LTST-S326KGJRKT Dual-Color SMD LED Datasheet - Side-View - AlInGaP Green and Red - 30mA - Technical Documentation

1. Product Overview

This document provides the complete technical specifications for the LTST-S326KGJRKT, a surface-mount device (SMD) LED lamp. This component is a side-view, bicolor LED that integrates independent AlInGaP chips within a single compact package for emitting green and red light respectively. Designed for automated printed circuit board (PCB) assembly, it is well-suited for space-constrained applications in various consumer electronics and industrial electronic equipment.

1.1 Core Features and Advantages

LTST-S326KGJRKT inatoa faida muhimu kadhaa kwa muundo wa kisasa wa elektroniki:

• Chanzo cha mwanga cha rangi mbili:Inajumuisha chipi za kujitegemea za AlInGaP zenye mwangaza mkubwa sana, zinazotumika kutoa mwanga wa kijani kibichi na mwekundu, zinazoongozwa na pini za kujitegemea (C1 kwa mwekundu, C2 kwa kijani kibichi).
• Side-view package:The primary light is emitted from the side of the component, suitable for edge lighting, status indication in confined spaces, and backlight applications where vertical mounting is not feasible.
• Manufacturing compatibility:The packaging conforms to EIA standards and is supplied in 8mm carrier tape on 7-inch reels, fully compatible with high-speed automatic placement equipment.
• Robust assembly process:Designed to withstand standard infrared (IR) reflow soldering processes, facilitating reliable surface-mount assembly.
• Environmental compliance:Vifaa vinakidhi maagizo ya RoHS (Vizuizi vya Vitu Vinavyoweza Kuumiza).
• Uendeshaji wa Umeme:Vifaa vinapatana na mzunguko wa umeme uliojumuishwa, na katika hali nyingi huruhusu kuendeshwa moja kwa moja na mtawala mdogo au pato la mantiki.

1.2 Lengwa la Matumizi na Soko

This LED is designed for various electronic devices requiring reliable, compact indicators, offering broad applicability. The main application areas include:

• Telecommunications equipment:Viashiria vya hali katika simu zisizo na waya, simu za mkononi, na vifaa vya mfumo wa mtandao.
• Kompyuta na Uboreshaji wa Ofisi:Mwanga wa nyuma wa kibodi na vitufe kwenye kompyuta mkononi na vifaa vya kubebwa vingine; taa za hali kwenye vifaa vya ziada.
• Elektroniki za matumizi ya kawaida na vifaa vya nyumbani:Viashiria vya nguvu, hali au utendaji katika vifaa mbalimbali vya nyumbani.
• Vifaa vya viwanda:Panel indicator lights, machine status lights, and control system feedback lights.
• Dedicated display:Suitable for micro-displays, and as a light source for small-size signal and symbol illumination.

2. Uchambuzi wa kina wa Vigezo vya Kiufundi

Sura zifuatazo zinatoa ufafanuzi wa kina na usio na upendeleo wa vigezo muhimu vya umeme, vya macho na vya kuegemea vilivyobainishwa katika maelezo ya vipimo.

2.1 Viwango vya juu kabisa

Hizi viwango vinaelezea mipaka ya mkazo inayoweza kusababisha uharibifu wa kudumu wa kifaa. Haipendekezwi kufanya kazi kwenye au karibu na mipaka hii wakati wa matumizi ya kawaida. Viwango vyote vimeainishwa kwa joto la mazingira (Ta) la 25°C.

• Matumizi ya nguvu (Pd):75 mW kwa chip. Hii ndiyo nguvu ya juu inayoweza kutolewa kwa namna ya joto na kila chip ya LED. Kuzidi thamani hii kunaweza kusababisha joto la kiungo kuwa juu kupita kiasi, kuharakisha uharibifu wa utendaji au kushindwa kufanya kazi.
• Peak forward current (I_FP):80 mA, allowed only under pulse conditions (duty cycle 1/10, pulse width 0.1ms). This allows for brief, high-intensity flashing without causing overheating.
• Continuous Forward Current (I_F):30 mA DC. This is the recommended maximum current for continuous operation, balancing brightness and long-term reliability.
• Reverse Voltage (V_R):5 V. Applying a reverse bias voltage higher than this value may cause breakdown and damage the semiconductor junction.
• Operating and Storage Temperature:The device can operate at -30°C to +85°C and be stored at -40°C to +85°C. These ranges ensure functionality in most commercial and industrial environments.
• Soldering Thermal Limit:During IR reflow soldering, the package can withstand a peak temperature of up to 260°C for up to 10 seconds, which complies with the standard for lead-free assembly processes.

2.2 Electrical and Optical Characteristics

These are typical performance parameters measured under standard test conditions (Ta=25°C, unless noted, I_F=20mA). They define the expected behavior of the device in a circuit.

• Luminous intensity (I_V):Kipimo muhimu cha kuhisi mwangaza. Kwa chipu ya mwanga wa kijani, thamani ya kawaida ni 35.0 mcd (millicandela), anuwai kutoka 18.0 mcd (kiwango cha chini) hadi 112.0 mcd (kiwango cha juu). Kwa chipu ya mwanga mwekundu, thamani ya kawaida ni ya juu zaidi, 45.0 mcd, ikiwa na anuwai sawa ya chini/ya juu. Anuwai mpana hufanya mfumo wa kupanga unaoelezwa baadaye uwe muhimu.
• Pembe ya mtazamo (2θ_1/2):Digrii 130 (thamani ya kawaida). Hii ndiyo pembe kamili wakati nguvu ya mwanga inapungua hadi nusu ya thamani yake ya kilele (axial). Pembe mpana ya 130° ni sifa ya LED ya mtazamo wa upande yenye lenzi ya kusambaza, ikitoa muundo mpana wa utoaji unaofaa kwa taa za eneo au kuonekana kwa pembe pana.
• Forward Voltage (V_F):At 20mA, the typical value for both colors is 2.0 V, with a maximum of 2.4 V. Compared to some blue or white LEDs, this value is relatively low, simplifying the design of the drive circuit. The consistent V_Fallows the use of similar current-limiting resistor values when driving them individually.
• Peak Wavelength (λ_P) and Dominant Wavelength (λ_d):
  • Mwanga wa Kijani:Kilele cha wimbi kiko kwenye 574 nm (thamani ya kawaida), wimbi kuu kiko kwenye 571 nm (thamani ya kawaida). Hii inaiweka katika eneo la kijani safi la wigo.
  • Mwanga Mwekundu:Kilele kiko kwenye 639 nm (thamani ya kawaida), urefu wa wimbi kuu kwenye 631 nm (thamani ya kawaida). Hii ni nyekundu ya kawaida, tofauti na nyekundu nzito au nyekundu ya machungwa.
  Urefu wa wimbi kuu unatokana na mchoro wa rangi wa CIE kama utambuzi wa urefu wa wimbi mmoja wa rangi.
• Upana wa nusu ya mstari wa wigo (Δλ):Mwanga wa kijani ni takriban 15 nm, mwanga nyekundu ni takriban 20 nm. Hii inaonyesha usafi wa wigo; thamani ndogo inamaanisha pato liko karibu na rangi moja (rangi safi zaidi).
• Reverse current (I_R):At a 5V reverse bias, it is a maximum of 10 µA, indicating high junction quality and low leakage current.

3. Binning System Description

To ensure consistency in mass production, LEDs are sorted (binned) based on key optical parameters. The LTST-S326KGJRKT employs a two-dimensional binning system.

3.1 Kugawanya kwa Nguvu ya Mwanga (Mwangaza)

Chipi za kijani kibichi na nyekundu hutumia njia sawa ya kugawanya nguvu ya mwanga kwenye 20mA. Msimbo wa kugawanya hufafanua anuwai ya chini na ya juu ya mwangaza. Toleransi ndani ya kila kikundi ni +/-15%.

• Bin Code M:18.0 – 28.0 mcd
• Bin Code N:28.0 – 45.0 mcd (covers typical value)
• Bin code P:45.0 – 71.0 mcd
• Bin code Q:71.0 – 112.0 mcd

Designers must select the appropriate bin based on the brightness required for their application. Using a higher bin (e.g., P or Q) ensures a higher minimum brightness but may incur additional cost.

3.2 Kugawanya kwa Rangi ya Kijani (Wavelength Kuu)

Chip ya mwanga wa kijani pekee ndiyo ina grading maalum ya tonaliti (wavelength) kwa kudhibiti usawaziko wa rangi. Toleransi ya kila daraja ni +/- 1 nm.

• Msimbo wa Grading C:567.5 – 570.5 nm
• Bin code D:570.5 – 573.5 nm (including the typical 571 nm)
• Bin code E:573.5 – 576.5 nm

The dominant wavelength of the red LED chip is specified only as a typical value (631 nm) in this datasheet, with no formal binning table. This indicates tighter process control or lower sensitivity to color shift in the application.

4. Performance Curve Analysis

Although specific graphical curves (e.g., Figure 1, Figure 5) are referenced in the datasheet, their general significance is crucial for design.

4.1 Sifa za Umeme na Voltage (I-V)

Forward Voltage (V_F) has a positive temperature coefficient and also increases slightly with current. At 20mA, the typical V_Fis 2.0V, which is a key parameter for designing current-limiting circuits. Usually, a simple series resistor is sufficient: R = (V_{Power supply}- V_F) / I_FDesigners should use the maximum V_F(2.4V) to calculate the worst-case current to avoid overdriving the LED.

4.2 Uhusiano kati ya Nguvu ya Mwanga na Mkondo wa Mbele

Katika safu ya kawaida ya uendeshaji, pato la mwanga (I_V) takriban ni sawia na mkondo wa mbele (I_F). Kuendesha LED kwa mkondo chini ya 20mA kutapunguza mwangaza kwa uwiano. Kufanya kazi zaidi ya 20mA hadi kiwango cha juu cha 30mA kutaongeza mwangaza, lakini pia kutaongeza matumizi ya nguvu na joto la kiungo, ambayo inaweza kuathiri maisha ya huduma na kusababisha mabadiliko madogo ya urefu wa wimbi.

4.3 Utegemezi wa Joto

Kama LED zote, utendaji wa chip ya AlInGaP unategemea joto. Kadiri halijoto ya kiungo inavyopanda:

• Ukali wa mwanga hupungua:Pato la mwanga hupungua. Mwongozo wa maelezo unaweza kuonyesha mkunjo wa kupunguza uwezo.
• Kupungua kwa voltage ya mwelekeo mzuri:Kupungua kidogo kutokana na mabadiliko katika pengo la bendi ya semiconductor.
• Kuhama kwa urefu wa wimbi:Kwa kawaida, urefu wa wimbi kuu huongezeka kwa joto (hubadilika kuelekea urefu wa wimbi mrefu zaidi). Hii inaonekana zaidi katika LED za AlInGaP kuliko katika aina nyingine. Katika matumizi muhimu, usimamizi mzuri wa joto kwenye PCB ni muhimu kwa uthabiti wa rangi.

5. Taarifa za Mitambo na Ufungaji

5.1 Package Dimensions and Polarity

Kifaa hiki kinatumia ufungaji wa kawaida wa SMD. Mgawanyo wa pini umeainishwa wazi: Cathode 1 (C1) inatumika kwa chipi nyekundu, Cathode 2 (C2) inatumika kwa chipi kijani. Anode inaweza kuwa ya kawaida au kuunganishwa ndani kulingana na mchoro wa ufungaji, ni lazima kukagua mchoro kwa mpangilio halisi. Vipimo vyote muhimu vinatolewa kwa milimita, na uvumilivu wa kawaida ni ±0.1 mm, kuhakikisha ufungaji na uuzaji wa kuaminika.

5.2 Recommended PCB Pad Design

Spec inajumuisha mpangilio wa padi ya PCB unaopendekezwa. Kufuata usanidi huu ni muhimu kwa kufikia mshono wa kuaminika, usawa sahihi, na kudhibiti utoaji wa joto wakati wa reflow. Usanidi wa padi umezingatia uundaji wa kona ya solder na kuzuia hali ya tombstone (inapoinuka upande mmoja wakati wa reflow).

6. Soldering, Assembly and Operation Guide

6.1 Vigezo vya Uchimbaji wa IR Reflow

Kwa usanidi bila risasi, mkunjo wa kuyeyusha unaopendekezwa ni:

• Joto la awali:150–200°C
• Muda wa joto la awali:Kwa upeo sekunde 120.
• Kiwango cha juu cha joto:Kwa upeo 260°C kwenye pini za sehemu.
• Time above liquidus:The component's exposure time to peak temperature shall not exceed 10 seconds. Reflow soldering should be performed a maximum of two times.

This profile complies with the JEDEC standard, ensuring reliable solder joint formation while maintaining package integrity.

6.2 Uchimbaji wa Mikono (Ikiwa Inahitajika)

If manual rework is required, use a soldering iron with a temperature not exceeding 300°C. Contact time with the pad should be limited to a maximum of 3 seconds and to a single operation only. Excessive heat or prolonged time may damage the plastic package or internal bond wires.

6.3 Cleaning

If post-soldering cleaning is required, use only the specified solvents. It is acceptable to immerse the LED in ethanol or isopropyl alcohol at room temperature for no more than one minute. Unspecified or corrosive chemicals may damage the lens material or the encapsulating epoxy.

6.4 Storage and Moisture Sensitivity

LEDs are packaged in moisture barrier bags with desiccant. In this sealed state, they should be stored at ≤30°C and ≤90% relative humidity and used within one year. Once the original bag is opened, the devices have a Moisture Sensitivity Level of 3 (MSL3). This means they must undergo IR reflow soldering within one week after exposure to factory ambient conditions (≤30°C/60% RH). For storage longer than this after opening, they must be stored in a sealed container with desiccant or in a nitrogen environment. Devices exposed for more than one week require baking at 60°C for at least 20 hours prior to soldering to remove absorbed moisture and prevent "popcorn" effect (package cracking due to vapor pressure during reflow).

6.5 Electrostatic Discharge (ESD) Precautions

AlInGaP LEDs are sensitive to electrostatic discharge. Proper ESD control measures must be taken during handling and assembly. This includes using grounded wrist straps, anti-static mats, and ensuring all equipment is properly grounded. ESD can cause immediate failure or latent damage, leading to reduced device lifetime.

7. Habari za Ufungaji na Uagizaji

7.1 Vipimo vya Ukanda wa Kubeba na Reel

Components are supplied in embossed carrier tape wound on 7-inch (178 mm) diameter reels for automated assembly.

• Carrier tape width:8 mm.
• Quantity per reel:3000 vipande.
• Kiasi cha chini cha kuagiza (MOQ):Idadi iliyobaki ni vipande 500.
• Kifuniko cha mfuko wa nyenzo:Empty material bags are sealed with covering tape.
• Missing Parts:According to packaging standards, a maximum of two consecutive missing LEDs is allowed.

Ufungaji unalingana na kifani cha ANSI/EIA-481, kuhakikisha utangamano na vifaa vya kusambaza mkanda wa kawaida kwenye mashine ya kubandika vipande.

8. Application Design Considerations

8.1 Ubunifu wa Sakiti ya Kuendesha

Kwa kuwa rangi mbili zina kathodi huru, zinaweza kuendeshwa tofauti. Kwa kila kituo, chanzo rahisi cha mkondo wa mara kwa mara au upinzani wa kikomo wa mkondo unatosha. Kwa kuzingatia V sawa,_F, ikiwa inaendeshwa kutoka kwa reli sawa ya voltage, kawaida unaweza kutumia thamani sawa ya upinzani kwa rangi zote mbili, lakini inashauriwa kufanya hesabu tofauti kwa usahihi. Kwa kuzidisha njia nyingi au kudim kwa PWM, hakikisha kuwa mkondo wa kuendesha na kasi ya kubadili ziko ndani ya viwango vya kifaa.

8.2 Usimamizi wa Joto

Ingawa matumizi ya nguvu ni ya chini (hadijuu ya 75 mW kwa chip), usimamizi bora wa joto kwenye bodi ya mzunguko wa chapa ni muhimu ili kudumisha pato la mwanga thabiti na kuaminika kwa muda mrefu, haswa katika hali ya joto la juu la mazingira au inapoendeshwa kwa mkondo wa juu unaoendelea. Hakikisha kuwa pedi za bati za PCB zina utoaji wa joto wa kutosha au zimeunganishwa kwa ndege ya shaba ili kupoza joto.

8.3 Ujumuishaji wa Optics

Tabia ya kuangalia kwa ubavu ya LED hii inahitaji muundo wa mitambo makini. Inaweza kuhitaji bodi ya kuongoza mwanga, kioo cha kutafakari, au kifaa cha kusambaza mwanga ili kuongoza mwanga kwenye eneo linalohitajika la kuona au kuunda mwanga wa nyuma sawasawa. Pembe ya upana ya 130° inasaidia kuangaza eneo kubwa bila kuzalisha sehemu zenye joto kali.

9. Ulinganishi wa Teknolojia na Tofauti

LTST-S326KGJRKT inajitofautisha katika soko kupitia mchanganyiko wake maalum wa utendaji:

• Ikilinganishwa na LED ya upande mmoja ya rangi moja:Ina hutoa utendakazi mbili ndani ya ukubwa sawa wa ufungashaji, ikihifadhi nafasi ya PCB na wakati wa usanikishaji ikilinganishwa na kusakinisha LED mbili za rangi moja tofauti.
• Ikilinganishwa na LED yenye rangi mbili inayoonekana kutoka juu:Sifa yake ya kutokaza mwanga kwa upande ndio kipengele chake kikuu cha kutofautisha, kukifanya kiwezekane katika muundo wa kipekee wa mitambo ambapo mwanga lazima utokwe sambamba na uso wa PCB.
• Ikilinganishwa na teknolojia nyingine za rangi mbili:Rangi zote mbili hutumia teknolojia ya AlInGaP, ikitoa ufanisi wa juu na usawa mzuri wa rangi kwa nyekundu na kijani ikilinganishwa na teknolojia za zamani kama vile GaP.
• Ikilinganishwa na LED ya RGB:Hiki ni kifaa cha rangi mbili msingi (nyekundu/kijani). Hakiwezi kutoa mwanga wa bluu au mweupe. Ilichaguliwa kwa matumizi mahususi yanayohitaji viashiria vya nyekundu na kijani pekee (k.m.v., nguvu/hali, ishara za kufanya kazi/onyo).

10. Maswali Yanayoulizwa Mara kwa Mara (Kulingana na Vigezo vya Kiufundi)

Q1: Je, naweza kuendesha LED nyekundu na kijani kwa wakati mmoja ili kutoa rangi ya manjano/ya machungwa?
A: Ndiyo, kwa kuwasha chips zote mbili kwa wakati mmoja, mwanga unaotolewa utachukuliwa kuwa wa manjano au manjano-machungwa, kulingana na nguvu ya jamaa ya kila chip. Tonali halisi inaweza kuboreshwa kwa kurekebisha uwiano wa sasa kati ya njia hizo mbili.

Q2: What is the difference between peak wavelength and dominant wavelength?
A: Peak wavelength (λ_P) is the wavelength at which the spectral power distribution is highest. Dominant wavelength (λ_d) is derived from CIE color coordinates and represents the wavelength of monochromatic light that appears to have the same color. λ_dIna ni muhimu zaidi katika mipangilio ya rangi ya programu.

Q3: Kwa nini kuna mfumo wa kugawa daraja, na ninawezaje kubainisha daraja gani ninahitaji?
A: Mfumo wa kugawa daraja ulianzishwa kukabiliana na tofauti za asili katika utengenezaji wa semiconductor. Unaruhusu wateja kuchagua LED zinazokidhi mahitaji maalum ya bidhaa zao kwa uangavu na usawa wa rangi. Unapofanya agizo, lazima ubainishe msimbo wa daraja la nguvu ya mwanga unayohitaji (k.m. "N"), na kwa mwanga wa kijani, pia ubainishe msimbo wa daraja la tone la rangi (k.m. "D"), ili kuhakikisha vipengele unavyopokea viko ndani ya viwango hivi vya utendaji.

Q4: Je, LED hii inahitaji kifaa cha kupoza joto?
A: Chini ya hali ya kawaida ya uendeshaji (I_F≤ 30mA, Ta ≤ 85°C), kwa kawaida haihitaji heatsink maalum. Hata hivyo, inashauriwa kutumia muundo mzuri wa joto wa PCB—kwa mfano kutumia pedi za shaba na njia za umeme za kutosha—ili kupunguza joto la kiungo iwezekanavyo, na hivyo kuongeza kiwango cha juu cha mwanga na maisha ya huduma.

11. Mfano wa Utumizi Halisi

Mfano 1: Kionyeshi cha hali ya kifaa kinachobebeka:Katika vifaa vya matibabu vinavyoshikiliwa mkononi, LED zinaweza kusanikishwa kwenye ukingo wa PCB kuu. Rangi ya kijani inaweza kuonyesha "Tayari/Imezimwa", nyekundu inaweza kuonyesha "Hitilafu/Nishati ndogo", na zote mbili zikiwaka wakati mmoja zinaweza kuonyesha "Kusubiri/Kuchaji". Mwanga unaotoka kando hufanya mwanga uonekane kupitia ufa mwembamba kwenye kifuniko cha kifaa.

Mfano 2: Mwanga wa nyuma wa jopo la udhibiti wa viwanda:A series of such LEDs can be placed along the side of a translucent membrane switch panel. The side light is coupled into the panel material, providing uniform, low-glare backlighting for labels or symbols. Dual colors can distinguish operating modes (e.g., green for automatic, red for manual).

12. Utangulizi wa Kanuni za Kiufundi

The LTST-S326KGJRKT uses aluminum indium gallium phosphide (AlInGaP) semiconductor material as its light-emitting chip. AlInGaP is a direct bandgap III-V compound semiconductor. By precisely controlling the ratios of aluminum, indium, and gallium, the bandgap energy of the material can be tuned. When forward biased, electrons and holes recombine in the active region of the chip, releasing energy in the form of photons. The wavelength (color) of these photons is determined by the bandgap energy: a larger bandgap produces shorter wavelengths (green), while a slightly smaller bandgap produces longer wavelengths (red). The device contains two such chips, fabricated with different material compositions, encapsulated within a reflective plastic package featuring a diffused lens that shapes the light output into a wide side-emitting pattern.

13. Industry Trends and Background

Maendeleo ya SMD LED za kuona kwa upande huu yanachochewa na udogo unaoendelea wa vifaa vya elektroniki na mahitaji ya kiolesura cha mtumiaji changamani zaidi katika vipimo vidogo. Viwango vinavyoathiri eneo hili la bidhaa ni pamoja na:

• Kuongezeka kwa Kiwango cha Ujumuishaji:Kutoka kwa viashiria vingi vilivyojitenga kwenda kwenye ufungaji wa chip nyingi na rangi nyingi, ili kuokoa nafasi na kurahisisha usanikishaji.
• Ufanisi wa juu zaidi:Uboreshaji endelevu wa teknolojia ya ukuaji wa epitaxial ya AlInGaP na InGaN (kwa mwanga wa bluu/kijani) umesababisha ufanisi mkubwa wa kutolea mwanga (utoaji zaidi wa mwanga kwa kila wati ya umeme).
• Mahitaji ya uthabiti wa rangi:Vipimo madhubuti zaidi vya kugawanya na upimaji wa hali ya juu wa wafers unazidi kuwa kawaida, ili kukidhi mahitaji ya matumizi yanayohitaji sanjari kwa rangi kwa ukali, kama vile safu nyingi za LED au alama.
• Uimara katika Mazingira Magumu:Uboreshaji wa nyenzo za ufungaji na teknolojia za kufunga umeboresha uaminifu dhidi ya unyevu, mzunguko wa joto na mfiduo wa kemikali, na kupanua matumizi katika matumizi ya magari na nje ya nyumba.

LTST-S326KGJRKT inawakilisha suluhisho lililokomaa na lililoelezwa wazi katika uwanja huu unaoendelea kukua, likitoa mchanganyiko thabiti wa utendaji wa rangi mbili, mwanga wa upande na uwezekano wa utengenezaji.