LTE-C216R-14 Infrared Emitter and Detector Datasheet - 1206 Package - 850nm Wavelength - 60mA Current - Technical Documentation

1. Product Overview

LTE-C216R-14 ni kifaa cha usakinishaji wa uso kinachotoa na kugundua mionzi ya infrared (IR), kilichobuniwa mahsusi kwa ujumuishaji katika vifaa vya kisasa vya elektroniki. Kazi yake kuu ni kutoa na kugundua mwanga wa infrared wenye urefu wa wimbi la kilele cha manomita 850, unaofaa kwa matumizi mbalimbali ya kihisi, uhamishaji data, na kugundua ukaribu. Kifaa hiki kinatumia kifurushi chepesi cha 1206, ambacho ni kipimo sanifu cha kifurushi cha EIA, na kinahakikisha utangamano mpana na michakato ya usanikishaji otomatiki na mpangilio uliopo wa PCB.

Faida kuu ya kifaa hiki ni uwezo wake wa kutumika kwenye vifaa vya kiotomatiki vinavyoweza kushughulikia wingi mkubwa, na uthabiti wake katika mchakato wa kawaida wa kulehemu kwa mionzi ya infrared. Hii inaufanya kuwa chaguo bora la uzalishaji wa wingi wenye gharama nafuu. Zaidi ya hayo, inafuata maagizo ya RoHS (Vizuizi vya Vitu hatari), na ni bidhaa ya kirafiki kwa mazingira, jambo muhimu sana kwa ufikiaji wa soko la kimataifa na kufuata kanuni za kimazingira.

Soko lengwa la kifaa hiki linajumuisha vifaa vya matumizi ya kielektroniki, otomatiki ya viwanda, vifaa vya mawasiliano, na mashine za ofisi. Uaminifu wake na ufungashaji uliostandardishwa unaufanya kuwa kipengele cha msingi chenye matumizi mengi kwa wabunifu wanaotafuta suluhisho thabiti la infrared.

2. Detailed Technical Parameters

2.1 Absolute Maximum Ratings

Operating any electronic component beyond its absolute maximum ratings may cause permanent damage. For the LTE-C216R-14, these limits are defined under an ambient temperature (T_A) of 25°C.

• Power consumption (P_DRadiation intensity (I100 mW. This is the maximum power that the device can safely dissipate as heat.
• Peak forward current (I_FP):800 mA. Hii ndiyo mkondo wa papo hapo unaoruhusiwa kwa kiwango cha juu, kwa kawaida huwekwa chini ya hali ya msukumo (msukumo 300 kwa sekunde, upana wa msukumo 10 μs) ili kuzuia mkazo wa joto wakati wa msukumo mfupi.
• Mkondo wa mbele unaoendelea (I_F):60 mA. Hii ndiyo mkondo wa moja kwa moja wa juu zaidi unaoweza kutumika kwa kuendelea bila kupunguza utendaji au maisha ya huduma.
• Reverse voltage (V_R):5 V. Applying a reverse bias higher than this value may cause semiconductor junction breakdown.
• Operating temperature range:-40°C to +85°C. The device is guaranteed to operate normally within this ambient temperature range.
• Mbalimbali ya joto la uhifadhi:-55°C hadi +100°C. Vipengele havitapata uharibifu wa utendaji wakati vimehifadhiwa ndani ya mbalimbali hii.
• Masharti ya kuunganisha kwa mionzi ya infrared:Inaweza kukabili joto la 260°C kwa sekunde 10 zinazofuatana. Hii inafafanua uwezo wake wa kustahimili mkunjo wa joto wa upakiaji tena usio na risasi (Pb-free).

2.2 Electrical and Optical Characteristics

Vigezo muhimu vya utendaji vinapimwa kwenye T_A=25°C na chini ya masharti maalum ya majaribio, hutoa msingi wa mahesabu ya muundo.

• Radiant Intensity (I_E):4 (minimum) to 13 (maximum) mW/sr, with typical values provided. Measured at a forward current (I_F) of 20 mA. This parameter quantifies the emitted optical power per unit solid angle (steradian).
• Peak Emission Wavelength (λ_Peak):850 nm (kawaida). Hii ndio urefu wa wimbi ambao mtoaji wa mwanga hutoa nguvu ya juu zaidi ya mwanga. Hii ni kigezo muhimu kinacholingana na usikivu wa wigo wa kigunduzi cha mwanga.
• Upana wa nusu ya mstari wa wigo (Δλ):50 nm (kawaida). Hii inaonyesha upana wa ukanda wa mwanga unaotolewa, unaoonyesha usambazaji wa urefu wa wimbi karibu na kilele.
• Forward voltage (V_F):1.6 V (typical), 2.0 V (maximum), at I_F= 50 mA condition. This is the voltage drop when the device is on. It is crucial for designing current limiting circuits.
• Reverse current (I_R):10 μA (maximum), at V_R= Under 5V conditions. This is the tiny leakage current that flows when the device is reverse-biased.
• Rise/Fall Time (T_r/T_f):30 ns (typical). This specifies the speed at which the optical output turns on and off (measured from 10% to 90% of the output), determining the maximum possible modulation speed for data transmission.
• Viewing Angle (2θ_1/2):75 degrees (typical). This is the full angle at which the radiation intensity drops to half of its maximum (on-axis) value. A wider angle provides broader spatial coverage but lower intensity at any specific point.

3. Uchambuzi wa Mviringo wa Utendaji

Mwongozo unarejelea safu za kawaida za sifa za umeme na mwanga. Ingawa michoro maalum haijarudiwa katika maandishi, lengo lake ni kutoa uelewa wa kuona wa tabia ya kifaa chini ya hali tofauti.

Safu hizi kwa kawaida zinajumuisha:

• I-V (current-voltage) curve:It shows the relationship between forward current and forward voltage, which is nonlinear for LEDs. This helps determine the dynamic resistance and the driving voltage required for the target current.
• Radiant Intensity vs. Forward Current:It illustrates how the optical output power increases with the driving current. It is typically linear within the operating range but may saturate at extremely high currents.
• Peak Wavelength vs. Temperature:Demonstrates how the emission wavelength shifts with junction temperature, which is critical for temperature-sensitive applications.
• Angular Distribution Pattern:Mchoro wa kuratibu polar unaoonyesha usambazaji wa nafasi wa nguvu ya mwanga unaotolewa.

Wahandisi hutumia mikondo hii kuboresha muundo, kuhakikisha kifaa kinafanya kazi katika eneo lake la ufanisi na uaminifu wa juu, na kutabiri utendaji chini ya hali zisizo za kawaida.

4. Mechanical and Packaging Information

4.1 Package Dimensions

This component adopts the standard 1206 package size. The datasheet provides detailed mechanical drawings, with all critical dimensions given in millimeters. Key dimensions include the overall length, width, and height of the component body, as well as the position and size of the device's own pads. Unless otherwise specified, the tolerance for these dimensions is typically ±0.10 mm. Adhering to these dimensions is crucial for successful PCB pad pattern design and automated assembly.

4.2 Recommended Land Pattern

Usauri wa kupanga pad za PCB umetolewa. Mpango huu unakusudiwa kuhakikisha muundo thabiti wa mnyororo wakati wa uchomeaji wa reflow, na kupunguza kwa kiwango cha juu matatizo kama vile "kujikunja" (kipengele kinainama upande mmoja) au ukosefu wa mnyororo. Kufuata vipimo hivi vipendwa vya pad (ambavyo kwa kawaida ni kubwa kidogo kuliko terminali ya kipengele, ili kuunda pembe ya mnyororo ifaayo) ni njia bora ya kufikia uzalishaji mzuri na uthabiti wa muda mrefu.

4.3 Tape and Reel Packaging

Kwa urahisi wa usanikishaji wa kiotomatiki, vipengele vinapatikana kwa njia ya mkanda wa mm 8 kwenye reeli yenye kipenyo cha inchi 7. Kila reeli ina vipande 3000. Vipimo vya mkanda na reeli vinakubaliana na kiwango cha ANSI/EIA 481-1-A-1994, kuhakikisha utangamano na mashine za kawaida za kupachika. Maelezo yanaonyesha kuwa mifuko ya vipengele tupu imefungwa kwa mkanda wa kifuniko, na kila reeli inaruhusu kukosekana kwa vipengele viwili mfululizo ("taa") kwa kiwango cha juu, hii ni dhamana ya kawaida ya ubora ya ufungaji wa reeli ya mkanda.

5. Soldering and Assembly Guide

5.1 Reflow Soldering Temperature Profile

This device is suitable for infrared (IR) reflow soldering processes, particularly those using lead-free (Pb-free) solder. A recommended reflow soldering temperature profile is provided, with key parameters including a preheat stage (150-200°C), a maximum peak temperature of 260°C, and a time above liquidus (typically around 217°C for lead-free solder) not exceeding 10 seconds. The datasheet emphasizes that the optimal temperature profile depends on the specific PCB design, components, solder paste, and oven, and recommends using the JEDEC standard curve as a baseline while adhering to the solder paste manufacturer's specifications.

5.2 Manual Soldering

Ikiwa ununuzi wa mikono lazima ufanyike, joto la ncha ya chuma lisizidi 300°C litumike, na muda wa mguso usizidi sekunde 3. Operesheni hii ifanyike mara moja tu, ili kuzuia uharibifu wa joto kwa kifuniko cha plastiki na chipu ya ndani ya semiconductor.

5.3 Cleaning

Ikiwa usafishaji baada ya ununuzi unahitajika, tumia tu safishaji maalum. Mwongozo unasisitiza kuepuka kutumia kemikali zisizoidhinishwa, kwani zinaweza kuharibu nyenzo za kifuniko. Njia zinazopendekezwa ni kuzamisha LED kwenye ethanol au isopropanol kwa si zaidi ya dakika moja kwenye halijoto ya kawaida.

5.4 Storage and Handling

Unyeti wa unyevu ni kipengele muhimu kwa vifaa vya kusakinishwa kwenye uso. LED husafirishwa katika mifuko ya kuzuia unyevu yenye vimumunyisho vya unyevu. Katika hali iliyotiwa muhuri, zinapaswa kuhifadhiwa katika mazingira ya ≤30°C na unyevu jamaa (RH) ≤90%, na kutumika ndani ya mwaka mmoja. Mara tu mfuko wa asili unapofunguliwa, mazingira ya uhifadhi hayapaswi kuzidi 30°C na 60% RH. Vipengee vilivyotolewa kwenye mifuko iliyotiwa muhuri vifaa vyaweza kulehemwa kwa njia ya reflow ndani ya wiki moja. Kwa uhifadhi wa muda mrefu zaidi nje ya ufungashaji asili, lazima zihifadhiwe katika chombo kilichotiwa muhuri chenye vimumunyisho vya unyevu au katika mazingira ya nitrojeni. Vipengee vilivyohifadhiwa nje ya mifuko ya kukausha kwa zaidi ya wiki moja, vinahitaji utaratibu wa kukaanga (takriban 60°C kwa angalau saa 20) kabla ya kulehemu ili kuondoa unyevu uliokwama na kuzuia uharibifu wa "popcorn" wakati wa kulehemu kwa reflow.

6. Mapendekezo ya Utumiaji

6.1 Typical Application Scenarios

LTE-C216R-14 inafaa kwa vifaa vya kawaida vya elektroniki. Matumizi ya kawaida ni pamoja na:

• Proximity Sensor:It detects the presence or absence of an object by reflecting its infrared light.
• Photoelectric Switch:Kukata mwanga wa infrared ili kugundua mwendo au msimamo.
• Uhamishaji wa data:Kuunda muunganisho rahisi wa data wa infrared kupitia udhibiti wa mkondo wa kuendesha (mfano, kifaa cha kudhibiti kwa mbali, mawasiliano ya mfuatano wa umbali mfupi).
• Kuhesabu vitu:Inatumika kwenye mstari wa uzalishaji wa kiotomatiki kwa kuzuia mwanga wa vitu.
• Imeunganishwa kwenye vifaa vya ofisi, vifaa vya mawasiliano, na vifaa vya nyumbani.

Mwongozo una onyo muhimu: Kwa matumizi ambayo hitilafu inaweza kuhatarisha maisha au afya (anga, vifaa vya matibabu, mifumo ya usalama), shauri na mtengenezaji kabla ya kubuni na kutumia.

6.2 Drive Circuit Design

It emphasizes a fundamental principle of using LEDs: they are current-driven devices. To ensure uniform brightness when driving multiple LEDs in parallel, the datasheet strongly recommends connecting an independent current-limiting resistor in series with each LED (Circuit Model A). This compensates for minor differences in the forward voltage (V_F) characteristics between individual devices. Directly paralleling LEDs without independent resistors (Circuit Model B) is discouraged, as an LED with a slightly lower V_Fwill draw a disproportionately larger current, leading to uneven brightness and potentially overloading that device.

7. Ulinganishi wa Kiufundi na Tofauti

Although this independent datasheet does not provide a direct side-by-side comparison with other models, the key differentiating features of the LTE-C216R-14 can be inferred:

• Standardized Package (1206/EIA):Inatolea urahisi wa kubadilishwa moja kwa moja na uzoefu wa muundo unaofanana na ufungaji maalum.
• Bila risasi na inakidhi RoHS:Inakidhi kanuni za kisasa za mazingira, wakati vipengele vya zamani au vya kikundi kidogo huenda visikidhi.
• Inafaa kwa otomatiki:Its tape and reel packaging, along with compatibility with pick-and-place machines and reflow soldering processes, make it highly suitable for cost-effective, high-volume manufacturing.
• Balanced Performance:A 75-degree viewing angle, 850nm wavelength, and 30ns speed provide a comprehensive set of features for general-purpose infrared applications.

8. Maswali Yanayoulizwa Mara kwa Mara (Kulingana na Vigezo vya Kiufundi)

Q1: Je, naweza kudhibiti LED hii ya infrared moja kwa moja kwa kutumia pini ya microcontroller ya 5V?
A: Hapana. Kwa 50mA, voltage yake ya kawaida ya mbele ni 1.6V. Kuunganisha moja kwa moja kwenye pini ya 5V kutaijaribu kulazimisha mkondo mkubwa sana na wa kuharibu kupitia hiyo. Lazima utumie resistor ya kuzuia mkondo mfululizo. Kwa mfano, ili kupata mkondo wa 20mA kutoka kwa usambazaji wa umeme wa 5V: R = (5V - 1.6V) / 0.02A = 170Ω (unaweza kutumia resistor ya kawaida ya 180Ω au 150Ω).

Q2: Je, kiwango cha juu cha data kinachoweza kufikiwa kwa kutumia transmitter hii ni kipi?
A: Muda wa kupanda/kushuka wa 30 ns unaonyesha upana wa bendi ya kinadharia ya juu zaidi ya modulisho uko katika safu ya mamia ya MHz. Hata hivyo, kiwango halisi cha data cha mawasiliano ya kuaminika ni cha chini, kwa kawaida kati ya mamia ya kbps hadi Mbps chache, kulingana na mzunguko wa kuendesha, kigunduzi na kelele ya mazingira.

Q3: Kwa nini masharti ya uhifadhi baada ya kufungua mfuko ni magumu sana (≤60% RH)?
A: Surface-mount plastic packages absorb moisture from the atmosphere. During high-temperature reflow soldering, this trapped moisture rapidly vaporizes, creating internal pressure that can lead to package cracking or internal connection delamination—a failure known as the "popcorn" effect. Strict storage conditions and baking requirements are implemented precisely to prevent this phenomenon.

Q4: How to interpret the radiant intensity value (mW/sr)?
A: It measures optical power density. A value of 10 mW/sr means the device emits 10 milliwatts of optical power into a spatial cone of one steradian in its pointing direction. To calculate the total power, this intensity must be integrated over the entire viewing angle (75 degrees, approximately 1.84 sr).

9. Uchunguzi wa Kesi za Ubunifu

Scenario: Designing a paper presence sensor for a printer.
Objective:Angalia ikiwa kuna karatasi kwenye tray ya usambazaji wa karatasi.
Utekelezaji:Weka transmitter ya LTE-C216R-14 upande mmoja wa njia ya karatasi, na weke kichunguzi cha mwanga kinacholingana (au sehemu ya kichunguzi kinachotumia vipengele sawa) moja kwa moja upande mwingine. Wakati hakuna karatasi, boriti ya infrared inafika kwenye kichunguzi, na kutoa ishara (mfano, mantiki ya juu). Wakati kuna karatasi, karatasi huzuia boriti, na kusababisha ishara ya kichunguzi kupungua (mantiki ya chini).
Mambo ya Kuzingatia katika Ubunifu:

• Uwekaji wa Umeme:Tumia upinzani wa mfululizo kuendesha kiendeshi kwa 20mA, ili kupata pato thabiti na la muda mrefu.
• Ulinganifu:The 75-degree viewing angle provides a certain tolerance for mechanical alignment.
• Anti-ambient light interference:Since it uses modulated 850nm light, by adding simple modulation/demodulation circuits or using detectors with daylight filters, the system can be made resistant to ambient light interference.
• Welding:Follow the recommended reflow soldering temperature profile to ensure reliable connections on the PCB without damaging the components.

10. Kanuni za Uendeshaji

Infrared Light Emitting Diodes (IR LEDs) operate based on the principle of electroluminescence in semiconductor materials. When a forward voltage is applied across the p-n junction, electrons from the n-type region and holes from the p-type region are injected into the junction area. When these charge carriers recombine, they release energy. In an IR LED, the semiconductor bandgap is engineered so that the released energy corresponds to photons in the infrared spectrum (approximately 850nm for this device). The generated photons are emitted as light. The detector function (if applicable to a paired component) operates in reverse: incident infrared photons with sufficient energy generate electron-hole pairs in the photodiode's semiconductor, producing a measurable photocurrent when reverse-biased.

11. Mwelekeo wa Teknolojia

The field of optoelectronics continues to evolve. Trends related to components such as the LTE-C216R-14 include:

• Kuongezeka kwa Ujumuishaji:Mwelekeo wa kuunganisha kipaza sauti, kigunduzi, na mantiki ya udhibiti (kama vile madereva ya usanidi na vifaa vya urekebishaji wa ishara) kwenye kifurushi kimoja, ili kurahisisha muundo wa mfumo.
• Ufanisi Zaidi:Kuendeleza vifaa vya semiconductor na miundo inayoweza kubadilisha zaidi ya nishati ya umeme kuwa mwazao wa mwanga, na hivyo kupunguza matumizi ya nguvu na joto.
• Kupunguza ukubwa:Ingawa kifurushi cha 1206 ni kipimo cha kawaida, kwa lengo la kuokoa nafasi kwenye bodi ya mzunguko wa umeme katika vifaa vinavyozidi kuwa kompakt, inasukuma ukubwa mdogo zaidi wa kifurushi (k.m. 0805, 0603).
• Uimarishaji wa kutegemewa:Kuboresha nyenzo na mchakato wa ufungaji, ili kustahimili halijoto za juu za upasuaji wa mtiririko na hali mbaya za mazingira, na kupanua maisha ya bidhaa.
• Kihisi Kielewa:Kuunganisha akili ya msingi katika kiwango cha vipengele, kama vile kuondoa mwanga wa mazingira au pato la dijiti, ili kurahisisha muunganisho na kidhibiti-kichwa.

Mwelekeo huu unalenga kutoa vifaa vya msingi vinavyofanya kazi vizuri zaidi, kuwa thabiti zaidi, na rahisi kutumia kwa vifaa vya kielektroniki vya kizazi kijacho.