LED Chip 383-2SYGD/S530-E2 Datasheet - Bright Yellow-Green - 20mA - 2.0V - Technical Documentation

1. Product Overview

Hii karatasi inatoa maelezo kamili ya kiufundi ya taa ya LED yenye rangi ya manjano-kijani yenye mwangaza mkubwa. Kifaa hiki ni sehemu ya mfululizo ulioundwa kwa matumizi yanayohitaji utoaji bora wa mwanga na uaminifu. Inatumia teknolojia ya chip ya AlGaInP, imefungwa kwenye mfinyanzi wa kijani unaosambaa mwanga, na hutoa mwanga wa kipekee na mkali wa manjano-kijani.

Faida kuu ya LED hii ni pamoja na muundo wake thabiti, kufuata kanuni kuu za mazingira (RoHS, REACH, halojeni-bure), na kutoa chaguzi nyingi za ufungaji (kama vile kwenye mkanda na rejareja) ili kusaidia usanikishaji wa kiotomatiki. Iliundwa kwa ajili ya kuunganishwa katika vifaa mbalimbali vya matumizi ya kaya na viwanda vinavyohitaji taa ya kiashiria thabiti na yenye mwangaza.

Soko lengwa linajumuisha wazalishaji wa paneli za maonyesho, vifaa vya mawasiliano, na vifaa vya kompyuta, ambapo mahitaji ya uaminifu wa vipengele na utendaji wa macho ni ya juu sana.

2. In-depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

Absolute maximum ratings define the stress limits that may cause permanent damage to the device. These are not recommended operating conditions.

• Continuous Forward Current (IF):25 mA. This is the maximum DC current that can be continuously applied to the LED.
• Peak Forward Current (IFP):60 mA. This pulse current rating (duty cycle 1/10, 1 kHz) allows for short periods of high-intensity operation, suitable for multiplexing or strobe effects.
• Reverse Voltage (VR):5 V. Exceeding this voltage under reverse bias may cause junction breakdown.
• Power Dissipation (Pd):60 mW. The maximum power the package can dissipate as heat, calculated as VF * IF.
• Operating and Storage Temperature:Ranges from -40°C to +85°C (operating) and -40°C to +100°C (storage). This wide range ensures functionality in harsh environments.
• Soldering Temperature (Tsol):260°C for 5 seconds. This defines the tolerance for the reflow soldering temperature profile.

2.2 Electro-Optical Characteristics

Vigezo hivi vilipimwa chini ya hali za kawaida za majaribio Ta=25°C na IF=20mA, na vinatoa data ya msingi ya utendaji.

• Nguvu ya Mwanga (Iv):40 (kiwango cha chini), 80 (kiwango cha kawaida) mcd. Hii inabainisha mwangaza unaohisiwa wa LED kwa jicho la mwanadamu. Kiwango cha kawaida cha 80 mcd kinaonyesha pato lake la mwangaza linafaa kwa matumizi ya kiashiria.
• Pembe ya Mtazamo (2θ1/2):25° (kiwango cha kawaida). Pembe hii nyembamba ya mtazamo inakusanya mwanga kuwa mwale unaoelekezwa zaidi, unaofaa kabisa kwa matumizi yanayohitaji nukta ya mwanga iliyolengwa.
• Peak Wavelength (λp):575 nm (Typical). The wavelength at which spectral emission is strongest.
• Dominant Wavelength (λd):573 nm (typical value). Wavelength ya mwanga unaotambuliwa na jicho la binadamu, unaofafanua "kijani-kimanjano kilichoangaza".
• Upana wa mnururisho wa wigo (Δλ):20 nm (typical value). Masafa ya urefu wa wimbi yanayotolewa, yanaonyesha rangi safi kiasi.
• Voltage ya mwelekeo mzuri (VF):1.7 (Min), 2.0 (Typ), 2.4 (Max) V. The voltage drop across the LED when operating at 20mA. This is crucial for circuit design and current-limiting resistor calculation.
• Reverse Current (IR):10 μA Max at VR=5V. Specifies the leakage current under reverse bias.

Vigezo muhimu vinatoa kutokuwa na uhakika wa kipimo: nguvu ya mwanga (±10%), wavelength kuu (±1.0nm) na voltage ya mbele (±0.1V), ambayo ni muhimu kwa udhibiti wa ubora na uchambuzi wa ukingo wa muundo.

3. Performance Curve Analysis

Spec ina curves nyingi za sifa, zinazoonyesha tabia ya kifaa chini ya hali tofauti. Hii ni muhimu kwa kuelewa utendaji nje ya pointi za kawaida za majaribio.

3.1 Curve of Relative Intensity versus Wavelength

Mpangilio huu unaonyesha usambazaji wa nguvu ya wigo. Kilele kinazingatia karibu 575 nm, upana wa kawaida (FWHM) wa 20 nm, na kuthibitisha alama ya rangi ya manjano-kijani. Umbo lake ni sifa ya nyenzo za semiconductor za AlGaInP.

3.2 Directivity Pattern

The radiation pattern visually demonstrates a 25° viewing angle. The intensity is highest at 0° (on-axis) and drops to half at approximately ±12.5° off-axis, thereby defining the 2θ1/2 angle.

3.3 Mchoro wa Uhusiano wa Sasa ya Mbele na Voltage ya Mbele (IV Curve)

This graph illustrates the exponential relationship between the current (I) and voltage (V) of a diode. This curve allows designers to determine VF at currents other than 20mA. The typical 2.0V VF at 20mA can be seen on this graph.

3.4 Mchoro wa Uhusiano wa Nguvu ya Jamaa na Sasa ya Mbele

Mkunjo huu unaonyesha kuwa, katika safu ya uendeshaji, pato la mwanga (nguvu) lina uhusiano wa mstari takriban na mkondo wa mbele. Unathibitisha kuwa kuendesha LED kwenye mkondo wa juu unaoendelea (25mA) kutazalisha mwangaza zaidi kuliko kwenye mkondo wa majaribio ya 20mA.

3.5 Mchoro wa Tabia ya Joto

Michoro miwili muhimu inaunganisha utendaji na joto la mazingira (Ta):Uhusiano wa Nguvu ya Jamaa na Joto la Mazingira:Inaonyesha pato la mwanga linapungua kadri joto linavyoongezeka. Kupunguzwa huku ni muhimu kwa matumizi katika mazingira ya joto la juu; LED hupungua mwangaza kwenye joto la juu.Uhusiano wa Mkondo wa Mbele na Joto la Mazingira:Inaelezea jinsi voltage ya mbele (VF) inavyobadilika kulingana na joto kwa mkondo uliopewa. Kwa kawaida, LED ina mgawo hasi wa joto wa VF, ikimaanisha kuwa hupungua kidogo kadiri joto linavyoongezeka.

4. Mechanical and Packaging Information

4.1 Package Dimensions

Mechanical drawings provide critical dimensions for PCB pad design and assembly. Key specifications include:

4.2 Polarity Identification

The cathode (negative) pin is typically indicated by a flat on the LED lens, a shorter lead, or a marking on the package. Correct polarity must be observed during installation to prevent damage from reverse bias.

5. Soldering and Assembly Guide

Uendeshaji sahihi ni muhimu kwa kuegemea. Maelezo ya kina yametolewa:

5.1 Umbo la Pini

• Bend the leads at a minimum distance of 3mm from the epoxy lamp bead base.
• Perform formingZamani soldering.
• Epuka kutumia mkazo kwenye kifuniko; mkazo unaweza kusababisha ufa wa epoxy au kuharibu chip.
• Kata pini kwenye joto la kawaida.
• Hakikisha mashimo ya PCB yanalingana kikamilifu na pini za LED ili kuepuka mkazo wa usakinishaji.

5.2 Storage

• Store at ≤30°C and ≤70% relative humidity. Under these conditions, the shelf life is 3 months.
• For longer storage (up to 1 year), use a sealed container with nitrogen and desiccant.
• Epuka mabadiliko ya ghafla ya joto katika mazingira yenye unyevunyevu ili kuzuia umande.

5.3 Welding Process

Kanuni za Jumla:Sharti kuhifadhi umbali wa chini wa mm 3 kati ya mwambao wa kuunganishia na taa ya epoxy.

Kuunganishia kwa Mkono:- Joto la ncha ya chuma cha kuunganishia: Hadi 300°C (inayofaa kwa chuma cha kuunganishia chenye nguvu ya juu ya 30W).

Wave soldering/Dip soldering:- Preheating temperature: up to 100°C (max. 60 seconds).

Key considerations:- Avoid applying stress to the pins during the high-temperature stage.

5.4 Cleaning

• If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute.
• Air-dry at room temperature.
• Avoid ultrasonic cleaning unless absolutely necessary and pre-verified, as it may damage the LED chip or bonding wires.

5.5 Thermal Management

Ubunifu bora wa joto ni muhimu kwa kuongeza maisha na kudumisha utendaji.

5.6 ESD (Electrostatic Discharge) Protection

LED zinaathiriwa na kutokwa kwa umeme tuli na mawimbi ya voltage, ambayo yanaweza kuharibu chipu ya semiconductor. Ni lazima kuzingatia tahadhari za kawaida za uendeshaji wa ESD katika michakato yote ya usanikishaji na uendeshaji. Tumia dawati la kutuliza, mkanda wa mkono na vyombo vinavyoweza kusafirisha umeme.

6. Packaging and Ordering Information

6.1 Packaging Specifications

LED packaging is designed to ensure protection during transportation and handling:Primary Packaging:Antistatic bags (minimum 200 to 500 pieces per bag).Secondary packaging:5 bags are placed into one inner box.Tertiary packaging:Masanduku kumi ya ndani yanapakiwa kwenye sanduku kuu moja la nje. Ufungashaji huu wa tabaka nyingi huzuia unyevunyevu, umeme tuli na uharibifu wa kimwili.

6.2 Labeling Instructions

Lebo kwenye ufungashaji ina maelezo muhimu yanayotumika kwa ufuatiliaji na utambulisho:CPN:Customer Production Number.P/N:Manufacturer Production Number (e.g., 383-2SYGD/S530-E2).QTY:Idadi ya ufungaji.CAT:Luminous Intensity Grade/Binning.HUE:Dominant Wavelength Grade/Binning.REF:Forward voltage grade/classification.LOT No:Production lot number, used for traceability.

7. Application Recommendations

7.1 Mandhari ya Kawaida ya Utumiaji

Kama ilivyoorodheshwa kwenye maelezo ya kiufundi, LED hii inafaa kwa:Televisioni na skrini ya kuonyesha:Inatumika kama kiashiria cha hali, mwanga wa nyuma wa kitufe au taa za mapambo.Simu:Call status indicator, message waiting light, or keyboard backlight.Computer:Power indicator, hard drive activity light, or decorative accents on peripherals. Its high brightness and reliability make it an ideal choice for consumer electronics products where long life and consistent color are important.

7.2 Design Considerations

• Current Limiting:Always use a series resistor or constant current driver to limit the forward current to the desired value (e.g., 20mA). Calculate the resistor value using the formula R = (Supply Voltage - VF) / IF.
• Thermal Design:Ensure sufficient PCB copper area or other heat dissipation measures if operating near maximum ratings or in high ambient temperatures.
• Optical Design:A 25° viewing angle provides a focused beam. For wider illumination, consider using a diffuser lens or selecting an LED with a wider viewing angle.
• Kinga ya ESDKatika matumizi nyeti, fikiria kuongeza diode ya kuzuia voltage ya muda mfupi (TVS) au hatua nyingine za kinga kwenye mstari wa LED.

8. Technical Comparison and Differentiation

Ingawa maelezo haya ya pekee hayatoi kulinganisha moja kwa moja na bidhaa nyingine, inaweza kudokezwa kuwa sifa kuu ya utofautishaji wa LED hii ni:Teknolojia ya Chip:使用AlGaInP（磷化铝镓铟），该材料在黄、橙、红光谱区域以高效率著称，而InGaN则用于蓝光和绿光。环保合规：完全符合RoHS、REACH和无卤素标准（溴<900ppm，氯<900ppm，溴+氯<1500ppm），这对于面向法规严格的全球市场的产品是一个显著优势。 -Pembe nyembamba ya mtazamo:25°视角比许多标准LED（通常为30-60°）更窄，提供了更定向的光输出，适用于特定的指示应用。详细操作指南：Mwongozo kamili wa kulehemu, uhifadhi na ESD unazidi vipimo vya msingi, ukionyesha muundo unalenga kutegemewa na uwezekano wa kutengenezwa.

9. Maswali Yanayoulizwa Mara kwa Mara (Kulingana na Vigezo vya Kiufundi)

Q1: Kutumia chanzo cha umeme cha 5V kuendesha LED hii kwa 20mA, thamani gani ya upinzani inapaswa kutumika?A1: Using typical VF 2.0V: R = (5V - 2.0V) / 0.020A = 150 ohms. Use the nearest standard value (e.g., 150Ω or 160Ω). Always calculate using the maximum VF (2.4V) to ensure sufficient current limiting under worst-case conditions: R_min = (5V - 2.4V) / 0.020A = 130 ohms.

Q2: Can I drive this LED at its maximum continuous current of 25mA?A2: Yes, but proper heat dissipation must be ensured. The luminous intensity will be higher than at 20mA (refer to the relative intensity vs. current curve), but the forward voltage will also be slightly higher, and the device will operate at a higher temperature. Derating may be necessary in high ambient temperatures.

Q3: The dominant wavelength is 573nm. Will the color be exactly the same for all units?A3: Hapana. 573nm ni thamani ya kawaida. Kuna uvumilivu wa utengenezaji, na LED kawaida hupangwa kulingana na ngazi za HUE. Kutokuwa na uhakika wa kipimo ni ±1.0nm. Ili kudumisha uthabiti wa rangi kati ya LED nyingi katika bidhaa moja, taja au chagua seli kutoka kwa ngazi moja ya HUE.

Q4: Kwa nini umbali wa kuunganisha (3mm kutoka kwa taa) ni muhimu sana?A4: Hii inazuia joto la kupita kiasi wakati wa kuunganisha lisifike kwenye taa ya epoxy kupitia pini. Joto la kupita kiasi linaweza kusababisha mkazo wa joto, kuvunja epoxy, kuharibika kwa kiambatisho cha chip cha ndani, au kubadilika kwa rangi ya lenzi, na hivyo kupunguza mwanga unaotolewa.

10. Mifano ya Uundaji na Matumizi Halisi

Case: Designing a Status Indicator Panel for a Network RouterDesigners need to install multiple bright, reliable status LEDs (power, internet, Wi-Fi, LAN ports) on routers intended for use in various home environments.Reason for Selection:This bright yellow-green LED was chosen for its high typical intensity (80 mcd), ensuring visibility even in well-lit rooms. Its compliance with environmental regulations is mandatory for the global market. It is supplied on tape and reel to support high-volume automated PCB assembly.Implementation:The LED is driven via a GPIO pin of the main microcontroller and a series resistor at 18mA (slightly below the 20mA test point for margin). The PCB layout provides a small thermal pad connected to the ground plane for heat dissipation. The 25° viewing angle is ideal, as the LED is mounted behind a small transparent hole on the router's front panel, creating a clear, bright spot of light for each status. The detailed soldering temperature profile from the datasheet is programmed into the pick-and-place and reflow oven equipment to ensure a high-yield, reliable manufacturing process.

11. Introduction to Working Principles

This LED operates based on the principle of electroluminescence in a semiconductor p-n junction. The active region consists of AlGaInP (aluminum gallium indium phosphide) layers. When a forward voltage exceeding the junction's built-in potential (approximately 2.0V) is applied, electrons from the n-type region and holes from the p-type region are injected into the active region. Here, they recombine, releasing energy in the form of photons (light). The specific composition of the AlGaInP alloy determines the bandgap energy, which directly corresponds to the wavelength (color) of the emitted light—in this case, a yellowish-green of approximately 573-575 nm. The green diffused resin package is used to protect the delicate semiconductor chip, shape the radiation pattern into a 25° viewing angle, and slightly diffuse the light to improve viewing uniformity.

12. Mwenendo wa Teknolojia

LED technology continues to evolve, with the following overarching trends impacting such devices:Efficiency Improvement:Uboreshaji endelevu wa sayansi ya nyenzo na usanifu wa chipi huleta ufanisi bora wa kutolea mwanga (pato zaidi la mwanga kwa kila wati ya umeme), na hivyo kuwezesha viashiria vya mwanga vyenye mwangaza zaidi au matumizi ya nguvu ya chini.Udogo:Msukumo wa vifaa vya elektroniki vidogo zaidi unahitaji ukubwa wa ufungaji wa LED kupungua endelevu, huku ukidumisha au kuboresha utendaji wa macho.Uthabiti ulioimarishwa na maisha marefu:Uboreshaji wa nyenzo za ufungaji, mbinu za kuunganisha chip, na teknolojia ya fosforesheni (kwa taa za LED nyeupe) unaendelea kuongeza urefu wa maisha ya huduma na uthabiti chini ya hali ngumu.Ujumuishaji wa Akili:Kuna mwelekeo wa kuelekea LED zenye IC ya udhibiti iliyojengwa ndani (kama vile LED zinazoweza kushikiliwa za RGB), lakini kwa viashiria rahisi kama hivi, msisitizo bado uko kwenye vipengele tofauti vinavyotoa utendaji bora kwa gharama nafuu.Viwango kali zaidi za mazingira:Kufuata kanuni kama vile RoHS na REACH sasa ni mahitaji ya msingi. Vigezo vya halojeni vilivyosisitizwa katika maelezo haya ni sehemu ya mwelekeo wa kuondoa vitu hatarishi katika mnyororo wa usambazaji wa elektroniki.