LTST-B32JEGBK-AT Ultra-Thin Full-Color SMD LED Datasheet - RGB Tri-Color - 0.65mm Ultra-Low Profile - 25mA/20mA Forward Current - Technical Documentation

1. Product Overview

LTST-B32JEGBK-AT ni LED ya rangi kamili ya aina ya kukandamizwa, iliyoundwa mahsusi kwa matumizi ya kisasa ya elektroniki yanayohitaji kuonyesha rangi zenye uangavu au taa ya nyuma katika nafasi ndogo. Kifaa hiki kinaunganisha chipi tatu tofauti za semiconductor ndani ya kifurushi kimoja: chipi moja ya AlInGaP inayotoa mwanga mwekundu na chipi mbili za InGaN zinazotoa mwanga kijani na bluu. Mchanganyiko huu huruhusu uzalishaji wa anuwai pana ya rangi kupitia udhibiti wa pekee au wa pamoja wa vyanzo vya mwanga vya rangi za msingi tatu. Sifa yake kuu ni urefu mdogo sana wa wastani wa 0.65mm, unaofaa kwa matumizi yenye nafasi ya wima iliyopunguzwa sana, kama vile vifaa vya kipekee vya watumiaji, vifaa vinavyovaliwa au paneli za udhibiti sahihi.

LED hii imepakiwa kwenye mkanda wa 8mm, umewindwa kwenye reeli yenye kipenyo cha inchi 7, na inafuata viwango vya EIA, ikihakikisha utangamano na vifaa vya kiotomatiki vya kasi vinavyotumika katika utengenezaji wa wingi. Zaidi ya hayo, inakubaliana na mchakato wa kuunganishwa kwa IR usio na risasi, ukifuata kanuni za kisasa za mazingira na viwango vya utengenezaji.

1.1 Product Features

• Inakidhi na RoHS (Vikwazo vya Vitu Hatari) Mwongozo.
• Ufungaji nyembamba sana, urefu ni mm 0.65 tu.
• Inatumia teknolojia ya ufanisi ya AlInGaP kwa mwanga mwekundu, na teknolojia ya InGaN kwa mwanga kijani na bluu, na hivyo kupata nguvu ya mwanga ya juu.
• Packaged in 8mm carrier tape on 7-inch reels for automated handling.
• Complies with the standard EIA package outline.
• Design compatible with integrated circuit (IC) drive levels.
• Suitable for automatic placement equipment.
• Can withstand standard infrared reflow soldering temperature profiles.

1.2 Maeneo ya Utumizi

• Viashiria vya hali na umeme katika vifaa vya mawasiliano, vifaa vya otomatiki ofisini, vifaa vya nyumbani, na mifumo ya udhibiti wa viwanda.
• Backlighting for keyboards, keys, and control buttons.
• Illumination for micro-displays and symbol indicators.
• General-purpose signal lights requiring multi-color functionality.

2. Vigezo vya Kiufundi: Ufafanuzi wa kina na wa kiekuzi

The performance of the LTST-B32JEGBK-AT is defined by a comprehensive set of electrical, optical, and thermal parameters. Understanding these specifications is crucial for reliable circuit design and achieving the desired visual effects.

2.1 Absolute Maximum Ratings

These ratings define the stress limits that may cause permanent damage to the device. Operation at or beyond these limits is not guaranteed.

• Power Dissipation (Pd):Red light: 62.5 mW, Green/Blue light: 76 mW. This parameter, combined with thermal resistance, determines the maximum allowable power to prevent overheating.
• Peak Forward Current (I_F(PEAK)):Red light: 60 mA, green/blue light: 100 mA. This is the maximum allowable pulse current, typically specified at a low duty cycle (1/10) and short pulse width (0.1ms), suitable for multiplexing or brief high-brightness pulses.
• DC forward current (I_F):Red light: 25 mA, green/blue light: 20 mA. This is the maximum continuous current recommended for reliable long-term operation.
• Electrostatic discharge (ESD) tolerance:Mwanga Mwekundu: 2000V (Mfano wa Mwili wa Binadamu), Mwanga wa Kijani/Bluu: 1000V (Mfano wa Mwili wa Binadamu). Chip za InGaN za mwanga wa kijani na bluu kwa kawaida huwa nyeti zaidi kwa ESD kuliko chip za AlInGaP za mwanga mwekundu, kwa hivyo zinahitaji tahadhari kali zaidi za uendeshaji.
• Joto la Uendeshaji na Uhifadhi:-40°C hadi +85°C (uendeshaji), -40°C hadi +90°C (uhifadhi). Hii inafafanua hali ya mazingira ambayo kifaa kinaweza kustahimili.
• Infrared Welding Conditions:Can withstand a peak temperature of 260°C for 10 seconds, which is the standard condition for lead-free reflow processes.

2.2 Electrical and Optical Characteristics

Hizi ni vigezo vya kawaida na vya uhakika vya utendaji vilivyopimwa chini ya hali ya kawaida ya majaribio (Ta=25°C, I_F=5mA, isipokuwa ikibainishwa vinginevyo).

• Nguvu ya mwanga (I_V):hupimwa kwa msaada wa milikandela (mcd). Thamani ya chini kwa kila rangi ni: Mwanga Mwekundu: 26.0 mcd, Mwanga Kijani: 122.0 mcd, Mwanga Bluu: 22.0 mcd. Pato la chipi ya kijani ni kubwa zaidi kutokana na ufanisi wa juu wa nyenzo za InGaN kwenye urefu wa wimbi hili na upeo wa usikivu wa jicho la binadamu katika eneo la kijani.
• Pembe ya mtazamo (2θ_1/2):The typical value is 120 degrees. This wide viewing angle indicates a Lambertian or near-Lambertian emission pattern, providing uniform brightness over a broad area.
• Peak emission wavelength (λ_P):Typical values: Red: 632 nm, Green: 518 nm, Blue: 468 nm. This is the wavelength at which the spectral power distribution reaches its maximum.
• Mdomo wa mwanga (λ_d):Mdomo mmoja wa mwanga unaotambuliwa na jicho la binadamu na unaofafanua rangi. Masafa maalum yameainishwa kama ifuatavyo: Mwanga mwekundu: 616-628 nm, Mwanga kijani: 519-537 nm, Mwanga wa bluu: 464-479 nm.
• Upana wa nusu ya mstari wa wigo (Δλ):Thamani za kawaida: Mwanga mwekundu: 12 nm, Mwanga kijani: 27 nm, Mwanga wa bluu: 20 nm. Hii inaashiria usafi wa wigo; thamani ndogo inamaanisha mwanga unaokaribia kuwa wa mdomo mmoja. Wigo wa mwanga mwekundu kutoka kwa AlInGaP kwa kawaida ni nyembamba kuliko ule wa mwanga kijani/bluu kutoka kwa InGaN.
• Forward voltage (V_F):At 5mA: Red: 1.50-2.15V, Green: 2.00-3.20V, Blue: 2.00-3.20V. The lower V_Fis a characteristic of AlInGaP technology compared to InGaN.
• Reverse current (I_R):At V_RMaximum 10 μA at =5V. The LED is not designed for reverse bias operation; this parameter is for quality test purposes only.

3. Bin System Description

To ensure color consistency and brightness matching in production, LEDs are sorted into different bins based on key optical parameters.

3.1 Kugawanya Kwa Nguvu ya Mwanga (Mwangaza)

Each color is divided into several grades (e.g., A, B, C...). Luminous intensity is measured at a standard drive current of 5mA. For example, red light 'A' bin covers 26.0-31.0 mcd, while 'E' bin covers 54.0-65.0 mcd. Green and blue lights have their own independent binning tables. A tolerance of +/-10% is applied within each bin. Designers must specify the required binning code to ensure brightness uniformity among multiple units within an assembly.

3.2 Kugawanya Kwa Hue (Wavelength Kuu)

Ugawanyaji huu unahakikisha usawa wa rangi. LED zinagawanywa kulingana na wavelength yao kuu. Kwa mfano, mwanga mwekundu unagawanywa kwa hatua ya 1 nm kutoka 616-628 nm (daraja 1-4). Mwanga kijani unagawanywa kutoka 519-537 nm (daraja 1-6), na mwanga wa bluu kutoka 464-479 nm (daraja 1-5). Kila daraja lina uvumilivu wa +/-1 nm. Katika matumizi yanayohitaji mechi sahihi ya rangi, kama vile skrini nyingi za LED au viashiria vya hali ambapo LED zote nyekundu lazima zionekane sawa, kubainisha daraja la rangi ni muhimu sana.

4. Performance Curve Analysis

Ingawa maelezo ya uainishaji yanarejelea michoro maalum (Mchoro 1, Mchoro 5), maana yake ni ya kawaida.

• I-V Curve:Forward voltage (V_F) Inakuongezeka kwa mkondo (I_F) kwa njia ya kawaida isiyo ya mstari ya diode, ya kielelezo. Kwa sababu ya tofauti za nyenzo za semiconductor na pengo la bendi, safu ya kila rangi ya chip itatofautiana.
• Uzito wa mwanga dhidi ya mkondo:Katika anuwai ya kawaida ya uendeshaji, pato la mwanga kawaida huwa sawia na mkondo wa mbele, lakini kwa mikondo ya juu sana, ufanisi unaweza kupungua kwa sababu ya athari za joto na kupungua kwa ufanisi.
• Spectral Distribution:Ensure the output spectrum of the red LED chip is single-peaked. The graph will show the relationship between relative radiant power and wavelength, indicating the peak wavelength (λ_P) and the spectral half-width (Δλ).
• Angular Distribution Pattern:Grafu ya Kuratibu za Polar (Mchoro 5) inaonyesha usambazaji wa pembe ya ukubwa wa mwanga, ikathibitisha pembe ya mtazamo ya digrii 120 wakati ukubwa unapungua hadi nusu ya thamani ya mhimili.

5. Mechanical and Packaging Information

5.1 Package Dimensions and Pin Definitions

This device adheres to standard SMD package dimensions. Pin definitions are clear: Pin 2 is the cathode for the red chip, Pin 3 is the cathode for the green chip, and Pin 4 is the cathode for the blue chip. The common anode is most likely Pin 1 (inferred from standard RGB LED configuration). All dimensions are provided in millimeters, with a standard tolerance of ±0.1mm. The ultra-thin 0.65mm height is a key mechanical characteristic.

5.2 Recommended PCB Land Pattern

Pad pattern design is provided to ensure proper soldering and mechanical stability. Adhering to these recommended package dimensions is crucial for achieving reliable solder joints, preventing tombstoning, and ensuring correct alignment during the reflow process.

6. Soldering and Assembly Guide

6.1 Masharti ya Uchomeaji wa Infrared Reflow (Mchakato usio na Risasi)

Mkunjo wa joto wa urejeshaji unaopendekezwa kwa kina. Vigezo muhimu vinajumuisha hatua ya joto la awali, muda maalum juu ya mstari wa kioevu, na kiwango cha juu cha joto kisizozidi 260°C, kwa upeo wa sekunde 10. Kifaa hiki kimebainishwa kustahimili mkunjo huu wa joto hadi mara mbili tu. Kwa matengenezo ya mkono kwa kutumia chuma cha kulehemu, joto la ncha ya chuma halipaswi kuzidi 300°C, muda wa mguso kwa kila kiungo cha kuunganishwa unapaswa kuwa chini ya sekunde 3, na mara moja tu.

6.2 Uhifadhi na Uendeshaji

• ESD Precautions:Wrist straps, anti-static mats, and properly grounded equipment must be used, especially for ESD-sensitive green and blue light chips.
• Moisture Sensitivity Level (MSL):Kifaa hiki kiko katika kiwango cha MSL 3. Baada ya kufungua mfuko wa asili wa kuzuia unyevunyevu, ikiwa kuhifadhiwa chini ya hali ya ≤30°C/60% RH, lazima kuchomwa kwa mkondo wa joto (reflow) ndani ya wiki 1. Ikiwa kuhifadhiwa nje ya mfuko wa asili kwa muda mrefu zaidi, inahitajika kukaushwa kwa takriban 60°C kwa angalau saa 20 kabla ya kuchomeka, ili kuzuia athari ya "popcorn" wakati wa mchakato wa reflow.
• Usafishaji:Ikiwa usafishaji baada ya kuchomeka unahitajika, tumia tu vimumunyisho vya aina ya pombe kama vile isopropanol au ethanol. Pasua kwa chini ya dakika moja kwa joto la kawaida. Kemikali zisizobainishwa zinaweza kuharibu kifurushi cha LED au lenzi.

7. Ufungaji na Taarifa za Kuagiza

LED hutolewa kwa umbo la mkanda wa kubeba wenye matari yenye upana wa 8mm, umefungwa kwenye reel ya kawaida yenye kipenyo cha inchi 7 (178mm). Kila reel ina vipande 4,000. Mkanda wa kubeba unajumlisha mkanda wa kufunika kulinda vipengele. Reel kwa kawaida hupakiwa tatu kwa kila kisanduku cha ndani. Ufungaji unalingana na vipimo vya ANSI/EIA-481. Nambari ya sehemu LTST-B32JEGBK-AT inatambulisha kipekee aina hii maalum ya lenzi ya rangi kamili, ya maji safi.

8. Application Suggestions and Design Considerations

8.1 Typical Application Circuit

Each color channel (red, green, blue) must be driven independently. A current-limiting resistor must be connected in series with each anode pin to set the desired forward current and protect the LED. The resistor value is calculated using Ohm's Law: R = (V_{Power Supply}- V_F) / I_F. Kwa kuwa V_Ftofauti kwa kila rangi, hata kwa kutumia voltage sawa ya umeme na kuendesha kwa mkondo sawa, kwa kawaida inahitaji thamani tatu tofauti za upinzani. Kwa udhibiti sahihi wa mkondo au kuzidisha LED nyingi, inashauriwa kutumia IC maalum ya kuendesha LED au chanzo cha mkondo thabiti.

8.2 Thermal Management

Ingawa matumizi ya nguvu ni ya chini, muundo mzuri wa joto kwenye PCB ni muhimu kwa kuongeza maisha na kudumisha mwanga thabiti. Hakikisha eneo la shaba linalounganishwa kwenye pedi ya kupoeza (ikiwepo) au pedi ya LED linatosha kutumika kama kipoezi, hasa wakati wa kufanya kazi karibu na viwango vya juu vilivyopangwa au kwenye hali ya joto ya juu ya mazingira.

8.3 Optical Design

The water-clear lens provides a wide, diffuse light pattern. For applications requiring focused light or specific beam patterns, secondary optical elements (such as light guides, lenses, or diffusers) must be designed considering the LED's 120-degree viewing angle and the spatial separation of the three color chips within the package (which affects color mixing at close distances).

9. Technical Comparison and Differentiation

The primary differentiating factor of the LTST-B32JEGBK-AT is its achievement of a full RGB color gamut within an ultra-thin 0.65mm package height. Compared to older technologies using discrete monochrome LEDs or larger RGB packages, this device enables slimmer product designs. The use of AlInGaP for red light, compared to some other red LED technologies, offers higher efficiency and better temperature stability. Its compatibility with automated assembly and standard reflow processes, compared to devices requiring manual soldering or special handling, reduces manufacturing complexity and cost.

10. Maswali Yanayoulizwa Mara kwa Mara (Kulingana na Vigezo vya Teknolojia)

10.1 Kwa nini mkondo wa juu wa DC wa mwanga nyekundu (25mA) na mwanga kijani/bluu (20mA) ni tofauti?

Tofauti hii inatokana na sifa asilia za nyenzo na muundo wa chip. Chini ya vikwazo sawa vya joto vya ufungaji, chipi nyekundu ya AlInGaP kwa kawaida inaweza kukabili msongamano wa mkondo wa juu kidogo kuliko chipi za kijani na bluu za InGaN, na hivyo kuwa na mkondo wa juu zaidi wa kudumu unaoruhusiwa.

10.2 Je, naweza kutumia upinzani mmoja kwenye anode ya pamoja kuendesha rangi zote tatu?

Hapana. Kwa sababu voltage ya mbele (V_FThere is a significant difference. Connecting them in parallel with a single current-limiting resistor will cause severe current imbalance. The color with the lowest V_F(red light) will draw most of the current, potentially exceeding its rating, while other colors may be dim or not light up at all. Each color channel must have its own independent current-limiting mechanism.

10.3 What does "Bin Code" mean? Why is specifying it important?

Due to manufacturing variations, LEDs are not identical. They are sorted (binned) after production based on measured luminous intensity and dominant wavelength. Specifying a binning code when ordering ensures you receive LEDs with nearly identical brightness and color. This is crucial for applications using multiple LEDs where visual uniformity is required, such as backlight panels or multi-segment displays. Using LEDs from different bins can lead to noticeable differences in brightness or color.

11. Practical Design and Use Cases

Kesi: Kubuni Kiashiria cha Hali cha Rangi Nyingi kwa Router ya Mtandao
The designer required three status LEDs (power, internet, Wi-Fi) but had space for only one LED on the PCB. Therefore, the LTST-B32JEGBK-AT was selected. The microcontroller drives each color independently: red for "power off/error," green for "normal operation," blue for "Wi-Fi activity," and combinations like cyan (green+blue) for other statuses. Its 0.65mm height is suitable for the slim router enclosure. The designer specified strict chromaticity bins (e.g., green bin 2: 522-525nm) and mid-range luminous intensity bins to ensure consistent color and brightness across all manufactured units. The recommended reflow temperature profile was used during assembly, and the device passed all reliability tests.

12. Introduction to Principles

Light emission in LEDs is based on the phenomenon of electroluminescence in semiconductor materials. When a forward voltage is applied across a p-n junction, electrons and holes are injected into the active region where they recombine. This recombination releases energy in the form of photons (light). The color (wavelength) of the emitted light is determined by the bandgap energy of the semiconductor material. The bandgap of AlInGaP (aluminum indium gallium phosphide) corresponds to red and amber-orange light. InGaN (indium gallium nitride) has a wider, tunable bandgap, enabling emission across the spectrum from ultraviolet to blue and green light. Full-color functionality is achieved by integrating chips of these different materials into a single package.

13. Development Trends

Mwelekeo wa maendeleo ya LED za Chip (SMD) zinazotumika kwa viashiria na taa za nyuma unaendelea kuelekea ufanisi zaidi (utoaji wa mwanga zaidi kwa kila watt), ukubwa mdogo zaidi wa kifurushi, na urefu mdogo wa wasifu ili kufikia bidhaa za mwisho nyembamba zaidi. Wakati huo huo, pia kuna kusukumia kuboresha ubora wa rangi na uthabiti. Zaidi ya hayo, kuunganisha vifaa vya elektroniki vya udhibiti (kama vile madereva au saketi za udhibiti wa upana wa mawimbi) ndani ya kifurushi cha LED yenyewe ni mwelekeo endelevu wa maendeleo, ili kurahisisha muundo wa mfumo. Matumizi ya nyenzo za hali ya juu na teknolojia ya Chip Scale Packaging (CSP) yanaweza kuendeleza zaidi mipaka ya udogo na utendaji.