Table of Contents
- 1. Product Overview
- 1.1 Core Features and Target Market
- 2. Vigezo vya Kiufundi: Ufafanuzi wa kina na usio na upendeleo
- 2.1 Viwango vya Juu Kabisa
- 2.2 Electrical and Optical Characteristics
- 2.3 Thermal Considerations
- 3. Grading System Description
- 3.1 Kugawanya Nguvu ya Mwanga (IV)
- 3.2 Kugawanya Hue / Chroma
- 4. Performance Curve Analysis
- 4.1 Mstari wa Sasa-Voltage (I-V)
- 4.2 Uhusiano wa Ukubwa wa Mwanga wa Jamaa na Sasa ya Mbele
- 4.3 Uhusiano wa Nguvu ya Mwanga wa Jamaa na Joto la Mazingira
- 4.4 Usambazaji wa Wigo
- 5. Mechanical and Packaging Information
- 5.1 Package Dimensions and Pin Definitions
- 5.2 Recommended PCB Pad Design and Polarity
- 6. Soldering and Assembly Guide
- 6.1 Infrared Reflow Soldering Process
- 6.2 Cleaning
- 6.3 Uhifadhi na Uendeshaji
- 7. Ufungaji na Taarifa za Kuagiza
- 7.1 Carrier Tape and Reel Specifications
- 8. Application Suggestions and Design Considerations
- 8.1 Saketi ya Kawaida ya Utumizi
- 8.2 Thermal Management in Design
- 8.3 Optical Design Considerations
- 9. Technical Comparison and Differentiation
- 10. Frequently Asked Questions (Based on Technical Specifications)
- 11. Mfano wa Matumizi Halisi
- 12. Introduction to Working Principles
- 13. Technology Trends
1. Product Overview
This document provides the complete technical specifications for the LTW-S225DSKS-PH, a side-view dual-color Surface-Mount Device (SMD) LED. This component integrates two distinct light-emitting chips within a compact package designed for automated assembly processes. Its primary application is in space-constrained electronic equipment requiring reliable status indication or backlighting functions.
1.1 Core Features and Target Market
Muundo wa LTW-S225DSKS-PH una sifa muhimu kadhaa zinazomfanya ufawe kwa utengenezaji wa kisasa wa elektroniki. Unalingana na amri ya RoHS (Vizuizi vya Vitu Vinavyoweza Kuumiza), na kuhakikisha utiifu wa kanuni za mazingira. Kifaa hiki kinatumia fremu ya waya iliyopakwa bati ili kuboresha uwezo wa kuunganishwa. Kinaunganisha chipi za semiconductor zenye mwangaza wa juu sana: moja inayotumia teknolojia ya InGaN kutoa mwanga mweupe, na nyingine inayotumia teknolojia ya AlInGaP kutoa mwanga wa manjano.
Kifurushi hiki kinapatikana katika umbo la kawaida la mkanda wa kubeba wa 8mm, uliozungushwa kwenye reel yenye kipenyo cha inchi 7, na unalingana na viwango vya EIA (Shirikisho la Viwanda vya Elektroniki), jambo linalosaidia kuendana na vifaa vya kiotomatiki vya kasi ya juu vinavyotumika sana katika uzalishaji wa wingi. Kifaa hiki pia kimeundwa kuendana na mchakato wa kuunganishwa kwa kuyeyusha kwa mionzi ya infrared (IR), ambao ni mchakato wa kawaida wa usanikishaji wa PCB usio na risasi (Pb-free).
Matumizi yake makuu ya lengwa yanajumuisha vifaa vya mawasiliano (kama vile simu za mkononi na simu zisizo na waya), vifaa vya otomatiki ya ofisi (kama vile kompyuta za mkononi), mifumo ya mtandao, vifaa mbalimbali vya nyumbani, na matumizi ya alama au maonyesho ya ndani. Matumizi maalum yanajumuisha mwanga wa nyuma wa kibodi, nguvu, viashiria vya hali ya muunganisho au mfumo, maonyesho madogo, na taa ya jumla ya ishara au alama.
2. Vigezo vya Kiufundi: Ufafanuzi wa kina na usio na upendeleo
Utendaji wa LTW-S225DSKS-PH unafafanuliwa na seti kamili ya vigezo vya umeme, vya macho na vya joto vilivyopimwa chini ya hali ya kawaida (isipokuwa imeainishwa vinginevyo, Ta=25°C). Kuelewa vigezo hivi ni muhimu kwa usanifu sahihi wa saketi na uendeshaji thabiti.
2.1 Viwango vya Juu Kabisa
Viwango hivi vinafafanua mipaka ya mkazo inayoweza kusababisha uharibifu wa kudumu wa kifaa. Uendeshaji ndani ya au zaidi ya mipaka hii hauhakikishi uhakika, na unapaswa kuepukwa ili kuhakikisha utendaji wa muda mrefu.
- Matumizi ya nguvu (Pd):Chip ya mwanga mweupe ni 72 mW, chip ya mwanga wa manjano ni 62.5 mW. Hii ndiyo nguvu ya juu ambayo LED inaweza kutawanya kwa njia ya joto.
- Kilele cha sasa cha mbele (IFP):The maximum instantaneous current allowed under pulse conditions (1/10 duty cycle, 0.1ms pulse width) is 100 mA for white light and 60 mA for yellow light.
- DC Forward Current (IF):Mwanga mweupe ni 20 mA, mwanga wa manjano ni 25 mA. Hii ndiyo mkondo wa mwendelezo wa mbele unaopendekezwa kwa uendeshaji wa kawaida.
- Safu ya joto la uendeshaji:-20°C hadi +80°C. Hii ndiyo safu ya joto la mazingira ambayo LED imeundwa kufanya kazi ndani yake.
- Safu ya joto la uhifadhi:-30°C hadi +85°C. Hii ndio upeo wa joto la uhifadhi wakati kifaa hakijaunganishwa kwenye umeme.
- Masharti ya kuunganisha kwa infrared:Inaweza kustahimili 260°C kwa sekunde 10, hii ndio mkunjo wa kawaida wa joto wa upakiaji tena usio na risasi.
2.2 Electrical and Optical Characteristics
These are typical performance parameters measured at the standard test current IF= 20mA.
- Luminous intensity (IV):Kwa LED nyeupe, anuwai ya ukubwa ni kutoka kiwango cha chini cha 112.0 mcd hadi kiwango cha juu cha 450.0 mcd. Kwa LED ya manjano, anuwai ni kutoka 45.0 mcd hadi 180.0 mcd. Thamani halisi ya kipimo kwa kila kipande inategemea daraja lake la kugawanyika (angalia Sehemu ya 4). Upimaji unatumia sensor iliyosahihishwa kwa kichujio ili kukaribia mkunjo wa majibu ya kuona ya wazi ya CIE.
- Pembe ya mtazamo (2θ1/2):Kwa rangi zote mbili, kawaida ni digrii 130. Hii ndiyo pembe kamili wakati nguvu ya mwanga ni nusu ya thamani iliyopimwa kwenye mhimili wa kati (0°). Pembe mpana kama hii ni sifa ya LED inayotoa mwanga kwa upande.
- Mdomo wa mwanga (λd):Inatumika kwa LED ya rangi ya manjano pekee, kuanzia 584.0 nm hadi 596.0 nm. Hii ni urefu wa wimbi la mwanga mmoja unaotambuliwa na jicho la binadamu na unaofafanua rangi.
- Urefu wa wimbi la kilele cha utoaji (λP):Kwa kawaida ni 591.0 nm kwa LED ya manjano, inawakilisha kilele cha usambazaji wa nguvu ya wigo.
- Kuratibu za rangi (x, y):For white LEDs, typical coordinates are x=0.31, y=0.31, placing them in the "cool white" region of the CIE 1931 chromaticity diagram. The color of yellow LEDs is defined by their dominant wavelength bin.
- Spectral line half-width (Δλ):For yellow LEDs, it is typically 15 nm, indicating the spectral purity or bandwidth of the emitted light.
- Forward Voltage (VF):White LED: min 2.5V, max 3.7V. Yellow LED: min 1.6V, max 2.4V. This is the voltage drop across the LED at a 20mA drive current. The VFdifference between the two colors is significant and must be considered in circuit design, especially if they are to be driven by the same current source.
- Reverse Current (IR):at Reverse Voltage (VR) When the voltage is 5V, the maximum reverse current for both colors is 10.0 μA.Important Note:The datasheet clearly states that the reverse voltage condition is only for infrared (IR) testing; this device is not designed for reverse operation. Applying reverse bias in application circuits is not recommended.
2.3 Thermal Considerations
Upeo wa matumizi ya nguvu (72mW/62.5mW) unahusiana moja kwa moja na usimamizi wa joto. Kuzidi viwango hivi kunasababisha ongezeko la joto la kiungo, na kusababisha kuzorota kwa kasi kwa flux ya mwanga (punguzo la pato la mwanga kwa muda), kuhamia kwa kuratibu za rangi, na hatimaye kushindwa kwa kifaa. Safu ya joto la uendeshaji ya -20°C hadi +80°C inafafanua hali ya mazingira. Wabunifu lazima wahakikishe kuwa athari za pamoja za joto la mazingira na joto linalotokana na matumizi ya nguvu zinaweka joto la kiungo cha LED ndani ya mipaka salama.
3. Grading System Description
Ili kuhakikisha uthabiti katika uzalishaji wa wingi, LED zimeainishwa katika "vipimo" tofauti kulingana na vigezo muhimu vya utendaji. LTW-S225DSKS-PH hutumia mfumo wa kupimia wa pande nyingi.
3.1 Uwiano wa Mwangaza (IV) Kupimia
LED zimeainishwa kulingana na mwanga unaozalisha wakati hupimwa chini ya 20mA.
White LED Binning:
- R Bin:112.0 – 180.0 mcd
- S-Grade:180.0 – 280.0 mcd
- T-Grade:280.0 – 450.0 mcd
Yellow LED Binning:
- P-grade:45.0 – 71.0 mcd
- Q-grade:71.0 – 112.0 mcd
- R Bin:112.0 – 180.0 mcd
3.2 Kugawanya Hue / Chroma
For white LEDs, color consistency is managed through chromaticity coordinate (x, y) binning defined by specific quadrilaterals on the CIE 1931 diagram (e.g., S1-1, S1-2, S2-1, etc.). The tolerance for each hue bin is +/- 0.01 on both the x and y coordinates. For yellow LEDs, a simpler dominant wavelength binning is used:
- H Bin:584.0 – 590.0 nm
- J-band:590.0 – 596.0 nm
Mfumo huu wa kugawa katika safu huruhusu wabunifu kuchagua vipengele vinavyokidhi mahitaji maalum ya mwangaza na uthabiti wa rangi ya matumizi yao, jambo muhimu sana kwa matumizi ambayo usawa ni muhimu kama vile taa za nyuma za LED nyingi au safu za viashiria vya hali.
4. Performance Curve Analysis
Ingawa maandishi yaliyotolewa hayajaelezea kikamilifu michoro maalum, lakini mkunjo wa kawaida wa LED kama hizi utajumuisha yafuatayo, isipokuwa ikiwa imeelezwa, yote yamepimwa kwa joto la mazingira la 25°C:
4.1 Mstari wa Sasa-Voltage (I-V)
Kielelezo hiki kinaonyesha mkondo wa mbele (IF) in relation to forward voltage (VF) It is nonlinear, exhibiting diode characteristics. The curve for AlInGaP (yellow light) chips typically has a lower knee voltage (approximately 1.8V) compared to InGaN (white light) chips (approximately 3.0V). This curve is crucial for designing current-limiting circuits, whether using a simple resistor or a constant current driver.
4.2 Uhusiano wa Ukubwa wa Mwanga wa Jamaa na Sasa ya Mbele
This graph illustrates how light output increases with drive current. It is typically linear within a certain range but saturates at higher currents due to efficiency droop and thermal effects. Operation at or near the absolute maximum DC current (20/25mA) is not recommended, as it reduces efficiency and lifespan.
4.3 Uhusiano wa Nguvu ya Mwanga wa Jamaa na Joto la Mazingira
Pato la mwanga la LED hupungua kadri joto la kiungo linavyoongezeka. Mkunjo huu hupima uhusiano huo. Kwa AlInGaP LED (mwanga wa manjano), kupungua kwa kawaida ni dhahiri zaidi kuliko InGaN LED (mwanga mweupe). Hii ni jambo muhimu la kuzingatia kwa matumizi yenye joto la juu la mazingira au usimamizi duni wa joto wa PCB.
4.4 Usambazaji wa Wigo
For the yellow AlInGaP LED, this will show a relatively narrow peak centered at 591 nm. For the white InGaN LED, the spectrum is much broader, formed by the combination of light emitted from the blue InGaN chip and the light from the phosphor layer, resulting in a continuous spectrum across the visible wavelength range.
5. Mechanical and Packaging Information
5.1 Package Dimensions and Pin Definitions
The LTW-S225DSKS-PH is a side-view SMD package. Key dimension notes: All dimensions are in millimeters, with a standard tolerance of ±0.1 mm unless otherwise specified. Pin definitions are crucial for correct orientation:
- Pins 1 and 2 are assigned to the AlInGaP yellow LED chip.
- Pini 3 na 4 zimetengwa kwa chipi ya mwanga mweupe ya InGaN.
5.2 Recommended PCB Pad Design and Polarity
Mwongozo una mchoro wa mpangilio unaopendekezwa wa pads kwenye bodi ya mzunguko wa kuchapishwa. Kufuata muundo huu husaidia kufikia ufungaji wa kuaminika, uunganishaji sahihi, na nguvu ya mitambo nzuri. Muundo wa pad pia hutoa upunguzaji wa joto unaohitajika na kiasi cha solder. Upeo unaonyeshwa na nambari ya pini; ni muhimu sana kuunganisha anode na cathode kwa usahihi. Kutumia voltage ya kinyume kunaweza kuhariri LED.
6. Soldering and Assembly Guide
6.1 Infrared Reflow Soldering Process
This device is compatible with infrared (IR) reflow soldering, which is the standard process for lead-free assembly. The maximum rated condition is 260°C for 10 seconds. In practice, a standard lead-free reflow temperature profile should be used, with a peak temperature between 240°C and 260°C and a Time Above Liquidus (TAL) suitable for the solder paste used. The recommended profile in the datasheet should be followed to avoid thermal shock or damage to the LED package or internal bond wires.
6.2 Cleaning
Kusafisha baada ya kuchomeka lazima kufanywa kwa uangalifu. Kemikali zilizobainishwa tu ndizo zinazoweza kutumika. Uainishaji unapendekeza kwamba, ikiwa ni lazima kusafisha, kioo kinaweza kutumbukizwa kwenye ethanol au isopropanol kwa si zaidi ya dakika moja kwenye joto la kawaida. Kutumia kemikali za kioevu ambazo hazijabainishwa au zinazoweza kuharibu kunaweza kuharibu lenzi ya epoksi ya LED au nyenzo za kufunga, na kusababisha pato la mwanga kupungua au kushindwa mapema.
6.3 Uhifadhi na Uendeshaji
Vidokezo vya Kutokwa na Umeme wa Tuli (ESD):LED zinaweza kuharibika kwa urahisi na umeme wa tuli na mawimbi ya voltage. Inashauriwa kutumia mkanda wa mkono au glavu za kinga ya umeme wakati wa kuzishughulikia. Vifaa vyote na dawati la kazi lazima viwe na upatanishi wa ardhi unaofaa.
Uvumilivu wa Unyevu:LEDs are packaged in moisture barrier bags with desiccant. In sealed condition, they should be stored at 30°C or below and 90% relative humidity (RH) or below, with a recommended shelf life of one year. Once the original package is opened, the storage environment should not exceed 30°C or 60% RH. Components removed from the dry package should undergo infrared reflow soldering within one week (Moisture Sensitivity Level 3, MSL-3). For long-term storage outside the original bag, they should be kept in a sealed container with desiccant. If stored opened for more than one week, baking at approximately 60°C for at least 20 hours is required before soldering to prevent the "popcorn" phenomenon during reflow.
7. Ufungaji na Taarifa za Kuagiza
7.1 Carrier Tape and Reel Specifications
LTW-S225DSKS-PH inapatikana katika umbo la mkanda wa kusafirishaji wenye upana wa 8mm unaokubalika kiwastaa, umewindwa kwenye spool yenye kipenyo cha inchi 7 (178mm). Kila roll ina vipande 4000. Mfereji wa mkanda umefungwa kwa mkanda wa juu, ili kulinda kifaa wakati wa usafirishaji na usindikaji. Ufungashaji unafuata mwongozo wa ANSI/EIA-481. Kwa idadi chini ya roll nzima, kiwango cha chini cha ufungashaji kwa sehemu iliyobaki ni vipande 500. Muundo wa mkanda unaruhusu vifaa visivyopo kwa mfululizo hadi viwili (mifereji tupu).
8. Application Suggestions and Design Considerations
8.1 Saketi ya Kawaida ya Utumizi
Due to differences in forward voltage characteristics, each color chip within the LTW-S225DSKS-PH must be driven independently. The simplest driving method is to use a series current-limiting resistor for each chip. The formula for calculating the resistor value is R = (VPower Supply- VF) / IF, ambapo IFni mkondo unaohitajika wa kuendesha (kwa mfano 20mA), VFni voltage ya kawaida au ya juu ya mbele katika spec sheet, kulingana na ukingo wa muundo. Kwa uthabiti na uthabiti bora, hasa wakati joto au voltage ya umeme inabadilika, inashauriwa kutumia mzunguko wa kuendesha wa mkondo wa mara kwa mara.
8.2 Thermal Management in Design
Ingawa SMD LED zina ukubwa mdogo, usimamizi bora wa joto ni muhimu kwa utendaji na umri wa huduma. PCB hutumika kama kifaa kikuu cha kupoza joto. Kutumia muundo ulipendekezwa wa pedi za kuuza na kuunganisha eneo la kutosha la shaba kwenye pedi ya kupoza joto ya LED, husaidia katika usambazaji wa joto. Kwa matumizi ya nguvu kubwa au hali ya joto ya mazingira ya juu, huenda ikahitajika kuongeza mashimo ya kupoza joto chini ya kifurushi au eneo kubwa la karatasi ya shaba, ili kuhamisha joto kutoka kwenye kiungo cha LED.
8.3 Optical Design Considerations
Kama LED inayotoa mwanga kwa upande, mwelekeo wake mkuu wa utoaji mwanga ni sawa na uso wa PCB. Hii inafaa kabisa kwa ubao wa kuongoza mwanga wa ukingo, kuangazia viashiria vya utoaji mwanga wa upande, au kutoa taa ya nyuma kwa vitufe kutoka upande. Wakati wa kubuni mfereji wa mwanga, lenzi, au kifaa cha kusambaza, wabunifu wanapaswa kuzingatia pembe ya maono ya digrii 130, ili kuhakikisha mwangaza sawasawa na athari ya kuona inayohitajika.
9. Technical Comparison and Differentiation
Kipengele muhimu cha kutofautisha cha LTW-S225DSKS-PH ni usanidi wake wa rangi mbili na utoaji mwanga wa upande ndani ya kifuniko kimoja cha SMD. Ikilinganishwa na kutumia LED mbili tofauti za utoaji mwanga wa upande, hii inaokoa nafasi kwenye PCB. Matumizi ya nyenzo ya AlInGaP kwa mwanga wa manjano hutoa ufanisi wa juu na usafi mzuri wa rangi, huku mwanga mweupe unaotokana na InGaN ukitoa chanzo cha kisasa cha mwanga mweupe baridi. Mchanganyiko wa pembe pana ya maono ya digrii 130 na utangamano na mchakato wa usanikishaji wa otomatiki na reflow, hufanya iwe chaguo la jumla na la gharama nafuu kwa uzalishaji mkubwa.
10. Frequently Asked Questions (Based on Technical Specifications)
Q: Can I drive the white and yellow light chips using the same current-limiting resistor?
Jibu: Hapana. Kutokana na tofauti kubwa ya voltage ya mwelekeo mzuri (kwa 20mA, mwanga mweupe takriban 3.2V, mwanga wa manjano takriban 2.0V), kuwaunganisha sambamba kwenye upinzani mmoja kutasababisha usawa mbaya wa mkondo, unaoweza kusababisha chipi moja kuendeshwa kupita kiasi na nyingine kuendeshwa chini ya kiwango. Kila chipi inahitaji udhibiti wa mkondo unaojitegemea.FSwali: Maana ya msimbo wa kiwango cha nguvu ya mwanga (kwa mfano R, S, T) ni nini?
Jibu: Msimbo wa kiwango unawakilisha anuwai ya pato la mwanga unaohakikishiwa na LED hiyo maalum inapoendeshwa kwa mkondo wa kawaida wa majaribio (20mA). Kwa mfano, LED nyeupe kutoka kiwango cha T (280-450 mcd) ni mkubwa kuliko ile kutoka kiwango cha R (112-180 mcd). Wabunifu wanaainisha kiwango kinachohitajika ili kuhakikisha uthabiti wa mwangaza wa bidhaa zao.
Swali: Je, LED hii inafaa kwa matumizi ya nje?
Jibu: Upeo wa joto la kufanya kazi uliowekwa kwenye maelezo ya maelezo ni -20°C hadi +80°C, na unataja matumizi ya kawaida ya ndani. Kwa matumizi ya nje, ni muhimu kutathmini mambo kama vile mipaka ya joto pana zaidi, uchakavu wa epoksi kutokana na mionzi ya UV, na kuingia kwa unyevunyevu. Kifaa hiki hakijapimwa kwa mazingira magumu.
Swali: Je, kikomo cha wiki moja cha kukamilisha upakiaji tena baada ya kufungua mfuko wa kuzuia unyevu ni muhimu kiasi gani?
Jibu: Hii ni muhimu sana kwa uaminifu. Ikiwa vipengee vya kiwango cha MSL-3 vimevuta unyevunyevu mwingi kutoka kwa hewa, kisha vikakabili joto la juu la upakiaji tena, uvukizi wa haraka wa unyevunyevu unaweza kusababisha mgawanyiko wa ndani au ufa ("popcorn" effect), na kusababisha kushindwa mara moja au kwa uwezekano. Ikiwa kikomo kimezidi, tafadhali zingatia miongozo ya kukaanga.
11. Mfano wa Matumizi Halisi
Mfano 1: Kiashiria cha Hali ya Kifaa Cha Mkononi:
LTW-S225DSKS-PH moja inaweza kutoa viashiria vya hali mbalimbali. LED nyeupe inaweza kuashiria "Nguvu Imewashwa" au "Imejaa Umeme," wakati LED ya manjano inaweza kuashiria "Inachajiwa" au "Umeme Uko Chini." Tabia ya kutolea mwanga kwa upande huruhusu mwanga kuunganishwa kwenye fimbo ya kuongoza mwanga inayofikia ukingo wa kifuniko cha kifaa, na kuunda kiashiria cha hali kilicho wazi.Mfano 2: Taa ya Nyuma ya Paneli ya Udhibiti wa Viwanda:
Mfululizo wa LED kama hizi unaweza kuwekwa kando ya ukingo wa paneli ya swichi ya filamu. LED nyeupe hutoa taa ya nyuma ya jumla kwa vitufe vyote chini ya hali ya mwanga dhaifu. LED za manjano zinaweza kuunganishwa na vitufe maalum vya utendaji (k.m., kusimamisha dharura, onyo), hutoa rangi ya kuvutia na ya kukusanya umakini inapowashwa, yote hii kwa kutumia eneo sawa la kompakt la kipengele.12. Introduction to Working Principles
Diodi ya Kutoa Mwanga (LED) ni kifaa cha semiconductor kinachotoa mwanga kupitia umeme-luminensheni. Wakati voltage chanya inatumika kwenye makutano ya p-n, elektroni na mashimo hujumuika na kutolewa nishati kwa namna ya fotoni. Rangi ya mwanga imedhamiriwa na pengo la bendi ya nishati ya nyenzo ya semiconductor.
AlInGaP (aluminium-indium-gallium-phosphide):
- Mfumo huu wa nyenzo hutumiwa kwa LED za mwanga wa manjano. Pengo lake la bendi linalingana na utoaji katika maeneo ya mwanga nyekundu, machungwa, kahawia na manjano ya wigo. Inajulikana kwa ufanisi wake wa juu katika rangi hizi.InGaN (Indium Gallium Nitride):
- This material system is used for white LEDs. Typically, a blue-emitting InGaN chip is combined with a phosphor coating. The blue light from the chip excites the phosphor, which then re-emits light over a broader spectrum, creating the perception of white light. The specific phosphor blend determines the white point (e.g., cool white, warm white).The side-view package structure utilizes a reflective cavity and a molded epoxy lens to direct the primary light output to the side of the component body.
13. Technology Trends
The optoelectronics industry continues to advance in several key areas related to components such as the LTW-S225DSKS-PH. The industry is constantly pursuing
higher luminous efficacy(more light output per watt of electrical input), which improves energy efficiency and allows for the use of lower drive currents or the attainment of brighter output.Uboreshaji wa uhalisi wa rangiNa uwiano mpana wa sehemu nyeupe zinazoweza kuchaguliwa (CCT - Joto la rangi linalohusiana) ni mwelekeo, hasa kwa LED nyeupe.Kupunguzwa kwa ukubwaKuendeleza maendeleo, kuruhusu ukubwa mdogo wa ufungashaji kwa utendakazi sawa au bora zaidi. Zaidi ya hayo,Uthabiti ulioimarishwa na maisha marefu chini ya hali ya joto na unyevu wa juu zaidiNi lengo la maendeleo endelevu, ambalo linapanua mazingira yanayowezekana ya matumizi ya SMD LED. Kuunganisha kazi nyingi (kama rangi nyingi hata kiendeshi cha jumla) kwenye ufungashaji mmoja pia inawakilisha mwelekeo muhimu katika muundo wa vipengele.Uendelevu wa maendeleo yanayoendelea chini ya hali ya joto na unyevunyevu wa juu, kupanua mazingira yanayowezekana ya matumizi ya SMD LEDs. Ujumuishaji wa kazi nyingi (kama rangi nyingi au hata madereva waliyounganishwa) katika vifurushi moja pia inawakilisha mwelekeo muhimu katika muundo wa vipengele.
Maelezo ya kina ya istilahi za vipimo vya LED
Ufafanuzi kamili wa istilahi za kiteknolojia ya LED
I. Viashiria Muhimu vya Utendaji wa Umeme na Mwanga
| Istilahi | Vitengo/Uwakilishi | Popular Explanation | Why It Is Important |
|---|---|---|---|
| Ufanisi wa Mwanga (Luminous Efficacy) | lm/W (lumen/watt) | Mwangaza unaotolewa kwa kila watt ya umeme, ufanisi wa juu zaidi unamaanisha matumizi bora ya nishati. | Huamua moja kwa moja kiwango cha ufanisi wa nishati wa taa na gharama za umeme. |
| Luminous Flux | lm (lumen) | Jumla ya mwanga unaotolewa na chanzo cha mwanga, unaojulikana kwa jina la "mwangaza". | Huamua kama taa inatosha kuwa na mwangaza. |
| Pembe ya kuangazia (Viewing Angle) | ° (digrii), k.m. 120° | Pembe ambapo mwangaza hupungua hadi nusu, huamua upana wa boriti ya mwanga. | Huathiri eneo la mwangaza na usawa wake. |
| Joto la rangi (CCT) | K (Kelvin), k.m. 2700K/6500K | Joto la rangi ya mwanga, thamani ya chini inaelekea manjano/joto, thamani ya juu inaelekea nyeupe/baridi. | Inaamua mazingira ya taa na matumizi yanayofaa. |
| Kielelezo cha Uonyeshaji Rangi (CRI / Ra) | Hakuna kitengo, 0–100 | Uwezo wa chanzo cha mwanga kurejesha rangi halisi ya kitu, Ra≥80 ni bora. | Huathiri ukweli wa rangi, hutumika katika maeneo yenye mahitaji makubwa kama maduka makubwa, makumbusho ya sanaa, n.k. |
| Color Tolerance (SDCM) | MacAdam Ellipse Steps, e.g., "5-step" | A quantitative metric for color consistency; a smaller step number indicates higher color consistency. | Kuhakikisha hakuna tofauti ya rangi kati ya taa za kundi moja. |
| Dominant Wavelength | nm (nanometer), kama 620nm (nyekundu) | Thamani ya urefu wa wimbi inayolingana na rangi ya LED zenye rangi. | Inaamua hue ya LED ya rangi moja kama nyekundu, manjano, kijani, n.k. |
| Usambazaji wa Wigo (Spectral Distribution) | Mkunjo wa Wimbi dhidi ya Nguvu | Inaonyesha usambazaji wa nguvu ya mwanga unaotolewa na LED katika kila urefu wa wimbi. | Inaathiri ubora wa kuonyesha rangi na ubora wa rangi. |
II. Vigezo vya Umeme
| Istilahi | Ishara | Popular Explanation | Mambo ya Kuzingatia katika Ubunifu |
|---|---|---|---|
| Voltage ya Mbele (Forward Voltage) | Vf | Voltage ya chini inayohitajika ili LED iwashwe, kama "kizingiti cha kuanzisha". | Voltage ya chanzo cha umeme inahitaji kuwa ≥ Vf, voltage inajumlishwa wakati LED nyingi zimeunganishwa mfululizo. |
| Forward Current | If | The current value required for the LED to emit light normally. | Constant current drive is commonly used, as the current determines both brightness and lifespan. |
| Mkondo wa juu wa msukumo (Pulse Current) | Ifp | Peak current that can be withstood for a short period, used for dimming or flashing. | Pulse width and duty cycle must be strictly controlled to prevent overheating damage. |
| Reverse Voltage | Vr | The maximum reverse voltage that an LED can withstand; exceeding it may cause breakdown. | Mzunguko unahitaji kuzuia uunganishaji kinyume au mshtuko wa voltage. |
| Thermal Resistance | Rth (°C/W) | Upinzani wa joto kutoka kwenye chip hadi kwenye sehemu ya kuunganishia, thamani ya chini inaonyesha usambazaji bora wa joto. | Upinzani wa juu wa joto unahitaji muundo wa nguvu zaidi wa usambazaji wa joto, vinginevyo joto la kiungo litaongezeka. |
| Upinzani wa Kutokwa na Umeme Tuli (ESD Immunity) | V (HBM), k.m. 1000V | Uwezo wa kukabiliana na mshtuko wa umeme tuli, thamani ya juu zaidi inamaanisha uwezo mkubwa wa kuepusha uharibifu kutokana na umeme tuli. | Hatua za kinga dhidi ya umeme wa tuli zinahitajika katika uzalishaji, hasa kwa LED zenye usikivu mkubwa. |
Tatu, Usimamizi wa Joto na Uthabiti
| Istilahi | Viashiria Muhimu | Popular Explanation | Athari |
|---|---|---|---|
| Junction Temperature | Tj (°C) | The actual operating temperature inside the LED chip. | Kila kupungua kwa joto kwa 10°C, maisha ya taa yanaweza kuongezeka mara mbili; joto la juu sana husababisha kupungua kwa mwanga na mabadiliko ya rangi. |
| Kupungua kwa Mwanga (Lumen Depreciation) | L70 / L80 (saa) | Muda unaohitajika ili mwangaza upunguke hadi 70% au 80% ya thamani ya awali. | Inafafanua moja kwa moja "maisha ya huduma" ya LED. |
| Lumen Maintenance | % (e.g., 70%) | The percentage of remaining brightness after a period of use. | Inaonyesha uwezo wa kudumisha mwangaza baada ya matumizi ya muda mrefu. |
| Color Shift | Δu′v′ or MacAdam ellipse | The degree of color change during use. | Affects the color consistency of the lighting scene. |
| Uzeefu wa joto (Thermal Aging) | Kupungua kwa utendaji wa nyenzo | Deterioration of packaging materials due to prolonged high temperatures. | May lead to decreased brightness, color shift, or open-circuit failure. |
IV. Packaging and Materials
| Istilahi | Common Types | Popular Explanation | Characteristics and Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | The housing material that protects the chip and provides optical and thermal interfaces. | EMC offers good heat resistance and low cost; ceramics provide excellent heat dissipation and long lifespan. |
| Chip structure | Face-up, Flip Chip | Chip electrode arrangement. | Flip Chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications. |
| Phosphor coating | YAG, silicate, nitride | Inayofunikwa kwenye chip ya mwanga wa bluu, sehemu hubadilishwa kuwa mwanga wa manjano/nyekundu, na kuchanganywa kuwa mwanga mweupe. | Fosfori tofauti huathiri ufanisi wa mwanga, halijoto ya rangi na ubora wa kuonyesha rangi. |
| Lens/Usanifu wa Optics | Flat, Microlens, Total Internal Reflection | Optical structures on the package surface to control light distribution. | Determine the light emission angle and light distribution curve. |
V. Quality Control and Binning
| Istilahi | Binning Content | Popular Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Binning | Codes such as 2G, 2H | Group by brightness level, each group has a minimum/maximum lumen value. | Ensure consistent brightness for the same batch of products. |
| Mgawanyiko wa voltage | Msimbo kama vile 6W, 6X | Group by forward voltage range. | Facilitates driver matching and improves system efficiency. |
| Color binning. | 5-step MacAdam Ellipse | Group by color coordinates to ensure colors fall within a minimal range. | Hakikisha usawa wa rangi, epuka kutofautiana kwa rangi ndani ya taa moja. |
| Mgawanyiko wa joto la rangi | 2700K, 3000K, n.k. | Kugawanywa kulingana na joto la rangi, kila kikundi kina anuwai ya kuratibu inayolingana. | Kukidhi mahitaji ya joto la rangi kwa matukio tofauti. |
VI. Upimaji na Uthibitishaji
| Istilahi | Viwango/Upimaji | Popular Explanation | Maana |
|---|---|---|---|
| LM-80 | Upimaji wa Kudumisha Lumeni | Kurekebisha chini ya hali ya joto la kudumu kwa muda mrefu, rekodi data ya kupungua kwa mwangaza. | Inatumika kukadiria maisha ya LED (kwa kuchanganya TM-21). |
| TM-21 | Standard for Life Projection | Projecting service life under actual operating conditions based on LM-80 data. | Toa utabiri wa kisayansi wa maisha ya taa. |
| IESNA Standard | Illuminating Engineering Society Standard | Inajumuisha mbinu za majaribio ya mwanga, umeme na joto. | Msingi wa majaribio unaokubalika na tasnia. |
| RoHS / REACH | Environmental Certification | Ensure products are free from hazardous substances (e.g., lead, mercury). | Masharti ya kuingia katika soko la kimataifa. |
| ENERGY STAR / DLC | Uthibitishaji wa Ufanisi wa Nishati | Uthibitishaji wa Ufanisi wa Nishati na Utendaji kwa Bidhaa za Taa. | Inatumika kwa kawaida katika miradi ya ununuzi wa serikali na ruzuku, kuimarisha ushindani wa soko. |