Dual-Color SMD LED Datasheet - AlInGaP Chip - Green and Red Light - 30mA - Simplified Chinese Technical Documentation

1. Product Overview

Waraka huu unaelezea kwa kina vipimo vya kiufundi vya LED ya SMD yenye mwangaza mkubwa na rangi mbili. Kifaa hiki kina viini viwili huru vya semiconductor vilivyojumuishwa kwenye kifurushi kimoja: kimoja kinatoa mwanga wa kijani, na kingine kinatoa mwanga mwekundu. Kwa kutumia teknolojia ya kisasa ya viini vya AlInGaP, LED hii imebuniwa hasa kwa matumizi yanayohitaji viashiria viwili tofauti vya rangi kutoka kwa kifurushi kimoja kompakt. Faida zake kuu ni pamoja na nguvu kubwa ya mwanga, utangamano na michakato ya usanikishaji otomatiki, na kufuata viwango vya mazingira.

LED hii inatumia ufungashaji wa kiwango cha tasnia wa mkanda wa kubeba wa milimita 8, inayotolewa kwenye reeli ya inchi 7, inayofaa kwa mstari wa usanikishaji wa SMT wenye kiasi kikubwa na otomatiki. Inaendana na michakato mbalimbali ya kuunganishia, ikiwa ni pamoja na kuunganishia kwa joto la kurudisha (IR) na kuunganishia kwa joto la mvuke (vapor phase), na imekuwa katika kundi la bidhaa za kijani, zikifuata maagizo yanayohusiana na mazingira.

2. In-depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

Upeo wa uendeshaji wa kifaa umebainishwa chini ya hali ya joto la mazingira (Ta) ya 25°C. Chipi za mwanga wa kijani na nyekundu zinashiriki viwango vya juu sawa, vikihakikisha utendakazi ulio sawa na ukingo wa usalama wa muundo.

• Matumizi ya nguvu:75 mW kwa kila chipi. Kigezo hiki kinafafanua nguvu ya juu ambayo LED inaweza kutawanyisha kwa usalama kama joto chini ya uendeshaji endelevu.
• Upeo wa mkondo wa mbele:80 mA, inaruhusiwa chini ya hali ya msisitizo (1/10 ya uwiano wa wajibu, upana wa msisitizo 0.1ms). Kipimo hiki ni muhimu kwa matumizi ya multiplexing au ishara fupi zenye nguvu.
• Mkondo wa mbele wa DC:30 mA. Hii ndiyo mkondo wa juu unaopendekezwa wa mbele endelevu, ili kuhakikisha uendeshaji thabiti wa muda mrefu.
• Kupunguzwa kwa mkondo:Starting from 25°C, the linear derating is 0.4 mA/°C. For each degree Celsius above 25°C, the maximum allowable continuous current must be reduced by 0.4 mA to prevent thermal overstress.
• Reverse Voltage:5 V. Exceeding this voltage in the reverse direction will cause immediate and irreversible damage to the LED chip.
• Temperature Range:The operating and storage temperature range is -55°C to +85°C, indicating its suitability for industrial and extended environmental applications.
• Soldering Tolerance:The device can withstand 260°C wave or infrared reflow soldering for 5 seconds, and 215°C vapor phase reflow soldering for 3 minutes.

2.2 Electrical and Optical Characteristics

Vipimo hivi vinafanywa kwa Ta=25°C na mkondo wa kawaida wa majaribio (IF) 2 mA, na vinabainisha utendakazi wa msingi wa LED.

• Nguvu ya Mwanga (Iv):Kila rangi angalau 1.8 mcd, kwa kawaida 2.5 mcd. Hii ni mwangaza unaohisiwa wa mwanga unaopimwa na sensor iliyochujwa kufuatana na mkondo wa jibu wa kuona kwa mwanga wa CIE (jicho la binadamu).
• Pembe ya Mtazamo (2θ1/2):Kwa kawaida ni digrii 130. Pembe hii pana ya mtazamo inaonyesha hali ya utoaji wa mwanga uliosambaa, usiolenga, unaofaa kwa viashiria vya hali vinavyohitaji kuonekana kutoka kwa mtazamo mpana.
• Urefu wa Wimbi la Kilele (λP):Mwanga wa Kijani: 570 nm (kwa kawaida). Mwanga Mwekundu: 636 nm (kwa kawaida). Huu ndio urefu wa wimbi ambao pato la nguvu la wigo hufikia thamani yake ya juu zaidi.
• Wavelength kuu (λd):Mwanga wa kijani: 569 nm (thamani ya kawaida). Mwanga mwekundu: 633 nm (thamani ya kawaida). Hii ndiyo wavelength moja inayowakilisha zaidi rangi inayohisiwa ya LED, inayotokana na chati ya rangi ya CIE.
• Upana wa wigo (Δλ):Mwanga wa kijani: 15 nm (thamani ya kawaida). Mwanga mwekundu: 20 nm (thamani ya kawaida). Hii inafafanua usafi wa wigo; upana mwembamba zaidi, rangi inakuwa iliyojaa na safi zaidi.
• Voltage ya mbele (VF):Mwanga wa kijani: 1.8V (thamani ya kawaida), 2.2V (thamani ya juu). Mwanga mwekundu: 1.7V (thamani ya kawaida), 2.2V (thamani ya juu). Hii ni kushuka kwa voltage kwenye LED wakati inapita mkondo maalum. Hii ni muhimu kwa muundo wa saketi na uteuzi wa usambazaji wa nguvu.
• Mkondo wa nyuma (IR):Upeo wa 10 μA kwa VR=5V. Hii ni kipimo cha uvujaji wa kiungo katika hali ya kuzima.
• Capacitance (C):Typical value is 40 pF at VF=0V, f=1MHz. Relevant for high-frequency switching applications.

3. Grading System Description

LEDs are binned according to performance to ensure consistency within production lots. Designers can specify bins to meet precise application requirements.

3.1 Kugawanya Kwa Nguvu ya Mwanga

Green and red chips use the same intensity binning code. Tolerance within each bin is +/-15%.

• Binning Code G:At 2mA, 1.80 mcd (min) to 2.80 mcd (max).
• Bin Code H:At 2mA, 2.80 mcd (min) to 4.50 mcd (max).
• Bin Code J:At 2mA, 4.50 mcd (min) to 7.10 mcd (max).

3.2 Kugawanya Kwa Wavelength Kuu (Kwa Mwanga wa Kijani Pekee)

Only green chips have specified wavelength binning to control color consistency. The tolerance for each bin is +/- 1nm.

• Bin Code C:567.5 nm to 570.5 nm.
• Bin Code D:570.5 nm to 573.5 nm.
• Bin Code E:573.5 nm to 576.5 nm.

4. Uchambuzi wa Curve ya Utendaji

Although specific graphical curves (e.g., Figure 1, Figure 6) are referenced in the datasheet, their typical characteristics can be described based on technology and specified parameters.

Mkondo wa mbele dhidi ya Voltage ya mbele (Mkondo-Voltage Curve):LED ya AlInGaP inaonyesha uhusiano wa kielelezo wa kipekee wa I-V. Thamani ya kawaida ya VF ya takriban 1.8V inaonyesha kwamba voltage yake ya uendeshaji ni ya chini ikilinganishwa na baadhi ya nyenzo nyingine za semiconductor. Curve hii itaonyesha kuwashwa kwa ghafla kwenye voltage ya kizingiti, ikifuatiwa na eneo ambapo voltage huongezeka takriban kwa mstari na mkondo.

Nguvu ya Mwanga dhidi ya Mkondo wa Mbele (Mwangaza-Mkondo Curve):Katika anuwai ya uendeshaji inayopendekezwa (hadi 30mA DC), pato la mwanga kwa kawaida huwa la mstari na mkondo. Hata hivyo, kwenye mikondo ya juu zaidi, ufanisi unaweza kupungua kutokana na athari za joto na mambo mengine yasiyo ya mstari ndani ya semiconductor.

Utengamano wa Joto:Nguvu ya mwanga ya LED kwa kawaida hupungua kadiri joto la kiungo linavyoongezeka. Kipengele maalum cha kupunguza mkondo (0.4 mA/°C) ni matokeo ya moja kwa moja ya tabia hii ya joto, iliyokusudiwa kudumisha uaminifu. Voltage ya mbele pia ina mgawo hasi wa joto, ikimaanisha kuwa itapungua kidogo kadiri joto linavyoongezeka.

Usambazaji wa Wigo:Chipu ya kijani, yenye kilele cha kawaida cha 570 nm, upana mwembamba wa 15 nm, itatoa mwanga wa kijani uliojaa. Chipu ya nyekundu, yenye kilele cha 636 nm, upana wa 20 nm, inatoa mwanga wa nyekundu wa kawaida. Urefu huu wa mawimbi uko kabisa ndani ya eneo la usikivu wa juu la jicho la binadamu.

5. Taarifa za Mitambo na Ufungaji

5.1 Device Dimensions and Pin Assignment

LED hii inalingana na vipimo vya ufungaji vya kawaida vya SMD kulingana na EIA. Lensi ni nyeupe kama maji. Mgawanyiko wa ndani wa pini za chipu mbili ni kama ifuatavyo:

• Chipu ya Kijani:Imeunganishwa kwenye pini 1 na 3.
• Chipu ya Nyekundu:Unganisha kwenye pini 2 na 4.

Usanidi huu unaruhusu LED mbili kuendeshwa kikamilifu kwa kujitegemea. Isipokuwa imebainishwa vinginevyo, uvumilivu wote wa vipimo ni ±0.10 mm.

5.2 Recommended Land Pattern

Muundo wa pad unaopendekezwa (vipimo vya pad) umetolewa ili kuhakikisha umbo sahihi la mshono wakati wa upakiaji tena, utulivu wa mitambo na utoaji wa joto. Kufuata mpango huu ni muhimu kwa kufikia muunganisho wa kuaminika wa usakinishaji wa uso na kuzuia kusimama kwa mwamba au kupotoka.

5.3 Carrier Tape and Reel Packaging

Kifaa hiki kinasambazwa kwenye mkanda uliochongwa wenye upana wa milimita 8. Vipimo muhimu vya ufungaji ni pamoja na:

• Vipimo vya Reel:Diameter 7 inches.
• Quantity per Reel:3000 pieces.
• Minimum Order Quantity (MOQ):Minimum order starts from 500 pieces remaining.
• Cover Tape:Empty component pockets are sealed with top cover tape.
• Missing Component:According to packaging standards, a maximum of two consecutive LEDs are allowed to be missing.
• Standard:Packaging complies with ANSI/EIA 481-1-A-1994 specification.

6. Soldering and Assembly Guidelines

6.1 Mkunjo Unaopendekezwa wa Reflow Soldering

Two suggested infrared (IR) reflow profiles are provided: one for standard (tin-lead) soldering processes and another for lead-free soldering processes. The lead-free profile is specifically designed for use with Sn-Ag-Cu (SAC) alloy solder paste. Both profiles define key parameters such as preheat temperature and time, peak temperature, and time above liquidus to ensure proper solder joint formation while preventing excessive thermal stress on the LED package.

6.2 Masharti ya Jumla ya Uchomeaji

• Uchimbaji wa Umeme wa ReflowUpashaji joto: 120-150°C, kwa muda wa sekunde 120 kwa upeo. Kiwango cha juu cha joto: hadi 240°C. Muda juu ya mstari wa kioevu: hadi sekunde 10.
• Uchimbaji wa Umeme wa WaveUpashaji joto: hadi 100°C, kwa muda wa sekunde 60 kwa upeo. Wimbi la solder: hadi 260°C, kwa muda wa sekunde 10 kwa upeo.
• Uchimbaji wa Umeme wa Mkono (Chuma cha kuchomelea)Joto: hadi 300°C. Muda wa kuchomelea: hadi sekunde 3 kwa kila kiungo (mara moja tu).

6.3 Usafishaji

Ikiwa utahitaji kusafisha baada ya kuchomelea, tumia kemikali maalum tu. Kemikali zisizoidhinishwa zinaweza kuharibu vifuniko vya LED. Pendekezo: weka LED kwenye etanoli au isopropanoli kwa dakika moja tu kwenye halijoto ya kawaida.

6.4 Uhifadhi na Uendeshaji

• Mazingira ya Uhifadhi:Usizidi 30°C na unyevu wa jamaa wa 70%.
• Uvumilivu wa Unyevu:LED zilizotolewa kwenye mfuko asilia wa kukinga unyevu zinapaswa kuchomelewa kwa njia ya reflow ndani ya wiki moja. Kwa uhifadhi wa muda mrefu nje ya mfuko asilia, zihifadhi kwenye chombo kilichotiwa muhuri chenye vifaa vya kukausha au kikaushi cha nitrojeni.
• Kupasha Joto (Baking):Components stored outside their moisture barrier bag for over one week must be baked at approximately 60°C for at least 24 hours prior to assembly to remove absorbed moisture and prevent the "popcorn" effect during reflow soldering.

7. Mapendekezo ya Utumizi

7.1 Mazingira ya Kawaida ya Utumizi

This bi-color LED is ideal for applications requiring multi-state indication from a single point, such as:

• Status Indicators:Power (Green=On, Red=Off/Error), Network Activity, Battery Charge Status (Red=Charging, Green=Full).
• Consumer Electronics:Viashiria kwenye vifaa vya nyumbani, vya sauti na video, na vifaa vya ziada vya kompyuta.
• Paneli ya udhibiti wa viwanda:Kiashiria cha hali ya mashine (kijani = inafanya kazi, nyekundu = imesimama/haribifu).
• Taa za ndani za gari:Kiashiria cha dashibodi au koni yenye utendaji maradufu.

7.2 Mazingatio ya Ubunifu wa Sakiti

Njia ya kuendesha:LED ni kifaa kinachoendeshwa kwa mkondo. Ili kuhakikisha mwangaza sawa, hasa wakati LED nyingi zinatumiwa sambamba,Inapendekeza sanaTumia kipingamanishi mfululizo kimoja kwa kila LED (Mfano wa Sakiti A). Haipendekezwi kudhibiti LED nyingi sambamba moja kwa moja kutoka kwa chanzo cha voltage (Mfano wa Sakiti B), kwani tofauti ndogo za sifa za voltage ya mbele (VF) kati ya LED moja na nyingine zitasababisha mgawanyiko tofauti wa mkondo na mwangaza.

Thamani ya kipingamanishi mfululizo (R_s) inaweza kuhesabiwa kwa kutumia sheria ya Ohm: R_s= (V_chanzo- V_F) / I_F, ambapo V_Fni voltage ya LED kwenye mkondo unaohitajika I_F.

Voltage ya mbele chini ya.

7.3 Electrostatic Discharge (ESD) Protection

• LEDs are sensitive to electrostatic discharge, which can degrade or damage the semiconductor junction. Precautions must be taken during handling and assembly:
• Personnel should wear grounded wrist straps or anti-static gloves.
• All workstations, tools, and equipment must be properly grounded.
• Use conductive or dissipative mats on work surfaces.

Store and transport LEDs in ESD protective packaging.

8. Ulinganishi wa Kiufundi na TofautiKipengele muhimu cha kutofautisha cha bidhaa hii niUtekelezaji wa utendakazi wa rangi mbili katika kifuniko kimoja cha SMDna matumizi ya.

Teknolojia ya Chip ya AlInGaP

• . Ikilinganishwa na LED ya rangi moja, kifaa hiki hukifanya kipande cha PCB kiwe na nafasi ndogo, hupunguza idadi ya vipengele, na hurahisisha usanikishaji wa matumizi yanayohitaji rangi mbili. Ikilinganishwa na teknolojia nyingine ya rangi mbili (mfano, chip moja inayotumia rangi ya phosphor), matumizi ya chip mbili huru za AlInGaP yana faida zifuatazo:Color Saturation:
• AlInGaP provides highly saturated, pure green and red light without the need for phosphor conversion, resulting in higher color purity.Efficiency:
• AlInGaP is known for its high external quantum efficiency, especially in the red and amber spectral regions, which helps devices achieve high brightness.Independent Control:

The two chips are electrically isolated, allowing fully independent control of color, brightness, and blinking patterns.

9. Frequently Asked Questions (FAQ)
Q1: Can I drive both the green and red LEDs at their maximum DC current (30mA each) simultaneously?

A1: Ndiyo, lakini lazima uzingatie matumizi ya jumla ya nguvu. Kwa 30mA, VF ya kawaida ni 1.8V (kijani) na 1.7V (nyekundu), jumla ya nguvu ni takriban (0.03A * 1.8V) + (0.03A * 1.7V) = 0.105W au 105 mW. Hii inazidi kiwango cha chip moja cha 75 mW. Kwa hivyo, kufanya kazi kwa wakati mmoja kwa mkondo kamili kunaweza kuhitaji usimamizi wa joto au kupunguza nguvu kulingana na halijoto ya mazingira na mpangilio wa PCB, ili kuhakikisha joto la kiungo liko ndani ya mipaka salama.
Q2: Je, kuna tofauti gani kati ya urefu wa wimbi la kilele na urefu wa wimbi kuu?

A2: Urefu wa wimbi la kilele (λP) ni urefu wa wimbi halisi ambapo LED hutoa nguvu nyingi zaidi ya mwanga. Urefu wa wimbi kuu (λd) ni thamani iliyohesabiwa kulingana na chati ya rangi ya CIE, inayowakilisha rangi inayohisiwa kama urefu wa wimbi mmoja. Kwa vyanzo vya mwanga wa rangi moja kama vile AlInGaP LED, hizi mbili kwa kawaida ziko karibu sana, lakini λd ni parameta inayohusiana zaidi kwa vipimo vya rangi katika matumizi.
Q3: Je, ninawezaje kuelewa msimbo wa kugawanya wakati wa kuagiza?

A3: Unaweza kubainisha kiwango cha nguvu unachohitaji (kwa mfano, "J" kwa mwangaza wa juu zaidi), na kwa chip ya kijani, unaweza pia kubainisha kiwango cha urefu wa wimbi kuu (kwa mfano, "D" kwa kivuli maalum cha kijani). Hii inahakikisha unapokea LED zilizo na utendakazi thabiti. Ikiwa haujabainisha, unaweza kupokea mchanganyiko wa kundi kutoka kwa uzalishaji.
Q4: Je, inahitaji heatsink?

A4: Careful thermal design is crucial for continuous operation at or near the maximum DC current, especially under high ambient temperatures or when both colors are illuminated. While a single indicator may not require a dedicated heatsink, it is recommended to ensure a good thermal path from the LED pad to the PCB copper layer (using thermal vias or large copper pours) to aid heat dissipation and maintain performance and lifespan.

10. Uundaji na Uchambuzi wa Kesi za Matumizi

Scenario: Designing a Dual-State Power Indicator for Portable DevicesRequirements:

Indicate "Charging" (red) and "Full/On" (green). The device is powered by a 5V USB source. The indicator should be clearly visible, but brightness should not be excessive to save power.

1. Design Steps:Current Selection:_FSelect a forward current (I
2. ). Kulingana na ukubwa wa mwanga wa kawaida wa 2.5 mcd kwenye 2 mA, 5 mA inaweza kuwa mwanzo mzuri wa kiashiria cha wazi.
   Hesabu ya upinzani:KwaLED nyekundu_F(V
   R_{Thamani ya kawaida = 1.7V), kwenye 5 mA:}R
   红= (5V - 1.7V) / 0.005A = 660 Ω. Tumia upinzani wa kawaida wa 680 Ω.Kwa_FLED ya kijani
   R_(VThamani ya kawaida = 1.8V), kwa 5 mA:
3. R绿_F= (5V - 1.8V) / 0.005A = 640 Ω. Tumia upinzani wa kawaida wa 620 Ω au 680 Ω._FUkaguzi wa nguvu:
4. Nguvu kwa kila LED: P = V* I
5. ≈ 1.7V * 0.005A = 8.5 mW (nyekundu) na 1.8V * 0.005A = 9 mW (kijani). Zote mbili ziko chini sana ya kiwango cha juu cha 75 mW, hata kama zote zinawaka wakati mmoja (katika matumizi haya hazitawaka pamoja).Utekelezaji wa saketi:

Connect the red LED (pins 2,4) with its 680Ω resistor to a microcontroller GPIO pin, set as a high-level output during charging. Connect the green LED (pins 1,3) with its resistor to another GPIO pin, activated when charging is complete or the device is powered on. The common cathode/anode configuration (implied by separate pins) allows for this simple independent drive.

PCB Layout:Follow the recommended pad dimensions. Ensure there is no solder mask between pads to prevent solder bridging. Include a small area of copper pour connected to the ground plane beneath the LED to provide slight thermal relief.11. Technical Principle Introduction

This LED is based on_{Aluminum Indium Gallium Phosphide (AlInGaP)}semiconductor material. This is a III-V compound semiconductor whose bandgap energy—the energy difference between the valence band and the conduction band—can be precisely tuned by varying the proportions of Al, In, Ga, and P. This tunability allows engineers to design materials that emit light at specific wavelengths in the red, orange, amber, and green regions of the visible spectrum._{When a forward voltage is applied across the p-n junction of the AlInGaP chip, electrons are injected from the n-region into the p-region, and holes are injected from the p-region into the n-region. These charge carriers recombine in the active region of the junction. In a direct bandgap semiconductor like AlInGaP, this recombination event releases energy in the form of a photon (a particle of light). The wavelength (color) of this photon is directly determined by the material's bandgap energy (E}photon

= hc/λ ≈ E

Bandgap

• ). The two-color package accommodates two such independently manufactured chips, each made from AlInGaP material with different compositions, producing green and red light respectively.12. Industry Trends and Developments
• The SMD indicator LED market continues to evolve. Key trends associated with such components include:Miniaturization:
• Although this device uses a standard package, the market continuously drives towards smaller package sizes (e.g., 0402, 0201) to save space on increasingly dense PCBs, particularly in consumer portable electronics.Efficiency Improvement:
• Uboreshaji endelevu wa sayansi ya nyenzo na usanifu wa chip unalenga kutoa mwanga zaidi (lumeni) kutoka kwa kila wati ya umeme, na hivyo kupunguza matumizi ya nguvu katika kiwango fulani cha mwangaza.Uimara na Uthabiti Ulioimarishwa:
• Uboreshaji wa nyenzo za ufungaji na mbinu za kuweka chip umeboresha uwezo wa kifaa kukabili joto la juu, unyevunyevu na mkazo wa mitambo, na kupanua matumizi yake katika matumizi ya magari na viwanda.Suluhisho Zilizounganishwa: