designers must consider the minimum value for worst-case brightness scenarios.
- Viewing Angle (2θ1/2):30 degrees (typical). This is the full angle at which the luminous intensity drops to half of its peak (axial) value. A 30-degree angle indicates a relatively concentrated beam, suitable for directional indicator lights.
- Peak and Dominant Wavelength (λp, λd):They are 575 nm and 573 nm, respectively. The peak wavelength is the spectral point of maximum radiant power. The dominant wavelength is the perceived color point. The close values indicate a spectrally pure yellow-green emission.
- Spectral Radiant Bandwidth (Δλ):20 nm. Hii ni upana wa wigo kwenye nusu ya kiwango cha juu zaidi (FWHM). Upana wa 20 nm ni sifa ya kawaida ya LED zinazotokana na AlGaInP, na hutoa usafi mzuri wa rangi.
- Voltage ya mbele (VF):1.7V hadi 2.4V (kiwango cha kawaida 2.0V). Hii ni kushuka kwa voltage kwenye LED wakati inaendeshwa kwa 20mA. Ikiwa voltage ya usambazaji imebainishwa, muundo wa mzunguko lazima utumie kipingamizi cha kudhibiti mkondo kilichohesabiwa kwa VF ya juu zaidi au kichocheo, ili kuhakikisha mkondo hauzidi kiwango cha juu kilichowekwa.
- Mkondo wa nyuma (IR):Maximum 10 μA at VR=5V. This is the leakage current when the device is reverse-biased. For a healthy LED, this value is typically very low.
Measurement Tolerance:The datasheet specifies particular uncertainties: ±0.1V for VF, ±10% for Iv, and ±1.0nm for λd. These must be considered in precision design calculations.
3. Mfumo wa Kugawanya Maelezo
Data iliyotolewa inaonyesha muundo wa kugawanya kulingana na vigezo muhimu vya utendaji, ili kuhakikisha uthabiti katika uzalishaji wa wingi. Ingawa matrix kamili ya kugawanya haijaelezewa kwa kina, habari zifuatazo zinaweza kudhaniwa kutoka kwa jedwali la vipimo na maelezo ya lebo:
- Kugawanya kwa Nguvu ya Mwanga/Mtiririko wa Mwanga:The Iv range of 40-80 mcd indicates that the devices are binned according to their measured output at 20mA. The "CAT" field on the packaging label likely denotes this grade or category.
- Wavelength/Color Binning:The "HUE" field on the label corresponds to the dominant wavelength (λd). Given the typical value of 573 nm, production batches are likely characterized and marked according to their specific dominant wavelength to maintain color consistency within applications.
- Forward Voltage Binning:A VF range of 1.7V to 2.4V indicates that LEDs may also be grouped based on their forward voltage characteristics. Matching VF in parallel circuits helps achieve uniform current distribution.
4. Performance Curve Analysis
Typical characteristic curves provide crucial insights into a device's behavior under various conditions, which is essential for robust circuit and thermal design.
4.1 Relative Intensity vs. Wavelength
This curve graphically represents the spectral power distribution, showing a peak near 575 nm with a full width at half maximum of approximately 20 nm. It confirms the monochromatic nature of the light output, concentrated in the yellow-green region of the visible spectrum.
4.2 Directivity Pattern
The directivity (or radiation pattern) curve illustrates the spatial distribution of light. The provided 30-degree viewing angle is derived from this pattern. The curve shape is typical for a standard LED die with a hemispherical lens, showing a near-Lambertian or slightly focused emission profile.
4.3 Mkondo wa Mwelekeo dhidi ya Voltage ya Mwelekeo (Mkunjo wa I-V)
Mkunjo huu unaonyesha uhusiano wa kielektroniki kati ya mkondo na voltage, ambayo ni sifa ya kawaida ya diode. Voltage ya "kiunzi" ni takriban 1.8V-2.0V. Kuzidi hatua hii, ongezeko dogo la voltage husababisha ongezeko kubwa la mkondo, jambo linaloangazia umuhimu mkubwa wa udhibiti wa mkondo badala ya udhibiti wa voltage wakati wa kuendesha LED.
4.4 Uimara wa Jamaa dhidi ya Mkondo wa Mwelekeo (Mkunjo wa L-I)
Mkunjo huu unaonyesha uhusiano kati ya mkondo wa kuendesha na pato la mwanga. Katika anuwai ya kazi inayopendekezwa kwa kawaida ni laini, lakini kwenye mikondo ya juu sana hujaa na hatimaye hupungua. Kufanya kazi kwenye 20mA ya kawaida kuhakikisha usawa mzuri wa ufanisi, mwangaza na maisha ya huduma.
4.5 Thermal Characteristics
Mikunjo ifuatayo ni muhimu sana:Nguvu ya jamaa vs. Joto la mazingiraandForward Current vs. Ambient Temperature(at constant voltage). They indicate that the light output decreases with increasing ambient temperature due to reduced internal quantum efficiency and increased non-radiative recombination. Conversely, for a fixed applied voltage, the forward current increases with temperature because the diode's forward voltage has a negative temperature coefficient. If not properly managed with a constant current driver, this can lead to a potential thermal runaway condition.
5. Mechanical and Packaging Information5.1 Package Dimensions and Drawings
The datasheet contains detailed dimensional drawings. Key specifications derived from the drawings and notes include: all dimensions are in millimeters (mm), the flange height must be less than 1.5mm, and unless otherwise specified, the general tolerance is ±0.25mm. The drawings define pin pitch, body dimensions, and overall shape, which are crucial for PCB pad design (pad pattern).
5.2 Polarity Identification
Although not explicitly detailed in the provided text, standard LED beads typically identify the cathode (negative pin) through a flat edge on the lens, a shorter lead, or markings on the package. The PCB pad design must match this polarity to ensure correct orientation during assembly.
6. Soldering and Assembly Guide
Usindikaji sahihi ni muhimu kwa kudumisha uaminifu na utendaji wa kifaa.
6.1 Lead Forming
- Kupinda lazima kuwe umbali wa angalau 3mm kutoka kwenye msingi wa taa ya epoxy ili kuzuia ufa wa mkazo.
- Umbo lazima liwe limekamilika kabla ya kuchomelea.
- Kata pini kwenye halijoto ya kawaida ya chumba ili kuepuka mshtuko wa joto.
- Vipenye vya PCB lazima viwe sawasawa kabisa na pini za LED ili kuepuka msongo wa usakinishaji.
6.2 Storage Conditions
- Baada ya kupokea, hifadhi chini ya ≤30°C na unyevunyevu wa jamaa (RH) ≤70%. Maisha ya rafiki chini ya hali hizi ni miezi 3.
- Kwa uhifadhi wa muda mrefu zaidi (hadi mwaka 1), tumia chombo kilichotiwa muhuri na gesi ya nitrojeni pamoja na desiccant.
- Epuka mabadiliko ya ghafla ya joto katika mazingira yenye unyevu, ili kuzuia umande.
6.3 Welding Process
Key Rules:Maintain a minimum distance of 3mm from the solder joint to the epoxy resin LED.
- Manual Soldering:Maximum tip temperature 300°C (for irons up to 30W), maximum soldering time 3 seconds.
- Wave/Immersion Soldering:Joto la juu la kukausha ni 100°C (kwa muda wa sekunde 60). Joto la juu la chombo cha kuuza bati ni 260°C, muda wa juu wa kuzamishwa ni sekunde 5.
- Mkunjo wa joto unaopendekezwa wa kuuza bati umetolewa, unapaswa kufuatiwa ili kupunguza mkazo wa joto.
- Epuka kutumia mkazo wa mitambo kwenye pini wakati wa kuuza bati na baada ya kuuza bati wakati kifaa bado kiko moto.
- Usifanye uuzi wa kuzamishwa/wa mkono zaidi ya mara moja.
- Punguza joto polepole kutoka kwenye kiwango cha juu cha uuzi; epuka kuzamisha haraka.
6.4 Usafi
- Safisha tu wakati inahitajika, tumia isopropanoli kwenye halijoto ya kawaida, muda ≤ dakika 1. Kauka kwa upepo.
- Usisafi kwa mawimbi ya sauti haipendekezwi kabisa. Ikiwa ni lazima kabisa, lazima ufanye majaribio makubwa ya utambuzi wa awali ili kubaini viwango vya nguvu salama na muda, kwa sababu nishati ya mawimbi ya sauti inaweza kuharibu muunganisho wa chipu ya ndani au ufungaji wa epoksi.
6.5 Usimamizi wa Joto
Usimamizi bora wa joto ni muhimu kwa utendakazi na maisha ya LED. Kama inavyoonyeshwa kwenye mkunjo wa kupunguza nguvu uliorejeshwa kwenye hati ya maelezo, kiwango cha sasa kinapaswa kupunguzwa ipasavyo katika hali ya joto ya mazingira ya juu. Muundo lazima uhakikishe kuwa joto karibu na mwili wa LED linadhibitiwa, kwa kawaida kwa kutumia PCB yenye pedi za kutosha za kupoza joto, visima vya kupoza joto, au baridi za nje kwa matumizi ya nguvu ya juu.
6.6 Ulinzi dhidi ya Utoaji Umeme wa Tuli (ESD)
LED hizi zina usikivu kwa utoaji umeme wa tuli (ESD). ESD inaweza kusababisha uharibifu wa siri au kushindwa mara moja. Daima shughulikia vipengele katika eneo linalolindwa dhidi ya ESD kwa kutumia mkanda wa mkono uliowekwa ardhini na pedi inayoweza kuongoza umeme. Tumia ufungashaji na vifaa vya kuzuia umeme tuli katika michakato yote ya usanikishaji na usindikaji.
7. Habari za Ufungashaji na Kuagiza7.1 Vipimo vya Ufungaji
Device packaging is designed to prevent mechanical and electrostatic damage during transportation and handling.
- Primary Packaging:Antistatic bag.
- Secondary packaging:Inner box, containing 5 bags.
- Tertiary packaging:Outer carton, containing 10 inner boxes.
- Packaging Quantity:Minimum 200 to 500 pieces per bag. Therefore, one outer carton contains 10,000 to 25,000 pieces (10 inner boxes * 5 bags * 200-500 pieces/bag).
7.2 Labeling Instructions
Lebo ya ufungashaji ina misimbo kadhaa inayotumika kwa kufuatilia na kutambua:
- CPN:Customer Part Number.
- P/N:Manufacturer's Production Number (e.g., 333-2SYGD/S530-E2).
- QTY:Idadi kwenye mfuko.
- CAT:Daraja au kitengo cha utendaji (inaweza kuhusiana na upangaji wa nguvu ya mwanga).
- HUE:Msimbo wa urefu wa wimbi kuu.
- REF:Reference code.
- LOT No:Production batch number, used for traceability.
8. Mapendekezo ya Utumizi na Mambo ya Kukusudiwa8.1 Typical Application Scenarios
LED hii inafaa kabisa kutumika kwa:
- Mwongozo wa Hali:Miongozo ya umeme, shughuli au hali katika vifaa vya matumizi ya kielektroniki (runinga, skrini, simu, kompyuta) kwa sababu ya mwangaza wa juu na pembe ya mtazamo iliyolengwa.
- Mwanga wa Nyuma:Uangazaji wa makali au taa ya nyuma ya alama kwa paneli ndogo za LCD zinazohitaji mwanga sawasawa na mkali.
- Onyesho la paneli ya mbele:Uangazaji wa vifungo, swichi, au vipima vya paneli.
8.2 Key Design Considerations
- Udhibiti wa Mkondo:Hakikisha unatumia upinzani wa mfululizo wa udhibiti wa mkondo au kiendesha mkondo thabiti. Tumia voltage ya juu ya mbele (2.4V) kuhesabu thamani ya upinzani, ili kuhakikisha kwamba mkondo hauzidi 25mA hata katika hali mbaya zaidi (VF ndogo zaidi). Fomula: R = (Chanzo cha Voltage - VF_max) / Mkondo wa Lengo.
- Ubunifu wa Joto:Consider the negative impact of temperature on light output and forward voltage. Provide sufficient PCB copper area or other heat dissipation means, especially in high ambient temperature environments or enclosed spaces.
- ESD Protection:Incorporate ESD protection diodes on signal lines connected to the LED anode/cathode that are exposed to the user interface or external connectors.
- Optical Design:A 30-degree viewing angle provides a relatively narrow beam. For wider illumination, consider using a diffuser lens or selecting an LED with a wider native viewing angle.
9. Technical Comparison and Differentiation
While a direct comparison with specific competitor components is not provided, according to its datasheet, the key differentiating features of this LED include:
- Teknolojia ya Chip:Matumizi ya nyenzo za semiconductor za AlGaInP (Aluminium Gallium Indium Phosphide), ambayo ni bora zaidi katika kutoa mwanga wa kahawia, njano na kijani ikilinganishwa na teknolojia ya zamani.
- Mwangaza:Inatoa nguvu ya mwanga ya kawaida ya 80 mcd kwenye 20mA, inayoshindana katika kifurushi cha kawaida cha taa la rangi hii.
- Uimara:Mwongozo wa vipimo unasisitiza muundo thabiti na imara, na unatoa mwongozo wa kina wa uendeshaji na kuunganisha, unaoonyesha kuwa imeundwa kustahimili mchakato wa kawaida wa usanikishaji.
- Usawa:Imetangazwa kuwa haina risasi na inalingana na viwango vya RoHS, ikikidhi kanuni za kisasa za mazingira kwa vipengee vya elektroniki.
10. Maswali Yanayoulizwa Mara kwa Mara (Kulingana na Vigezo vya Kiufundi)
Q1: Je, naweza kuendesha LED hii kwa 30mA ili kupata mwangaza zaidi?
A: Hapana. Kikomo cha juu kabisa cha mkondo endelevu wa mbele ni 25 mA. Kufanya kazi kwa 30mA inazidi kikomo hiki, ambayo itapunguza sana maisha ya LED, kusababisha kupungua kwa kasi kwa mwanga, na kunaweza kusababisha shida kubwa ya joto.
Q2: Chanzo changu cha umeme ni 5V. Kwa mkondo wa kuendesha wa 20mA, nifanye upinzani wa thamani gani?
A: Kwa usalama wa muundo, tumia thamani mbaya zaidi (ya juu) ya VF ya 2.4V. R = (5V - 2.4V) / 0.020A = 130 ohms. Thamani ya kawaida ya juu zaidi iliyo karibu ni 150 ohms. Kwa kutumia 150 ohms, mkondo ni takriban (5V - 2.0V)/150 = 20mA (kwa kutumia VF ya kawaida), hii ni salama. Hakikisha kuthibitisha matumizi ya nguvu ya upinzani: P = I^2 * R = (0.02^2)*150 = 0.06W, kwa hivyo upinzani wa kawaida wa 1/8W (0.125W) unatosha.
Q3: Kwa nini pato la mwanga linapungua wakati kifaa changu kinapokanzwa?
A: Hii ni sifa ya msingi ya LED, kama inavyoonyeshwa kwenye mkunjo wa "Relative Intensity vs. Ambient Temperature". Ufanisi wa nyenzo za semiconductor hupungua kadiri joto la kiungo linavyoongezeka, na hutoa mwanga mdogo chini ya mkondo sawa. Usimamizi bora wa joto katika muundo unaoboreshwa unaweza kupunguza athari hii.
Q4: Je, naweza kutumia safisha sauti ya juu kwenye PCB baada ya kuchomeza LED hizi?
A: Inapendekeziwa kabisa. Mwongozo wa maelezo ya kiufundi unaonyesha kuwa usafishaji wa mawimbi ya sauti ya juu unaweza kuharibu LED kulingana na nguvu na hali ya usanikishaji. Iwapo ni lazima kutumia, unahitaji kufanya majaribio ya utambuzi kabla ya matumizi. Njia mbadala salama zaidi ni kutumia isopropanol pamoja na kusugua kwa upole, au kutumia flux isiyohitaji usafishaji baada ya kuchomelea.
11. Uundaji wa Vitendo na Uchambuzi wa Kesi za Matumizi
Hali: Kubuni seti ya viashiria vya hali kwa ruta ya mtandao.
Mbunizi anahitaji viashiria 5 vya rangi ya njano-kijani vyenye mwangaza, kwa ajili ya nguvu, intaneti, Wi-Fi na bandari mbili za Ethernet. Walichagua LED hii kwa sababu ya mwangaza na rangi yake.
- Circuit Design:The router's internal logic supply is 3.3V. Using a maximum VF of 2.4V and a target current of 18mA (with added margin), the resistance value is (3.3V - 2.4V) / 0.018A = 50 ohms. A standard 51-ohm resistor is selected. The power dissipation per resistor is (0.018^2)*51 ≈ 0.0165W.
- PCB Layout:PCB pads are created strictly according to the package dimension drawing. Use small thermal relief connections to connect the LED pads to the larger ground plane to aid heat dissipation without making soldering difficult.
- Assembly:Assembly personnel follow guidelines: use ESD protection, form leads before placement (if required), and follow the recommended reflow profile with a peak temperature not exceeding 260°C.
- Results:LED hutoa mwongozo wazi na mkali, vitengo vyote vitano vina rangi sawa, na kwa sababu ya muundo unaofaa wa joto na umeme, bidhaa imepita vipimo vya kuegemea.
12. Utangulizi wa Kanuni ya Kazi
LED hii inafanya kazi kulingana na kanuni ya umeme-luminisheni ya makutano ya p-n ya semikondukta. Nyenzo ya chip ni AlGaInP. Wakati voltage chanya inayozidi voltage ya kuwasha diode (takriban 1.7-2.0V) inatumika, elektroni kutoka eneo la aina-n na mashimo kutoka eneo la aina-p huingizwa kwenye eneo la makutano. Vibebaji hivi hujumuika katika eneo lenye ufanisi la semikondukta. Sehemu kubwa ya mchanganyiko huu ni mnururisho, ikimaanisha kuwa hutoa nishati kwa njia ya fotoni (mwanga). Urefu maalum wa wimbi wa 573-575 nm (kijani-manjano) umedhamiriwa na nishati ya pengo la bendi ya muundo wa aloi ya AlGaInP inayotumika katika safu yenye ufanisi ya chip. Kifuniko cha epoksi ya kijani kinachotawanyika hutumika kulinda chip, kufanya kazi kama lenzi kuu kuunda mwendo wa mwanga wa pato, na kutawanya mwanga ili kutoa muonekano sawa zaidi.
13. Technology Trends and Background
This component represents the established mainstream technology for monochromatic indicator LEDs. AlGaInP-based LEDs are the standard for efficient red, amber, and yellow-green emission. Current industry trends associated with such devices include:
- Efficiency Improvement:Utafiti unaoendelea unalenga kuboresha ufanisi wa ndani wa quantum (IQE) na ufanisi wa uchimbaji wa mwanga (LEE) wa nyenzo hizi, na hivyo kupata ukali wa mwanga wa juu zaidi chini ya mkondo wa pembejeo sawa, au ukali sawa chini ya nguvu ya chini.
- Kupunguzwa kwa ukubwa:Ingawa hii ni ufungaji wa kawaida wa taa ya LED, mwelekeo mpana zaidi unaelekea kwenye vifaa vidogo vya kufungia kwenye uso (SMD) (k.m. 0402, 0201), ili kufaa muundo wa PCB wenye msongamano mkubwa, ingawa kwa kawaida hii hufanyika kwa gharama ya pato la jumla la mwanga na uwezo wa kupooza joto.
- Uimarishaji wa kuegemea:Uboreshaji wa mchanganyiko wa Epoxy, vifaa vya kuunganisha Chip na mbinu za kuunganisha waya zinaendelea kuongeza maisha ya kazi ya LED na uvumilivu wa joto.
- Ujumuishaji wa Akili:Mwelekeo mkubwa katika uwanja wa taa ni ujumuishaji wa moja kwa moja wa saketi za udhibiti (kiendeshaji, mawasiliano) ndani ya kifurushi cha LED, na kuunda sehemu "zenye akili". Ingawa sehemu hii maalum ni LED tofauti, isiyo na akili, kuelewa vigezo vyake vya msingi ni msingi wa kutumia suluhisho zaidi zilizojumuishwa.
Detailed Explanation of LED Specification Terminology
Complete Explanation of LED Technical Terminology
I. Core Indicators of Photoelectric Performance
| Istilahi | Kipimo/Uwakilishi | Mafasiri ya Kawaida | Kwa Nini Ni Muhimu |
|---|---|---|---|
| Ufanisi wa Mwanga (Luminous Efficacy) | lm/W (lumen/watt) | Mwanga unaotolewa kwa kila watt ya umeme, unavyozidi kuwa mkubwa ndivyo unavyozidi kuokoa nishati. | Inaamua moja kwa moja kiwango cha ufanisi wa nishati na gharama za umeme za taa. |
| Flux ya Mwanga (Luminous Flux) | lm (lumen) | Jumla ya mwanga unaotolewa na chanzo cha mwanga, unaojulikana kwa kawaida kama "mwangaza". | Huamua kama taa inatosheleza kwa mwangaza. |
| Pembe ya Kuangazia (Viewing Angle) | ° (digrii), k.m. 120° | Pembe ambapo nguvu ya mwanga hupungua hadi nusu, inayoamua upana wa boriti ya mwanga. | Huathiri eneo la mwangaza na usawa wake. |
| Joto la rangi (CCT) | K (Kelvin), kama 2700K/6500K | Joto la rangi ya mwanga, thamani ya chini inaelekea manjano/joto, thamani ya juu inaelekea nyeupe/baridi. | Huamua mazingira ya taa na matumizi yanayofaa. |
| Kielelezo cha Uonyeshaji Rangi (CRI / Ra) | Hakuna kitengo, 0–100 | Uwezo wa chanzo cha mwanga kurejesha rangi halisi ya kitu, Ra≥80 ni bora. | Inaathiri ukweli wa rangi, hutumika katika maeneo yenye mahitaji makubwa kama maduka makubwa, majumba ya sanaa, n.k. |
| Kosa la uvumilivu wa rangi (SDCM) | MacAdam Ellipse Steps, e.g., "5-step" | A quantitative metric for color consistency; a smaller step number indicates better color consistency. | Hakikisha rangi ya taa za kundi moja hazina tofauti. |
| Urefu wa wimbi kuu (Dominant Wavelength) | nm (nanomita), k.m. 620nm (nyekundu) | Thamani ya urefu wa wimbi inayolingana na rangi ya LED zenye rangi. | Huamua hue ya LED za rangi moja kama nyekundu, manjano, kijani, n.k. |
| Usambazaji wa Wigo (Spectral Distribution) | Mkunjo wa Urefu wa Mawimbi dhidi ya Ukubwa | Inaonyesha usambazaji wa ukubwa wa mwanga unaotolewa na LED katika urefu wa mawimbi tofauti. | Inaathiri ubora wa kuonyesha rangi na ubora wa rangi. |
II. Vigezo vya Umeme
| Istilahi | Ishara | Mafasiri ya Kawaida | Vidokezo vya Ubunifu |
|---|---|---|---|
| Forward Voltage | Vf | The minimum voltage required to light up an LED, similar to a "starting threshold". | Voltage ya chanjo ya umeme lazima iwe ≥ Vf, voltage inaongezeka wakati LED nyingi zimeunganishwa mfululizo. |
| Forward Current | If | The current value that makes the LED emit light normally. | Constant current drive is often used, where the current determines brightness and lifespan. |
| Maksimum ya mkondo wa msukumo (Pulse Current) | Ifp | Kilele cha mkondo kinachoweza kustahimili kwa muda mfupi, kinachotumika kwa kudimisha au kumulika. | Pulse width and duty cycle must be strictly controlled to prevent overheating and damage. |
| Reverse Voltage | Vr | The maximum reverse voltage that an LED can withstand; exceeding it may cause breakdown. | The circuit needs to prevent reverse connection or voltage surges. |
| Thermal Resistance | Rth (°C/W) | Upinzani wa joto kutoka kwenye chip hadi kwenye sehemu ya kuunganishia, thamani ya chini inaonyesha usambazaji bora wa joto. | Upinzani mkubwa wa joto unahitaji muundo wenye nguvu zaidi wa usambazaji wa joto, vinginevyo joto la kiungo litaongezeka. |
| ESD Immunity | V (HBM), k.m. 1000V | Uwezo wa kupinga mshtuko wa umeme tuli, thamani ya juu zaidi inamaanisha uwezo mkubwa wa kuepusha uharibifu kutokana na umeme tuli. | Antistatic measures must be implemented during production, especially for high-sensitivity LEDs. |
III. Thermal Management and Reliability
| Istilahi | Key Indicators | Mafasiri ya Kawaida | Athari |
|---|---|---|---|
| Junction Temperature | Tj (°C) | The actual operating temperature inside the LED chip. | For every 10°C reduction, the lifespan may double; excessively high temperatures lead to lumen depreciation and color shift. |
| Kupungua kwa Mwanga (Lumen Depreciation) | L70 / L80 (saa) | Muda unaohitajika ili mwangaza upunguke hadi 70% au 80% ya thamani ya awali. | Kufafanua moja kwa moja "maisha ya huduma" ya LED. |
| Lumen Maintenance | % (e.g., 70%) | The percentage of remaining brightness after a period of use. | Characterizes the ability to maintain brightness after long-term use. |
| Color Shift | Δu′v′ or MacAdam Ellipse | Kiwango cha mabadiliko ya rangi wakati wa matumizi. | Inaathiri uthabiti wa rangi wa eneo la taa. |
| Thermal Aging | Material performance degradation | Degradation of packaging materials due to prolonged high temperatures. | Inaweza kusababisha kupungua kwa mwangaza, mabadiliko ya rangi, au kushindwa kwa mzunguko wazi. |
Nne. Ufungaji na Nyenzo
| Istilahi | Aina za Kawaida | Mafasiri ya Kawaida | Sifa na Matumizi |
|---|---|---|---|
| Aina za Ufungaji | EMC, PPA, Ceramic | The housing material that protects the chip and provides optical and thermal interfaces. | EMC ina mzuri kwa upinzani wa joto na gharama nafuu; kauri ina utoaji bora wa joto na maisha marefu. |
| Muundo wa Chip | Usakinishaji wa Kawaida, Usakinishaji wa Kichupo (Flip Chip) | Chip electrode arrangement method. | Flip-chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications. |
| Phosphor coating | YAG, silicate, nitride | Coated on the blue LED chip, partially converted to yellow/red light, mixed to form white light. | Fosfori tofauti huathiri ufanisi wa mwanga, halijoto ya rangi, na ubora wa kuonyesha rangi. |
| Lenzi/Usanifu wa Optics | Planar, microlens, total internal reflection | Optical structure on the package surface, controlling light distribution. | Determines the emission angle and light distribution curve. |
V. Quality Control and Binning
| Istilahi | Binning Content | Mafasiri ya Kawaida | Kusudi |
|---|---|---|---|
| Kikomo cha Flux ya Mwanga | Kificho kama 2G, 2H | Group by brightness level, each group has a minimum/maximum lumen value. | Ensure consistent brightness for products within the same batch. |
| Voltage binning | Codes such as 6W, 6X | Grouped by forward voltage range. | Facilitates driver power matching and improves system efficiency. |
| Color binning | 5-step MacAdam ellipse | Group by color coordinates to ensure colors fall within an extremely small range. | Ensure color consistency and avoid color unevenness within the same luminaire. |
| Color temperature binning | 2700K, 3000K, etc. | Group by color temperature, each group has a corresponding coordinate range. | Meet the color temperature requirements of different scenarios. |
VI. Testing and Certification
| Istilahi | Kigezo/Uchunguzi | Mafasiri ya Kawaida | Maana |
|---|---|---|---|
| LM-80 | Lumen Maintenance Test | Long-term operation under constant temperature conditions to record brightness attenuation data. | Used for estimating LED lifespan (in conjunction with TM-21). |
| TM-21 | Standard for Life Projection | Projecting lifespan under actual use conditions based on LM-80 data. | Providing scientific life prediction. |
| IESNA Standard | Illuminating Engineering Society Standard | Inashughuli njia za kupima za kioo, umeme na joto. | Msingi wa upimaji unaokubaliwa na tasnia. |
| RoHS / REACH | Uthibitisho wa kiwango cha mazingira | Hakikisha bidhaa haina vitu hatari (kama risasi, zebaki). | Masharti ya kuingia katika soko la kimataifa. |
| ENERGY STAR / DLC | Uthibitisho wa ufanisi wa nishati. | Uthibitishaji wa Ufanisi na Utendaji wa Bidhaa za Taa. | Hutumiwa kwa kawaida katika miradi ya ununuzi wa serikali na ruzuku, kuimarisha ushindani wa soko. |