Table of Contents
- 1. Product Overview
- 2. In-depth and Objective Interpretation of Technical Parameters
- 2.1 Viwango vya juu kabisa
- 2.2 Sifa za umeme na za nuru
- 3. Grading System Description
- 3.1 Luminous Intensity Binning
- 3.2 Dominant Wavelength Binning (Green Only)
- 4. Performance Curve Analysis
- 5. Mechanical and Packaging Information
- 5.1 Package Dimensions
- 5.2 Pin Assignment and Polarity
- 5.3 Recommended Pad Dimensions
- 6. Mwongozo wa Uchomeaji na Usanikishaji
- 6.1 Mkunjo wa Joto wa Uchomeaji wa Reflow
- 6.2 Manual Soldering
- 6.3 Masharti ya Uhifadhi
- 6.4 Usafishaji
- 7. Ufungaji na Taarifa za Kuagiza
- 7.1 Vipimo vya Tape Carrier na Reel
- 7.2 Part Number Interpretation
- 8. Mapendekezo ya Utumiaji
- 8.1 Mandhari ya Kawaida ya Utumiaji
- 8.2 Design Considerations
- 9. Technical Comparison and Differentiation
- 10. Maswali Yanayoulizwa Mara kwa Mara (Kulingana na Vigezo vya Kiufundi)
- 11. Matumizi Halisi ya Kifani
- 12. Utangulizi wa Kanuni
- 13. Mwelekeo wa Maendeleo
1. Product Overview
The LTST-C195TGKRKT is a dual-color surface-mount device (SMD) LED designed for modern electronic applications, suitable for scenarios with high demands for compact size and reliable performance. This device integrates two different semiconductor chips within a single package: an InGaN (Indium Gallium Nitride) chip for emitting green light and an AlInGaP (Aluminum Indium Gallium Phosphide) chip for emitting red light. Its primary design goal is to provide a high-brightness, color-indicating solution within an ultra-thin form factor, making it ideal for space-constrained designs such as ultra-thin consumer electronics, wearable devices, and advanced panel indicators.
The core advantage of this LED lies in its ability to achieve dual-color functionality within a single EIA standard package, eliminating the need for two separate components. It is an environmentally friendly product compliant with RoHS standards. The device is supplied in 8mm carrier tape format, wound on 7-inch diameter reels, fully compatible with high-speed automatic pick-and-place equipment used in high-volume manufacturing. Furthermore, its design can withstand standard infrared (IR) reflow soldering processes, facilitating easy integration into automated PCB assembly lines.
2. In-depth and Objective Interpretation of Technical Parameters
2.1 Viwango vya juu kabisa
Viwango hivi vinaelezea mipaka ya mkazo ambayo inaweza kusababisha uharibifu wa kudumu kwa kifaa. Ili kuhakikisha uendeshaji unaotegemewa, hali ya uendeshaji haipaswi kuzidi maadili haya. Viwango vimebainishwa kwa joto la mazingira (Ta) la 25°C.
- Matumizi ya nguvu (Pd):Kwa chipu ya kijani ni 76 mW, na kwa chipu nyekundu ni 75 mW. Kigezo hiki kinaonyesha nguvu ya juu zaidi ambayo LED inaweza kutawanya kwa njia ya joto bila kuharibika.
- Upeo wa sasa wa mbele (IFP):Kijani ni 100 mA, nyekundu ni 80 mA. Hii ndiyo mkondo wa juu zaidi unaoruhusiwa wa msukumo, kwa kawaida umebainishwa kwa uwiano wa mzunguko wa 1/10 na upana wa msukumo wa 0.1ms, kutumika kwa mwanga mfupi wenye nguvu.
- Mkondo wa moja kwa moja wa mbele (IF):Kijani ni 20 mA, nyekundu ni 30 mA. Hizi ni mikondo inayopendekezwa ya kufanya kazi kwa mfululizo wakati wa uangavu wa kawaida.
- Safu ya joto:Joto la kufanya kazi: -20°C hadi +80°C; Joto la kuhifadhi: -30°C hadi +100°C.
- Masharti ya IR reflow:Capable of withstanding a peak temperature of 260°C for 10 seconds, which is the standard condition for lead-free (Pb-free) soldering processes.
2.2 Sifa za umeme na za nuru
These are typical performance parameters, measured under the conditions of Ta=25°C and IF=20mA, isipokuwa imeelezwa vinginevyo.
- Nguvu ya mwanga (IV):Chip ya kijani thamani ya chini ni 112 mcd, thamani ya juu ni 450 mcd. Chip ya nyekundu thamani ya chini ni 112 mcd, thamani ya juu ni 280 mcd. Thamani ya kawaida haijabainishwa, ikionyesha utendaji unasimamiwa kupitia mfumo wa kugawanya daraja.
- Pembe ya mtazamo (2θ1/2):Kwa rangi zote mbili, pembe ya maono ya kawaida ya upana ni digrii 130, inayofafanuliwa kama pembe ya mhimili wakati nguvu ya mwanga inapungua hadi nusu ya thamani ya mhimili.
- Urefu wa wimbi la kilele (λP):Thamani za kawaida ni nm 525 (kijani kibichi) na nm 639 (nyekundu). Hii ndio urefu wa wimbi unaolingana na sehemu ya juu zaidi katika wigo wa utoaji.
- Urefu wa wimbi kuu (λd):Thamani ya kawaida ni 525 nm (kijani kibichi) na 631 nm (nyekundu). Hii ni urefu wa wimbi moja linalohisiwa na jicho la mwanadamu, linalotokana na chati ya rangi ya CIE, na ni muhimu kwa ufafanuzi wa rangi.
- Upana wa nusu ya mstari wa wigo (Δλ):Thamani ya kawaida ni 35 nm (kijani kibichi) na 20 nm (nyekundu). Hii inaonyesha usafi wa wigo; upana wa nusu unavyopungua, rangi inavyokuwa iliyojazwa na safi zaidi.
- Voltage ya mbele (VF):At 20mA, the typical forward voltage is 3.30V (max 3.50V) for green and 2.00V (max 2.40V) for red. These are key parameters for driving circuit design and power supply selection.
- Reverse Current (IR):At a Reverse Voltage (VR) of 5V, the maximum for both is 10 µA. The datasheet clearly states that the device is not designed for reverse operation; this test is only for characterizing leakage current characteristics.
3. Grading System Description
Bidhaa hii inatumia mfumo wa kugawanya, unaowagawanya LED kulingana na vigezo muhimu vya macho, kuhakikisha uthabiti ndani ya kundi. Kivuli cha uvimbe wa kila kiwango cha nguvu ya mwanga ni ±15%, na kivuli cha kiwango cha mawimbi makuu ni ±1 nm.
3.1 Luminous Intensity Binning
Kijani (@20mA):
Nambari ya kiwango R: 112.0 – 180.0 mcd
Nambari ya kiwango S: 180.0 – 280.0 mcd
Nambari ya kiwango T: 280.0 – 450.0 mcd
Red (@20mA):
Nambari ya kiwango R: 112.0 – 180.0 mcd
Nambari ya kiwango S: 180.0 – 280.0 mcd
3.2 Dominant Wavelength Binning (Green Only)
Bin Code AP: 520.0 – 525.0 nm
Gear code AQ: 525.0 – 530.0 nm
Gear code AR: 530.0 – 535.0 nm
4. Performance Curve Analysis
Although specific graphical curves are referenced in the datasheet (e.g., Figure 1 for spectral distribution, Figure 6 for viewing angle), their typical interpretation is crucial for design.
- IV curve:Voltage ya mbele (VF) and forward current (IFThe relationship is nonlinear. For both chips, VFincreases with IFand decreases with rising junction temperature. It is strongly recommended to use a constant current driver rather than a constant voltage source to ensure stable light output.
- Temperature Characteristics:Kawaida ya mwangaza hupungua kwa kiwango kikubwa kadri halijoto ya kiungo kinavyoongezeka. Safu ya halijoto ya uendeshaji ya -20°C hadi +80°C hufafanua hali ya mazingira ambayo utendaji maalum unahakikishiwa. Wabunifu lazima wazingatie usimamizi wa joto kwenye bodi ya mzunguko ili kuzuia kupanda kwa halijoto kupita kiasi katika nafasi za juu za sasa au zilizofungwa.
- Usambazaji wa wigo:Ikilinganishwa na chipi nyekundu (AlInGaP) (20nm), chipi ya kijani (InGaN) ina upana wa nusu ya wigo (35nm). Ikitumika pamoja na LED nyingine, hii inaweza kuathiri athari za kuchanganya rangi na usawa wa rangi unaohisiwa.
5. Mechanical and Packaging Information
5.1 Package Dimensions
This device conforms to the EIA standard package outline. Key dimensions include a body size of approximately 2.0mm x 1.25mm and a critical low-profile height of 0.55mm (typical). Unless otherwise specified, all dimensional tolerances are ±0.10mm. The package employs a water-clear lens, which is optimal for achieving the specified wide viewing angle and maintaining pure emission color.
5.2 Pin Assignment and Polarity
This LED has four terminals. The green chip is connected between Pin 1 and Pin 3. The red chip is connected between Pin 2 and Pin 4. This configuration allows independent control of each color. The cathode/anode designation for each chip must be verified against the recommended pad layout diagram to ensure correct orientation during PCB design and assembly.
5.3 Recommended Pad Dimensions
Mwongozo huo unatoa muundo unaopendekezwa wa pad (package) kwa ajili ya kubuni PCB. Kufuata vipimo hivi ni muhimu kwa ajili ya kupata muunganisho wa kuaminika wa solder, usawa sahihi, na upitishaji mzuri wa joto wakati wa mchakato wa reflow. Ubunifu wa pad pia husaidia kuzuia tukio la "kujikunja" (kipengele kinachoinama upande mmoja) wakati wa kufunga.
6. Mwongozo wa Uchomeaji na Usanikishaji
6.1 Mkunjo wa Joto wa Uchomeaji wa Reflow
Provides recommended IR reflow temperature profiles for lead-free processes. Key parameters include:
- Preheating:150°C hadi 200°C.
- Muda wa kuwasha moto:Kwa upeo wa sekunde 120, ili kupokanzwa bodi ya mzunguko na vipengele hatua kwa hatua, kuamilisha flux na kupunguza mshtuko wa joto kwa kiwango cha juu.
- Kiwango cha juu cha joto:Maximum 260°C.
- Time Above Liquidus:The component should not be exposed to the peak temperature for more than 10 seconds, and this reflow cycle should not be performed more than twice.
Curve hii inategemea kiwango cha JEDEC ili kuhakikisha uaminifu. Hata hivyo, maelezo ya vipimo yanaonyesha kwa usahihi kwamba curve bora inategemea muundo maalum wa bodi ya mzunguko, vipengele, mchanga wa kuuza na tanuru, kwa hivyo inashauriwa kufanya uchambuzi wa sifa.
6.2 Manual Soldering
Ikiwa ni lazima kufanya uuzaji wa mikono, tumia chuma cha kuuza cha umeme kisichozidi 300°C na uweke kikomo cha muda wa mguso kwa kila kiunga cha kuuza kwa sekunde 3 kwa upeo. Kitendo hiki kinapaswa kufanywa mara moja tu, ili kuepuka kuharibu kwa joto chip ya LED na ufungaji wa plastiki.
6.3 Masharti ya Uhifadhi
LED ni kifaa kinachohisi unyevunyevu (MSD).
- Ufungashaji Uliofungwa:Store at ≤ 30°C and ≤ 90% RH. Use within one year from the date the moisture barrier bag is opened.
- Opened Packaging:Store at ≤ 30°C and ≤ 60% RH. It is recommended to complete IR reflow soldering within one week after opening. For long-term storage outside the original packaging, use a sealed container with desiccant or a nitrogen dry cabinet. Components stored for more than one week should be baked at approximately 60°C for at least 20 hours prior to soldering to remove absorbed moisture and prevent "popcorn" effect (package cracking due to vapor pressure during reflow).
6.4 Usafishaji
Tumia tu vifaa vya kusafisha vilivyobainishwa. Kemikali zisizobainishwa zinaweza kuharibu kifuniko cha plastiki. Ikiwa unahitaji kusafisha baada ya kuchomea, weka LED kwenye ethanol au isopropanol kwa si zaidi ya dakika moja kwenye halijoto ya kawaida. Usitumie usafishaji wa mawimbi ya sauti isipokuwa ikiwa umehakiki usawa wake, kwani inaweza kusababisha mkazo wa mitambo.
7. Ufungaji na Taarifa za Kuagiza
7.1 Vipimo vya Tape Carrier na Reel
The device is supplied in embossed carrier tape with protective cover tape, wound on 7-inch (178mm) diameter reels. The standard reel quantity is 4000 pieces. For remainder quantities, the minimum packaging quantity is 500 pieces. The packaging conforms to the ANSI/EIA 481-1-A-1994 specification. A maximum of two consecutive missing components (cavities) is allowed per reel.
7.2 Part Number Interpretation
The part number LTST-C195TGKRKT follows the manufacturer's internal coding system, which typically encodes information related to series, size, color, bin code, and packaging. In this case, "TG" and "KR" may represent the color/bin combination for green and red, respectively.
8. Mapendekezo ya Utumiaji
8.1 Mandhari ya Kawaida ya Utumiaji
- Kiashiria cha Hali:Kazi ya rangi mbili inaruhusu utoaji wa ishara za hali nyingi kutoka kwa kipengele kimoja cha mwanga (mfano, kijani=kiwango cha kawaida/wazi, nyekundu=hitilafu/onyo, rangi mbili=msubiri/onyo).
- Mwanga wa nyuma wa kibodi na alama:Umbo lake nyembamba sana linafaa kutoa mwanga wa nyuma kwa vifungo nyembamba au alama katika vifaa vya matumizi ya kawaida, vifaa vya nyumbani, na mapambo ya ndani ya magari.
- Kiashiria cha usakinishaji wa jopo:Suitable for industrial control panels, network equipment, and instrumentation where space is limited and clear color differentiation is required.
- Portable and Wearable Devices:Smartwatches, fitness trackers, and medical monitors benefit from their low profile and dual-function indicator lights.
8.2 Design Considerations
- Current Limiting:Always use a series current-limiting resistor or a constant-current driver for each color channel. Based on the power supply voltage (VCC), the typical V of the LED at the required currentFand the required IF(e.g., 20mA) to calculate the resistance value. Green example: R = (VCC- 3.3V) / 0.020A.
- ESD Protection:LEDs are sensitive to Electrostatic Discharge (ESD). If trace lengths are long or the environment is prone to ESD, implement ESD protection measures (e.g., TVS diodes) on the PCB near the LED connection points. Always handle components with proper ESD precautions (wrist strap, grounded workstation).
- Thermal Management:Ingawa matumizi ya nguvu ni ya chini, hakikisha eneo la shaba la kutosha karibu na pedi ya joto (ikiwepo) au pini ili kupitisha joto, hasa wakati wa kufanya kazi katika hali ya joto la juu la mazingira au karibu na mkondo wa juu zaidi.
- Usanifu wa Kioo:Lenzi ya uwazi na pembe ya maono ya digrii 130 hutoa mwanga mpana uliosambaa. Kwa mwanga wa mwelekeo maalum, huenda ikahitajika lenzi ya nje au kielekezi cha mwanga.
9. Technical Comparison and Differentiation
The primary differentiation of the LTST-C195TGKRKT lies in its feature set:
1. Ultra-thin profile (0.55mm):Nyembamba kuliko LED nyingi za kawaida za rangi mbili, inafaa kwa muundo wa bidhaa zinazokuwa nyembamba zaidi.
2. Chip technology:Inatumia InGaN yenye ufanisi kwa rangi ya kijani, na AlInGaP kwa rangi nyekundu, hutoa utendaji mzuri wa mwangaza na rangi.
3. Ujumuishaji wa Chipu Mbili:Kuchanganya rangi mbili ndani ya ukubwa wa kifungashio cha kiwango cha tasnia, hukokoa nafasi kwenye PCB na gharama za usanikishaji ikilinganishwa na kutumia LED mbili tofauti.
4. Uwezekano wa Uzalishaji:Inaendana kabisa na rejista ya mkanda, usakinishaji wa kiotomatiki na mchakato wa IR reflow usio na risasi, na hivyo kuifanya inafaa sana kwa uzalishaji mkubwa wa kiotomatiki.
10. Maswali Yanayoulizwa Mara kwa Mara (Kulingana na Vigezo vya Kiufundi)
Q1: Je, naweza kuendesha LED ya kijani kibichi na nyekundu kwa wakati mmoja kwa mkondo wa juu wa moja kwa moja?
A: Kikomo cha juu kabisa cha ukadiriaji kinabainisha matumizi ya nguvu kwa chipi (kijani kibichi 76mW, nyekundu 75mW). Kufanya kazi kwa wakati mmoja kwa 20mA (kijani kibichi) na 30mA (nyekundu) hutoa matumizi ya nguvu ya takriban 66mW (3.3V*0.02A) na 60mW (2.0V*0.03A) mtawalia, yote yakiwa ndani ya mipaka. Hata hivyo, ni lazima kuzingatia jumla ya joto linalozalishwa ndani ya kifurushi kidogo, ambalo linaweza kuhitaji kupunguzwa kwa matumizi katika hali ya joto la juu la mazingira.
Q2: Kuna tofauti gani kati ya urefu wa wimbi la kilele na urefu wa wimbi kuu?
A: Peak wavelength (λP) is the physical wavelength corresponding to the highest intensity point of the emission spectrum. Dominant wavelength (λd) is a value calculated based on human color vision (CIE diagram), representing the "color" we perceive. For monochromatic LEDs, they are usually very close, but for broader spectra (like the green chip here), they may differ slightly. λdis more relevant for color specifications.
Q3: Kwa nini kufanya mtihani wa mkondo wa nyuma kwenye 5V ikiwa kifaa hakitumiki kwa kazi ya nyuma?
A: Katika VR=5V, mtihani wa IRni mtihani wa ubora wa kiungo cha semiconductor na mkondo wa uvujaji. Inathibitisha ukamilifu wa chip. Haipendekezwi kutumia voltage ya nyuma katika mzunguko halisi kwani haikusudiwa kuzuia voltage ya nyuma kubwa, na kufanya hivyo kunaweza kuharibu LED haraka.
Q4: How to choose the appropriate bin code for my application?
A: For applications requiring consistent brightness across multiple units (e.g., status indicators on a panel), specify stricter luminous intensity bins (e.g., bin S or T). For applications with strict color requirements (e.g., color mixing), specify dominant wavelength bins (e.g., AP, AQ, AR for green). Negotiate with suppliers during procurement to ensure delivered batches meet your binning requirements.
11. Matumizi Halisi ya Kifani
Scenario: Designing a Dual-State Indicator Light for an IoT Sensor Module
Due to space constraints, a compact IoT sensor module requires a single LED to indicate power (green) and data transmission activity (red). The LTST-C195TGKRKT was selected.
1. PCB Layout:Tumia muundo ulipendekezwa wa pad. Pini 1 na 3 (kijani) zimeunganishwa kupitia resistor ya 100Ω kwa pini ya GPIO, ambayo imewekwa kuwa pato la kiwango cha juu kuashiria "wazi" (kwa usambazaji wa 3.3V: (3.3V-3.3V)/0.02A ≈ 0Ω, kwa hivyo resistor ndogo hutumika kuzuia mkondo wa mafuriko). Pini 2 na 4 (nyekundu) zimeunganishwa kupitia resistor ya 68Ω kwa pini nyingine ya GPIO (kwa usambazaji wa 3.3V: (3.3V-2.0V)/0.02A = 65Ω).
2. Firmware:Wakati usambazaji wa umeme uko sawa, LED ya kijani inawaka kwa mwendelezo. LED nyekundu inawaka na kuzima kwa muda mfupi wakati wa kifurushi cha uhamishaji data.
3. Matokeo:Moduli hii inatoa kiashiria cha hali mbili wazi kutoka kwa nukta ya 2.0x1.25mm, inachukua nafasi ndogo sana ya bodi na urefu, na hutumia mchakato wa kawaida wa SMT kwa usanikishaji.
12. Utangulizi wa Kanuni
Mwangaza katika LED unatokana na umeme-luminiscence ya p-n junction ya semikondukta. Wakati voltage chanya inatumika, elektroni kutoka eneo la aina-n na mashimo kutoka eneo la aina-p huingizwa kwenye eneo lenye ufanisi. Wakati vibeba hivi vinaungana tena, hutoa nishati kwa njia ya fotoni (mwanga). Urefu maalum wa wimbi wa mwanga unaotolewa (rangi) huamuliwa na nishati ya pengo la bendi ya nyenzo za semikondukta zinazotumiwa katika eneo lenye ufanisi.
-Kijani LEDTumiaInGaN(Indium Gallium Nitride) semiconductor compound. Adjusting the ratio of indium to gallium can tune the bandgap to produce green light (approximately 525 nm).
-Red LEDTumiaAlInGaP(AlInGaP) semiconductor ya mchanganyiko. Mfumo huu wa nyenzo unaweza kutoa mwanga mwekundu, wa machungwa na wa kahawia kwa ufanisi mkubwa. Hapa, umepangwa kutoa mwanga mwekundu (takriban 631-639 nm).
Chipu zote mbili zimefungwa ndani ya kifurushi kimoja cha plastiki lenye lenzi ya epoksi wazi kama maji, ambayo inalinda chipu, hutoa uthabiti wa kiufundi, na huunda muundo wa pato la mwanga.
13. Mwelekeo wa Maendeleo
Soko la SMD LED kama vile LTST-C195TGKRKT linaendelea kukua linalimwa na mwelekeo muhimu kadhaa:
1. Miniaturization:The persistent demand for thinner and smaller components drives package heights below 0.5mm and smaller package sizes.
2. Increased Integration:Mbali na rangi mbili, mwelekeo pia unajumuisha kuunganisha RGB (chips tatu) au RGBW (chips tatu + nyeupe) kwenye kifurushi kimoja, hata kuunganisha IC ya kuendesha ndani ya kifurushi cha LED ("LED zenye akili").
3. Ufanisi na mwangaza wa juu zaidi:Uboreshaji endelevu wa ukuaji wa epitaxial na muundo wa chip umeleta ufanisi wa juu zaidi wa utoaji mwanga (utoaji zaidi wa mwanga kwa kila watt ya umeme), kuruhusu matumizi ya nguvu ya chini au mwangaza wa juu zaidi chini ya mkondo sawa.
4. Uboreshaji wa kuegemea na utendaji wa joto:Maendeleo katika nyenzo za ufungashaji (mifuko ya umbo, fremu za waya) yameimarisha ukinzani wa unyevu, joto la juu na mzunguko wa joto, na kupanua maisha ya kazi, hasa katika matumizi ya magari na viwanda.
5. Ulinganifu wa Rangi na Uainishaji wa Juu:Toleransi zaidi ya kiwango cha mwanga, viwianishi vya rangi (x, y kwenye chati ya CIE), na voltage ya mbele, inakuwa mahitaji ya kawaida kwa matumizi kama vile taa za nyuma za maonyesho na taa za majengo, na inasukuma upimaji na uchaguzi ngumu zaidi wa uzalishaji.
Maelezo ya Istilahi za Vipimo vya LED
Maelezo Kamili ya Istilahi za Teknolojia ya LED
I. Viashiria vikuu vya utendaji wa umeme na nuru
| Istilahi | Vitengo/Uwakilishi | Popular Explanation | Why It Is Important |
|---|---|---|---|
| Ufanisi wa Mwanga (Luminous Efficacy) | lm/W (lumen/watt) | Mwangaza unaotolewa kwa kila watt ya umeme, thamani ya juu zaidi inaonyesha matumizi bora ya nishati. | Huamua moja kwa moja kiwango cha ufanisi wa nishati cha taa na gharama ya umeme. |
| Luminous Flux | lm (lumen) | Jumla ya mwanga unaotolewa na chanzo cha mwanga, unaojulikana kwa jina la "mwangaza". | Huamua kama taa inatosha kuwa na mwangaza. |
| Pembe ya kuona (Viewing Angle) | ° (digrii), kama 120° | Pembe ambapo ukali wa mwanga hupungua hadi nusu, huamua upana wa boriti ya mwanga. | Huathiri eneo la mwangaza na usawa wake. |
| Joto la rangi (CCT) | K (Kelvin), k.m. 2700K/6500K | Joto la rangi ya mwanga, thamani ya chini inaelekea manjano/joto, thamani ya juu inaelekea nyeupe/baridi. | Inaamua mazingira ya taa na matumizi yanayofaa. |
| Kielelezo cha Uonyeshaji Rangi (CRI / Ra) | Hakuna kitengo, 0–100 | Uwezo wa chanzo cha mwanga kurejesha rangi halisi ya kitu, Ra≥80 ni bora. | Inaathiri ukweli wa rangi, hutumika katika maeneo yenye mahitaji makubwa kama maduka makubwa, majumba ya sanaa n.k. |
| Color Tolerance (SDCM) | MacAdam Ellipse Steps, e.g., "5-step" | A quantitative indicator of color consistency; a smaller step number indicates higher color consistency. | Kuhakikisha hakuna tofauti ya rangi kati ya taa za kundi moja. |
| Dominant Wavelength | nm (nanometer), kama 620nm (nyekundu) | Thamani ya urefu wa wimbi inayolingana na rangi ya LED zenye rangi. | Inaamua hue ya LED ya rangi moja kama nyekundu, manjano, kijani, n.k. |
| Usambazaji wa Wigo (Spectral Distribution) | Mkunjo wa Wimbi la Mwinda dhidi ya Nguvu | Inaonyesha usambazaji wa nguvu ya mwanga unaotolewa na LED kwenye kila urefu wa wimbi. | Huathiri ubora wa kuonyesha rangi na ubora wa rangi. |
II. Vigezo vya Umeme
| Istilahi | Ishara | Popular Explanation | Mambo ya Kuzingatia katika Ubunifu |
|---|---|---|---|
| Voltage ya Mbele (Forward Voltage) | Vf | Voltage ya chini inayohitajika kuwasha LED, kama "kizingiti cha kuanzisha". | Voltage ya chanzo cha umeme inahitaji kuwa ≥ Vf, voltage inajumlishwa wakati LED nyingi zimeunganishwa mfululizo. |
| Forward Current | If | The current value required for the LED to emit light normally. | Constant current drive is commonly used, as the current determines brightness and lifespan. |
| Mkondo wa juu zaidi wa msukumo (Pulse Current) | Ifp | Peak current that can be withstood for a short period, used for dimming or flashing. | Pulse width and duty cycle must be strictly controlled to prevent overheating damage. |
| Reverse Voltage | Vr | The maximum reverse voltage that an LED can withstand; exceeding it may cause breakdown. | Mzunguko unahitaji kuzuia uunganishaji kinyume au mshtuko wa voltage. |
| Thermal Resistance | Rth(°C/W) | Upinzani wa joto kutoka kwenye chip hadi kwenye sehemu ya kuuziwa, thamani ya chini inaonyesha usambazaji bora wa joto. | Upinzani wa juu wa joto unahitaji muundo wenye nguvu zaidi wa usambazaji wa joto, vinginevyo joto la kiungo litaongezeka. |
| Uvumilivu wa Kutokwa na Umeme wa Tuli (ESD Immunity) | V (HBM), k.m. 1000V | Uwezo wa kukabiliana na mshtuko wa umeme wa tuli, thamani ya juu zaidi inamaanisha uwezo mkubwa wa kuepusha uharibifu kutokana na umeme wa tuli. | Hatua za kinga dhidi ya umeme wa tuli zinahitajika katika uzalishaji, hasa kwa LED zenye usikivu mkubwa. |
III. Usimamizi wa Joto na Uthabiti
| Istilahi | Viashiria Muhimu | Popular Explanation | Athari |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Joto halisi la uendeshaji ndani ya chip ya LED. | Kila kupungua kwa joto kwa 10°C, maisha ya taa yanaweza kuongezeka mara mbili; joto la juu sana linasababisha kupungua kwa mwanga na mabadiliko ya rangi. |
| Kupungua kwa Mwanga (Lumen Depreciation) | L70 / L80 (saa) | Muda unaohitajika ili mwangaza upunguke hadi 70% au 80% ya thamani ya awali. | Inafafanua moja kwa moja "maisha ya huduma" ya LED. |
| Lumen Maintenance | % (e.g., 70%) | The percentage of remaining brightness after a period of use. | Inaonyesha uwezo wa kudumisha mwangaza baada ya matumizi ya muda mrefu. |
| Color Shift | Δu′v′ or MacAdam ellipse | The degree of color change during use. | Affects the color consistency of the lighting scene. |
| Uzeefu wa joto (Thermal Aging) | Kupungua kwa utendaji wa nyenzo | Deterioration of packaging materials due to prolonged high temperatures. | May lead to decreased brightness, color shift, or open-circuit failure. |
IV. Packaging and Materials
| Istilahi | Common Types | Popular Explanation | Characteristics and Applications |
|---|---|---|---|
| Packaging Type | EMC, PPA, Ceramic | A housing material that protects the chip and provides optical and thermal interfaces. | EMC offers good heat resistance and low cost; ceramics provide excellent heat dissipation and long lifespan. |
| Chip structure | Front-side mounting, flip-chip (Flip Chip) | Chip electrode arrangement method. | Flip-chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications. |
| Phosphor coating | YAG, Silicate, Nitride | Inayofunikwa kwenye chip ya mwanga wa bluu, sehemu hubadilishwa kuwa mwanga wa manjano/nyekundu, na kuchanganywa kuwa mwanga mweupe. | Fosfori tofauti huathiri ufanisi wa mwanga, halijoto ya rangi na ubora wa kuonyesha rangi. |
| Lenzi/Usanifu wa Optics | Flat, Microlens, Total Internal Reflection | Optical structure on the encapsulation surface, controlling light distribution. | Determine the beam angle and light distribution curve. |
V. Quality Control and Binning
| Istilahi | Binning Content | Popular Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Binning | Codes such as 2G, 2H | Group by brightness level, each group has a minimum/maximum lumen value. | Ensure consistent brightness for products within the same batch. |
| Mgawanyiko wa voltage | Msimbo kama vile 6W, 6X | Group by forward voltage range. | Facilitates driver matching and improves system efficiency. |
| Color binning. | 5-step MacAdam Ellipse | Group by color coordinates to ensure colors fall within a minimal range. | Hakikisha usawa wa rangi, epuka kutofautiana kwa rangi ndani ya taa moja. |
| Mgawanyiko wa joto la rangi | 2700K, 3000K, n.k. | Kugawanywa kulingana na joto la rangi, kila kikundi kina anuwai ya kuratibu inayolingana. | Kukidhi mahitaji ya joto la rangi kwa matukio tofauti. |
VI. Upimaji na Uthibitishaji
| Istilahi | Viwango/Upimaji | Popular Explanation | Maana |
|---|---|---|---|
| LM-80 | Mtihani wa Kudumisha Lumen | Kurekebisha kwa muda mrefu chini ya hali ya joto la kudumu, kurekodi data ya kupungua kwa mwangaza. | Kutumia kukadiria maisha ya LED (kwa kuchanganya TM-21). |
| TM-21 | Standard for Life Projection | Projecting lifetime under actual use conditions based on LM-80 data. | Toa utabiri wa kisayansi wa maisha. |
| IESNA Standard | Illuminating Engineering Society Standard | Inajumuisha mbinu za majaribio ya optiki, umeme na joto. | Msingi wa majaribio unaokubalika na tasnia. |
| RoHS / REACH | Environmental Certification | Ensure products are free from hazardous substances (e.g., lead, mercury). | Masharti ya kuingia katika soko la kimataifa. |
| ENERGY STAR / DLC | Uthibitishaji wa Ufanisi wa Nishati | Uthibitishaji wa Ufanisi wa Nishati na Utendaji kwa Bidhaa za Taa. | Inatumika kwa kawaida katika miradi ya ununuzi wa serikali na ruzuku, kuimarisha ushindani wa soko. |