LTW-C235DSKF-5A Bicolor SMD LED Datasheet - White and Orange Light - 20-30mA - 72-75mW - Technical Documentation

1. Product Overview

This document details the specifications of a high-performance dual-color Surface-Mount Device (SMD) LED. The component integrates two independent LED chips within a single package: one emitting white light and the other emitting orange light. This design is specifically intended for applications requiring multiple indication states or color-coded signaling from a compact space.

LED hii imetengenezwa kwa kutumia nyenzo za kisasa za semiconductor. Mwanga mweupe hutolewa na chipi inayotokana na InGaN (Indium Gallium Nitride), wakati mwanga wa machungwa unatokana na chipi inayotokana na AlInGaP (Aluminium Indium Gallium Phosphide). Mchanganyiko huu unatumia kikamilifu ufanisi na sifa za mwangaza za mifumo hii miwili ya nyenzo.

Faida kuu za bidhaa hii ni pamoja na kufuata maagizo ya RoHS (Restriction of Hazardous Substances), kubainishwa kama bidhaa ya kijani, na uwezo wa kuendana na michakato ya kawaida ya utengenezaji kwa wingi. Inatumia ufungaji wa mkanda unaofaa kwa vifaa vya kiotomatiki vya kuchomeka, na imepimwa kwa ajili ya mchakato wa kuunganishia kwa IR (Infrared) reflow, na hivyo kuwa chaguo bora kwa mstari wa kisasa wa usanikishaji wa PCB.

2. Detailed Technical Specifications

2.1 Absolute Maximum Ratings

Kuendesha kifaa zaidi ya mipaka hii kunaweza kusababisha uharibifu wa kudumu. Viwango vimebainishwa kwa joto la mazingira (Ta) la 25°C.

• Matumizi ya Nguvu:Mwanga mweupe: 72 mW, Mwanga wa machungwa: 75 mW. Kigezo hiki kinaeleza nguvu ya juu inayoweza kutolewa kama joto kwa LED inayofanya kazi kwa mfululizo.
• Upeo wa mkondo wa mbele:Mwanga mweupe: 100 mA, Mwanga wa machungwa: 80 mA. Hii ndiyo mkondo wa juu unaoruhusiwa wa msukumo (1/10 ya uwiano wa kazi, upana wa msukumo 0.1ms), unaofaa kwa mwako mfupi wenye nguvu.
• Mkondo wa mbele wa DC:Mwanga mweupe: 20 mA, Mwanga wa machungwa: 30 mA. Hii ndiyo mkondo wa juu unaopendekezwa wa mbele unaoendelea kwa kazi ya kudumu na ya kuaminika.
• Voltage ya nyuma:Rangi zote mbili: 5 V. Kutumia voltage ya nyuma inayozidi thamani hii inaweza kuharibu kiungo cha LED. Uendeshaji endelevu wa voltage ya nyuma ni marufuku.
• Safu ya joto:Operating temperature: -20°C to +80°C; Storage temperature: -30°C to +100°C. These define the environmental limits for functionality and non-operational storage.
• Infrared soldering conditions:Withstands 260°C for 10 seconds, which defines its compatibility with standard lead-free reflow soldering profiles.

2.2 Electrical and Optical Characteristics

These are typical performance parameters measured at Ta=25°C and a test current (IF) of 5mA, unless otherwise specified.

• Luminous intensity (Iv):A measure of perceived light output. White: Min 45.0 mcd, Typ (unspecified), Max 180.0 mcd. Orange: Min 11.2 mcd, Typ (unspecified), Max 71.0 mcd. Intensity is measured using a sensor filtered to match the human eye's photopic response (CIE curve).
• Viewing angle (2θ1/2):Both colors are approximately 130 degrees. This is the angle at which the luminous intensity drops to half of its peak value, defining the spread of the light beam.
• Forward Voltage (VF):The voltage drop when the LED is conducting. White light: typical 2.85V, maximum 3.15V. Orange light: typical 2.00V, maximum 2.40V. This is crucial for circuit design and current-limiting resistor calculation.
• Peak Emission Wavelength (λP):For the orange LED, the typical value is 611 nm. This is the wavelength at which the spectral power distribution is highest.
• Dominant Wavelength (λd):For the orange LED, the typical value is 605 nm. This is the single wavelength perceived by the human eye as representative of that color, derived from the CIE chromaticity diagram.
• Spectral Line Half-Width (Δλ):Kwa LED ya rangi ya machungwa, kawaida ni 20 nm. Hii inaonyesha usafi wa wigo au upana wa ukanda wa mwanga unaotolewa.
• Kuratibu za rangi (x, y):Kwa LED nyeupe, thamani ya kawaida kwenye chati ya CIE 1931 ni (0.3, 0.3). Toleo la ±0.01 linatumika. Kuratibu hizi zinafafanua kwa usahihi sehemu ya rangi ya mwanga mweupe.
• Mkondo wa nyuma (IR):Wakati VR=5V, upeo wa μA 10 kwa rangi zote mbili, inaonyesha mkondo mdogo sana wa uvujaji wakati kifaa kimewekwa kinyume ndani ya mipaka yake.

Tahadhari za Utoaji Umeme wa Tuli (ESD):LED ni nyeti kwa umeme wa tuli. Ni lazima kuchukua tahadhari zinazofaa za ESD wakati wa kushughulika, kama vile kutumia mkanda wa mkono uliowekwa ardhini, mkeka wa kuzuia umeme tuli, na vifaa, ili kuzuia uharibifu unaowezekana au wa maangamizo.

3. Bin System Description

Ili kuhakikisha uthabiti katika uzalishaji wa wingi, LED zinagawanywa kulingana na utendaji. Msimbo maalum wa kugawanya kwa kundi fulani unawekwa alama kwenye ufungaji wake.

3.1 Kugawanya Voltage ya Mbele (VF) ya LED ya Mwanga Mweupe

LED zinagawanywa kulingana na voltage yao ya mbele kwenye IF=5mA. Kiasi kinachoruhusiwa cha kupotoka kwa kila kiwango ni ±0.1V.
- Kiwango A: 2.55V - 2.70V
- Kiwango B: 2.70V - 2.85V
- Kiwango C: 2.85V - 3.00V
- Kiwango D: 3.00V - 3.15V

3.2 Kugawanya Nguvu ya Mwangaza (Iv)

White LED (at IF=5mA, each bin tolerance ±15%):
- Bin P: 45.0 mcd - 71.0 mcd
- Bin Q: 71.0 mcd - 112.0 mcd
- Bin R: 112.0 mcd - 180.0 mcd

Orange LED (at IF=5mA):
- Bin L: 11.2 mcd - 18.0 mcd
- Bin M: 18.0 mcd - 28.0 mcd
- Bin N: 28.0 mcd - 45.0 mcd
- Bin P: 45.0 mcd - 71.0 mcd

3.3 Kugawanya Hue (Rangi) ya LED ya Mwanga Mweupe

The white light chromaticity binning is based on its chromaticity coordinates (x, y) on the CIE 1931 diagram at IF=5mA. Six bins (S1 to S6) are defined by specific quadrilateral regions on the chromaticity diagram. A tolerance of ±0.01 applies to the (x, y) coordinates within each bin. This ensures visual color consistency across different production batches.

4. Uchambuzi wa Curve ya Utendaji

The datasheet references typical characteristic curves to graphically represent device behavior. Although specific charts are not reproduced in the text, they typically include:

• Relative Luminous Intensity vs. Forward Current:Shows how light output increases with current, typically in a sub-linear relationship, highlighting efficiency variations.
• Forward Voltage vs. Forward Current:Illustrates the diode's I-V characteristics, which are crucial for thermal management and driver design.
• Mwangaza wa jamaa dhidi ya joto la mazingira:Inaelezea jinsi pato la mwanga linavyopungua kadri joto la kiungo linavyopanda, jambo muhimu katika usanidi wa joto.
• Usambazaji wa nguvu ya wigo:Kwa LED ya rangi ya machungwa, mkunjo huu utaonyesha ukali wa mwanga unaotolewa kwa kila urefu wa wimbi, ukikazia 611 nm na upana wa nusu ya 20 nm.

Mikunjo hii ni muhimu kwa wabunifu kutabiri utendaji chini ya hali zisizo za kawaida (mikondo tofauti, halijoto) na kuboresha saketi ya matumizi.

5. Taarifa za Mitambo na Ufungashaji

5.1 Nambari ya Sehemu na Mgawanyiko wa Pini

Part Number:LTW-C235DSKF-5A
Lens Color:Yellow (affects light diffusion and appearance when off).
Emission Color and Pin Assignment:
- InGaN white chip: connected to pins 1 and 2.
- AlInGaP orange chip: connected to pins 3 and 4.
This 4-pin configuration allows independent control of the two colors.

5.2 Vipimo vya Ufungashaji

This LED conforms to the EIA (Electronic Industries Alliance) standard SMD package outline. All dimensions are in millimeters, with a standard tolerance of ±0.10 mm unless otherwise specified. The datasheet includes a detailed dimensional drawing showing the package's length, width, height, lead pitch, and other key mechanical features critical for PCB pad design.

5.3 Vipimo vya Bamba ya Uchomeleaji Vinavyopendekezwa

Recommended PCB pad layout is provided to ensure reliable solder joint formation during reflow soldering. Adhering to these dimensions aids in proper solder fillet formation, mechanical stability, and thermal relief.

6. Mwongozo wa Uchomaji, Usanikishaji na Uendeshaji

6.1 Mchakato wa Uchomaji

This device is fully compatible with infrared (IR) reflow soldering processes. A recommended reflow profile is provided, with a peak temperature condition of 260°C for 10 seconds, meeting common lead-free solder requirements. Following the recommended profile is crucial to prevent thermal damage to the LED package or die.

6.2 Usafishaji

Ikiwa usafishaji baada ya kulehemu unahitajika, kemikali zilizobainishwa tu zinapaswa kutumika. Viyeyusho visivyobainishwa vinaweza kuharibu lenzi ya epoksi au kifurushi. Njia inayopendekezwa ni kuzamishwa katika ethanol au isopropanol kwa joto la kawaida, kwa muda usiozidi dakika moja.

6.3 Masharti ya Uhifadhi

Kifurushi kilichotiwa muhuri (na draya):Hifadhi kwa ≤30°C na ≤90% unyevu wa jamaa (RH). Maisha ya rafu chini ya hali hizi ni mwaka mmoja.
Kifurushi kilichofunguliwa:Components must be stored at ≤30°C and ≤60% RH. It is strongly recommended to complete the IR reflow soldering process within one week after opening the moisture barrier bag.
Long-term storage (opened):For storage exceeding one week, place the components in a sealed container with desiccant or a nitrogen dry cabinet.
Re-baking:LEDs stored outside the original packaging for more than one week require baking at approximately 60°C for at least 20 hours before soldering to remove absorbed moisture and prevent "popcorn" effect (package cracking) during reflow.

7. Ufungaji na Taarifa ya Kuagiza

7.1 Vipimo vya Mkanda Uliojirundika

LEDs are supplied in embossed carrier tape with a protective cover tape, wound on 7-inch (approx. 178 mm) diameter reels. This packaging complies with the ANSI/EIA 481-1-A-1994 standard.

• Quantity per reel:3000 pieces.
• Remaining Minimum Order Quantity (MOQ):500 pieces.
• Cover tape:Empty cavities in the carrier tape are sealed with cover tape.
• Missing components:Idadi kubwa ya vipengele vilivyokosekana mfululizo kwenye spooli inaruhusiwa kuwa mbili.

Mchoro wa kina wa vipimo wa mkanda wa usafirishaji (ukubwa wa mfuko, umbali, n.k.) na spooli (kipenyo cha shimoni, kipenyo cha flange, n.k.) umetolewa katika hati ya maelezo ya maelezo, ili kuhakikisha utangamano na vifaa vya usanikishaji otomatiki.

8. Maelezo ya Matumizi na Mazingatio ya Ubunifu

8.1 Matumizi Yanayotarajiwa

LED hii imebuniwa kwa matumizi katika vifaa vya kawaida vya elektroniki, ikiwa ni pamoja na vifaa vya otomatiki ya ofisi, vifaa vya mawasiliano, na vifaa vya nyumbani. Kwa matumizi yanayohitaji uaminifu wa juu sana ambapo kushindwa kunaweza kuhatarisha maisha au afya (k.m.v. anga, mifumo ya matibabu, vifaa vya usalama), ushauri maalum na uthibitishaji unahitajika kabla ya kubuni na kutumia.

8.2 Ubunifu wa Saketi

• Kizuizi cha mkondo:Each color of LED must use an external current-limiting resistor. The resistor value (R) can be calculated using Ohm's Law: R = (Supply Voltage - VF) / IF, where VF is the forward voltage of the specific color/batch, and IF is the desired operating current (which must not exceed the DC forward current rating).
• Thermal Management:Although the power consumption is low, ensuring sufficient PCB copper area or thermal vias helps maintain a lower junction temperature, thereby preserving light output and lifespan.
• Parallel/Series Connection:Due to variations in VF, directly connecting LEDs in parallel is generally not recommended, as it may lead to current imbalance. For uniform brightness, a series connection sharing a common current-limiting resistor is preferred.

8.3 Mazingira ya Kawaida ya Utumizi

• Status Indicator:Utendaji wa rangi mbili huruhusu hali nyingi (mfano, mwanga mweupe = wazi, mwanga wa machungwa = kusubiri, rangi mbili = onyo).
• Mwanga wa nyuma wa kibodi au ikoni:Inaweza kuchaguliwa mwanga wa nyuma wa rangi tofauti.
• Bidhaa za umeme za watumiaji:Viashiria vya nguvu, muunganisho au hali katika vifaa kama vile ruta, chaja au vifaa vya sauti.
• Viashiria vya mwanga vya ndani ya gari:(Ikiwa imethibitishwa kupitia mazingira maalum ya utumiaji).

9. Ulinganishi wa Kiufundi na Tofauti

Hii LED yenye rangi mbili ina faida dhahiri katika matumizi maalum:

• Kulinganisha na LED mbili za rangi moja:Kuokoa nafasi kwenye PCB, kupunguza wakati/gharama ya kushikilia (kipengele kimoja dhidi ya viwili), na kuhakikisha usawaziko kamili wa mitambo kwa vyanzo viwili vya mwanga.
• Teknolojia ya nyenzo:Kutumia nyenzo bora za chip (InGaN kwa mwanga mweupe, AlInGaP kwa mwanga wa machungwa), kufikia ufanisi na mwangaza wa juu katika wigo husika, badala ya kutumia mabadiliko ya rangi ya machungwa yanayoweza kuwa na ufanisi mdogo.
• Muundo wa usakinishaji wa nyuma:Kutaja "usakinishaji wa nyuma" unaonyesha ni muundo wa kifuniko ambao utoaji wake mkuu wa mwanga unafanywa kupwa msingi au mwelekeo maalum, ambayo inaweza kuwa na faida kwa miundo fulani ya macho ikilinganishwa na kifuniko cha kawaida cha utoaji wa juu.

10. Maswali Yanayoulizwa Mara kwa Mara (FAQ)

Q1: Je, naweza kuendesha LED nyeupe na ya machungwa kwa mkondo wa moja kwa moja wa juu wakati huo huo?
A1: Ndiyo, lakini ni lazima uzingatie matumizi ya jumla ya nguvu kwenye kifurushi. Kuendesha LED nyeupe kwa 20mA (~2.85V=57mW) na LED ya machungwa kwa 30mA (~2.00V=60mW) kunatoa jumla ya takriban 117mW, ambayo inazidi viwango vya nguvu vilivyobainishwa (72mW, 75mW). Kufanya kazi kwa mkondo kamili wakati huo huo kunaweza kuhitaji kupunguza viwango au kuboresha usimamizi wa joto ili kuweka halijoto ya kiungo ndani ya safu salama.

Q2: Kuna tofauti gani kati ya urefu wa wimbi la kilele na urefu wa wimbi kuu?
A2: Urefu wa wimbi la kilele (λP=611 nm) ni urefu wa wimbi halisi ambapo LED hutoa nguvu ya mwango zaidi. Urefu wa wimbi kuu (λd=605 nm) ni kipimo cha hisia; ni urefu wa wimbi wa mwanga wa rangi moja ambao, kwa mwangalizi wa kawaida wa binadamu, una rangi sawa na pato la LED. Kwa kawaida ni tofauti, hasa kwa rangi zilizojaa.

Q3: Kwa nini mahitaji ya unyevu wakati wa uhifadhi yanakuwa magumu zaidi baada ya mfuko kufunguliwa?
A3: Mfuko uliofungwa una dawa ya kukausha ndani yake ili kudumisha viwango vya chini sana vya unyevu, na hivyo kulinda LED dhidi ya kunyonya unyevu. Mara tu ufunguo, vipengele vinakuwa wazi kwa unyevu wa mazingira. Unyevu unaonyonywa na kifurushi cha plastiki unaweza kupanuka kwa haraka na kuwa mvuke wakati wa upakiaji wa joto wa juu wa reflow, na kusababisha uwezekano wa kutenganisha ndani au ufa (jina la "popcorn").

Q4: Je, ninawezaje kuelewa msimbo wa kugawanya wakati wa kuagiza?
A4: Ili kuhakikisha utendaji wa bidhaa ni thabiti, unapaswa kubainisha safu zinazohitajika za VF, Iv na tone wakati wa kuagiza. Kwa mfano, unaweza kuomba "LTW-C235DSKF-5A, safu ya VF B, safu ya mwanga mweupe Iv Q, safu ya mwanga wa machungwa Iv M, safu ya tone S3". Hii inahakikisha kwamba LED zote katika kundi lako la uzalishaji zina sifa za umeme na mwanga zinazolingana kwa karibu.

11. Mifano ya Uchunguzi wa Kesi za Ubunifu

Tukio:Buni kiashiria cha hali kwa swichi ya mtandao, chenye hali tatu: kuzima, kiungo kinachofanya kazi (mwanga mweupe) na usafirishaji wa data (mwanga wa machungwa unayowaka mara kwa mara).
Utekelezaji:Tumia LTW-C235DSKF-5A moja. Microcontroller (MCU) ina pini mbili za GPIO, kila moja ikiunganishwa na rangi moja ya LED kupitia kipingamizi cha kudhibiti mkondo.
Hesabu:Tumia usambazaji wa umeme wa 3.3V, lengo la mkondo ni 10mA, ili kufikia uonekano mzuri na kuokoa nguvu.
- Kwa mwanga mweupe (VF~2.85V): R = (3.3V - 2.85V) / 0.01A = 45 Ω. Tumia kipingamizi cha kawaida cha 47 Ω.
- Kwa mwanga wa machungwa (VF~2.00V): R = (3.3V - 2.00V) / 0.01A = 130 Ω. Tumia kipingamizi cha kawaida cha 130 Ω au 120 Ω.
Muundo wa PCB:Tumia muundo wa pedi ulipendekezwa. Weka eneo dogo lisilokubalika chini ya LED ili kuzuia kunyonya kwa solder. Firmware ya MCU inadhibiti pini ili kufikia hali thabiti na ya kuwaka inayotakiwa.
Matokeo:Kwa kutumia eneo la kipengele kimoja tu, kionyeshi cha hali nyingi, cha kompakt, cha kuaminika na cha wazi kimetekelezwa.

12. Kanuni ya Uendeshaji

LED ni diode ya semikondukta. Wakati voltage chanya inayozidi nishati ya pengo la bendi ya chip inatumika, elektroni na mashimo hujumuika katika eneo lenye shughuli, huku wakitoa nishati kwa namna ya fotoni (mwanga). Rangi ya mwanga imedhamiriwa na nishati ya pengo la bendi ya nyenzo ya semikondukta. Nyenzo za InGaN zina pengo la bendi pana, linaloweza kutoa mionzi katika safu ya bluu/zambarau/ultravioleti; mwanga mweupe kwa kawaida huzalishwa kwa kuchorea chip ya bluu ya InGaN kwa fosforasi ya manjano, na kuchanganya mionzi ili kuonekana nyeupe. Pengo la bendi la nyenzo za AlInGaP linafaa kwa utoaji wa moja kwa moja katika sehemu nyekundu, ya machungwa, ya kahawia na ya manjano ya wigo, kama inavyotumika katika chip ya machungwa ya kifaa hiki. Ufungashaji wa chip mbili umetenga kiunga cha semikondukta mbili kwa umeme, ukiruhusu zisimkiliwe kwa kujitegemea.

13. Mwelekeo wa Teknolojia

The optoelectronics industry continues to evolve. Trends related to this bi-color LED include:
Efficiency Enhancement:Continuous improvements in internal quantum efficiency and light extraction techniques lead to higher luminous intensity (mcd) at the same or lower drive currents, thereby increasing system energy efficiency.
Miniaturization:While this product uses a standard package, the industry continuously pushes for smaller package sizes (e.g., 0402, 0201 metric) to accommodate high-density electronics, albeit often at the expense of total light output or thermal performance.
Color Consistency and Binning:Advances in epitaxial growth and manufacturing control are reducing natural variations in VF and chromaticity, resulting in tighter binning distributions, which reduces the need for extensive binning or simplifies inventory management.
Integrated Solutions:The trend of integrating LED driver ICs (constant current sources, PWM controllers) directly with LED packages or modules simplifies end-circuit design. This specific component remains a discrete, driverless LED.
Reliability and Lifetime:Continuous improvements in packaging materials (epoxy, silicone) and die-attach technology enhance long-term reliability, lumen maintenance, and resistance to thermal and environmental stresses.