LTST-S115TGKFKT 双色侧发光贴片LED规格书 - 侧视封装 - 绿色(530nm) & 橙色(611nm) - 3.2V/2.0V - 76mW/75mW - 中文技术文档

1. Product Overview

This document provides the complete technical specifications for a dual-color, side-view surface mount device (SMD) LED. This component is specifically designed for applications requiring compact, high-brightness illumination from the side, with its primary target market being LCD panel backlight modules. Its core advantages include: integration of two different semiconductor chips within a single package, compatibility with automated assembly processes, and compliance with RoHS and green product standards.

The LED features a transparent lens and houses two independent light-emitting chips: one producing green light and the other producing orange light. This design allows for color mixing or independent control in space-constrained designs. The device is supplied on industry-standard 8mm carrier tape, wound onto 7-inch reels, facilitating high-volume, automated pick-and-place assembly and reflow soldering.

2. In-depth Interpretation of Technical Parameters

2.1 Absolute Maximum Ratings

These ratings define the stress limits that may cause permanent damage to the device. Operation at or beyond these limits is not guaranteed. Key parameters include:

• Power Dissipation (Pd):76 mW for the green chip, 75 mW for the orange chip. This is the maximum allowable power that the LED can dissipate as heat when the ambient temperature (Ta) is 25°C. Exceeding this limit risks thermal runaway and failure.
• Peak Forward Current (I_FP):Under pulse conditions (1/10 duty cycle, 0.1ms pulse width), it is 100 mA for green and 80 mA for orange. This rating is significantly higher than the DC rating, allowing for brief high-current pulses in applications such as multiplexing or achieving instantaneous peak brightness.
• DC Forward Current (I_F):20 mA for green, 30 mA for orange. This is the recommended continuous operating current to ensure long-term reliable performance.
• Reverse Voltage (V_R):5 V for both chips. Applying a reverse voltage exceeding this value may cause immediate and catastrophic junction breakdown. The datasheet explicitly states that reverse voltage operation cannot be sustained.
• Temperature Range:Joto la Uendeshaji: -20°C hadi +80°C; Joto la Uhifadhi: -30°C hadi +100°C. Hizi hufafanua mipaka ya mazingira ya matumizi ya kazi na uhifadhi usio wa kazi.
• Masharti ya Uchomaji wa Infrared (Infrared Reflow):Inaweza kustahimili 260°C kwa sekunde 10, hii ni mahitaji ya kawaida ya mchakato wa uchomaji usio na risasi (Pb-free) unaolingana na viwango vya IPC/JEDEC.

2.2 Electrical and Optical Characteristics

Hizi ni vigezo vya kawaida vya utendakazi vilivyopimwa chini ya hali ya Ta=25°C na I_F=20mA, zinawakilisha tabia inayotarajiwa chini ya hali za kawaida za uendeshaji.

• Nguvu ya Mwanga (I_V):Chipu ya kijani chini ni 71.0 mcd, juu ni 450.0 mcd. Chipu ya machungwa chini ni 28.0 mcd, juu ni 280.0 mcd. Upeo huu mpana unasimamiwa kupitia mfumo wa kugawanya katika makundi (utaelezewa baadaye). Upimaji wa nguva unafanywa kwa kutumia sensor iliyosanifishwa ili kufanana na mwitikio wa jicho la binadamu la kuona wazi (CIE).
• Pembe ya Mtazamo (2θ_1/2):The typical value for both colors is 130 degrees. This wide viewing angle is characteristic of side-view LEDs, making them highly suitable for backlight applications that require uniform light distribution across the panel.
• Peak Wavelength (λ_P):The typical value is 530 nm for green and 611 nm for orange. This is the wavelength at which the spectral power distribution reaches its maximum.
• Dominant Wavelength (λ_d):The typical value is 525 nm for green and 605 nm for orange. This is the single wavelength perceived by the human eye that defines the color, derived from the CIE chromaticity diagram. It is a more relevant parameter for color specification.
• Spectral Line Half-Width (Δλ):The typical value is 35 nm for green and 17 nm for orange. This indicates spectral purity; a narrower half-width corresponds to a more saturated and purer color. In this device, the orange AlInGaP chip exhibits higher color purity than the green InGaN chip.
• Forward Voltage (V_F):At 20mA current, the typical value is 3.2 V (max 3.6 V) for green and 2.0 V (max 2.4 V) for orange. This parameter is crucial for driver circuit design, as the two chips require different supply voltages at the same current.
• Reverse current (I_R):Under V_R=5V condition, both have a maximum of 10 µA. Low reverse leakage current is a hallmark of a high-quality semiconductor junction.

3. Explanation of the Grading System

To ensure consistency in mass production, LEDs are binned according to performance. This system allows designers to select devices that meet the specific minimum standards for their application.

3.1 Kugawanya Kwa Nguvu ya Mwanga

Light output is classified into letter-designated bins. Each bin has defined minimum and maximum intensities, with an intra-bin tolerance of ±15%.

• Green chip:Binning Q (71.0-112.0 mcd), R (112.0-180.0 mcd), S (180.0-280.0 mcd), T (280.0-450.0 mcd).
• Orange Chip:Binning N (28.0-45.0 mcd), P (45.0-71.0 mcd), Q (71.0-112.0 mcd), R (112.0-180.0 mcd), S (180.0-280.0 mcd).

3.2 Kugawanya Kwa Wavelength Kuu (Kijani Pekee)

Green chips are also binned by dominant wavelength to control color consistency.

• Binning AP (520.0-525.0 nm), AQ (525.0-530.0 nm), AR (530.0-535.0 nm). The tolerance for each wavelength bin is ±1 nm.

The specific bin combination for a complete device (e.g., green intensity bin, orange intensity bin, green wavelength bin) is typically specified in the full ordering code or can be obtained from the manufacturer.

4. Uchambuzi wa Curve ya Utendaji

Buku la maelezo linarejelea mikunjo ya kawaida ya sifa, ambayo ni muhimu sana kwa kuelewa tabia ya kifaa chini ya hali tofauti. Ingawa michoro halisi haijatolewa katika maandishi, tafsiri yake ya kawaida ni kama ifuatavyo:

• Mkunjo wa I-V (Sasa-Voltage):Inaonyesha uhusiano kati ya voltage ya mbele (V_F) na sasa ya mbele (I_F). Ni isiyo ya mstari, na kuna voltage ya kuanzisha/kiwango cha kizingiti (kijani takriban 2.8V, machungwa takriban 1.8V), baada ya hapo sasa huongezeka kwa kasi. Mkunjo huu ni muhimu sana kwa kubuni madereva ya sasa ya kudumu.
• Nguvu ya Mwanga ya Jamaa dhidi ya Sasa ya Mbele:Inaonyesha jinsi pato la mwanga linavyoongezeka kwa kuongezeka kwa mkondo, kwa kawaida huwa na uhusiano wa karibu laini ndani ya anuwai ya kazi inayopendekezwa. Kuendesha mkondo zaidi ya I_Fkunaweza kusababisha kupungua kwa faida na kuongeza joto.
• Ukubwa wa mwanga wa jamaa dhidi ya joto la mazingira:Inaonyesha kupungua kwa pato la mwanga kwa kuongezeka kwa joto la kiungo. LED zina ufanisi mdogo katika halijoto za juu. Mkunjo huu ni muhimu kwa usimamizi wa joto katika muundo ili kudumisha uthabiti wa mwangaza.
• Usambazaji wa wigo:Grafu ya nguvu ya mnururisho wa jamaa dhidi ya urefu wa wimbi, inayoonyesha kilele (λ_P) na upana wa nusu (Δλ).

5. Taarifa za Mitambo na Ufungaji

5.1 Package Dimensions and Polarity

The device utilizes a standard EIA package size. Pin definitions are clear: Cathode 2 (C2) corresponds to the green (InGaN) chip, and Cathode 1 (C1) corresponds to the orange (AlInGaP) chip. The common anode configuration is typical for multi-chip LEDs. A detailed dimension drawing (not fully detailed in the text excerpt) will provide precise length, width, height, lead pitch, and lens geometry, with a standard tolerance of ±0.10 mm for all dimensions.

5.2 Recommended Land Pattern and Orientation

The datasheet contains recommendations for the printed circuit board (PCB) pad pattern (pad dimensions) and soldering orientation. Following these guidelines ensures proper mechanical alignment, forms reliable solder joints, and prevents issues like tombstoning during reflow soldering.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Temperature Profile

A recommended infrared (IR) reflow temperature profile for lead-free processes is provided. This profile complies with JEDEC standards, and its key parameters include:

• Upashaji joto kabla:150-200°C, kwa upeo wa sekunde 120, ili kupasha joto bodi ya mzunguko na vipengele hatua kwa hatua, kuamilisha kioevu cha kuunganisha na kupunguza mshtuko wa joto kwa kiwango cha juu.
• Kiwango cha juu cha joto:Upeo wa 260°C. Kifaa hiki kimekadiriwa kustahimili joto hili kwa sekunde 10.
• Mkunjo huu unasisitiza kwamba, kutokana na tofauti katika muundo wa bodi ya mzunguko, vipengele na wambiso wa kuuza, uchambuzi maalum wa bodi ya mzunguko lazima ufanyike.

6.2 Hand Soldering

Ikiwa unahitaji kuuza kwa mikono, joto la chuma cha kuuza lisizidi 300°C linapendekezwa, na wakati wa kuuza kwa kila kiungo usizidi sekunde 3. Operesheni hii inapaswa kufanywa mara moja tu, ili kuepuka uharibifu wa joto kwa kifurushi cha plastiki na waya za ndani za kuunganisha.

6.3 Cleaning

Tumia tu vimumunyisho vilivyobainishwa. Njia inayopendekezwa ni kuzamisha katika ethanol au isopropanol kwa joto la kawaida kwa chini ya dakika moja. Matumizi ya kemikali kali au zisizobainishwa yanaweza kuharibu lenzi ya epoksi na kifuniko, na kusababisha pato la mwanga kupungua au kushindwa mapema.

6.4 Storage and Handling

LED ni kifaa kinachohisi unyevunyevu (MSD).

• Ufungaji Uliofungwa:Masharti ya uhifadhi ni ≤30°C na ≤90% RH. Katika mfuko wa kuzuia unyevu ulio na kikaushi, muda wa maisha ya rafiki ni mwaka mmoja.
• Imefunguliwa ufungashaji:Masharti ya uhifadhi hayapaswi kuzidi 30°C na 60% RH. Vipengee vilivyotolewa kwenye ufungashaji asilia vinapaswa kutiwa mshumari wa reflow ndani ya wiki moja. Kwa uhifadhi wa muda mrefu zaidi, lazima vihifadhiwe kwenye chombo kilichofungwa chenye kivukizi au kikaushaji cha nitrojeni. Ikiwa ufungashaji umefunguliwa na kuhifadhiwa kwa zaidi ya wiki moja, inahitajika kukausha kwa takriban 60°C kwa angalau saa 20 kabla ya usanikishaji, ili kuondoa unyevunyevu uliovutwa na kuzuia tukio la "popcorn" wakati wa mchakato wa reflow soldering.

7. Packaging and Ordering Information

Bidhaa hii inapatikana katika umbo la reel ya kipande cha mkanda unaolingana na vifaa vya usanikishaji wa kiotomatiki vya SMD.

• Reel:Reel ya kipenyo cha inchi 7.
• Mkanda wa kubeba:8mm wide carrier tape.
• Quantity:3000 pieces per full reel. For remaining quantities, the minimum packaging quantity is 500 pieces.
• Quality:Packaging conforms to ANSI/EIA 481-1-A-1994 specification. Empty positions in the carrier tape are sealed with cover tape. The maximum number of consecutive missing components ("missing LEDs") is two.

8. Mapendekezo ya Matumizi

8.1 Mandhari ya Kawaida ya Matumizi

The primary and explicitly stated application isLCD Backlighting, particularly for small to medium-sized displays, where side-view LEDs are used to inject light into the Light Guide Plate (LGP). The dual-color feature enables tunable white backlighting (by mixing green and orange with blue LEDs elsewhere) or the creation of specific color accents and indicators within the display assembly. Other potential applications include status indicators, panel lighting, and decorative lighting in consumer electronics, office equipment, and communication devices.

8.2 Mazingatio ya Ubunifu

• Drive Circuit:Due to the different forward voltages of the green and orange chips (3.2V vs. 2.0V), they cannot be driven from a single constant voltage source in a simple parallel configuration without a current-limiting resistor for each chip. The use of a constant current driver is recommended for optimal performance and stability.
• Thermal Management:Despite the low power consumption, employing a proper PCB layout with adequate heat dissipation and possibly small copper pads aids in heat management, especially when operating near maximum current or at higher ambient temperatures. This helps maintain luminous efficacy and lifespan.
• Optical Design:A 130-degree viewing angle is suitable for edge-lit backlighting. The design of the light guide plate, diffuser, and reflector must be optimized for this LED's emission pattern to achieve uniform illumination.

9. Ulinganishi wa Kiufundi na Tofauti

This device offers specific advantages in its niche:

• Dual-Chip Integration:Compared to using two separate monochromatic LEDs, this package saves PCB space, simplifies assembly (one mounting step), and ensures precise mechanical alignment between the two light sources, which is crucial for color mixing.
• Side-View Profile:Compared to top-view LEDs, the side-view package is crucial for ultra-thin backlight modules where thickness (Z-axis) is constrained and light must be emitted parallel to the PCB plane.
• Teknolojia ya Chipu:Kutumia AlInGaP kutengeneza chipu ya machungwa, ikilinganishwa na teknolojia za zamani kama GaAsP, ina ufanisi bora na utulivu bora wa joto, na hivyo kutoa mwanga wa machungwa mkali na thabiti zaidi.
• Ustahikilivu wa Mchakato:Inaendana kabisa na ufungaji wa reflow na uwekaji wa kiotomatiki, na hivyo kufaa kwa mstari wa kisasa wa uzalishaji wa wingi.

10. Maswali Yanayoulizwa Mara kwa Mara (Kulingana na Vigezo vya Kiufundi)

Q1: Je, naweza kuendesha chipu ya kijani na ya machungwa kwa wakati mmoja kwa mkondo wa juu wa DC (20mA na 30mA)?
A1: Ndiyo, lakini ni lazima uzingatie matumizi ya jumla ya nguvu. Kufanya kazi kwa wakati mmoja kwa mkondo wa juu utatumia takriban (3.2V * 0.02A) + (2.0V * 0.03A) = 0.124W ya nguvu. Hii ni chini ya viwango vya Pd vya kila chipu, lakini iko karibu na jumla yao. Uundaji wa kutosha wa joto kwenye PCB unahitajika ili kuzuia joto la kiungo kuzidi kikomo salama, hasa ndani ya kifuniko kilichofungwa.

Q2: Kwa nini kiwango cha voltage ya kinyume ni 5V tu, na "haiwezi kufanya kazi kwa muda mrefu" inamaanisha nini?
A2: Kiungo cha semiconductor cha LED hakikusudiwa kuzuia voltage ya nyuma ya juu. Kiwango cha 5V ni kawaida. Maneno hayo yanamaanisha kuwa hata kutumia voltage ya nyuma chini ya 5V kwa kuendelea hakupendekezwi au hakubainishwa. Katika usanidi wa mzunguko, ni muhimu kuhakikisha kuwa LED haiwai kubeba mkazo wa nyuma, au kutumia diode ya ulinzi sambamba ikiwa ni lazima.

Q3: Je, ninawezaje kufasiri msimbo wa kiwango wakati wa kuagiza?
A3: Unahitaji kubainisha msimbo wa kiwango cha nguvu ya mwanga unayohitaji (kwa kijani na machungwa) na msimbo wa kiwango cha wavelength kuu (kwa kijani), ili kuhakikisha bidhaa yako inapata LED yenye sifa za mwangaza na rangi zinazohitajika. Kwa mfano, unaweza kuagiza kifaa chenye kiwango cha "kijani: nguvu T, wavelength AQ; machungwa: nguvu R." Wasiliana na mtengenezaji kwa muundo halisi wa msimbo wa kuagiza.

11. Mifano Halisi ya Ubunifu

Tukio:Kusanya kiashiria cha hali kwa kifaa kinachohitaji rangi mbili tofauti (kijani kwa "tayari," machungwa kwa "kusubiri/onyo"), na nafasi inayopatikana kwenye PCB ni ndogo sana, iko kwenye makali ya PCB iliyowekwa wima ndani ya kasha cha bidhaa.

Utatuzi uliotekelezwa:LTST-S115TGKFKT ndio chaguo bora. Tumia eneo la kipengele kimoja. Pini rahisi ya GPIO ya microcontroller inaweza kuunganishwa kwa kila cathode (C1 inalingana na rangi ya machungwa, C2 inalingana na kijani) kupitia upinzani unaozuia mkondo unaofaa (kulingana na mkondo unaohitajika, hadi 20/30mA, na voltage ya usambazaji), anode ya pamoja inaunganishwa kwa usambazaji chanya. Mwanga wa kuangalia kwa upande unaruhusu mwanga kutolewa kupitia tundu ndogo au mwongozo wa mwanga kwenye ukuta wa kifaa. Pembe pana ya maoni inahakikisha kuwa taa ya onyesho inaweza kuonekana kutoka kwa pembe nyingi. Ufungaji unaoruhusu reflow unaruhusu kuunganishwa kwa mchakato mmoja wa kuunganisha na vifaa vingine vyote vya SMD.

12. Utangulizi wa Kanuni

Mwanga katika LED unatokana na umeme unaosababisha mwanga katika mpaka wa p-n wa semiconducta. Wakati voltage chanya inatumika, elektroni na mashimo huingizwa kwenye eneo lenye shughuli, ambapo huchanganyika na kutolewa kwa nishati kwa njia ya fotoni. Rangi ya mwanga unaotolewa (urefu wa wimbi) imedhamiriwa na nishati ya pengo la bendi ya nyenzo ya semiconducta.

• Chipu ya kijani (InGaN):Indium Gallium Nitride ni semiconducta ya kiwanja ambayo pengo lake la bendi linaweza kubadilishwa kwa kurekebisha uwiano wa indiamu/gali ili kutoa mwanga kutoka kwa wigo wa bluu hadi kijani. Hapa, imeundwa kutoa mwanga wa kijani wa takriban 530 nm.
• Chipu ya machungwa (AlInGaP):Aluminium Indium Gallium Phosphide ni semiconducta nyingine ya kiwanja inayojulikana kwa ufanisi wake katika maeneo ya urefu wa wimbi wa nyekundu, machungwa na manjano. Pengo lake la bendi limebadilishwa hapa ili kutoa mwanga wa machungwa wa takriban 611 nm.

Chipu mbili zimewekwa kwenye fremu ya waya, zimefungwa ndani ya ufungaji mmoja wa epoxy, na zina lenzi wazi ambayo hufyonza mwanga mdogo kutoka kwa mwanga unaotolewa, na hivyo kufanikisha ufanisi wa juu wa macho.

13. Mienendo ya Maendeleo

The SMD LED field continues to evolve, with several notable trends associated with such components including:

• Efficiency Improvement (lm/W):Ongoing advancements in material science and chip design aim to extract more light (lumens) from the same electrical input power (watts), thereby reducing energy consumption and thermal load.
• Higher Reliability and Lifespan:Improvements in packaging materials, die-attach techniques, and phosphor technology (where applicable) are extending operational lifespan and enhancing performance under harsh environmental conditions.
• Miniaturization:The drive for smaller electronic devices is pushing LEDs towards smaller package sizes and lower profile heights while maintaining or increasing light output.
• Color Accuracy and Consistency:Tighter binning tolerances and improved manufacturing processes result in smaller variations in color and brightness between batches, which is crucial for applications requiring a uniform appearance.
• Integration:Beyond dual-color, there is a trend towards integrating more functions (such as RGB chips, driver ICs, and even photodetectors) into a single package to create smarter, more compact lighting solutions.