Table of Contents
- 1. Product Overview
- 1.1 Core Advantages and Target Market
- 2. Viwango vya Juu Kabisa na Vigezo vya Kiufundi
- 3. Tabia za Kielektroniki na Mwanga
- 4. Binning System Description
- 4.1 Luminous Intensity Binning
- 4.2 Dominant Wavelength Binning
- 4.3 Binning ya Voltage ya Mwelekeo
- 5. Uchambuzi wa Curve ya Utendaji
- 5.1 Nguvu ya Mwanga vs. Mkondo wa Mbele
- 5.2 Mwangaza Nguvu dhidi ya Joto la Mazingira
- 5.3 Mstari wa Kupunguza Mkondo wa Mbele
- 5.4 Forward Voltage vs. Forward Current
- 5.5 Spectral Distribution
- 5.6 Radiation Pattern
- 6. Mechanical and Packaging Information
- 7. Soldering, Assembly, and Storage Guidelines
- 7.1 Mahitaji ya Udhibiti wa Mto
- 7.2 Uhifadhi na Uwezekano wa Unyevunyevu
- 7.3 Masharti ya Uchomeleo
- 7.4 Manual Soldering and Rework
- 8. Packaging and Ordering Information
- 9. Mazingatio ya Ubunifu wa Matumizi
- 9.1 Ubunifu wa Saketi
- 9.2 Thermal Management
- 9.3 Optical Integration
- 10. Technical Comparison and Differentiation
- 11. Maswali Yanayoulizwa Mara kwa Mara (FAQ)
- 12. Muundo na Mfano wa Matumizi
- 13. Working Principle
- 14. Mwenendo wa Teknolojia
1. Product Overview
19-218/BHC-ZL1M2QY/3T ni kifaa cha kuchomelea uso (SMD) cha taa ya mwanga ya diode (LED) iliyoundwa kwa matumizi ya kisasa ya elektroniki yenye ukubwa mdogo. Kipengele hiki kina mafanikio makubwa ikilinganishwa na LED za aina ya fremu ya waya za jadi, na kinaweza kupunguza kwa kiasi kikubwa ukubwa wa bidhaa ya mwisho. Thamani yake ya msingi ni kufikia muundo mdogo wa bodi ya mzunguko wa kuchapishwa (PCB), msongamano mkubwa wa usanikishaji wa vipengele, na kupunguza ukubwa na uzito wa jumla wa kifaa. Hii inafanya iwe chaguo bora kwa matumizi ambapo nafasi na uzito ni mipaka muhimu.
该 LED 为单色型,发射蓝光,采用环保材料制造。它完全符合主要的国际法规,包括欧盟的《有害物质限制指令》(RoHS)、《化学品注册、评估、授权和限制法规》(REACH) 以及无卤素要求 (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm)。产品以卷带形式供货,兼容标准的自动化贴片组装设备,简化了大规模制造流程。
1.1 Core Advantages and Target Market
Faida kuu ya SMD LED hii inatokana na ufungashaji wake mdogo na muundo mwepesi. Kwa kuondoa pini nzito, inaweza kutumia nafasa ya PCB kwa ufanisi zaidi. Hii inabadilishwa moja kwa moja kuwa kifurushi cha mwisho kidogo, gharama ya nyenzo chini, na vifaa vya mtumiaji wa mwisho vyenye uzito mwepesi. Msongamano wa juu wa usanikishaji unaowezekana na vipengele vya SMD ni muhimu kwa vifaa vya kisasa vya elektroniki vilivyo na utendaji mwingi.
Matumizi yake lengwa ni mbalimbali, yakiwa makini zaidi kwenye utendaji wa viashiria na taa za nyuma. Masoko muhimu yanajumuisha mambo ya ndani ya magari (k.m. dashibodi na taa za nyuma za swichi), vifaa vya mawasiliano (k.m. viashiria vya hali na taa za nyuma za kibodi katika simu na faksi), na bidhaa za elektroniki za watumiaji (k.m. taa za nyuma za gorofa za zana za kuonyesha kioevu (LCD), swichi, na alama). Uwezo wake wa kutumika kwa jumla pia hufanya iwe inafaa kwa matumizi mengine mengi ya viashiria katika sekta ya viwanda na ya watumiaji.
2. Viwango vya Juu Kabisa na Vigezo vya Kiufundi
Understanding Absolute Maximum Ratings is crucial for ensuring reliable operation and preventing premature device failure. These ratings define the stress limits that could cause permanent damage.
- Reverse Voltage (VR):5 V. Exceeding this voltage in the reverse direction may cause junction breakdown.
- Continuous forward current (IF):25 mA. This is the maximum DC current that can be continuously applied.
- Peak forward current (IFP):100 mA. This pulse current rating (duty cycle 1/10, frequency 1 kHz) allows for brief high-brightness operation but must not be used for continuous operation.
- Power Dissipation (Pd):95 mW. This is the maximum power the device can dissipate as heat, calculated as the product of forward voltage and forward current.
- Electrostatic Discharge (ESD) Human Body Model (HBM):150 V. Proper ESD handling procedures must be followed during assembly and handling to avoid electrostatic damage.
- Operating Temperature (Topr):-40°C to +85°C. The device is guaranteed to operate within this ambient temperature range.
- Storage temperature (Tstg):-40°C hadi +90°C.
- Joto la kulehemu:Kifaa kinaweza kustahimili joto la kilele cha 260°C kwa muda wa sekunde 10 kwa kulehemu kwa mtiririko, au 350°C kwa kila terminal kwa muda wa sekunde 3 kwa kulehemu kwa mkono.
3. Tabia za Kielektroniki na Mwanga
Tabia za Kielektroniki na Mwangaa) ya 25°C na mkondo wa mbele (IF) ya 5 mA, isipokuwa ikitajwa vinginevyo. Vigezo hivi vinabainisha mwanga unaotolewa na tabia ya umeme ya LED.
- Ukubwa wa Mwanga (Iv):Mbalimbali kutoka kiwango cha chini cha 11.5 millicandela (mcd) hadi kiwango cha juu cha 28.5 mcd. Thamani ya kawaida haijabainishwa kwenye jedwali la muhtasari, lakini mfumo wa kugawanya umetoa masafa maalum.
- Pembe ya mtazamo (2θ1/2):Digrii 120. Hii ndiyo pembe kamili wakati nguvu ya mwanga inapungua hadi nusu ya nguvu ya digrii 0 (axial). Pembe ya mtazamo pana kama hii inafaa kwa matumizi yanayohitaji taa ya pembe pana au kuonekana kutoka pembe nyingi.
- Peak Wavelength (λp):468 nm. This is the wavelength at which the spectral power distribution reaches its maximum value.
- Dominant Wavelength (λd):Ranging from 465 nm to 475 nm. This is the single wavelength that the human eye perceives as matching the color of the LED light. It is a key parameter for defining color.
- Spectral Radiant Bandwidth (Δλ):25 nm (typical). This defines the width of the emission spectrum at half of the peak intensity.
- Forward Voltage (VF):At IF= 5mA, the range is from 2.7 V to 3.2 V. This is the voltage drop across the LED when the conduction current flows.
- Reverse current (IR):When a reverse voltage (VR) of 5V is applied, the maximum is 50 μA.
Tolerance description:Tolerances for luminous intensity are ±11%, for dominant wavelength ±1 nm, and for forward voltage ±0.05 V. These tolerances have been accounted for in the binning system.
4. Binning System Description
To ensure color and brightness consistency in production, LEDs are sorted into different bins based on key parameters. This allows designers to select components that meet the uniformity requirements of specific applications.
4.1 Luminous Intensity Binning
Kulingana na vipimo vilivyochukuliwa katika IF= 5mA, LED zimegawanywa katika vikundi vinne (L1, L2, M1, M2) kulingana na kiwango cha mwanga kilichopimwa.
- Kikundi L1:11.5 mcd to 14.5 mcd
- Gear L2:14.5 mcd to 18.0 mcd
- Gear M1:18.0 mcd to 22.5 mcd
- Gear M2:22.5 mcd to 28.5 mcd
4.2 Dominant Wavelength Binning
LEDs are grouped according to their dominant wavelength to control the hue of blue.
- Kundi Z:Kundi hili linajumuisha viwango vya LED ya bluu.
- Kiwango X:465 nm hadi 470 nm (wavelength fupi kidogo, inaweza kuwa ya kijani-bluu)
- Kipimo Y:470 nm hadi 475 nm (wavelength ndefu kidogo, inaweza kuwa bluu safi zaidi au nene zaidi)
4.3 Binning ya Voltage ya Mwelekeo
LEDs are also binned according to forward voltage (VF) to aid circuit design, particularly for current-limiting resistor calculation and power supply design.
- Group Q:Kundi hili lina viwango vya voltage chanya.
- Kiwango cha 29:2.7 V hadi 2.8 V
- Kiwango cha 30:2.8 V to 2.9 V
- Gear 31:2.9 V to 3.0 V
- Gear 32:3.0 V to 3.1 V
- Gear 33:3.1 V to 3.2 V
The complete product model (e.g., BHC-ZL1M2QY/3T) contains codes specifying the luminous intensity, dominant wavelength, and forward voltage bin to which the device belongs.
5. Uchambuzi wa Curve ya Utendaji
Mwongozo wa maelezo hutoa mikunjo kadhaa ya sifa, inayoonyesha mabadiliko ya utendaji wa LED chini ya hali tofauti za uendeshaji. Hizi ni muhimu sana kwa muundo thabiti.
5.1 Nguvu ya Mwanga vs. Mkondo wa Mbele
Mkunjaji huu unaonyesha mwangaza kuongezeka kadri mkondo wa mbele unavyoongezeka, lakini uhusiano sio wa mstari kamili, haswa katika mikondo ya juu. Kufanya kazi kwa mkondo unaozidi ile inayopendekezwa ya kuendelea kunaongeza pato la mwanga, lakini pia hutoa joto zaidi, ambalo linaweza kufupisha maisha ya kifaa na kusababisha mabadiliko ya rangi.
5.2 Mwangaza Nguvu dhidi ya Joto la Mazingira
Kadri joto la mazingira linavyopanda, nguvu ya mwanga ya LED hupungua. Hii ni sifa ya msingi ya chanzo cha mwanga cha semiconductor. Mkunjo unaonyesha nguvu ya jamaa ya mwanga inapungua kadri joto linavyopanda kutoka -40°C hadi +100°C. Uundaji katika mazingira ya joto kali lazima uzingatie kupunguzwa huku kwa nguvu.
5.3 Mstari wa Kupunguza Mkondo wa Mbele
To prevent overheating, the maximum allowable continuous forward current must be reduced as the ambient temperature increases. This curve provides derating information, specifying lower IFat higher Talimits to stay within the power dissipation rating.
5.4 Forward Voltage vs. Forward Current
This is the current-voltage (I-V) characteristic of an LED diode. It shows an exponential relationship, where a small increase in voltage beyond the turn-on threshold leads to a large increase in current. This highlights the absolute necessity of a current-limiting device (such as a resistor or constant current driver) in series with the LED.
5.5 Spectral Distribution
The diagram depicts the relative radiant power emitted within the visible spectrum, centered at a peak wavelength of 468 nm with a typical bandwidth of 25 nm. This defines the purity and specific hue of the blue light.
5.6 Radiation Pattern
Mchoro huu wa polar unaonyesha wazi usambazaji wa anga wa mwanga, ukathibitisha pembe ya maono ya digrii 120. Unaonyesha jinsi ukubwa unavyopungua kadiri unavyopotea kutoka kwenye mhimili wa kati.
6. Mechanical and Packaging Information
Vipimo vya kimwili vya kifurushi cha SMD LED vinatolewa kwenye michoro ya kina. Vipimo muhimu vinajumuisha urefu wa jumla, upana, urefu, na nafasi na ukubwa wa vituo vinavyoweza kutengenezewa. Mpangilio wa pedi unaopendekezwa pia unapendekezwa ili kuhakikisha muunganisho wa kuaminika na usawa sahihi wakati wa mchakato wa reflow. Ubunifu wa pedi ni kwa kusudi la kumbukumbu tu, na wabunifu wanaweza kuubadilisha kulingana na uwezo wao maalum wa utengenezaji wa PCB na mahitaji ya usimamizi wa joto. Isipokuwa imeelezwa vinginevyo, uvumilivu wa vipimo vya kifurushi kwa kawaida ni ±0.1 mm.
Kipengele hiki kinatumia lenzi ya wazi (isiyo na rangi) ya msumari, inayoruhusu mwanga wa bluu kutoka kwa chipu ya semikondukta ya InGaN (Indium Gallium Nitride) kutolewa bila kuhitaji kuchuja rangi. Ulinganifu unaonyeshwa na alama kwenye kifurushi, na lazima izingatiwe wakati wa kusanikisha ili kuhakikisha muunganisho sahihi wa umeme.
7. Soldering, Assembly, and Storage Guidelines
Kufuata miongozo hii ni muhimu kwa mavuno ya usanikishaji na uimara wa muda mrefu.
7.1 Mahitaji ya Udhibiti wa Mto
Lazima utumie upinzani wa nje wa kuzuia mkondo. Tabia ya kielelezo ya I-V ya LED inamaanisha kwamba mabadiliko madogo ya voltage ya usambazaji yanaweza kusababisha mabadiliko makubwa na yanayoweza kuharibu ya mkondo wa mbele. Upinzani huweka mkondo wa uendeshaji kwa uhakika.
7.2 Uhifadhi na Uwezekano wa Unyevunyevu
LEDs are packaged in moisture barrier bags with desiccant to prevent absorption of atmospheric moisture. The bag should not be opened until ready for production. Before opening, storage conditions should be ≤30°C and ≤90% RH. After opening, components have a 1-year "floor life" if maintained at ≤30°C and ≤60% RH. Unused parts should be resealed in moisture barrier packaging. If the desiccant indicator changes color or the storage time exceeds the specification, baking at 60 ±5°C for 24 hours is required prior to reflow soldering to remove moisture.
7.3 Masharti ya Uchomeleo
This device is compatible with infrared (IR) and vapor phase reflow soldering processes. A lead-free reflow temperature profile is provided, specifying preheat, time above liquidus (217°C), peak temperature (maximum 260°C for up to 10 seconds), and cooling rate. Reflow soldering should not be performed more than twice on the same LED. During soldering, no mechanical stress should be applied to the component, and the PCB should not warp after the process.
7.4 Manual Soldering and Rework
如果必须进行手工焊接,烙铁头温度必须低于 350°C,每个端子的接触时间不应超过 3 秒。建议使用低功率烙铁 (<25W),焊接每个端子之间至少间隔 2 秒。强烈不建议在 LED 焊接后进行返修。如果绝对不可避免,必须使用专用的双头烙铁同时加热两个端子,并且必须事先验证对 LED 特性的影响。
8. Packaging and Ordering Information
The product is supplied in standard 8mm carrier tape on 7-inch diameter reels. Each reel contains 3000 pieces. The carrier tape and reel dimensions are specified to ensure compatibility with automated assembly equipment. The packaging includes a foil moisture barrier bag, desiccant, and labels. The label on the reel provides key information, including the product number (P/N), customer part number (CPN), packaging quantity (QTY), specific bin codes for luminous intensity (CAT), dominant wavelength/chromaticity (HUE) and forward voltage (REF), as well as the production lot number (LOT No).
9. Mazingatio ya Ubunifu wa Matumizi
9.1 Ubunifu wa Saketi
The basic design step is to select an appropriate current-limiting resistor. Its value is calculated using Ohm's Law: R = (VPower Supply- VF) / IF. Tumia V ya juu kutoka kwenye maelezo ya kiufundi (au kiwango maalum)F, ili kuhakikisha kwamba mkondo hauzidi I inayohitajika hata katika hali mbaya zaidiF. Nguvu ya kawaida ya upinzani pia lazima iwe ya kutosha: PR= (IF)² * R. Kwa miradi inayohitaji uthabiti wa mwangaza kwenye anuwai ya joto au kati ya LED nyingi, fikiria kutumia kiendesha cha mkondo thabiti badala ya upinzani rahisi.
9.2 Thermal Management
Ingawa SMD LED zina ufanisi mzuri, bado hutoa joto. Kufanya kazi kwenye mkondo wa kiwango cha juu au karibu nao huongeza halijoto ya kiungo. Joto la juu hupunguza pato la mwanga (kupungua kwa mwanga) na kunaweza kuharakisha uharibifu wa muda mrefu. Hakikisha mpangilio wa PCB unatoa utoaji wa joto wa kutosha, hasa wakati LED inaendeshwa kwa mkondo wa juu au inatumika katika mazingira yenye halijoto ya juu ya mazingira. Fuata mkunjo wa kupunguza mkondo wa mbele uliotolewa kwenye hati ya maelezo.
9.3 Optical Integration
A 120-degree viewing angle provides a wide emission angle. For applications requiring a more focused beam, secondary optics such as lenses or light guides may be necessary. The transparent resin package is suitable for use with external optical components. When designing light guides or diffusers, the spatial radiation pattern and spectral output of the LED must be considered.
10. Technical Comparison and Differentiation
Ikilinganishwa na LED za kawaida zenye waya na mashimo, LED hii ya SMD ina faida kubwa zaidi kwa uzalishaji wa kisasa: kupunguza sana nafasi kwenye bodi ya mzunguko, kufaa kwa usanikishaji wa kiotomatiki kabisa, na urefu mdogo wa wasifu unaofanya bidhaa kuwa nyembamba zaidi. Katika kundi la LED za SMD, sababu muhimu za tofauti za aina hii maalum ni pamoja na safu yake ya juu kiasi ya ngazi ya nguvu ya mwanga (hadi 28.5 mcd kwa 5mA), pembe ya kuona pana sana ya digrii 120, na kufuata viwango vikali vya halojini na RoHS. Mfumo wa kina wa kugawanya kwa ngazi kwa nguvu, urefu wa wimbi, na voltage hutoa muundo wa kina unaohitajika na wabunifu, unaofaa kwa matumizi yanayohitaji uthabiti wa juu, kama vile safu nyingi za taa za nyuma za LED au vikundi vya viashiria vya hali ambapo mechi ya rangi na mwangaza ni muhimu kwa kuonekana.
11. Maswali Yanayoulizwa Mara kwa Mara (FAQ)
Swali: Kwa nini upinzani wa kudhibiti mkondo ni muhimu kabisa?
Jibu: LED ni diode zenye uhusiano usio wa mstari na wa kielelezo kati ya mkondo na voltage. Bila upinzani wa kudhibiti mkondo, hata ongezeko dogo la voltage linaweza kusababisha mkondo kupanda bila udhibiti, na LED kuharibika karibu mara moja kwa sababu ya joto kupita kiasi.
Swali: Naweza kutumia chanzo cha umeme cha 3.3V bila upinzani kuendesha LED hii?
A: Hapana. Anuwai ya voltage chanya ni 2.7V hadi 3.2V. Chanzo cha 3.3V kinazidi VF, bila upinzani wa kupunguza voltage ya ziada ya 0.1V hadi 0.6V, mkondo hautadhibitiwa, na uwezekano mkubwa utazidi kiwango cha juu cha kiwango, na kuharibu LED.
Q: Je, alama ya "bila risasi" inamaanisha nini kwa upakuaji?
A: Hii inamaanisha kuwa vituo vya kifaa havina risasi. Hii inahitaji matumizi ya aloi ya solder isiyo na risasi (Pb-free) wakati wa usanikishaji, ambayo kiwango chake cha kuyeyuka kwa kawaida ni cha juu kuliko solder ya zamani ya stani na risasi. Mkunjo wa reflow uliotolewa umeundwa mahsusi kwa michakato hii ya juu ya joto isiyo na risasi.
Swali: Je, kusoma vipi msimbo wa kiwango katika nambari ya aina (mfano ZL1M2QY)?
Jibu: Msimbo huu unalingana na vikundi vya kiwango. Kwa mfano, 'L1' au 'M2' inaashiria kiwango cha nguvu ya mwanga, 'Y' inaashiria kiwango cha urefu wa wimbi kuu (470-475nm), na 'QY' inaweza kumaanisha kikundi cha kiwango cha voltage ya mbele. Uhusiano halisi unapaswa kuthibitishwa kwa kurejelea hati ya kina ya msimbo wa kiwango kutoka kwa mtengenezaji.
12. Muundo na Mfano wa Matumizi
Kesi 1: Taa za Nyuma za Swichi za Dashibodi ya Gari:Kundi la LED 5-10 kama hili linatumika kutoa taa za nyuma kwa vitufe na visuonyesho mbalimbali. Wabunifu wanachagua LED kutoka kwa kiwango kimoja cha nguvu ya mwanga (k.m. M1) na kiwango kimoja cha urefu wa wimbi kuu (k.m. Y) ili kuhakikisha rangi na mwangaza sawa kwa swichi zote. Pembe ya kuona ya 120° inahakikisha taa za nyuma zinavyoonekana kutoka kwa mtazamo wa dereva. LED zinatumiwa kwa mkondo wa mara kwa mara wa 10mA uliokombolewa kwenye moduli ya udhibiti wa dashibodi, ili kudumisha mwangaza thabiti wakati mfumo wa umeme wa 12V wa gari unapopanda na kushuka.
Kesi 2: Paneli ya Viashiria vya Hali ya Viwanda:Kutumia LED moja kwenye vifaa vya kiwanda kama kiashiria cha "Umeme Umezimwa". Imebuniwa saketi rahisi, ikijumuisha reli ya umeme ya 5V, upinzani wa kudhibiti mkondo uliokokotolewa kwa mkondo wa kazi wa 15mA (kwa kutumia V ya juuF3.2V: R = (5-3.2)/0.015 = 120Ω) and LED. The bright blue light is highly visible in well-lit industrial environments. The SMD package allows it to be placed directly on the main control PCB, saving space and assembly costs compared to panel-mounted through-hole LEDs.
13. Working Principle
Hii LED ni kifaa cha nusu-uwazi cha fotoni. Kiini chake ni chipi iliyotengenezwa kwa nyenzo za InGaN (Indiamu-Galiamu-Nitrati). Unapotumia voltage chanya inayozidi kizingiti cha kuwasha diode, elektroni na mashimo huingizwa kwenye eneo lenye uwezo la nusu-uwazi. Vibeba malipo hivi hujumuika, na nishati inayotolewa wakati wa kujumuika hutolewa kwa mfumo wa fotoni (mwanga). Uchanganyiko maalum wa aloi ya InGaN huamua nishati ya pengo la bendi ya nusu-uwazi, ambayo huamua moja kwa moja urefu wa wimbi la mwanga unaotolewa (rangi) – kwa mfano huu, ni bluu. Kifuniko cha epoksi kilicho wazi kinalinda chipi nyeti ya nusu-uwazi, kichukua nafasi ya lenzi kwa kuunda pato la mwanga, na kutoa uthabiti wa mitambo.
14. Mwenendo wa Teknolojia
Maendeleo ya SMD LED kama vile mfululizo wa 19-218 ni sehemu ya mwelekeo mpana zaidi katika tasnia ya elektroniki: udogo, ongezeko la utendakazi kwa eneo la kitengo, na utengenezaji wa otomatiki na kiwango kikubwa. Maendeleo katika nyenzo za semikondukta, hasa ufanisi na upeo wa safu ya rangi za LED za bluu na nyeupe zenye msingi wa InGaN, yamekuwa kiini cha kuendesha. Mwelekeo wa baadaye wa vipengele kama hivi yanaweza kujumuisha uboreshaji zaidi wa ufanisi wa mwanga (pato zaidi la mwanga kwa kila watt ya umeme), uboreshaji wa uthabiti wa rangi na ubora wa kuonyesha rangi, ujumuishaji wa saketi za udhibiti kwenye bodi (kuwa LED "akili"), na ufungashaji uliobuniwa kwa msongamano wa nguvu wa juu na usimamizi bora wa joto. Msukumo wa uendelevu unaendelea kusukuma kuondolewa kwa vitu hatari na uboreshaji wa ufanisi wa nishati katika mzunguko mzima wa maisha.
Detailed Explanation of LED Specification Terminology
Complete Explanation of LED Technical Terminology
I. Core Indicators of Photoelectric Performance
| Istilahi | Kipimo/Uwakilishi | Mafasiri ya Kawaida | Kwa Nini Ni Muhimu |
|---|---|---|---|
| Ufanisi wa Mwanga (Luminous Efficacy) | lm/W (lumen/watt) | Mwanga unaotolewa kwa kila watt ya umeme, unavyozidi kuwa mkubwa ndivyo unavyozidi kuwa wa kutumia nishati kwa ufanisi. | Inaamua moja kwa moja kiwango cha ufanisi wa nishati na gharama za umeme za taa. |
| Flux ya Mwanga (Luminous Flux) | lm (lumen) | Jumla ya mwanga unaotolewa na chanzo cha mwanga, unaojulikana kwa kawaida kama "mwangaza". | Huamua kama taa inatosha kuwa na mwangaza. |
| Pembe ya Kuangazia (Viewing Angle) | ° (digrii), k.m. 120° | Pembe ambapo nguvu ya mwana hupungua hadi nusu, inayoamua upana wa boriti ya mwanga. | Huathiri eneo la mwanga na usawa wake. |
| Joto la rangi (CCT) | K (Kelvin), kama 2700K/6500K | Joto la rangi ya mwanga, thamani ya chini inaelekea manjano/joto, thamani ya juu inaelekea nyeupe/baridi. | Huamua mazingira ya taa na matumizi yanayofaa. |
| Kielelezo cha Uonyeshaji Rangi (CRI / Ra) | Hakuna kitengo, 0–100 | Uwezo wa chanzo cha mwanga kurejesha rangi halisi ya kitu, Ra≥80 ni bora. | Inaathiri ukweli wa rangi, hutumika katika maeneo yenye mahitaji makubwa kama maduka makubwa, majumba ya sanaa, n.k. |
| Kosa la uvumilivu wa rangi (SDCM) | MacAdam Ellipse Steps, e.g., "5-step" | A quantitative indicator of color consistency; a smaller step number indicates better color consistency. | Hakikisha rangi ya taa za kundi moja hazina tofauti. |
| Urefu wa wimbi kuu (Dominant Wavelength) | nm (nanomita), k.m. 620nm (nyekundu) | Thamani ya urefu wa wimbi inayolingana na rangi ya LED ya rangi. | Huamua hue ya LED ya rangi moja kama nyekundu, manjano, kijani, n.k. |
| Usambazaji wa Wigo (Spectral Distribution) | Mkunjo wa Urefu wa Wimbi dhidi ya Ukubwa | Inaonyesha usambazaji wa ukubwa wa mwanga unaotolewa na LED katika urefu wa wimbi tofauti. | Inaathiri ubora wa kuonyesha rangi na ubora wa rangi. |
II. Vigezo vya Umeme
| Istilahi | Ishara | Mafasiri ya Kawaida | Mapendekezo ya Ubunifu |
|---|---|---|---|
| Forward Voltage | Vf | The minimum voltage required to turn on an LED, similar to a "starting threshold". | Voltage ya chanjo ya umeme inahitaji kuwa ≥ Vf, voltage inaongezeka wakati LED nyingi zimeunganishwa mfululizo. |
| Forward Current | If | Thamani ya mkondo inayofanya LED ionekane kwa kawaida. | Kwa kawaida hutumia udhibiti wa mkondo wa kudumu, mkondo huamua mwangaza na maisha ya huduma. |
| Mwisho wa mkondo wa msukumo (Pulse Current) | Ifp | Kilele cha mkondo kinachoweza kustahimili kwa muda mfupi, kinachotumika kwa kudimisha au kumulika. | Pulse width and duty cycle must be strictly controlled to prevent overheating damage. |
| Reverse Voltage | Vr | The maximum reverse voltage that an LED can withstand; exceeding this may cause breakdown. | The circuit must be protected against reverse connection or voltage surges. |
| Thermal Resistance | Rth (°C/W) | Upinzani wa joto kutoka kwenye chip hadi kwenye sehemu ya kuunganishia, thamani ya chini inaonyesha usambazaji bora wa joto. | Upinzani wa joto wa juu unahitaji muundo wa nguvu zaidi wa usambazaji wa joto, vinginevyo joto la kiungo litaongezeka. |
| ESD Immunity | V (HBM), k.m. 1000V | Uwezo wa kukabiliana na mshtuko wa umeme tuli, thamani ya juu zaidi inamaanisha uwezo mkubwa wa kuepusha uharibifu. | Antistatic measures must be implemented during production, especially for high-sensitivity LEDs. |
III. Thermal Management and Reliability
| Istilahi | Key Indicators | Mafasiri ya Kawaida | Athari |
|---|---|---|---|
| Junction Temperature | Tj (°C) | The actual operating temperature inside the LED chip. | For every 10°C reduction, the lifespan may double; excessively high temperatures cause lumen depreciation and color shift. |
| Kupungua kwa Mwanga (Lumen Depreciation) | L70 / L80 (saa) | Muda unaohitajika ili mwangaza upunguke hadi 70% au 80% ya thamani ya awali. | Kufafanua moja kwa moja "maisha ya huduma" ya LED. |
| Lumen Maintenance | % (e.g., 70%) | The percentage of remaining luminous flux after a period of use. | Characterizes the ability to maintain brightness after long-term use. |
| Color Shift | Δu′v′ or MacAdam Ellipse | Kiwango cha mabadiliko ya rangi wakati wa matumizi. | Inaathiri uthabiti wa rangi wa eneo la taa. |
| Uchakavu wa Joto (Thermal Aging) | Kupungua kwa Utendaji wa Nyenzo | Uharibifu wa nyenzo za ufungaji kutokana na joto la juu kwa muda mrefu. | May lead to decreased brightness, color changes, or open-circuit failure. |
IV. Packaging and Materials
| Istilahi | Aina za Kawaida | Mafasiri ya Kawaida | Sifa na Matumizi |
|---|---|---|---|
| Aina za Ufungaji | EMC, PPA, Ceramic | A housing material that protects the chip and provides optical and thermal interfaces. | EMC ina mzuri kwa upinzani wa joto na gharama nafuu; kauri ina utoaji bora wa joto na maisha marefu. |
| Muundo wa Chip | Usakinishaji wa Kawaida, Usakinishaji wa Kichupo (Flip Chip) | Chip electrode arrangement method. | Flip-chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications. |
| Phosphor coating | YAG, silicate, nitride | Coated on the blue LED chip, partially converted to yellow/red light, mixed to form white light. | Fosfori tofauti huathiri ufanisi wa mwanga, halijoto ya rangi na ubora wa kuonyesha rangi. |
| Lenzi/Usanifu wa Optics | Planar, microlens, total internal reflection | The optical structure on the package surface controls light distribution. | Determines the emission angle and light distribution curve. |
V. Quality Control and Binning
| Istilahi | Binning Content | Mafasiri ya Kawaida | Kusudi |
|---|---|---|---|
| Kikomo cha Flux ya Mwanga | Msimbo kama 2G, 2H | Group by brightness level, each group has a minimum/maximum lumen value. | Ensure consistent brightness for products within the same batch. |
| Voltage binning | Codes such as 6W, 6X | Grouped according to forward voltage range. | Facilitates driver power matching and improves system efficiency. |
| Color binning. | 5-step MacAdam ellipse | Group by color coordinates to ensure colors fall within an extremely small range. | Ensure color consistency to avoid color unevenness within the same luminaire. |
| Mgawanyo wa joto la rangi | 2700K, 3000K, n.k. | Group by color temperature, each group has a corresponding coordinate range. | Meet the color temperature requirements of different scenarios. |
VI. Testing and Certification
| Istilahi | Kigezo/Uchunguzi | Mafasiri ya Kawaida | Maana |
|---|---|---|---|
| LM-80 | Lumen Maintenance Test | Long-term operation under constant temperature conditions, recording data on luminance attenuation. | Used for estimating LED lifespan (in conjunction with TM-21). |
| TM-21 | Standard for Life Projection | Projecting lifespan under actual use conditions based on LM-80 data. | Providing scientific life prediction. |
| IESNA Standard | Illuminating Engineering Society Standard | Inashughuli na mbinu za kupima kwa mwanga, umeme na joto. | Msingi unaokubalika kitaalamu wa kupima. |
| RoHS / REACH | Uthibitisho wa Mazingira | Hakikisha bidhaa haina vitu hatari (kama risasi, zebaki). | Masharti ya kuingia katika soko la kimataifa. |
| ENERGY STAR / DLC | Uthibitisho wa ufanisi wa nishati. | Uthibitisho wa Ufanisi wa Nishati na Utendaji kwa Bidhaa za Taa. | Hutumiwa mara nyingi katika miradi ya ununuzi wa serikali na ruzuku, kuimarisha ushindani wa soko. |