LTW-S225DSKF-F SMD LED Datasheet - Side-View Dual-Color (White/Orange) LED - 20mA - 74mW/48mW - Technical Documentation

1. Product Overview

The LTW-S225DSKF-F is a compact, side-view, dual-color surface-mount device (SMD) LED lamp. It is specifically designed for automated printed circuit board (PCB) assembly and is an ideal choice for space-constrained applications in modern electronic devices. This package features a yellow lens and houses two distinct LED chips: one emitting white light (based on InGaN) and the other emitting orange light (based on AlInGaP). This configuration enables versatile indication and backlighting functions within a single miniature package.

1.1 Core Advantages

• Utendaji wa Rangi Mbili:Kuunganisha vyanzo vya mwanga mweupe na wa machungwa kwenye kifurushi kimoja, kuokoa nafasi kwenye bodi ya mzunguko na kurahisisha muundo.
• Mwangaza wa juu:Inatumia teknolojia ya semikondukta ya AlInGaP na InGaN yenye mwangaza wa hali ya juu, inayotoa nguvu ya mwanga bora.
• Imepimwa chini ya hali ya kawaida ya majaribio IF = 20mA na Ta = 25°C.Designed for compatibility with automated placement equipment and infrared (IR) reflow soldering processes, facilitating high-volume production.
• Standard packaging:Supplied in EIA-standard 8mm tape on 7-inch reels for efficient handling.
• Usawa wa Mazingira:Bidhaa inafuata Amri ya RoHS (Vizuizi vya Vitu Hatari).

1.2 Target Market and Applications

Kipengele hiki kinatumika katika nyanja pana ya vifaa vya elektroniki vinavyohitaji kiashiria cha kuaminika na cha kompakt. Maeneo makuu ya matumizi ni pamoja na:

• Vifaa vya Mawasiliano:Taa za hali katika simu zisizo na waya, simu za mkononi na vifaa vya mtandao.
• Komputing ya Kubebeka:Mwanga wa nyuma wa kibodi au vitufe kwenye kompyuta ya mkononi na vifaa vingine vya rununu.
• Elektroniki za Matumizi ya Kaya na Viwanda:Viashiria vya mwanga katika vifaa vya nyumbani, vifaa vya otomatiki ya ofisi na paneli za udhibiti wa viwanda.
• Teknolojia ya kuonyesha:Inafaa kwa skrini ndogo ndogo na taa za alama zinazohitaji viashiria vyenye rangi zilizo wazi.

2. Technical Parameters: In-depth and Objective Interpretation

This section provides a detailed analysis of the operating limits and performance characteristics of the LED under standard test conditions (Ta=25°C).

2.1 Absolute Maximum Ratings

These ratings define the stress limits that may cause permanent damage to the device. Operation at or near these limits is not guaranteed.

Parameters	White light chip	Orange light chip	Unit
Power Dissipation (Pd)	74	48	mW
Peak forward current (1/10 duty cycle, 0.1ms pulse)	Mia moja	Arobaini	mA
Mwendo wa moja kwa moja wa umeme endelevu (IF)	20	20	mA
Reverse Voltage (VR)	5	5	V
Operating Temperature Range	-20°C to +80°C		°C
Aina ya joto la uhifadhi	-30°C to +85°C		°C

Interpretation:The white LED chip allows for higher power dissipation (74mW compared to 48mW), indicating that its thermal characteristics or chip efficiency may differ. Both chips share the same maximum continuous current of 20mA, which is the standard drive current for testing and typical operation. The reverse voltage rating of 5V is relatively low, emphasizing the need for proper circuit design to avoid accidental reverse bias; this rating is only for infrared testing.

2.2 Photoelectric Characteristics

Imepimwa chini ya hali ya kawaida ya majaribio ya IF = 20mA na Ta = 25°C.

Parameters	Ishara	White Light (Min/Typ/Max)	Orange Light (Min/Typ/Max)	Unit	Masharti/Maelezo
Ukubwa wa Mwanga	Iv	112 / - / 450	45 / - / 180	mcd	Remarks 1,2,5
Perspective (2θ1/2)	-	130 (Typical)		度	Fig.5
Peak Wavelength	λP	-	611 (Typical)	nm	-
Dominant Wavelength	λd	-	605 (typical value)	nm	Remarks 3,5
Forward Voltage	VF	2.5 / - / 3.7	1.7 / - / 2.4	V	IF=20mA

Interpretation:

• Mwangaza na Mgawanyiko wa Viwango:Anuwai pana ya Iv (k.m., mwanga mweupe 112-450 mcd) inahitaji mfumo wa kugawanya viwango ili kuhakikisha uthabiti wa kundi la uzalishaji. Chipi ya mwanga wa machungwa ina wavelength kuu ya kawaida ya 605nm na kilele cha 611nm, ikithibitisha kuwa iko katika wigo wa rangi ya machungwa/ya kahawia.
• Pembe ya Mtazamo:An angle of view of 130 degrees classifies it as a wide-angle LED, suitable for applications where off-axis visibility is important.
• Forward Voltage:Orange AlInGaP chips exhibit a lower typical forward voltage (VF ~1.7-2.4V) compared to white InGaN chips (VF ~2.5-3.7V). This is a key parameter for driver circuit design, as the two colors have different power supply requirements.

2.3 Thermal Characteristics and Soldering

This device is rated for infrared reflow soldering with a peak temperature of 260°C for a maximum of 10 seconds. This is compatible with standard lead-free (Pb-free) soldering process profiles. Its operating and storage temperature ranges comply with the standard for commercial-grade SMD LEDs.

3. Maelezo ya Mfumo wa Kugawa

Ili kudhibiti tofauti za asili katika utengenezaji wa semiconductor, LED hupangwa kulingana na utendaji. LTW-S225DSKF-F hutumia viwango viwili vikuu vya kugawanya.

3.1 Kugawa kwa Nguvu ya Mwanga (Iv)

LEDs are graded based on their luminous intensity measured at 20mA.

White light chip grading:

• R grade:112.0 mcd (min) to 180.0 mcd (max)
• S gear:180.0 mcd to 280.0 mcd
• T Grade:280.0 mcd to 450.0 mcd

The tolerance within each grade is ±15%.

Orange LED Chip Grading:

• P Grade:45.0 mcd to 71.0 mcd
• Q Grade:71.0 mcd to 112.0 mcd
• R grade:112.0 mcd to 180.0 mcd

The tolerance within each grade is ±15%.

3.2 Hue (Chromaticity Coordinates) Binning

Kwa LED nyeupe, uthabiti wa rangi unahakikishwa kupitia uainishaji kulingana na viwianishi vya rangi vya CIE 1931 (x, y). Mwongozo wa maelezo hubainisha viwango kadhaa (mfano, S1-1, S1-2, S2-1, n.k.), ambapo kila kiwango kinabainisha eneo dogo la pembe nne kwenye chati ya rangi. Toleransi ya viwianishi (x, y) ndani ya kiwango chochote cha rangi ni ±0.01. Udhibiti mkali huu ni muhimu sana kwa matumizi yanayohitaji LED nyingi kuonyesha muonekano sawa wa nyeupe.

4. Uchambuzi wa Mkunjo wa Utendaji

Ingawa mwongozo wa maelezo unarejelea mikunjo maalum ya michoro (mfano, Mchoro 5 ni mkunj

• Mkondo dhidi ya nguvu ya mwanga (Mkondo wa I-Iv):Nguvu ya mwanga kwa kawaida huongezeka kwa kuongezeka kwa mkondo wa mbele, kwa uhusiano wa chini ya mstari. Kuendesha LED kwa mkondo zaidi ya 20mA kunaweza kutoa pato la mwanga la juu zaidi, lakini huongeza matumizi ya nguvu na joto la kiungo, ambayo inaweza kuathiri maisha na mabadiliko ya rangi.
• Voltage ya mbele dhidi ya mkondo (Mkondo wa V-I):The V-I characteristic is exponential, which is typical for diodes. The forward voltage (VF) increases with increasing current and decreases with increasing junction temperature.
• Temperature Dependence:The luminous intensity of an LED typically decreases with increasing junction temperature. At higher temperatures, AlInGaP (orange) chips may exhibit less thermal quenching than InGaN (white) chips, but the output of both will decrease. The forward voltage also has a negative temperature coefficient.

5. Taarifa za Mitambo na Ufungaji

5.1 Package Dimensions and Pin Assignment

This SMD package has a specific footprint. Key dimensions include length, width, and height. Unless otherwise specified, the standard tolerance for all dimensions is ±0.1mm. Pin assignment is crucial for proper circuit connection:

• 引脚 1 & 2：Mwangaza wa Machungwaya Chip ya LED ya AlInGaPAnodi na Cathode.
• 引脚 3 & 4：Mwanga Mweupeya InGaN LED chipAnodi na Cathode.

Correct polarity must be observed during assembly.

5.2 Recommended PCB Land Pattern and Soldering Orientation

The datasheet includes the recommended PCB pad pattern (copper pad layout). Following this recommendation ensures reliable solder joint formation, proper mechanical stability, and correct alignment during reflow. The figure also shows the recommended orientation of the LED on the tape relative to the soldering direction to minimize tombstoning or misalignment.

6. Soldering and Assembly Guide

6.1 Infrared Reflow Soldering Parameters

Kwa mchakato wa kuunganisha bila risasi, sharti ya kutumia masharti yafuatayo:

• Joto la kilele:Kiwango cha juu cha 260°C.
• Muda wa kilele:Maximum 10 seconds.
• Preheating:150°C to 200°C.
• Wakati wa kuchochea:Kwa upeo wa sekunde 120.

LED inaweza kustahimili mkunjo huu wa reflow mara mbili tu.

6.2 Manual Soldering (if required)

If manual soldering is required:

• Soldering iron temperature:Maximum 300°C.
• Muda wa kulehemu:Pini moja kwa moja, sekunde 3 kwa upeo.
• Ujumbe Muhimu:Ushirikiano wa mikono unaweza kufanywa mara moja tu.

6.3 Cleaning

Ikiwa usafishaji unahitajika baada ya kushirikiana, tumia tu kutengenezea maalum. Kutumia ethanol au isopropanol kwenye joto la kawaida kunapendekezwa. Wakati wa kuzamishwa kwa LED usizidi dakika moja. Kemikali zisizotajwa zinaweza kuharibu kifuniko cha plastiki au lenzi.

6.4 Storage and Handling

• Tahadhari za ESD:LED ni nyeti kwa kutokwa kwa umeme tuli (ESD). Ni lazima kutumia hatua za kudhibiti ESD zinazofaa (kama mkanda wa mkono wa kuzuia umeme tuli, vifaa vilivyogunduliwa) wakati wa uendeshaji.
• Unyeti kwa unyevunyevu:Tahadhari kulingana na kiwango cha kawaida cha MSL (Kiwango cha Unyeti wa Unyevunyevu) cha ufungaji wa SMD:
• Mfuko uliofungwa kwa hermetically:LEDs in the original moisture barrier bag with desiccant should be stored at ≤30°C and ≤90% RH. The "floor life" after opening the bag is one week for infrared reflow soldering.
• Exposed devices:If stored outside the original packaging for more than one week, baking is recommended before soldering, at 60°C for at least 20 hours, to remove absorbed moisture and prevent "popcorn" phenomenon during reflow.

7. Ufungaji na Taarifa za Kuagiza

7.1 Tape and Reel Specifications

LEDs are supplied in embossed carrier tape for automated assembly:

• Tape width:8 mm.
• Reel diameter:7 inches (178 mm).
• Kiasi kwa kila roll:4000 vipande.
• Kiasi cha chini cha agizo (MOQ):Minimum order quantity is 500 pieces.
• Packaging Standard:Compliant with ANSI/EIA-481 specification.

The carrier tape is sealed with cover tape to protect components. The maximum allowable number of consecutive missing components in the tape is two.

8. Application Suggestions and Design Considerations

8.1 Saketi ya Kawaida ya Matumizi

Inapotumika kutoka chanzo cha voltage (mfano, reli ya umeme ya 3.3V au 5V), kila chip ya LED (nyeupe na ya machungwa) inahitaji upinzani wake wa kudhibiti mkondo. Thamani ya upinzani (R) inaweza kuhesabiwa kwa kutumia sheria ya Ohm: R = (Voltage ya chanzo - Voltage ya mbele ya LED) / Mkondo wa LED.Mfano:Kwa LED nyeupe yenye voltage ya mbele VF = 3.2V (kawaida), inayoendeshwa kutoka kwa chanzo cha 5V kwa 20mA: R = (5V - 3.2V) / 0.02A = 90 ohms. Upinzani wa kawaida wa 91 ohms unafaa. Kwa sababu thamani za VF za rangi mbili ni tofauti, hesabu hii lazima ifanywe kwa kila rangi kando.

8.2 Mambo ya Kukusudiwa

• Usimamizi wa joto:Ingawa matumizi ya nguvu ni ya chini, kuhakikisha eneo la shaba la PCB linalozunguka pad linatosha kusaidia kupoza joto, kudumisha utendaji na maisha ya LED, hasa katika hali ya joto kali ya mazingira.
• Kuendesha kwa mkondo:Kuendesha kwa mkondo wa kudumu ni bora kuliko kuendesha kwa shinikizo la kudumu, ili kudumisha mwangaza na rangi thabiti, kwani VF hubadilika kulingana na joto, na pia kuna tofauti kati ya vitengo mbalimbali.
• Usanifu wa Optiki:Tabia ya mwanga wa kando inafaa kabisa kwa taa za uongoza za mwanga wa ukingo au matumizi ya kiashiria ambapo LED imesakinishwa kwa usawa kwenye uso wa kutazama. Unapounda mfereji wa mwanga au tundu, fikiria pembe ya maono ya digrii 130.

9. Technical Comparison and Differentiation

The main differentiating factors of the LTW-S225DSKF-F include:

1. Dual-chip, side-emitting configuration:This is a special package not available in standard top-emitting LEDs. It allows a single device mounted on the PCB edge to provide two independent indication colors.
2. Chip Technology Portfolio:The use of AlInGaP for orange light and InGaN for white light represents optimized choices for efficiency and color quality within their respective spectral ranges.
3. Manufacturing Readiness:Inakubaliana kabisa na mchakato wa SMT wa kiotomatiki (usakinishaji, upashaji joto wa infrared) na ufungaji wa kawaida wa rejareja, na kuifanya kuwa kifaa kinachofaa kwa uzalishaji.

10. Maswali Yanayoulizwa Mara kwa Mara (Kulingana na Vigezo vya Kiufundi)

Q1: Je, naweza kuendesha LED nyeupe na ya machungwa kwa wakati mmoja kwa 20mA?
A1: Kinawezekana kwa umeme, kwa sababu zina anode na cathode tofauti. Hata hivyo, lazima uzizingatie matumizi ya jumla ya nguvu kwenye kifurushi kidogo. Kufanya kazi kwa mkondo kamili wakati huo huo kunazalisha joto zaidi, ambalo linaweza kuathiri utendaji na uaminifu. Kwa kazi endelevu ya rangi mbili kwa wakati mmoja, inashauriwa kupunguza mkondo au kutumia usimamizi wa joto.

Q2: Kwa nini kiwango cha voltage ya nyuma ni 5V tu?
A2: LED hazikusudiwa kufanya kazi kwenye upendeleo wa nyuma. Kiwango cha 5V ni kwa ajili ya kupima na voltage ya uvumilivu ya kuzuia uunganishaji wa nyuma usiotarajiwa. Katika muundo wa mzunguko, hakikisha LED haitawahi kufichuliwa kwa voltage ya nyuma inayozidi kikomo hiki, kwa kawaida kwa kuunganisha diode inayoruhusu mkondo wa mbele tu.

Q3: Inamaanisha nini msimbo wa kugawanya wakati wa kuagiza (R, S, T, P, Q)?
A3: These codes specify the guaranteed minimum luminous intensity within a batch of LEDs. For example, ordering "White, T bin" guarantees each LED's intensity is between 280 and 450 mcd at 20mA. Specifying a bin ensures brightness consistency across your production run. If color uniformity is critical, also specify the white LED's chromaticity bin (e.g., S2-1).

11. Mifano ya Matumizi Halisi

Scenario: Network Router Status Indicator
Mbunifu anahitaji kutekeleza viashiria viwili vya hali (k.m., "Nguvu Imewashwa" na "Shughuli ya Mtandao") kwenye paneli ya mbele ya ruta ya kompakt. Nafasi ni ndogo.
Utekelezaji:Weka LED moja ya LTW-S225DSKF-F wima kwenye PCB kuu, kwenye ukingo, ikikabili kibao cha kuongoza mwanga kuelekea paneli ya mbele.Mwangaza wa MachungwaThe chip is connected to the "power supply" circuit and emits stable light when powered on.Mwanga MweupeChipu inaunganishwa na kichakataji mtandao, na imepangwa kuwaka wakati inagundua shughuli ya data. Suluhisho hili linaokoa eneo la PCB, kupunguza idadi ya vipande, na kutumia bodi moja ya mwanga kuongoza kufikia ishara mbili tofauti za kuona.

12. Utangulizi wa Kanuni ya Kazi

Diodi Inayotoa Mwanga (LED) ni kifaa cha semiconductor kinachotoa mwanga kupitia umeme-luminisheni. Wakati voltage chanya inatumika kwenye kiungo cha p-n, elektroni na mashimo hujiunga tena, na kutolea nje nishati kwa njia ya fotoni. Rangi ya mwanga imedhamiriwa na pengo la bendi ya nishati ya nyenzo ya semiconductor.

• InGaN (Indium Gallium Nitride):This material system is used to manufacture white light LEDs. Typically, a blue-emitting InGaN chip is coated with a phosphor layer. The blue light excites the phosphor, which then re-emits a broad spectrum of light. This re-emitted light combines with the remaining blue light to produce white light.
• AlInGaP (Aluminum Indium Gallium Phosphide):This material is used to manufacture orange light LEDs. It is a direct bandgap semiconductor, well-suited for generating high-efficiency light in the red, orange, amber, and yellow wavelength ranges.

Ufungaji wa mwanga wa upande hujumuisha chips hizi mbili tofauti za semiconductor ndani ya kifuniko kimoja cha plastiki kilichotengenezwa kwa kutumia muundo wenye lensi ya manjano ya kushiriki.

13. Mwelekeo wa Teknolojia

Maendeleo ya SMD LED kama LTW-S225DSKF-F yanafuata mwelekeo muhimu kadhaa wa tasnia:

1. Kupunguzwa kwa ukubwa na Ujumuishaji:The trend towards smaller, more integrated components continues. Compared to using two separate discrete LEDs, multi-chip packages (such as this bicolor LED) save space and simplify assembly.
2. Efficiency and Brightness Enhancement:Ongoing improvements in epitaxial growth and chip design are leading to higher luminous efficacy (more light output per watt of electrical power) for both InGaN and AlInGaP technologies.
3. Uboreshaji wa Uaminifu na Uimara:Maendeleo katika nyenzo za ufungaji, teknolojia ya fosfori, na usimamizi wa joto yamesaidia kuongeza maisha ya kazi na kufikia utendaji bora chini ya hali ngumu.
4. Usanifishaji wa Otomatiki:Vifaa vingi zaidi vinazingatiwa tangu awali ya muundo kwa kufanana na mstari wa usanikishaji wa SMT wa kasi na usahihi, ikijumuisha ufungaji wa kawaida (reli za mkanda) na mkunjo wa reflow.

Mielekeo hii inahakikisha kuwa SMD LED bado ni kipengele cha msingi cha kuonyesha na taa cha utendaji wa juu katika tasnia nzima ya elektroniki.