Table of Contents
- 1. Mchanganuo wa Bidhaa
- 2. Ufafanuzi wa Vigezo vya Kiufundi
- 2.1 Absolute Maximum Ratings
- 2.2 Electro-Optical Characteristics
- 3. Binning System Description
- 3.1 Luminous Intensity Binning
- 3.2 Dominant Wavelength Binning
- 4. Performance Curve Analysis
- 5. Mechanical and Packaging Information
- 5.1 Package Dimensions
- 5.2 Reel and Carrier Tape Dimensions
- 5.3 Label Description
- 6. Mwongozo wa Uchimbaji na Usanikishaji
- 6.1 Uhifadhi na Uendeshaji
- 6.2 Reflow Soldering Temperature Profile
- 6.3 Manual Soldering and Rework
- 7. Application Recommendations
- 7.1 Mazingira ya Kawaida ya Utumizi
- 7.2 Mazingatio ya Ubunifu
- 7.3 Application Limitations
- 8. Maswali Yanayoulizwa Mara kwa Mara (Kulingana na Vigezo vya Kiufundi)
- 9. Utangulizi wa Kanuni ya Uendeshaji
- 10. Mwelekeo wa Teknolojia
1. Mchanganuo wa Bidhaa
19-213/BHC-AP1Q2/3T是一款表面贴装器件(SMD)LED,专为需要紧凑、高效、可靠光源的现代电子应用而设计。该器件为单色类型,具体发射蓝光,采用无铅材料制造,确保符合RoHS、欧盟REACH及无卤要求(溴<900 ppm,氯<900 ppm,溴+氯<1500 ppm)等当代环保与安全标准。
The primary advantage of this SMD LED lies in its miniature package size, which is significantly smaller than traditional lead-frame type LEDs. This size reduction enables designers to achieve smaller printed circuit board (PCB) layouts, higher component assembly density, lower storage space requirements, and ultimately, the development of more compact end-user equipment. Furthermore, its lightweight construction makes it an ideal choice for applications with stringent weight control requirements.
Kifaa hiki kinapatikana katika muundo wa kiwango cha tasnia wa mkanda wa kubeba wa mm 8 na reel ya kipenyo cha inchi 7, kuhakikisha utangamano na vifaa vya kiotomatiki vya kasi ya juu vya kupachika vinavyotumika kwa wingi katika uzalishaji. Muundo wake pia unalingana na mchakao wa kiwango wa kuchomelea kwa mionzi ya infrared (IR) na gesi, na kuifanya iwe rahisi kuunganishwa kwenye mstari wa usanikishaji wa kiotomatiki.
2. Ufafanuzi wa Vigezo vya Kiufundi
2.1 Absolute Maximum Ratings
Absolute maximum ratings define the limits beyond which permanent damage to the device may occur. These values are specified at an ambient temperature (Ta) of 25°C and must not be exceeded under any operating conditions.
- Reverse Voltage (VR):5 V. LED hii haikusudiwa kufanya kazi kinyume; voltage inayozidi hii inaweza kusababisha kushindwa mara moja.
- Mwendo wa mbele (IF):20 mA. Hii ndiyo mkondo unaopendekezwa wa kufanya kazi endelevu.
- Mwendo wa kilele wa mbele (IFP):40 mA. This value is only permissible under pulse conditions with a duty cycle of 1/10 and a frequency of 1 kHz.
- Power Dissipation (Pd):75 mW. This is the maximum power that the package can dissipate without exceeding its thermal limits.
- Electrostatic Discharge (ESD) Human Body Model (HBM):150 V. Proper ESD handling procedures must be followed to prevent potential damage.
- Operating Temperature (Topr):-40°C hadi +85°C. Kifaa hiki kimepangwa kufanya kazi katika anuwai hii pana ya joto.
- Joto la uhifadhi (Tstg):-40°C hadi +90°C.
- Joto la kuchomelea (Tsol):For reflow soldering, the peak temperature is specified as 260°C for a maximum of 10 seconds. For manual soldering, the soldering iron tip temperature should not exceed 350°C, with a maximum of 3 seconds per solder terminal.
2.2 Electro-Optical Characteristics
Photoelectric characteristics are measured under the conditions of Ta=25°C and IF=20 mA, representing the typical performance of the device under standard operating conditions.
- Nguvu ya mwanga (Iv):Thamani ya kawaida haijabainishwa kama nambari moja; badala yake, vifaa vimepangwa katika makundi. Anuwai inatoka kiwango cha chini cha 45.0 mcd hadi kiwango cha juu cha 112.0 mcd. Pembe ya mtazamo (2θ1/2) kwa kawaida ni digrii 120, ikitoa muundo wa boriti mpana.
- Urefu wa wimbi la kilele (λp):Typically 468 nm, indicating the wavelength at which spectral emission is strongest.
- Dominant Wavelength (λd):Ranges from 464.5 nm to 476.5 nm. This is the single wavelength perceived by the human eye, also binned.
- Spectral Radiant Bandwidth (Δλ):Typically 25 nm, it defines the width of the emission spectrum at half of the maximum intensity (Full Width at Half Maximum, FWHM).
- Forward Voltage (VF):At IF=20mA, the range is from 2.7 V to 3.7 V. The tolerance for this parameter is ±0.1V, and it is also binned.
- Reverse Current (IR):Maximum 50 μA when a 5V reverse voltage (VR) is applied. This test condition is for characterization only.
Important Note:Vigezo muhimu vinabainisha uvumilivu: nguvu ya mwanga (±11%), wavelength kuu (±1 nm), na voltage ya mbele (±0.1 V). Kifaa hiki hakikusudiwa kufanya kazi kwa nyuma; ukadiriaji wa VR unatumika tu kwa jaribio la IR.
3. Binning System Description
Ili kuhakikisha uthabiti wa rangi na mwangaza katika uzalishaji, LED hupangwa katika daraja kulingana na nguvu ya mwanga na wavelength kuu.
3.1 Luminous Intensity Binning
Uainishaji huo unafafanuliwa na msimbo wa herufi-nambari (P1, P2, Q1, Q2), ambapo kila msimbo hufunika anuwai maalum ya nguvu ya mwanga inayopimwa kwa millicandela (mcd) wakati IF=20mA.
- Bin P1:45.0 mcd (min) to 57.0 mcd (max)
- Bin P2:57.0 mcd to 72.0 mcd
- Bin Q1:72.0 mcd to 90.0 mcd
- Bin Q2:90.0 mcd to 112.0 mcd
3.2 Dominant Wavelength Binning
Wavelength bins are defined by alphanumeric codes (A9, A10, A11, A12), each covering a specific dominant wavelength range measured in nanometers (nm) at IF=20mA.
- Binning A9:464.5 nm to 467.5 nm
- Binning A10:467.5 nm to 470.5 nm
- Bin A11:470.5 nm to 473.5 nm
- Bin A12:473.5 nm to 476.5 nm
This binning allows designers to select components that meet the precise brightness and color consistency requirements of their application.
4. Performance Curve Analysis
Mwongozo wa vipimo unatoa mikunjo kadhaa ya kawaida ya sifa, inayoonyesha tabia ya kifaa chini ya hali tofauti. Hii ni muhimu kwa kuelewa utendaji katika mazingira halisi ya matumizi.
- Ukubwa wa Mwanga wa Jamaa vs. Joto la Mazingira:This curve shows how the light output decreases when the ambient temperature exceeds 25°C. This is crucial for thermal management design to maintain the required brightness level.
- Relative Luminous Intensity vs. Forward Current:This graph illustrates the nonlinear relationship between drive current and light output. Operating beyond the recommended 20mA may yield diminishing returns in brightness while increasing the device's heat and stress.
- Forward Current vs. Forward Voltage (IV Curve):This fundamental curve illustrates the exponential relationship between voltage and current in a diode. The specified VF range (2.7V-3.7V at 20mA) is read from this curve.
- Forward Current Derating Curve:Mkunjo huu unabainisha kiwango cha juu cha ruhusiwa cha mkondo wa moja kwa moja kama utendakazi wa joto la mazingira. Kadiri joto linavyoongezeka, kiwango cha juu cha salama cha mkondo hupungua ili kuzuia joto kupita kiasi.
- Usambazaji wa wigo:Mchoro wa uhusiano wa nguvu ya jamaa na urefu wa wimbi, unaozingatia urefu wa wimbi wa kilele cha kawaida cha 468 nm, na upana wa bendi takriban 25 nm.
- Mchoro wa mnururisho:A polar plot describing the spatial distribution of light intensity, confirming a typical 120-degree viewing angle.
5. Mechanical and Packaging Information
5.1 Package Dimensions
The datasheet contains detailed mechanical drawings of the LED package. The drawings specify all critical dimensions, including length, width, height, pad size, and their positions. Unless otherwise noted, dimensional tolerance is ±0.1 mm. This information is crucial for PCB pad design (land pattern) to ensure proper soldering and alignment.
5.2 Reel and Carrier Tape Dimensions
Bidhaa hutoa kwa ufungashaji unaokinga unyevunyevu. Vipimo vya mkanda wa kubeba vimebainishwa ili kushikilia vipengele kwa usalama. Kila mfuko una vyande 3000. Michoro ya kina ya reeli (kipenyo cha inchi 7), mkanda wa kubeba, na mkanda wa kufunika imetolewa, isipokuwa imebainishwa vinginevyo, uvumilivu wote ni ±0.1 mm. Hii inahakikisha utangamano na vifaa vya usanikishaji otomatiki.
5.3 Label Description
Lebo ya ufungashaji inajumuisha maelezo muhimu ya kufuatilia na utumiaji sahihi:
- CPN:Nambari ya Bidhaa ya Mteja.
- P/N:Nambari ya bidhaa (mfano, 19-213/BHC-AP1Q2/3T).
- QTY:Idadi ya vifurushi.
- CAT:Ngazi ya nguvu ya mwanga (Msimbo wa kiwango cha nguvu).
- HUE:Chromaticity coordinates and dominant wavelength grade (wavelength bin code).
- REF:Forward voltage grade.
- LOT No:Nambari ya kundi la uzalishaji, inayotumika kwa ufuatiliaji.
Mfuko wa kuzuia unyevu una vyombo vya kukausha na kadi ya kiashiria cha unyevu, ili kulinda vipengele dhidi ya unyevu wakati wa uhifadhi na usafirishaji.
6. Mwongozo wa Uchimbaji na Usanikishaji
6.1 Uhifadhi na Uendeshaji
LED hizi ni nyeti kwa unyevu. Mfuko wa kuzuia unyevu haupaswi kufunguliwa kabla ya kutumia vipengele. Baada ya kufungua:
- LED inafaa kuhifadhiwa kwenye ≤30°C na unyevunyevu wa ≤60%.
- Lazima itumike ndani ya saa 168 (siku 7).
- LED isiyotumika inafaa kufungwa tena kwenye mfuko wa kuzuia unyevu ulio na draya mpya.
- Ikiwa muda wa uhifadhi umepita au draya inaonyesha unyevu wa juu, inahitajika kukaushwa kwa masaa 24 kwenye joto la 60 ±5°C kabla ya kuchomelea.
6.2 Reflow Soldering Temperature Profile
Specified the lead-free reflow soldering temperature profile:
- Preheat:150-200°C, for 60-120 seconds.
- Time above liquidus (217°C):60-150 seconds.
- Peak temperature:Hadi kufikia 260°C.
- Muda wa kilele:Kwa upeo wa sekunde 10.
- Kasi ya joto:Hadi 6°C/s kiwango cha juu hadi 255°C, kisha hadi 3°C/s kiwango cha juu hadi kiwango cha juu cha joto.
Tahadhari Muhimu:Uuzaji wa reflow haupaswi kutekelezwa zaidi ya mara mbili. Mkazo haupaswi kutumika kwenye LED wakati wa kupokanzwa, na PCB haipaswi kupindika baada ya kuuzwa.
6.3 Manual Soldering and Rework
If manual soldering is unavoidable:
- 使用烙铁头温度<350°C的烙铁。
- Muda wa kulehemu kwa kila mwisho wa muunganisho usizidi ≤ sekunde 3.
- Tumia chuma cha kulehemu chenye nguvu ≤25W.
- Kukata kila mwisho wa kuunganisha kwa angalau sekunde 2 kati ya kila mmoja.
Haipendekezwi kabisa kufanya marekebisho baada ya kukata. Ikiwa ni lazima kabisa, tumia chuma cha kukatia chenye vichwa viwili ili kuwasha mwisho wa kuunganisha wote kwa wakati mmoja na kuepeka mkazo wa mitambo. Ni lazima kutathmini mapema uwezekano wa kuharibu sifa za LED wakati wa mchakato wa kurekebisha.
7. Application Recommendations
7.1 Mazingira ya Kawaida ya Utumizi
Kulingana na spec sheet, LED hii ya bluu ya SMD inafaa kwa matumizi mbalimbali ya viashiria vya nguvu ya kati na ya chini na taa za nyuma, ikiwa ni pamoja na:
- Backlighting:Used for instrument panels, switches, and symbols in consumer electronics, automotive interiors (non-critical), and industrial control panels.
- Communication Equipment:Viasho vya hali na taa za nyuma za kibodi katika simu na mashine za faksi.
- Taa ya nyuma ya LCD:Kama chanzo cha mwanga cha nyuma cha gorofa kwa maonyesho ya LCD ya rangi moja au ya sehemu ndogo.
- Onyesho la jumla:Viashiria vya hali ya umeme, uteuzi wa hali, na viashiria vingine vya kiolesura cha mtumiaji katika vifaa vya elektroniki mbalimbali.
7.2 Mazingatio ya Ubunifu
- Kikomo cha Sasa:An external current limiting resistor isrequired. The forward voltage has a range (2.7V-3.7V). Due to the exponential I-V characteristic of the diode, a small variation in the supply voltage can cause a large and potentially destructive change in the forward current. The resistor value must be calculated based on the worst-case VF (minimum) to ensure the current never exceeds the 20mA continuous absolute maximum rating.
- Usimamizi wa joto:Ingawa kifurushi ni kidogo, ni muhimu kuzingatia matumizi ya nguvu (kiwango cha juu cha 75mW) na mkunjo wa kupunguza nguvu, hasa katika mazingira yenye joto la juu la mazingira au katika nafasi zilizofungwa. Eneo la kutosha la shaba la PCB (kibao cha kutawanya joto) husaidia katika kutawanya joto.
- Ulinzi wa ESD:Thamani ya 150V HBM ESD ni ya chini kiasi. Tekeleza hatua za ulinzi wa ESD kwenye PCB zinazotumia LED hizi, na kufuata taratibu sahihi za ESD kila wakati wakati wa usanikishaji na uendeshaji.
7.3 Application Limitations
Spec inasema wazi kuwa bidhaa hiiHaipendekezwi kwa matumizi ya kuaminika sana.Kwa mfano, mifumo ya kijeshi/anga au mifumo ya usalama/usalama wa magari (k.m., taa za breki, viashiria viairbag). Kwa matumizi kama hayo, LED zilizo na uthibitisho unaolingana wa magari (AEC-Q101) au wa kijeshi zinapaswa kuchaguliwa.
8. Maswali Yanayoulizwa Mara kwa Mara (Kulingana na Vigezo vya Kiufundi)
Q1: Kwa nini upinzani wa kuzuia mkondo ni muhimu kabisa?
A1: LED ni vifaa vinavyotumia mkondo. Voltage yao ya mbele (VF) ina uvumilivu wa uzalishaji na hubadilika kulingana na joto. Bila upinzani uliosanidiwa mfululizo, mkondo umedhamiriwa tu na voltage ya usambazaji na upinzani wa mwendo wa LED, ambao ni wa chini sana. Kuongezeka kidogo kwa voltage ya usambazaji au kupungua kwa VF (kutokana na joto la juu) kunaweza kusababisha mwinuko wa mkondo kuzidi kiwango cha juu cha 20mA, na kusababisha joto la haraka na kushindwa kufanya kazi. Upinzani hutoa mkondo thabiti, unaotabirika na salama.
Q2: Ninawezaje kuchagua kategoria sahihi kwa matumizi yangu?
A2: Uchaguzi unategemea mahitaji yako ya usawa wa mwangaza na uthabiti wa rangi. Ikiwa LED nyingi zitatumiwa kwa upande mmoja (kwa mfano, katika safu au michoro ya mistari), kuchagua LED kutoka kwa kategoria sawa ya nguvu ya mwanga (CAT) na kategoria ya wavelength kuu (HUE) ni muhimu ili kuepuka tofauti zinazoonekana za mwangaza au tone la bluu. Kwa matumizi ya kiashiria kimoja yasiyo na mahitaji makali, kategoria pana inaweza kukubalika na kuwa na gharama nafuu zaidi.
Q3: Naweza kutumia mkondo wa msukumo wa zaidi ya 20mA kuendesha LED hii ili iwe mkubwa zaidi?
A3: Ndiyo, lakini tu ndani ya mipaka madhubuti. Datasheet inabainisha mkondo wa kilele cha mbele (IFP) wa 40mA kwa uwiano wa kazi wa 1/10 na mzunguko wa 1kHz. Kuendesha kwa msukumo kunaweza kufikia mwangaza unaohisiwa wa juu zaidi. Hata hivyo, lazima uhakikishe mkondo wa wastani wa wakati hauzidi kiwango cha mfululizo, na halijoto ya kiungo haizidi kikomo chake. Bado ni lazima kuzingatia mkunjo wa kupunguza nguvu na viwango vya matumizi ya nguvu.
Q4: Nini kitatokea ikiwa maisha ya karakana yazidi siku 7 baada ya kufungua mfuko wa kuzuia unyevu?
A4: Ufungaji wa plastiki wa SMD unachukua unyevu kutoka kwa hewa. Wakati wa upakiaji tena, unyevu huu uliofunikwa hubadilika haraka kuwa mvuke, unaoweza kusababisha mgawanyiko wa ndani, ufa wa kifuniko au kushindwa kwa mwamba wa kuuza ("popcorn" athari). Ikiwa muda wa maisha ya karakana unazidi, vipengele vinapaswa kupikwa (60°C, saa 24) ili kuondoa unyevu kabla ya kuuza salama.
9. Utangulizi wa Kanuni ya Uendeshaji
Kulingana na mwongozo wa uteuzi wa kifaa, LED hii inategemea muundo wa diode ya semiconducta iliyotengenezwa kwa nyenzo za indiamu-galliamu nitrati (InGaN). Wakati voltage chanya inayozidi kizingiti cha kufungua diode (takriban 2.7-3.7V) inatumika, elektroni na mashimo huingizwa kwenye eneo lenye ufanisi la semiconducta. Vibeba malipo hivi hujumuika na kutolea nishati kwa namna ya fotoni (mwanga). Muundo maalum wa aloi ya InGaN huamua nishati ya pengo la bendi ya semiconducta, ambayo huamua moja kwa moja urefu wa wimbi la mwanga unaotolewa (rangi). Katika mfano huu, aloi hiyo imeundwa kuzalisha fotoni katika eneo la bluu la wigo unaoonekana, na urefu wa wimbi wa kilele takriban 468 nm. Ufungaji wa resini wazi kama maji unalinda chip ya semiconducta na hutumika kama lenzi, ukiumba mwanga unaotolewa kuwa mtazamo mpana wa digrii 120.
10. Mwelekeo wa Teknolojia
19-213/BHC-AP1Q2/3T represents mature SMD LED technology. The overall LED industry trends associated with this component include the continuous drive towardsimproving efficiency(Zaidi lumens kwa kila watt), hii inaruhusu pato lenye mwangaza zaidi chini ya mkondo sawa, au mwangaza sawa kwa matumizi ya nguvu kidogo na joto linalotokana chini. Mwelekeo mwingine niUlinganifu wa rangi ulioimarika na uainishaji mkali zaidi, ili kukidhi mahitaji ya matumizi ya maonyesho na taa. Zaidi ya hayo,Kupunguzwa kwa ukubwaThe trend continues, with smaller package sizes (e.g., 0402, 0201 metric) becoming prevalent for space-constrained applications. Finally,Enhanced Reliability and Robustness, including higher ESD ratings and improved moisture resistance, are key development areas for extending LEDs into more demanding environments, such as automotive lighting.
Detailed Explanation of LED Specification Terminology
Complete Explanation of LED Technical Terminology
I. Core Indicators of Photoelectric Performance
| Istilahi | Kipimo/Uwakilishi | Mafasiri ya Kawaida | Kwa Nini Ni Muhimu |
|---|---|---|---|
| Ufanisi wa Mwanga (Luminous Efficacy) | lm/W (lumen/watt) | Mwanga unaotolewa kwa kila watt ya umeme, unavyozidi kuwa mkubwa ndivyo unavyozidi kuokoa nishati. | Inaamua moja kwa moja kiwango cha ufanisi wa nishati na gharama ya umeme ya taa. |
| Mwangaza unaotolewa (Luminous Flux) | lm (lumen) | Jumla ya mwanga unaotolewa na chanzo cha mwanga, unaojulikana kwa kawaida kama "mwangaza". | Huamua kama taa inatosha kuwa na mwangaza. |
| Pembe ya Kuona (Viewing Angle) | ° (digrii), k.m. 120° | Pembe ambapo nguvu ya mwanga hupungua hadi nusu, inayoamua upana wa boriti ya mwanga. | Huathiri eneo la mwangaza na usawa wake. |
| Joto la rangi (CCT) | K (Kelvin), kama 2700K/6500K | Joto la rangi ya mwanga, thamani ya chini inaelekea manjano/joto, thamani ya juu inaelekea nyeupe/baridi. | Huamua mazingira ya taa na matumizi yanayofaa. |
| Kielelezo cha Uonyeshaji Rangi (CRI / Ra) | Hakuna kitengo, 0–100 | Uwezo wa chanzo cha mwanga kurejesha rangi halisi ya kitu, Ra≥80 ni bora. | Inaathiri ukweli wa rangi, hutumika katika maeneo yenye mahitaji makubwa kama maduka makubwa, makumbusho ya sanaa, n.k. |
| Tofauti ya uvumilivu wa rangi (SDCM) | MacAdam Ellipse Steps, e.g., "5-step" | A quantitative indicator of color consistency; a smaller step number indicates better color consistency. | Hakikisha rangi ya taa za kundi moja hazina tofauti. |
| Mdomo mkuu wa wimbi (Dominant Wavelength) | nm (nanomita), k.m. 620nm (nyekundu) | Thamani ya urefu wa wimbi inayolingana na rangi ya LED zenye rangi. | Huamua hue ya LED za rangi moja kama nyekundu, manjano, kijani, n.k. |
| Usambazaji wa Wigo (Spectral Distribution) | Mkunjo wa Urefu wa Mawimbi dhidi ya Ukubwa | Inaonyesha usambazaji wa ukubwa wa mwanga unaotolewa na LED katika urefu wa mawimbi tofauti. | Inaathiri ubora wa kuonyesha rangi na ubora wa rangi. |
II. Vigezo vya Umeme
| Istilahi | Ishara | Mafasiri ya Kawaida | Maagizo ya Usanifu |
|---|---|---|---|
| Forward Voltage | Vf | The minimum voltage required to light up an LED, similar to a "starting threshold". | Voltage ya chanjo ya umeme lazima iwe ≥ Vf, voltage inaongezeka wakati LED nyingi zimeunganishwa mfululizo. |
| Mkombo wa Mbele (Forward Current) | If | Thamani ya mkondo inayofanya LED ionekane kwa kawaida. | Kwa kawaida hutumia udhibiti wa mkondo wa kudumu, mkondo huamua mwangaza na maisha ya taa. |
| Maksimum ya mkondo wa msukumo (Pulse Current) | Ifp | Kilele cha mkondo kinachoweza kustahimili kwa muda mfupi, kinachotumika kwa kudimisha au kumulika. | Pulse width and duty cycle must be strictly controlled to prevent overheating and damage. |
| Reverse Voltage | Vr | The maximum reverse voltage that an LED can withstand; exceeding this may cause breakdown. | The circuit must be protected against reverse connection or voltage surges. |
| Upinzani wa joto (Thermal Resistance) | Rth (°C/W) | Upinzani wa joto kutoka kwenye chip hadi kwenye sehemu ya kuunganishia, thamani ya chini inaonyesha usambazaji bora wa joto. | Upinzani wa joto wa juu unahitaji muundo wenye nguvu zaidi wa usambazaji wa joto, vinginevyo joto la kiungo litaongezeka. |
| ESD Immunity | V (HBM), kwa mfano 1000V | Uwezo wa kukabiliana na mshtuko wa umeme tuli, thamani ya juu zaidi inamaanisha uwezo mkubwa wa kuepusha uharibifu kutokana na umeme tuli. | Antistatic measures must be implemented during production, especially for high-sensitivity LEDs. |
III. Thermal Management and Reliability
| Istilahi | Key Indicators | Mafasiri ya Kawaida | Athari |
|---|---|---|---|
| Junction Temperature | Tj (°C) | The actual operating temperature inside the LED chip. | For every 10°C reduction, the lifespan may double; excessively high temperatures lead to lumen depreciation and color shift. |
| Kupungua kwa Mwanga (Lumen Depreciation) | L70 / L80 (saa) | Muda unaohitajika ili mwangaza upunguke hadi 70% au 80% ya thamani ya awali. | Kufafanua moja kwa moja "maisha ya huduma" ya LED. |
| Lumen Maintenance | % (e.g., 70%) | The percentage of remaining luminous flux after a period of use. | Characterizes the ability to maintain brightness after prolonged use. |
| Color Shift | Δu′v′ or MacAdam Ellipse | Kiwango cha mabadiliko ya rangi wakati wa matumizi. | Inaathiri uthabiti wa rangi wa eneo la taa. |
| Uchakavu wa Joto (Thermal Aging) | Kupungua kwa Utendaji wa Nyenzo | Uharibifu wa nyenzo za ufungaji unaosababishwa na joto la juu la muda mrefu. | Inaweza kusababisha kupungua kwa mwangaza, mabadiliko ya rangi, au kushindwa kwa mzunguko wazi. |
Nne. Ufungaji na Nyenzo
| Istilahi | Aina za Kawaida | Mafasiri ya Kawaida | Sifa na Matumizi |
|---|---|---|---|
| Aina za Ufungaji | EMC, PPA, Ceramic | The housing material that protects the chip and provides optical and thermal interfaces. | EMC ina mzuri kwa kuhimili joto, gharama nafuu; kauri ina ufanisi wa kupoza joto na maisha marefu. |
| Muundo wa Chip | Usakinishaji wa Kawaida, Usakinishaji wa Kichwa-chini (Flip Chip) | Chip electrode arrangement method. | Flip-chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications. |
| Phosphor coating | YAG, silicate, nitride | Coated on the blue LED chip, partially converted to yellow/red light, mixed to form white light. | Fosfori tofauti huathiri ufanisi wa mwanga, halijoto ya rangi na ubora wa kuonyesha rangi. |
| Lenzi/Usanifu wa Optics | Planar, microlens, total internal reflection | The optical structure on the package surface controls light distribution. | Determines the emission angle and light distribution curve. |
Tano, Udhibiti wa Ubora na Uainishaji
| Istilahi | Yaliyomo katika Uainishaji | Mafasiri ya Kawaida | Kusudi |
|---|---|---|---|
| Kikomo cha Flux ya Mwanga | Msimbo kama 2G, 2H | Group by brightness level, each group has a minimum/maximum lumen value. | Ensure consistent brightness for products within the same batch. |
| Voltage binning | Codes such as 6W, 6X | Grouped by forward voltage range. | Facilitates driver power matching and improves system efficiency. |
| Color binning | 5-step MacAdam ellipse | Group by color coordinates to ensure colors fall within an extremely small range. | Ensure color consistency to avoid color unevenness within the same luminaire. |
| Color temperature binning | 2700K, 3000K, etc. | Group by color temperature, each group has a corresponding coordinate range. | Meet the color temperature requirements of different scenarios. |
VI. Testing and Certification
| Istilahi | Kigezo/Uchunguzi | Mafasiri ya Kawaida | Maana |
|---|---|---|---|
| LM-80 | Lumen Maintenance Test | Long-term operation under constant temperature conditions, recording data on brightness attenuation. | Used to estimate LED lifespan (in conjunction with TM-21). |
| TM-21 | Standard for Life Projection | Projecting lifespan under actual use conditions based on LM-80 data. | Providing scientific life prediction. |
| IESNA Standard | Illuminating Engineering Society Standard | Inashughuli njia za kupima za kioo, umeme na joto. | Msingi wa upimaji unaokubaliwa na tasnia. |
| RoHS / REACH | Uthibitisho wa Mazingira | Hakikisha bidhaa hazina vitu hatari (kama risasi, zebaki). | Masharti ya kuingia katika soko la kimataifa. |
| ENERGY STAR / DLC | Uthibitisho wa ufanisi wa nishati. | Uthibitisho wa Ufanisi na Utendaji wa Nishati kwa Bidhaa za Taa. | Inatumika kwa kawaida katika miradi ya ununuzi wa serikali na ruzuku, kuimarisha ushindani wa soko. |