LTST-C155TGKFKT Bicolor SMD LED Datasheet - 1.10mm Ultra-Low Profile - Green 3.3V/Orange 2.0V - 76mW/75mW - Technical Documentation

1. Muhtasari wa Bidhaa

This document provides the complete technical specifications for the LTST-C155TGKFKT model dual-color surface-mount device (SMD) LED. This device integrates two different semiconductor chips within an ultra-thin package: an InGaN chip for emitting green light and an AlInGaP chip for emitting orange light. Its design aims to meet modern electronic assembly processes and application scenarios requiring compact dual-color indication.

The core advantage of this LED lies in its extremely low 1.10mm package height, which is crucial for space-constrained designs such as consumer electronics, automotive interiors, and portable devices. It is an environmentally friendly product compliant with the ROHS directive. The device is supplied in 8mm carrier tape format, wound on 7-inch diameter reels, fully compatible with high-speed automated pick-and-place equipment used in high-volume manufacturing. Its design is also compatible with infrared (IR) reflow soldering processes, meeting lead-free (Pb-free) assembly standards.

Target markets cover various electronic devices requiring reliable dual-state indication, including office automation equipment, communication devices, home appliances, industrial control panels, and automotive dashboard indicator lights. Independent anode/cathode pins for each color allow for independent control, enabling status signal indication, power indication, or multi-state user interface feedback.

2. In-depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

Operating the device beyond these limits may cause permanent damage. Ratings are specified at an ambient temperature (Ta) of 25°C.

• Power Dissipation (Pd):76 mW for the green chip, 75 mW for the orange chip. This parameter defines the maximum allowable thermal dissipation power. Exceeding this value may lead to excessive junction temperature and accelerated performance degradation.
• Peak Forward Current (I_FP):100 mA for green, 80 mA for orange. This is the maximum allowable pulsed current at 1/10 duty cycle, 0.1ms pulse width. It is significantly higher than the continuous DC rating and is suitable for brief high-brightness pulse applications.
• DC Forward Current (I_F):20 mA for green, 30 mA for orange. This is the recommended continuous operating current for standard brightness and long-term reliability.
• Reverse Voltage (V_R):Both colors operate at 5 V. The device provides limited reverse bias protection. It is not designed for AC operation or reverse bias conditions in circuit design.
• Operating temperature range:-20°C to +80°C. The LED can operate normally within this ambient temperature range.
• Storage temperature range:-30°C to +100°C.
• Infrared soldering conditions:Can withstand a peak temperature of 260°C for up to 10 seconds, which is the standard condition for lead-free reflow soldering profiles.

2.2 Electrical and Optical Characteristics

Hizi ni vigezo vya kawaida vya utendaji vilivyopimwa chini ya hali ya Ta=25°C, I_F=20mA, isipokuwa imeelezwa vinginevyo.

• Nguvu ya mwanga (I_V):Hii ni mwangaza unaohisiwa. Kwa rangi ya kijani, anuwai yake ni kutoka kiwango cha chini cha 71.0 mcd hadi kiwango cha juu cha 280.0 mcd. Kwa rangi ya machungwa, anuwai yake ni kutoka 45.0 mcd hadi 180.0 mcd. Nguvu ya kipengele maalum imedhamiriwa na msimbo wake wa kikundi (angalia Sehemu ya 3). Upimaji unafuata mkunjo wa majibu ya jicho la binadamu la kuona mwanga wa CIE.
• Pembe ya mtazamo (2θ_1/2):Rangi zote mbili kwa kawaida huwa digrii 130. Pembe hii pana ya mtazamo inafafanuliwa kama pembe kamili wakati nguvu ya mwanga inaposhuka hadi nusu ya thamani ya mhimili, na hufanya LED ifae kwa matumizi yanayohitaji kuonekana kutoka kwa mtazamo mpana.
• Urefu wa wimbi la kilele cha utoaji (λ_P):Kijani (InGaN) kwa kawaida ni 525 nm, na machungwa (AlInGaP) kwa kawaida ni 611 nm. Huu ndio urefu wa wimbi unaolingana na sehemu ya juu zaidi ya wigo wa utoaji.
• Urefu wa wimbi kuu (λ_d):Kijani kwa kawaida ni 525 nm, na machungwa kwa kawaida ni 605 nm. Thamani hii inatokana na chati ya rangi ya CIE na ni urefu wa wimbi mmoja unaowakilisha vyema zaidi rangi inayohisiwa ya mwanga.
• Spectral line half-width (Δλ):Green is typically 35.0 nm, orange is typically 17.0 nm. The orange AlInGaP chip has a narrower spectral bandwidth, producing more saturated and purer colors compared to the broader green spectrum.
• Forward voltage (V_F):Green is typically 3.3 V (max 3.5 V) at 20mA. Orange is typically 2.0 V (max 2.4 V) at 20mA. The lower V_Fof the orange chip means lower power consumption at the same drive current. These values are crucial for designing the current-limiting resistor in the drive circuit.
• Reverse current (I_R):When a 5V reverse voltage (V_R) is applied, green is max 10 µA, orange is max 20 µA. This test is for characterization only; the device is not intended for reverse operation.

3. Grading System Description

LEDs are binned according to their measured luminous intensity to ensure consistency within production batches. For applications requiring specific brightness levels, the binning code is a key part of the ordering information.

3.1 Kugawanya Nguvu ya Chip ya Kijani

• Binning Code Q:Minimum 71.0 mcd, maximum 112.0 mcd.
• Binning Code R:Minimum 112.0 mcd, maximum 180.0 mcd.
• Binning Code S:Minimum 180.0 mcd, maximum 280.0 mcd.

3.2 Kugawanya Nguvu ya Chip ya Chungwa

• Binning Code P:Minimum 45.0 mcd, maximum 71.0 mcd.
• Binning Code Q:Minimum 71.0 mcd, maximum 112.0 mcd.
• Binning Code R:Minimum 112.0 mcd, maximum 180.0 mcd.

Tolerance:The intensity tolerance within each defined bin is +/-15%. This accounts for minor measurement and production variations.

4. Uchambuzi wa Mkunjo wa Utendaji

The datasheet references typical performance curves, which are crucial for understanding device behavior under non-standard conditions. Although the specific graphs are not reproduced in the text, their implications are analyzed as follows.

4.1 Mkondo wa Mbele dhidi ya Voltage ya Mbele (Mkunjo wa I-V)

The I-V curve for each chip (green/orange) will show the typical exponential diode relationship. The curve knee voltage for the orange AlInGaP chip (approx. 2.0V) is lower than that of the green InGaN chip (approx. 3.3V). This graph is crucial for determining the necessary power supply voltage and designing a constant current driver to ensure brightness stability across units and temperatures.

4.2 Luminous Intensity vs. Forward Current

This curve typically shows a near-linear relationship between drive current and light output within the recommended operating range (up to 20-30mA). Driving the LED above its rated DC current increases brightness at the cost of higher power consumption, reduced efficiency, and potentially shortened lifetime due to increased junction temperature.

4.3 Spectral Distribution

The referenced spectral plot will illustrate the difference in spectral half-width between the green (broader, ~35nm) and orange (narrower, ~17nm) chips. The narrow emission of the orange chip is characteristic of AlInGaP technology, offering high color purity, which is often desirable for indicator applications where color differentiation is critical.

4.4 Temperature Dependence

Utendaji wa LED unategemea joto. Ingawa hakuna maelezo ya kina katika maandishi yaliyotolewa, sifa za kawaida ni pamoja na: Kupungua kwa nguvu ya mwanga kadiri joto la kiungo linapoongezeka; mabadiliko madogo ya urefu wa wimbi kuu (kawaida nanomita chache); na kupungua kwa voltage ya mbele (V_F) kadiri joto linapoongezeka. Kwa matumizi yanayokabiliwa na joto la juu la mazingira, lazima kuzingatiwe mambo haya katika usimamizi wa joto na muundo wa saketi.

5. Mechanical and Packaging Information

5.1 Package Dimensions

LED hii inatumia umbo la kifungo cha kiwango cha tasnia cha EIA. Sifa yake muhimu ya kimitambo ni umbo lake nyembamba sana lenye urefu wa juu zaidi (H) wa 1.10 mm. Vipimo vingine vyote muhimu vinavyohitajika kwa muundo wa pedi ya PCB, kama vile urefu, upana na umbali wa pini, vinatolewa kwenye mchoro wa kifungo, na uvumilivu wa kawaida wa ±0.10 mm, isipokuwa ikiwa imebainishwa vinginevyo.

5.2 Pin Assignment

Kifaa hiki kina pini nne. Kwa mfano wa LTST-C155TGKFKT:

• Pini 1 na 3 zimetengwa kwa ajili yakijanichip ya InGaN (anodi na katodi).
• Pini 2 na 4 zimetengwa kwa ajili yamachungwachip ya AlInGaP (anodi na katodi).

Usanidi huu unaruhusu LED zote mbili kuwekwa na kudhibitiwa kwa uhuru kamili.

5.3 Recommended Solder Pad Layout

Inatoa muundo unaopendekezwa wa pad ya PCB (package). Kufuata muundo huu ni muhimu kwa ajili ya kufikia muunganisho wa kuaminika wa solder wakati wa reflow, kuzuia kusimama kwa sehemu (component tombstoning), na kuhakikisha usawa sahihi. Uundaji wa pad unazingatia uundaji wa solder fillet na utoaji wa joto.

6. Soldering and Assembly Guide

6.1 Mkunjo wa Uchimbaji wa Reflow

Inajumuisha curve ya reflow ya infrared (IR) inayopendekezwa kwa mchakato usio na risasi. Curve hii inalingana na viwango vya JEDEC, na vigezo vyake muhimu ni pamoja na:

• Preheating:150°C hadi 200°C.
• Preheating time:Muda wa juu zaidi ni sekunde 120, kwa ajili ya kupokanzwa taratibu bodi ya mzunguko na vipengee, ili kupunguza kiwango cha juu cha mshtuko wa joto.
• Kiwango cha juu cha joto:Kiwango cha juu ni 260°C.
• Muda juu ya mstari wa kioevu:Muda wa juu zaidi ambapo kipengele kinakabiliwa na kiwango cha juu cha joto unapaswa kuwa sekunde 10. Urejeshaji wa solder unapaswa kufanyika mara mbili tu.

Kwa sababu muundo wa bodi, vipengele na mchanga wa solder hutofautiana, mkunjo huu unatumika tu kama lengo la jumla. Uchambuzi maalum wa bodi unapendekezwa.

6.2 Uchimbaji wa Mikono

Ikiwa uchomeaji wa mikono ni lazima, tumia chuma cha kuchomea chenye joto lisilozidi 300°C. Muda wa uchomeaji kwa kila pini unapaswa kuwa sekunde 3 kwa upeo, na uchomeaji unapaswa kufanyika mara moja tu, ili kuzuia uharibifu wa joto kwa kifuniko cha plastiki na waya za ndani za kuunganisha.

6.3 Usafishaji

Usitumie vimumunyisho vya kemikali visivyobainishwa. Iwapo unahitaji kusafisha baada ya kuchomelea, weka LED ndani ya ethanol au isopropanol kwa joto la kawaida kwa muda usiozidi dakika moja. Vimumunyisho vikali vinaweza kuharibu lenzi ya epoksi au alama ya ufungaji.

6.4 Tahadhari za Kuzuia Utoaji Umeme wa Tuli (ESD)

LED ni nyeti kwa utoaji umeme tuli (ESD) na mawimbi ya voltage. Inashauriwa kuvaa mkanda wa mkono wenye kutuliza au glavu za kuzuia umeme tuli wakati wa kufanya kazi. Vifaa vyote vya kukusanyia na vituo vya kazi lazima vitulizwe ipasavyo ili kuzuia uharibifu wa ESD, ambao hauwezi kuonekana mara moja lakini utapunguza uimara wa muda mrefu.

7. Maelezo ya Ufungaji na Uagizaji

7.1 Vipimo vya Ukanda wa Kubeba na Reel

Components are supplied on 7-inch (178 mm) diameter reels in embossed carrier tape per ANSI/EIA-481 standard.

• Carrier tape width:8 mm.
• Quantity per reel:3000 pieces.
• Minimum Order Quantity (MOQ):The remaining quantity is 500 pieces.
• Cover tape:Komponentgropar som är tomma förseglas med topplockremsa.
• Saknade komponenter:Enligt reel-specifikationen är högst två på varandra följande saknade lampor (tomma gropar) tillåtna.

7.2 Masharti ya Uhifadhi

Förpackning förseglad:Lagra vid ≤30°C och ≤90% relativ fuktighet (RH). Hållbarhetstid är ett år i förseglad fuktighetsskyddande påse med torkmedel.Förpackning öppnad:För komponenter tagna ur originalförpackningen ska lagringsmiljön inte överstiga 30°C / 60% RH. Infraröd reflowlödning rekommenderas slutföras inom en vecka efter öppnandet.UHIFADHI WA MUDA MREFU (UMEFUNGULIWA):Hifadhi kwenye chombo kilichotiwa muhuri chenye kivundo-chembe au kivundo-hewa cha nitrojeni. Ikiwa imehifadhiwa nje ya mfuko asilia kwa zaidi ya wiki moja, inashauriwa kukausha kwa takriban 60°C, kwa angalau saa 20 kabla ya kukusanywa, ili kuondoa unyevu uliovutwa na kuzuia tukio la "popcorn" wakati wa uuzi wa solder.

8. Maelezo ya Utumizi na Mazingatio ya Ubunifu

8.1 Typical Application Circuit

Wakati inaendeshwa kutoka kwa chanzo cha voltage (kwa mfano, reli ya umeme ya 5V au 3.3V), kila chip ya LED (kijani na machungwa) inahitaji upinzani wa kikomo wa nje wa sasa. Thamani ya upinzani (R) inaweza kuhesabiwa kwa kutumia sheria ya Ohm: R = (V_{Chanzo cha Nguvu}- V_F) / I_F. Tumia V ya juu kwenye maelezo ya ufundi_F, ili kuhakikisha ya kwamba sasa haizidi I_F(thamani ya juu). Kwa mfano, kusukuma LED ya kijani kutoka kwa chanzo cha 5V, lengo la I_Fni 20mA: R = (5V - 3.5V) / 0.020A = 75 Ω. Upinzani wa kawaida wa 75Ω au 82Ω unafaa. Kwa udhibiti sahihi au kuzidisha njia, inashauriwa kutumia kichocheo cha sasa thabiti.

8.2 Thermal Management

Ingawa matumizi ya nguvu ni ya chini (76/75 mW), usimamizi bora wa joto kwenye PCB ni muhimu sana kudumisha mwangaza na maisha ya kifaa, hasa katika hali ya joto kali ya mazingira au wakati inasukumwa kwa sasa ya juu. Hakikisha mpangilio wa PCB unatoa eneo la kutosha la shaba karibu na pedi za LED ili kutumika kama kifaa cha kupoza joto. Epuka kuweka vifaa vingine vinavyotoa joto karibu.

8.3 Optical Design

Lenzi ya wazi hutoa mtazamo mpana na uliosambaa. Kwa matumizi yanayohitaji mwanga ulioelekezwa zaidi, vifaa vya sekondari vya kioo (kama mfereji wa kuongoza mwanga au lenzi) vinaweza kusanikishwa juu ya LED. Utendaji wa rangi mbili huruhusu kuunda rangi ya tatu (kwa mfano, kijani manjano) kwa kusukuma chips zote mbili kwa sasa iliyorekebishwa wakati mmoja, lakini hii inahitaji udhibiti makini wa sasa ili kufikia kiwango kinachohitajika cha rangi.

9. Technical Comparison and Differentiation

LTST-C155TGKFKT inajitofautisha katika soko kupitia sifa zifuatazo muhimu:Umbo nyembamba sana (1.10mm):Ikilinganishwa na LED nyingi za kawaida za SMD, hii ni faida kubwa, ikifanya iweze kutumika katika vifaa vya kisasa vinyembamba kama simu janja, kompyuta kibao na kompyuta mkononi.Chip mbili, udhibiti huru:Tofauti na baadhi ya LED zenye rangi mbili zinazotumia anodi ya pamoja au katodi ya pamoja, kifaa hiki hutoa pini huru kabisa. Hii inatoa urahisi mkubwa wa kubuni, kuruhusu matumizi ya saketi za kuendesha huru na mifumo ngumu zaidi ya ishara, bila utata wa ziada wa kuzidisha njia.Teknolojia ya Nyenzo:Kutumia chip ya kijani iliyotengenezwa kwa InGaN na chip ya machungwa iliyotengenezwa kwa AlInGaP, inawakilisha nyenzo bora za semiconductor zilizochaguliwa kwa rangi husika, ikitoa mwangaza mzuri na uthabiti wa rangi.Uwezekano wa Uzalishaji:Inaingiliana kikamilifu na usakinishaji wa kiotomatiki na mkunjo wa kawaida wa kuyeyusha bila risasi, na hupunguza gharama na utata wa usanikishaji kwa wazalishaji wakubwa.

10. Maswali Yanayoulizwa Mara kwa Mara (FAQ)

Q1: Je, naweza kuendesha LED ya kijani na ya machungwa kwa wakati mmoja?A: Ndiyo, pini zinafanya kazi kwa kujitegemea. Unaweza kuendesha moja, nyingine, au zote mbili kwa wakati mmoja. Hakikisha chanzo chako cha umeme na saketi zinaweza kutoa mkondo wa jumla (mfano, hadi 50mA ikiwa kila moja ni 20mA).

Q2: Kuna tofauti gani kati ya urefu wa wimbi la kilele na urefu wa wimbi kuu?A: Urefu wa wimbi la kilele (λ_P) ni urefu wa wimbi halisi wa mahali pa kiwango cha juu zaidi katika wigo. Urefu wa wimbi kuu (λ_d) inatokana na mahesabu ya mtazamo wa rangi ya jicho la binadamu (chati ya CIE) na inalingana zaidi na rangi inayohisiwa. Kawaida hizi thamani zina karibu lakini si sawa kabisa, hasa kwa wigo mpana.

Q3: Kwa nini kiwango cha voltage ya nyuma ni 5V tu?A: LED haikusudiwa kuzuia voltage ya nyuma kama diode ya rectifier. Kipimo cha 5V ni kikomo salama cha kushughulikia au kupima wakati mwingine usiofuatwa wa voltage ya nyuma. Katika muundo wa mzunguko, ikiwa imeunganishwa kwa ishara ya AC au basi ya pande mbili, hakikisha kila wakati polarity ya LED iko sawa au inalindwa na diode iliyounganishwa mfululizo.

Q4: Je, ninawezaje kuelewa msimbo wa kiwango wakati wa kuagiza?A: Msimbo wa kiwango (kwa mfano, kijani "S", machungwa "R") huelezea kiwango cha chini kinachohakikishiwa na cha juu cha nguvu ya mwanga. Ili kuhakikisha mstari wa bidhaa una mwangaza sawa, elezea kwa msambazaji wako msimbo wa kiwango unahitaji. Ikiwa haujataja, unaweza kupokea vipengele kutoka kiwango chochote kinachopatikana ndani ya anuwai ya bidhaa.

11. Mfano wa Matumizi Halisi

Hali: Kiashiria cha nguvu ya hali mbili kwa vifaa vya matumizi ya kawaida.Kifaa kinachotumia betri kinatumia LED hii kuonyesha hali ya kuchaji. Lengo la muundo ni: rangi ya machungwa inamaanisha "inachajiwa," na kijani inamaanisha "imejaa."Implementation Method:The microcontroller (MCU) has two GPIO pins. Each pin is connected to the anode of one LED color via a current-limiting resistor (calculated as described in Section 8.1). The cathodes are connected to ground. The MCU firmware drives the orange LED pin high during charging. When the battery management IC signals a full charge, the MCU turns off the orange pin and drives the green pin high. The ultra-thin package allows it to be mounted behind narrow bezels. The wide viewing angle ensures visibility from all angles. Independent control simplifies the firmware compared to common-anode types that require toggling ground.

12. Utangulizi wa Kanuni za Teknolojia

A light-emitting diode (LED) is a semiconductor device that emits light when current passes through it. This phenomenon is called electroluminescence. When a forward voltage is applied, electrons from the n-type semiconductor and holes from the p-type semiconductor are injected into the active region (junction area). When an electron recombines with a hole, it releases energy in the form of a photon (light particle). The wavelength (color) of the emitted light is determined by the bandgap of the semiconductor material used in the active region.InGaN (Indium Gallium Nitride):This material system has a wider bandgap, which can be tuned to emit blue, green, and ultraviolet light. Here, it is designed to emit green light (peak ~525 nm).AlInGaP (Aluminum Indium Gallium Phosphide):This material system is known for its high efficiency in the red, orange, and yellow spectral regions. Here, it is designed to emit orange light (peak ~611 nm).

13. Mwelekeo wa Sekta

Maendeleo ya LED za SMD kama LTST-C155TGKFKT yanafuata viwanda muhimu kadhaa vya sekta:Kupunguzwa kwa Ukubwa:Msukumo wa vipengele nyembamba na vidogo zaidi unaendelea kufanya bidhaa za mwisho kuwa nyembamba na kompakt. Urefu wa 1.10mm unawakilisha mtindo huu.Uboreshaji wa Ujumuishaji:Kuchanganya kazi nyingi (rangi mbili) katika kifurushi kimoja, ikilinganishwa na kutumia LED mbili huru, inaokoa nafasi kwenye PCB na kupunguza gharama za usanikishaji.Bila Risasi na Uzalishaji wa Kijani:Kufuata ROHS na kuelewana na mikondo ya kiwango cha juu ya reflow isiyo na risasi sasa ni mahitaji ya kawaida yanayoendeshwa na kanuni za kimazingira duniani kote.Uwiano wa Otomatiki:Ufungaji wa rena za mkanda na muundo wa mashine ya kuchomezea ni muhimu kwa uzalishaji wa wingi na gharama nafuu.Sanifu ya Utendaji:Kutumia kifurushi sanifu cha EIA na mkunjo wa kuyeyusha wa JEDEC kuhakikisha ushirikiano na uaminifu katika mnyororo mzima wa usambazaji wa elektroniki. Mienendo ya baadaye inaweza kujumuisha kifurushi nyembamba zaidi, nyenzo zenye ufanisi zaidi, na ujumuishaji wa kichocheo au mantiki ya udhibiti ndani ya kifurushi cha LED yenyewe.