Table of Contents
- 1. Product Overview
- 1.1 Core Features and Advantages
- 1.2 Target Applications
- 2. Technical Parameter Analysis
- 2.1 Viwango vya Juu Kabisa
- 2.2 Photoelectric Characteristics
- 3. Performance Curve Analysis
- 3.1 Spectral and Spatial Distribution
- 3.2 Electrical and Thermal Relationship
- 4. Taarifa za Mitambo na Ufungaji
- 4.1 Package Dimensions
- 4.2 Polarity Identification
- 5. Mwongozo wa Uchomaji na Usanikishaji
- 5.1 Uundaji wa Pini
- 5.2 Storage
- 5.3 Welding Process
- 5.4 Cleaning
- 5.5 Udhibiti wa Joto
- 6. Ufungaji na Taarifa za Kuagiza
- 6.1 Packaging Specifications
- 6.2 Maelezo ya Lebo
- 7. Mapendekezo ya Matumizi na Mazingatio ya Ubunifu
- 7.1 Ubunifu wa Saketi
- 7.2 Mpangilio wa PCB
- 7.3 Thermal Management in Arrays
- 8. Ulinganisho wa Kiufundi na Tofauti
- 9. Maswali Yanayoulizwa Mara kwa Mara (Kulingana na Vigezo vya Kiufundi)
- 9.1 Can I drive this LED continuously at 25mA?
- 9.2 Why is the viewing angle only 30 degrees?
- 9.3 Je, unaelejeaje thamani za "kawaida" katika hati ya maelezo?
- 9.4 Je, inahitaji heatsink?
- 10. Mifano ya Utumizi Halisi
- 11. Kanuni ya Uendeshaji
- 12. Mwelekeo wa Teknolojia
1. Product Overview
Waraka huu unaelezea kwa kina vipimo vya kiufundi vya taa ya LED ya mviringo yenye kipenyo cha 5mm, ya kuingizwa moja kwa moja, na yenye rangi nyekundu ya kina. Kifaa hiki kimetengenezwa kwa kutumia teknolojia ya chip ya AlGaInP na imefungwa kwenye mchanganyiko wa plastiki nyekundu unaotawanyika mwanga, ili kutoa mwanga mkali wa rangi nyekundu ya kina. Ni kipengele kigumu na cha kuaminika, kinachofaa kwa matumizi mbalimbali ya viashiria vya mwanga na taa za nyuma katika vifaa vya kielektroniki vya watumiaji.
1.1 Core Features and Advantages
- Mwangaza wa Juu:Iliyoundaliwa kwa matumizi yanayohitaji nguvu ya mwanga ya juu zaidi.
- Chaguo za Pembe ya Mtazamo:Inatoa chaguo mbalimbali za pembe ya mtazamo ili kukidhi mahitaji tofauti ya matumizi.
- Ufungashaji:Provided in tape and reel packaging, suitable for automated assembly processes.
- Environmental Compliance:The product is lead-free and complies with the RoHS standard.
- Uaminifu:Imetengenezwa kwa uaminifu na uthabiti, inafaa kwa utendaji wa muda mrefu.
1.2 Target Applications
LED hii inatumika kimsingi kama kiashiria au chanzo cha mwanga wa nyuma katika vifaa mbalimbali vya elektroniki, ikiwa ni pamoja na lakini sio tu:
- Runinga
- Kionyeshi cha kompyuta
- Simu
- Kompyuta binafsi na vifaa vya ziada
2. Technical Parameter Analysis
Sehemu hii inatoa ufafanuzi wa kina na usio na upendeleo wa vigezo muhimu vya umeme, vya mwanga na vya joto vya kifaa vilivyobainishwa kwenye jedwali la "Absolute Maximum Ratings" na "Electro-Optical Characteristics".
2.1 Viwango vya Juu Kabisa
These ratings define the limiting conditions beyond which permanent damage to the device may occur. Functional operation is not guaranteed under or beyond these conditions.
- Continuous Forward Current (IF):25 mA. Hii ndiyo mkondo wa moja kwa moja wa juu zaidi unaoweza kutumika kwa LED kwa muda mrefu.
- Kilele cha mkondo wa mbele (IFP):60 mA. Mkondo huu wa juu zaidi unaruhusiwa tu chini ya hali ya msukumo (uwiano wa kazi 1/10 @ 1 kHz), unafaa kwa multiplexing au kufikia mwangaza wa juu zaidi kwa muda mfupi.
- Reverse voltage (VR):5 V. Exceeding this voltage under reverse bias may lead to junction breakdown.
- Power dissipation (Pd):60 mW. The maximum power that the package can dissipate, calculated by the formula VF* IF.
- Operating and Storage Temperature:-40°C to +85°C (operating), -40°C to +100°C (storage). These wide ranges indicate its suitability for industrial and automotive environments.
- Soldering Temperature:260°C kwa sekunde 5. Hii inafafanua uvumilivu wa usambazaji wa joto wa uuzaji wa reflow au uuzaji wa mikono.
2.2 Photoelectric Characteristics
Hizi ni vigezo vya kawaida vya utendaji vilivyopimwa chini ya hali ya kawaida ya majaribio ya 25°C na mkondo wa mbele wa 20mA.
- Mwangaza wa Kuwaka (Iv):100 mcd (thamani ya chini), 160 mcd (thamani ya kawaida). Hii inapima mwangaza unaohisiwa wa mwanga nyekundu sana. Kutokuwa na uhakika wa kipimo ni ±10%.
- Pembe ya Mtazamo (2θ1/2):30° (kawaida). Mtazamo huu mwembamba ni sifa ya lenzi zisizotawanyika au zinazotawanyika kidogo, zinazozalisha mwale uliojikita zaidi.
- Urefu wa wimbi wa kilele (λp):650 nm (kawaida). Urefu wa wimbi ambao nguvu ya mwanga inatoka kwa kiwango cha juu zaidi.
- Urefu wa wimbi mkuu (λd):639 nm (kawaida). Urefu wa wimbi mmoja unaohisiwa na jicho la mwanadamu, unaofafanua rangi. Kutokuwa na uhakika ni ±1.0 nm.
- Forward voltage (VF):2.0 V (typical), 2.4 V (maximum), at IF=20mA condition. This low voltage is typical for AlGaInP red LEDs. The measurement uncertainty is ±0.1V.
- Reverse current (IR):10 µA (maximum), at VRChini chini ya hali ya =5V. Hii inabainisha mkondo wa juu zaidi wa uvujaji katika hali ya kuzimwa.
3. Performance Curve Analysis
Mikunjo ya kawaida ya sifa inaonyesha wazi tabia ya kifaa chini ya hali tofauti, jambo muhimu sana kwa muundo wa saketi na usimamizi wa joto.
3.1 Spectral and Spatial Distribution
“Relative Intensity vs. WavelengthThe curve shows a distribution centered at 650 nm with a narrow spectral bandwidth (Δλ ~20 nm), confirming the color purity of the deep red.DirectionalityThe curve visually represents the 30° viewing angle, showing the angular distribution of light intensity.
3.2 Electrical and Thermal Relationship
- Forward Current vs. Forward Voltage (I-V Curve):This exponential curve is the basis for designing current-limiting circuits. At 20mA, the typical VFis 2.0V, which can serve as the design point for series resistor calculation: R = (VPower Supply- VF) / IF.
- Relative Intensity vs. Forward Current:Mkunjo huu unaonyesha kuwa katika safu ya kawaida ya uendeshaji, mwanga unaotolewa na mkondo unahusiana takriban kwa mstari, ikiruhusu udhibiti rahisi wa mwangaza kupitia udhibiti wa mkondo.
- Uwezo wa jamaa dhidi ya joto la mazingira:Inaonyesha kuwa mwanga unaotolewa hupungua kadri joto la kiungo linavyoongezeka. Katika mazingira ya joto la juu au miundo ya nguvu ya juu, upungufu huu wa joto lazima uzingatiwe.
- Mkondo wa mbele dhidi ya joto la mazingira:Although this is not a direct rating, considering this curve in conjunction with derating requirements reveals that operating current must be reduced at elevated ambient temperatures to maintain reliability and prevent accelerated luminous flux degradation.
4. Taarifa za Mitambo na Ufungaji
4.1 Package Dimensions
This device is a standard 5mm round LED with a red diffused lens. Key dimensional specifications include:
- All dimensions are in millimeters.
- The pin pitch is a 0.1-inch (2.54mm) grid, compatible with standard prototyping boards.
- The flange (the edge at the bottom of the dome) height must be less than 1.5mm to ensure proper seating on the PCB.
- Unless otherwise specified, the general tolerance for dimensions is ±0.25mm.
4.2 Polarity Identification
Kathodi kawaida hutambuliwa kwa uso wa gorofa na/au pini fupi kwenye ukingo wa kifurushi cha LED. Lazima kuzingatia upeo sahihi wakati wa usakinishaji.
5. Mwongozo wa Uchomaji na Usanikishaji
Uendeshaji sahihi ni muhimu kudumisha ukomo na utendaji wa kifaa.
5.1 Uundaji wa Pini
- Bend the leads at a minimum distance of 3mm from the bottom of the epoxy lamp bead.
- Forming OperationMust be soldering.
- Lazima ifanyike kabla ya soldering. Epuka kutumia mkazo kwenye kifurushi. Uteuzi usiofanana wa mashimo ya PCB unaosababisha mkazo kwenye pini unaweza kuharibu epoxy na utendaji wa LED.
- Kata pini kwenye joto la kawaida la chumba.
5.2 Storage
- Masharti ya uhifadhi: Joto ≤30°C, unyevunyevu wa jamaa ≤70%. Chini ya hali hizi, muda wa uhalali ni miezi 3.
- Kwa uhifadhi wa muda mrefu zaidi (hadi mwaka 1), tumia chombo kilichofungwa kwa hermetiki chenye nitrojeni na vifaa vya kukausha.
- Epuka mabadiliko ya ghafla ya joto katika mazingira yenye unyevunyevu ili kuzuia umande.
5.3 Welding Process
Key Rules:Maintain a minimum distance of 3mm from the solder point to the epoxy resin LED.
- Manual Welding:Soldering iron tip temperature ≤300°C (for irons up to 30W max), soldering time ≤3 seconds.
- Wave Soldering or Dip Soldering:Preheat ≤100°C (max 60 seconds), solder bath temperature ≤260°C, time ≤5 seconds.
- Epuka mkazo kwenye pini wakati wa hatua ya joto kali.
- Usifanye uuzaji tena (uzaji wa mara moja).
- Baada ya kuzalisha, acha LED ipoe polepole hadi joto la kawaida; epuka kupoa kwa kasi.
5.4 Cleaning
- Ikiwa ni lazima, tumia tu isopropanoli ya joto la kawaida kusafisha, kwa muda ≤ dakika 1.
- Epuka usafishaji wa sauti ya juu-sana. Ikiwa ni lazima kabisa, uchunguzi wa kina wa awali unahitajika ili kuhakikisha hakuna uharibifu.
5.5 Udhibiti wa Joto
Ubunifu sahihi wa usimamizi wa joto ni muhimu. Kama inavyoonyeshwa na curve ya kupunguza uwezo, katika hali ya joto ya juu ya mazingira, ni lazima kupunguza nguvu ya sasa inayotumika ipasavyo. Upungufu wa upoaji joto utasababisha pato la mwanga kupungua, mabadiliko ya rangi na kupungua kwa maisha ya huduma.
6. Ufungaji na Taarifa za Kuagiza
6.1 Packaging Specifications
Ufungaji wa kifaa unalenga kuzuia umeme wa tuli (ESD) na uharibifu wa unyevu:
- Ufungaji wa kiwango cha kwanza:Mfuko wa kuzuia umeme wa tuli.
- Secondary packaging:Inner box containing multiple anti-static bags.
- Tertiary packaging:Sanduku la nje linalo vyombo vingi vya ndani.
- Idadi ya vifurushi:Kila mfuko angalau vipande 200-500. Kila kisanduku cha ndani mifuko 5. Kila sanduku la nje visanduku 10 vya ndani.
6.2 Maelezo ya Lebo
Lebo kwenye kifurushi inaweza kuwa na msimbo unaotumika kwa kufuatilia na vipimo:
- CPN:Nambari ya Sehemu ya Mteja.
- P/N:Nambari ya Sehemu ya Mtengenezaji (mfano, 333-2SDRD/S530-A3).
- QTY:Included quantity.
- CAT / Ranks:Possibly indicates performance grading (e.g., luminous intensity ranks).
- HUE:Msimbo wa urefu wa wimbi kuu.
- LOT No:Nambari ya kundi ya uzalishaji inayoweza kufuatiliwa.
7. Mapendekezo ya Matumizi na Mazingatio ya Ubunifu
7.1 Ubunifu wa Saketi
Hakikisha unatumia upinzani wa kuzuia mkondo uliosanikishwa kwa mfululizo. Kulingana na V ya kawaidaF(2.0V) kukokotoa, lakini hakikisha mzunguko unaweza kustahimili V ya juu kabisaF(2.4V) bila kuzidi mkondo unaohitajika. Kwa mfano, kwa kutumia chanzo cha umeme cha 5V, lengo la IFni 20mA: R = (5V - 2.0V) / 0.02A = 150 Ω. Angalia mkondo chini ya V ya juu kabisa:FI = (5V - 2.4V) / 150 Ω ≈ 17.3 mA, hii ni salama.
7.2 Mpangilio wa PCB
Ensure the hole positions are precisely aligned with the 2.54mm pin pitch. Provide sufficient clearance around the LED body to meet the requirement of a 3mm minimum solder joint distance. For indicator lights that need to be viewed from multiple angles, consider the LED's 30° viewing angle when positioning it on the component.
7.3 Thermal Management in Arrays
Wakati LED nyingi zinatumiwa kwa msongamano au kufanya kazi kwa mkondo wa kuendesha wa juu, joto linalozalishwa pamoja linapaswa kuzingatiwa. Toa nafasi ya kutosha, uingizaji hewa, au fikiria kutumia mkondo wa kuendesha wa chini ili kudhibiti halijoto ya kiungo, ili kudumisha mwangaza na maisha thabiti.
8. Ulinganisho wa Kiufundi na Tofauti
Hii LED ya rangi nyekundu ya kina inayotumia teknolojia ya AlGaInP ina faida kuu zifuatazo:
- Ikilinganishwa na LED ya zamani ya rangi nyekundu ya GaAsP:Kwa mkondo sawa, ufanisi wa mwanga ni mkubwa zaidi, na pato la mwanga ni mkali zaidi.
- Comparison of wide-angle scattering LED:The 30° viewing angle provides a more directional beam, ideal for panel indicator lights, with light primarily visible from the front, reducing stray light.
- Comparison of standard red (~630nm):Nyekundu ya kina zaidi (639-650nm) inaweza kufaa zaidi kwa mahitaji maalum ya urembo, matumizi ya sensor, au hali zinazohitaji kutofautishwa na rangi ya nyekundu ya machungwa.
9. Maswali Yanayoulizwa Mara kwa Mara (Kulingana na Vigezo vya Kiufundi)
9.1 Can I drive this LED continuously at 25mA?
Yes, 25mA is the absolute maximum continuous forward current. However, for optimal lifespan and reliability, it is generally recommended to operate below the maximum rating. It is recommended to drive at a typical test current of 20mA.
9.2 Why is the viewing angle only 30 degrees?
The 30° viewing angle is a design feature of this specific LED, achieved through the lens shape and the degree of scattering in the resin. It is suitable for applications requiring a more focused beam rather than wide-area illumination.
9.3 Je, unaelejeaje thamani za "kawaida" katika hati ya maelezo?
Thamani "kawaida" zinawakilisha utendaji wa wastani unaotarajiwa wa bidhaa chini ya hali maalum. Kifaa kimoja kinaweza kutofautiana ndani ya safu ya thamani za juu/chini zilizotolewa. Wakati wa kubuni mzunguko, hakikisha kuwa inafanya kazi vizuri hata chini ya mchanganyiko mbaya zaidi wa vigezo (mfano, V ya chiniFpamoja na kikomo cha juu cha sasa).
9.4 Je, inahitaji heatsink?
对于在典型环境条件(<85°C)下以20mA运行的单个LED,由于其功耗较低(~40mW),通常不需要专用的散热片。然而,在阵列、高环境温度或接近最大电流运行时,通过PCB铜箔面积进行热管理就变得很重要。
10. Mifano ya Utumizi Halisi
Scenario: Designing a power indicator light for a device.
- Requirements:Kiashiria cha nyekundu-kirefu angavu kinachoweza kuonekana kutoka mbele ya paneli.
- Uchaguzi wa Vipengele:LED hii ilichaguliwa kwa sababu ya nguvu yake ya kawaida ya mwanga iliyoinuka (160mcd) na pembe yake ya kuangalia iliyolengwa ya digrii 30.
- Ubunifu wa Sakiti:Kifaa kinatolewa nguvu kwa njia ya mstari wa usambazaji wa 3.3V. Kokotoa upinzani wa mfululizo: R = (3.3V - 2.0V) / 0.02A = 65 Ω. Chagua thamani ya kawaida iliyo karibu zaidi ya 68 Ω, inayotoa IF≈ (3.3V-2.0V)/68Ω ≈ 19.1 mA.
- Utekelezaji wa PCB:Use a package with 2.54mm pitch. Place the LED on the front panel, with the lens passing through a 5.2mm hole. Pad placement must ensure compliance with the rule of maintaining a 3mm distance from the LED body.
- Assembly:Manually solder the LED using a temperature-controlled soldering iron set to 280°C, with the solder joint under the LED bead, and control the soldering time within 3 seconds.
11. Kanuni ya Uendeshaji
Hii ni diode inayotoa mwanga ya semiconductor. Wakati voltage chanya inayozidi uwezo wa ndani wa kiungo inatumika, elektroni na mashimo huingizwa kwenye eneo lenye ufanisi kutoka kwa nyenzo za aina-n na aina-p, mtawalia. Katika chip ya AlGaInP (aluminium-gallium-indium-phosphide), hizi vibebaji hubadilishana na kutolewa kwa nishati kwa njia ya fotoni. Muundo maalum wa aloi ya AlGaInP huamua nishati ya pengo la bendi, ambayo inalingana moja kwa moja na urefu wa wimbi la mwanga nyekundu unaotolewa (~650 nm). Chip imefungwa kwenye epoksi nyekundu inayotawanyika, inayotoa ulinzi wa mitambo, kuunda pato la mwanga (pembe ya maoni ya 30°), na kutawanya mwanga ili kutoa muonekano sawa.
12. Mwelekeo wa Teknolojia
Ingawa LED hii ya 5mm ya kuingiza moja kwa moja inawakilisha teknolojia ya ufungashaji iliyokomaa na inayotumika sana, mwenendo mpana zaidi wa tasnia ya LED bado unazingatia:
- Uboreshaji wa Ufanisi:Uboreshaji endelevu wa sayansi ya nyenzo unalenga kuzalisha lumens zaidi kwa kila watt (ufanisi mkubwa wa mwanga) kutoka kwa AlGaInP na nyenzo nyingine za semiconductor.
- Vifaa vilivyowekwa kwenye uso (SMD) vinatawala:Kwa usanikishaji wa otomatiki na kiwango kikubwa, ufungaji wa SMD (kama vile 0603, 0805, 1206 na ufungaji maalum wa LED) umebadilisha kwa kiasi kikubwa LED za kuingiza moja kwa moja katika miundo mipya kwa sababu ya ukubwa mdogo na gharama ya chini ya usanikishaji.
- Uthabiti wa rangi na upangaji:Uendelevu wa michakato ya utengenezaji unaruhusu uainishaji (kikundi) mkali zaidi wa urefu wa wimbi (rangi) na nguvu ya mwanga, ukitoa utendakazi unaotabirika zaidi kwa wabunifu.
- Uthabiti na Urefu wa Maisha:Mwelekeo wa utafiti unalenga kuboresha udumishaji wa mtiririko wa mwanga (uwezo wa kupinga kupungua kwa pato la mwanga kwa muda) na urefu wa maisha, hasa chini ya hali ya kazi ya joto la juu na mkondo mkubwa.
5mm through-hole LEDs remain a staple for prototyping, hobbyist projects, educational purposes, and applications where manual assembly or replacement is anticipated, thanks to their simplicity, robustness, and wide availability.
Detailed Explanation of LED Specification Terminology
Complete Explanation of LED Technical Terminology
I. Viashiria Muhimu vya Utendaji wa Umeme na Mwanga
| Istilahi | Unit/Representation | Layman's Explanation | Why It Matters |
|---|---|---|---|
| Ufanisi wa Mwanga (Luminous Efficacy) | lm/W (lumen kwa watt) | Kiasi cha mwanga kinachotolewa kwa kila wati wa umeme, cha juu zaidi ndivyo kinachoweka nishati. | Huamua moja kwa moja kiwango cha ufanisi wa nishati ya taa na gharama ya umeme. |
| Luminous Flux | lm (lumen) | Jumla ya kiasi cha mwanga kinachotolewa na chanzo cha mwanga, kinachojulikana kwa kawaida kama "mwangaza". | Kuamua kama taa inatoa mwanga wa kutosha. |
| Pembe ya kuangazia (Viewing Angle) | ° (digrii), kama vile 120° | Pembe wakati ukali wa mwanga unapungua kwa nusu, huamua upana wa boriti ya mwanga. | Huathiri eneo la mwangaza na usawa wake. |
| Joto la rangi (CCT) | K (Kelvin), k.m. 2700K/6500K | Joto la rangi la mwanga, thamani ya chini inaelekea manjano/joto, thamani ya juu inaelekea nyeupe/baridi. | Huamua mazingira ya taa na matumizi yanayofaa. |
| Kielelezo cha Uonyeshaji Rangi (CRI / Ra) | No unit, 0–100 | The ability of a light source to reproduce the true colors of objects, Ra≥80 is recommended. | Affects color fidelity, used in high-demand places such as shopping malls and art galleries. |
| Tofauti ya rangi (SDCM) | Hatua za duaradufu za MacAdam, k.m. "5-step" | Kipimo cha nambari cha usawa wa rangi, idadi ndogo ya hatua inaonyesha usawa mkubwa wa rangi. | Hakikisha hakuna tofauti ya rangi kati ya taa za kundi moja. |
| Dominant Wavelength | nm (nanomita), k.m. 620nm (nyekundu) | Thamani ya wavelength inayolingana na rangi ya LED ya rangi. | Amua rangi ya LED za rangi moja kama nyekundu, manjano, kijani, n.k. |
| Spectral Distribution | Wavelength vs. Intensity Curve | Inaonyesha usambazaji wa nguvu za mwanga unaotolewa na LED katika urefu tofauti wa mawimbi. | Inaathiri ubora wa kuonyesha rangi na ubora wa rangi. |
Electrical Parameters
| Istilahi | Symbols | Layman's Explanation | Design Considerations |
|---|---|---|---|
| Voltage ya Mbele (Forward Voltage) | Vf | Voltage ya chini inayohitajika kuwasha LED, kama "kizingiti cha kuanzisha". | Voltage ya chanzo cha usukumaji lazima iwe ≥ Vf, voltage inajumlishwa wakati LED nyingi zimeunganishwa mfululizo. |
| Forward Current | If | The current value that allows the LED to emit light normally. | Mara nyingi hutumia usukumaji wa mkondo wa mara kwa mara, mkondo huamua mwangaza na maisha ya taa. |
| Mkondo wa juu zaidi wa msukumo (Pulse Current) | Ifp | Peak current that can be withstood for a short period, used for dimming or flashing. | Pulse width and duty cycle must be strictly controlled, otherwise overheating damage will occur. |
| Reverse Voltage | Vr | The maximum reverse voltage that an LED can withstand; exceeding it may cause breakdown. | Mzunguko unahitaji kuzuia uunganishaji wa nyuma au mshtuko wa voltage. |
| Thermal Resistance | Rth (°C/W) | Upinzani wa joto kutoka kwenye chip hadi kwenye sehemu ya kuunganishia, thamani ya chini inaonyesha usambazaji bora wa joto. | Upinzani wa juu wa joto unahitaji muundo wa nguvu zaidi wa kupoza joto, vinginevyo joto la kiungo litaongezeka. |
| Uvumilivu wa Utoaji Umeme wa Tuli (ESD Immunity) | V (HBM), k.m. 1000V | Uwezo wa kukabiliana na mshtuko wa umeme, thamani ya juu zaidi inaweza kuzuia uharibifu wa umeme. | Katika uzalishaji, ni muhimu kuchukua hatua za kinga dhidi ya umeme, hasa kwa LED zenye usikivu mkubwa. |
Tatu, Usimamizi wa Joto na Uaminifu
| Istilahi | Viashiria Muhimu | Layman's Explanation | Athari |
|---|---|---|---|
| Joto la Kiungo (Junction Temperature) | Tj (°C) | Joto halisi la kufanya kazi ndani ya Chip ya LED. | For every 10°C reduction, the lifespan may double; excessively high temperatures lead to lumen depreciation and color shift. |
| Lumen Depreciation | L70 / L80 (saa) | Muda unaohitajika ili mwangaza upunguke hadi 70% au 80% ya thamani ya awali. | Kufafanua moja kwa moja "maisha ya huduma" ya LED. |
| Lumen Maintenance | % (e.g., 70%) | Asilimia ya mwangaza uliobaki baada ya kutumia kwa muda fulani. | Inaonyesha uwezo wa kudumisha mwangaza baada ya matumizi ya muda mrefu. |
| Color Shift | Δu′v′ or MacAdam Ellipse | The degree of color change during usage. | Inaathiri usawa wa rangi katika mandhari ya taa. |
| Uzeefu wa joto (Thermal Aging) | Kupungua kwa utendaji wa nyenzo | Uharibifu wa nyenzo za ufungaji unaosababishwa na joto la muda mrefu. | Inaweza kusababisha kupungua kwa mwangaza, mabadiliko ya rangi, au kushindwa kwa mzunguko wazi. |
IV. Ufungaji na Nyenzo
| Istilahi | Aina za Kawaida | Layman's Explanation | Sifa na Matumizi |
|---|---|---|---|
| Aina ya Ufungashaji | EMC, PPA, Kauri | Nyenzo za kifuniko zinazolinda chip na kutoa mwingiliano wa mwanga na joto. | EMC ina msimamo mzuri wa joto na gharama nafuu; kauri ina usambazaji bora wa joto na maisha marefu. |
| Muundo wa chip | Front-side, Flip Chip | Chip Electrode Layout. | Flip-chip design offers better heat dissipation and higher luminous efficacy, suitable for high-power applications. |
| Phosphor coating | YAG, silicate, nitride | Coated on the blue LED chip, partially converted to yellow/red light, mixed to form white light. | Different phosphors affect luminous efficacy, color temperature, and color rendering. |
| Lens/Optical Design | Flat, Microlens, Total Internal Reflection | Optical structures on the encapsulation surface control light distribution. | Determines the emission angle and light distribution curve. |
V. Quality Control and Binning
| Istilahi | Bin Content | Layman's Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Binning | Codes such as 2G, 2H | Grouped by brightness level, each group has a minimum/maximum lumen value. | Hakikisha mwangaza wa bidhaa za kundi moja unaolingana. |
| Voltage binning | Codes such as 6W, 6X | Grouped by forward voltage range. | Facilitates driver power supply matching and improves system efficiency. |
| Color Grading | 5-step MacAdam Ellipse | Group by color coordinates to ensure colors fall within a minimal range. | Ensure color consistency to avoid uneven colors within the same luminaire. |
| Color temperature binning | 2700K, 3000K, n.k. | Pangawianishwa kulingana na joto la rangi, kila kikundi kina safu maalum ya kuratibu. | Inakidhi mahitaji ya joto tofauti la rangi kwa matukio mbalimbali. |
Sita, Uchunguzi na Uthibitishaji
| Istilahi | Kigezo/Uchunguzi | Layman's Explanation | Maana |
|---|---|---|---|
| LM-80 | Mtihani wa Kudumisha Lumen | Long-term illumination under constant temperature conditions, recording brightness attenuation data. | Used to estimate LED lifetime (combined with TM-21). |
| TM-21 | Standard for Life Projection | Projecting the lifespan under actual operating conditions based on LM-80 data. | Toa utabiri wa kisayansi wa maisha ya taa. |
| IESNA standard | Illuminating Engineering Society Standards | Covers optical, electrical, and thermal test methods. | Industry-recognized testing basis. |
| RoHS / REACH | Uthibitisho wa usawa na mazingira | Hakikisha bidhaa haina vitu hatari (kama risasi, zebaki). | Masharti ya kuingia katika soko la kimataifa. |
| ENERGY STAR / DLC | Uthibitisho wa Ufanisi wa Nishati | Uthibitisho wa Ufanisi wa Nishati na Utendaji kwa Bidhaa za Taa. | Inatumika kwa shughuli za ununuzi wa serikali na miradi ya ruzuku, kuimarisha ushindani wa soko. |