Table of Contents
- 1. Product Overview
- 1.1 Core Features and Compliance
- 1.2 Matumizi Lengwa
- 2. Maelezo ya Uainishaji wa Kiufundi
- 2.1 Viwango vya Juu Kabisa
- 2.2 Photoelectric Characteristics
- 3. Binning System Description
- 3.1 Kugawanya Kwa Nguvu ya Mwanga
- 3.2 Kugawanya Kwa Wavelength Kuu
- 3.3 Forward Voltage Binning
- 4. Uchambuzi wa Curve ya Utendaji
- 4.1 Mkondo wa Mbele vs. Voltage ya Mbele (I-V Curve)
- 4.2 Relative Luminous Intensity vs. Forward Current
- 4.3 Relative Luminous Intensity vs. Ambient Temperature
- 4.4 Forward Current Derating Curve
- 4.5 Radiation Pattern Diagram
- 4.6 Spectral Distribution Diagram
- 5. Mechanical and Packaging Information
- 5.1 Package Dimensions
- 5.2 Polarity Marking
- 6. Mwongozo wa Uchomeaji na Usanikishaji
- 6.1 Mkunjo wa Joto wa Reflow Soldering (Lead-Free)
- 6.2 Manual Soldering
- 6.3 Storage and Moisture Protection Requirements
- 7. Maelezo ya Ufungaji na Uagizaji
- 7.1 Reel and Carrier Tape Specifications
- 7.2 Label Description
- 8. Vidokezo vya Utumizi na Mazingatio ya Ubunifu
- 8.1 Lazima Utumie Hatua za Kizuizi cha Mkondo
- 8.2 Usimamizi wa Joto Ingawa nguvu ni ya chini (kiwango cha juu cha 60mW), utendaji na maisha ya LED bado yanahusiana kwa karibu na joto. Hakikisha PCB inatoa njia ya kutosha ya kupoeza joto, hasa wakati wa kutumia LED nyingi au wakati halijoto ya mazingira ni ya juu. Tafadhali rejea mkunjo wa kupunguza mzigo. 8.3 Tahadhari za Ulinzi dhidi ya Umeme wa Tuli
- 9. Ulinganisho wa Teknolojia na Tofauti
- 10. Maswali Yanayoulizwa Mara kwa Mara (FAQ)
- 10.1 Jinsi ya Kuchagua Upinzani Sahihi wa Kikomo cha Mkondo?
- 10.2 Je, Inawezekana Kutumia Chanzo cha Umeme Cha Voltage Starehe Bila Kuunganisha Upinzani Ili Kuendesha LED Hii?
- 10.3 Kwa nini mchakato wa uhifadhi na upikaji umekuwa muhimu sana?
- 10.4 Ina maana ya "Y2C" kwenye nambari ya sehemu?
- 11. Uundaji na Utafiti wa Kesi za Matumizi
- 11.1 Low-Power Status Indicator Panel
- 12. Working Principle
- 13. Mwelekeo wa Teknolojia
1. Product Overview
19-213/Y2C-CP1Q2L/3T is a Surface Mount Device (SMD) LED designed for high-density electronic assembly. It is a monochromatic LED that emits bright yellow light, utilizing AlGaInP semiconductor material and encapsulated in transparent resin. The primary advantage of this component is its compact size, which significantly reduces PCB footprint, storage space, and overall device dimensions compared to traditional lead-frame LEDs. Its lightweight structure makes it highly suitable for miniaturization and portable applications.
1.1 Core Features and Compliance
- Imepakiwa kwenye mkanda wa 8mm kwenye reeli yenye kipenyo cha inchi 7, inafaa kwa usakinishaji wa otomatiki.
- Inaendana na mchakato wa infrared na mvuke wa kuunganisha.
- Inafanywa kwa kutumia nyenzo zisizo na risasi.
- 符合RoHS、欧盟REACH及无卤标准（Br <900 ppm， Cl <900 ppm， Br+Cl < 1500 ppm）。
1.2 Matumizi Lengwa
This LED is suitable for various indicator and backlight functions, including:
- Dashboard and switch backlighting in automotive and industrial control equipment.
- Viwango vya hali na taa za nyuma za kibodi katika vifaa vya mawasiliano kama vile simu, faksi, n.k.
- Taa za nyuma za gorofa za paneli ya LCD, swichi na alama.
- Matumizi ya jumla ya viashiria vya taa.
2. Maelezo ya Uainishaji wa Kiufundi
2.1 Viwango vya Juu Kabisa
Hizi viwango vya kawaida vinabainisha mipaka ambayo inaweza kusababisha uharibifu wa kudumu wa kifaa. Uendeshaji unapaswa kudumishwa daima ndani ya mipaka hii.
- Reverse voltage (VR):5 V - Kuzidi voltage hii ya nyuma kunaweza kusababisha kuvunjika kwa kiungo.
- Continuous Forward Current (IF):25 mA - The maximum DC current for reliable operation.
- Peak Forward Current (IFP):60 mA (duty cycle 1/10 @1KHz) - Inafaa kwa operesheni ya mfululizo, inaruhusu kilele cha muda mfupi.
- Matumizi ya nguvu (Pd):60 mW - Nguvu ya juu inayoweza kutawanywa na kifurushi, inayokokotolewa kwa VF * IF.
- Utoaji wa umeme wa tuli (ESD) HBM:2000 V - Human Body Model rating, indicating sensitivity to static electricity.
- Operating Temperature (Topr):-40°C to +85°C - Ambient temperature range for normal operation.
- Storage Temperature (Tstg):-40°C to +90°C.
- Soldering Temperature (Tsol):Reflow soldering: maximum 260°C, up to 10 seconds; Hand soldering: maximum 350°C per lead, up to 3 seconds.
2.2 Photoelectric Characteristics
Measured under Ta=25°C, IF=20mA conditions. These are typical performance parameters.
- Luminous intensity (Iv):45.0 - 112.0 mcd (millicandela). Actual output is binned (see Section 3).
- Viewing angle (2θ1/2):120° (kawaida). Pembe hii pana ya mtazamo inatoa uonekano mzuri wa mbali na mhimili.
- Urefu wa wimbi la kilele (λp):591 nm (kawaida). Urefu wa wimbi ambao utoaji wa wigo ni wenye nguvu zaidi.
- Urefu wa wimbi kuu (λd):585.5 - 591.5 nm. Hii inafafanua rangi inayohisiwa (njano mkali), pia imegawanywa katika makundi.
- Upana wa wigo (Δλ):15 nm (kawaida). Upana wa wigo wa mionzi kwenye nusu ya kiwango cha kilele.
- Forward Voltage (VF):1.70 - 2.30 V. The voltage drop across the LED at 20mA current, already binned.
- Reverse Current (IR):Maximum 10 μA at VR=5V. This device is not designed for reverse operation; this parameter is for leakage current testing only.
Important Note:Tolerance is specified as: luminous intensity ±11%, dominant wavelength ±1nm, forward voltage ±0.05V. Reverse voltage rating applies only under IR test conditions.
3. Binning System Description
Ili kuhakikisha uthabiti wa rangi na mwangaza katika uzalishaji, LED zimegawanywa katika vikundi tofauti. Nambari ya sehemu 19-213/Y2C-CP1Q2L/3T inajumuisha msimbo huu wa kugawanya.
3.1 Kugawanya Kwa Nguvu ya Mwanga
Grading is performed under the condition of IF=20mA. The code in the part number (e.g., Q2) indicates the output range.
- P1:45.0 - 57.0 mcd
- P2:57.0 - 72.0 mcd
- Q1:72.0 - 90.0 mcd
- Q2:90.0 - 112.0 mcd
3.2 Kugawanya Kwa Wavelength Kuu
Binning under the condition of IF=20mA. Define the chromaticity coordinate point.
- D3:585.5 - 588.5 nm
- D4:588.5 - 591.5 nm
3.3 Forward Voltage Binning
Binning is performed under the condition of IF=20mA. It is important for current-limiting resistor calculation and power supply design.
- 19:1.7 - 1.8 V
- 20:1.8 - 1.9 V
- 21:1.9 - 2.0 V
- 22:2.0 - 2.1 V
- 23:2.1 - 2.2 V
- 24:2.2 - 2.3 V
4. Uchambuzi wa Curve ya Utendaji
The datasheet provides several characteristic curves that are crucial for the design.
4.1 Mkondo wa Mbele vs. Voltage ya Mbele (I-V Curve)
This nonlinear curve illustrates the relationship between current and voltage. A slight increase in voltage beyond the threshold leads to a significant surge in current, highlighting the necessity of using current-limiting resistors or constant-current drivers.
4.2 Relative Luminous Intensity vs. Forward Current
Light output increases with current, but may not be perfectly linear, especially at higher currents. Operating near maximum ratings may yield diminishing returns and increase thermal stress.
4.3 Relative Luminous Intensity vs. Ambient Temperature
Ufanisi wa LED hupungua kadri joto la kiungo kinavyoongezeka. Mkunjo huu kwa kawaida unaonyesha pato linapungua kadri joto la mazingira linavyopanda kutoka -40°C hadi +85°C. Usimamizi sahihi wa joto kwenye PCB ni muhimu ili kudumisha uthabiti wa mwangaza.
4.4 Forward Current Derating Curve
Mchoro huu unabainisha uhusiano wa juu zaidi wa mkondo wa mwelekeo sahihi unaoruhusiwa na joto la mazingira. Kadri joto linavyoongezeka, mkondo wa juu salama hupungua, ili kuzuia kuzidi kikomo cha matumizi ya nguvu na kusababisha kutokaa kwa joto.
4.5 Radiation Pattern Diagram
Grafu ya polar inayoonyesha usambazaji wa pembe ya ukali wa mwanga, inathibitisha pembe ya maono ya 120°, yenye muundo wa kawaida wa Lambert au utoaji wa kando.
4.6 Spectral Distribution Diagram
A plot of relative intensity versus wavelength (approximately 550-700 nm), showing a peak near 591 nm (yellow) with a typical bandwidth of 15 nm, which is characteristic of AlGaInP material.
5. Mechanical and Packaging Information
5.1 Package Dimensions
The LED utilizes a compact SMD package. Key dimensions (tolerance ±0.1mm unless otherwise specified) are:
- Urefu: 2.0 mm
- Upana: 1.25 mm
- Urefu: 0.8 mm
- Inatoa vipimo vya pad na nafasi kati yao, kwa ajili ya kubuni muundo wa pad za PCB.
5.2 Polarity Marking
Cathode is usually marked, for example by a notch, a green dot, or different pad sizes on the bottom of the package. Correct orientation is crucial for circuit operation.
6. Mwongozo wa Uchomeaji na Usanikishaji
6.1 Mkunjo wa Joto wa Reflow Soldering (Lead-Free)
A key process to ensure reliable assembly.
- Preheat:150-200°C, kwa muda wa sekunde 60-120.
- Muda juu ya mstari wa kioevu (217°C):Sekunde 60-150.
- Kiwango cha juu cha joto:Maximum 260°C, hold time up to 10 seconds.
- Heating Rate:Maximum 6°C/second.
- Muda juu ya 255°C:Kwa upeo wa sekunde 30.
- Kasi ya kupoza:Hadi ya juu 3°C/s.
Ujumbe Muhimu:Idadi ya upasuaji wa reflow isizidi mara mbili. Epuka kutumia mkazo wa mitambo kwenye LED wakati wa joto, usipinde PCB baada ya upasuaji.
6.2 Manual Soldering
If manual repair is required:
- 使用烙铁头温度 < 350°C的烙铁。
- 对每个引脚加热 < 3秒。
- 使用额定功率 < 25W的烙铁。
- 焊接每个引脚之间间隔 > 2秒，以防止过热。
- Uangalifu mkubwa unahitajika, kwani uharibifu hutokea kwa urahisi zaidi wakati wa kuchomelea kwa mikono.
6.3 Storage and Moisture Protection Requirements
Components are packaged in moisture barrier bags.
- Do not open the moisture barrier bag before use.
- After opening, unused LEDs must be stored in an environment of ≤30°C and ≤60% relative humidity.
- "Maisha ya kiwanda" baada ya kufunguliwa ni saa 168 (siku 7).
- Ikiwa maisha ya kiwanda yamezidi au kiashiria cha kikaushi kimebadilisha rangi, inahitaji kukaushwa: kukaushwa kwa saa 24 kwenye 60 ±5°C kabla ya reflow soldering.
7. Maelezo ya Ufungaji na Uagizaji
7.1 Reel and Carrier Tape Specifications
- Carrier tape width: 8 mm.
- Reel diameter: 7 inches.
- Quantity per reel: 3000 pieces.
- Inatoa vipimo vya kina vya reeli, mkanda wa kubeba, na mfuko, na uvumilivu wa ±0.1mm.
7.2 Label Description
Lebo ya ufungaji inajumuisha:
- CPN: Nambari ya Bidhaa ya Mteja
- P/N: Nambari ya Bidhaa (mfano, 19-213/Y2C-CP1Q2L/3T)
- QTY: Packaging Quantity
- CAT: Luminous Intensity Grade (e.g., Q2)
- HUE: Chromaticity/Dominant Wavelength Grade (e.g., C, related to D3/D4)
- REF: Forward Voltage Grade (e.g., 1Q2L, related to voltage binning)
- LOT No: Traceable Lot Number
8. Vidokezo vya Utumizi na Mazingatio ya Ubunifu
8.1 Lazima Utumie Hatua za Kizuizi cha Mkondo
LEDs are current-driven devices. An external current-limiting resistor or constant-current driver must be used in series. The steep I-V curve means that a small voltage change can cause a large current change, which may instantly damage the LED ("burn out"). The resistor value is calculated using Ohm's Law: R = (Supply Voltage - VF) / IF, where VF is the forward voltage from the corresponding bin.
8.2 Usimamizi wa Joto
Ingawa nguvu ni ya chini (kiwango cha juu cha 60mW), utendaji na maisha ya LED bado yanahusiana kwa karibu na joto. Hakikisha PCB inatoa njia ya kutosha ya kupoza joto, hasa wakati wa kutumia LED nyingi au wakati joto la mazingira ni la juu. Tafadhali rejelea mkunjo wa kupunguza nguvu.
8.3 Tahadhari za Kinga dhidi ya Umeme wa Tuli
Kifaa hiki kina kiwango cha ESD HBM cha 2000V, na kina usikivu wa kati. Wakati wa usakinishaji na ukarabati, tafadhali fuata taratibu za usalama dhidi ya umeme tuli (vaa mkanda wa mkono, tumia kituo cha kazi kilichogunduliwa, tumia povu unaoendesha umeme).
9. Ulinganisho wa Teknolojia na Tofauti
LED ya 19-213 inayotumia teknolojia ya AlGaInP ina faida kubwa katika kutoa mwanga wa manjano:
- Ikilinganishwa na LED za jadi za manjano (k.m. GaAsP):AlGaInP hutoa ufanisi bora wa utoaji mwanga na usawa bora wa rangi (manjano yenye mwangaza na usafi zaidi), na hivyo kufikia pato lenye mwangaza zaidi chini ya mkondo sawa.
- Ikilinganishwa na LED nyeupe/manjano zinazobadilishwa kwa kutumia fosforasi:Kama kianzishio cha mwanga cha moja kwa moja cha semikondukta, haina tatizo la kupungua kwa fosforasi kwa muda, na inaweza kutoa utulivu bora wa rangi kwa muda mrefu. Wigo wake pia ni nyembamba zaidi, jambo linalopendelea kwa matumizi maalum ya kuchuja rangi.
- Ikilinganisha na LED kubwa za aina ya kuongoza:Ufungashaji wa SMD unaunga mkono usanikishaji wa otomatiki, msongamano wa juu kwenye bodi na kupunguza inductance ya parasi, jambo linalofaa kwa matumizi ya kubadili kwa kasi.
10. Maswali Yanayoulizwa Mara kwa Mara (FAQ)
10.1 Jinsi ya Kuchagua Upinzani Sahihi wa Kikomo cha Mkondo?
Kwa muundo ulio na tahadhari, tumia voltage ya juu ya mbele iliyobainishwa katika nambari ya agizo lako (mfano, daraja 24: 2.3V ya juu). Kwa usambazaji wa umeme wa 5V na mkondo unaolengwa wa 20mA: R = (5V - 2.3V) / 0.020A = ohm 135. Tumia thamani ya kawaida inayofuata (mfano, ohm 150) na uhesabu mkondo halisi: I = (5V - 2.1V_typical) / 150 = ~19.3mA, hii ni salama.
10.2 Je, Inawezekana Kutumia Chanzo cha Umeme Cha Voltage Starehe Bila Kuunganisha Upinzani Ili Kuendesha LED Hii?
Hapana.Hii karibu hakika itaharibu LED. Voltage ya mbele ina uvumilivu na hubadilika kulingana na joto. Ikiwa chanzo cha voltage ya kudumu kilichowekwa kwa VF ya kawaida (k.m., 2.0V) kikikuta LED yenye VF halisi ya chini, kinaweza kutoa mkondo mwingi kupita kiasi.
10.3 Kwa nini mchakato wa uhifadhi na upikaji umekuwa muhimu sana?
SMD packaging absorbs moisture from the air. During high-temperature reflow soldering, this trapped moisture rapidly vaporizes, causing internal delamination or the "popcorn" effect, which cracks the package. Moisture barrier bags and baking procedures prevent this failure mode.
10.4 Ina maana ya "Y2C" kwenye nambari ya sehemu?
This is a manufacturer-specific code that encapsulates the binning information for luminous intensity (CAT), dominant wavelength (HUE), and forward voltage (REF), allowing for precise selection of performance characteristics.
11. Uundaji na Utafiti wa Kesi za Matumizi
11.1 Low-Power Status Indicator Panel
Scenario:Design a compact control panel with 20 yellow status indicator lights.
Design selection:
- Drive circuit:Kuna reli ya umeme ya 5V inayopatikana. Ili kurahisisha muundo na kupunguza gharama, kila LED imeunganishwa mfululizo na upinzani. Kwa kiwango cha Q2 (90-112 mcd) na kiwango cha voltage 21 (1.9-2.0V), upinzani wa ohms 150 umechaguliwa kwa kila LED, ukitoa takriban 20mA ya mkondo na kiashiria cha mwangaza thabiti na sawa.
- Mpangilio wa PCB:Ukubwa wa kifurushi cha 2.0x1.25mm huruhusu kupangwa kwa karibu. Kiunganishi kidogo cha kutawanya joto kilichounganishwa kwenye ndege ya ardhi husaidia kutawanya takriban 40mW (2V * 20mA) ya nguvu kwa kila LED.
- Process:Components are supplied on 8mm carrier tape for automated pick-and-place machines. After opening, the entire reel should be used within one shift to avoid moisture issues.
- Results:Shukrani kwa ukubwa mdogo na uwekaji sawa wa 19-213 LED, safu ya viashiria vya mwanga imepatikana ambayo ni ya kuaminika, yenye msongamano mkubwa, na yenye usawa wa rangi na mwangaza.
12. Working Principle
19-213 LED ni kifaa cha fotoni cha semiconductor. Hutengenezwa kwa kutumia tabaka la epitaxial la alumini-gali-indiamu fosfidi (AlGaInP) linalokua kwenye msingi. Unapotumia voltage chanya inayozidi nishati ya pengo la bendi ya nyenzo (takriban 1.7-2.3V), elektroni na mashimo huingizwa kwenye eneo lenye ufanisi na kujumuika hapo. Mchakato huu wa kujumuisha hutoa nishati kwa njia ya fotoni (mwanga). Muundo maalum wa aloi ya AlGaInP huamua nishati ya pengo la bendi, ambayo inalingana moja kwa moja na urefu wa wimbi la mwanga unaotolewa—kwa mfano huu, njano mkali (~591 nm). Kifuniko cha wazi cha resin kinalinda chip ya semiconductor na kutumika kama lenzi, kukiunda muundo wa mionzi wa digrii 120.
13. Mwelekeo wa Teknolojia
Surface-mount LEDs like the 19-213 have become the standard for modern electronic components due to their compatibility with automated manufacturing. Development trends in this field include:
- Efficiency Improvement:Maboresho ya kudumu ya sayansi ya nyenzo yanalenga kuzalisha ufanisi wa juu wa kutolea mwanga (pato la mwanga zaidi kwa kila wati ya umeme) kutoka kwa AlGaInP na vichanganyiko vingine vya semikondukta.
- Udogo:Ukubwa wa ufungaji unaendelea kupungua (k.m. kutoka 2.0mm hadi 1.6mm au chini zaidi), ili kufikia msongamano wa juu zaidi kwenye PCB.
- Uboreshaji wa Uaminifu:Uboreshaji wa nyenzo za ufungaji na teknolojia ya kusanikisha chipi, ili kustahimili halijoto ya juu zaidi ya kuunganisha na hali ngumu zaidi za mazingira.
- Mgawanyiko Unaofafanuliwa Zaidi:Teknolojia ya kisasa ya uainishaji na upimaji inaruhusu safu nyembamba zaidi za utendaji, ikiruhusu wabunifu kudhibiti usawa wa rangi na mwangaza kwa usahihi zaidi katika bidhaa.
- Ujumuishaji:Mwelekeo ni kuelekea LED zilizojumuishwa ndani ya kifuniko sawa na upinzani wa kikomo wa mkondo au kiendesha IC, na hivyo kurahisisha muundo wa saketi.
Maelezo ya Istilahi za Vipimo vya LED
Ufafanuzi Kamili wa Istilahi za Teknolojia ya LED
I. Viashiria Muhimu vya Utendaji wa Kielektroniki na Mwanga
| Terminology | Unit/Representation | Layman's Explanation | Kwa Nini Ni Muhimu |
|---|---|---|---|
| Ufanisi wa Mwanga (Luminous Efficacy) | lm/W (lumens per watt) | The luminous flux emitted per watt of electrical power; the higher the value, the more energy-efficient. | It directly determines the energy efficiency rating of the luminaire and the electricity cost. |
| Flux ya Mwanga (Luminous Flux) | lm (lumen) | Jumla ya mwanga unaotolewa na chanzo cha mwanga, unaojulikana kwa kawaida kama "mwangaza". | Huamua kama taa inatosha kuwa na mwangaza. |
| Pembe ya kuona mwanga (Viewing Angle) | ° (digrii), kama 120° | Pembe ambayo nguvu ya mwanga hupungua hadi nusu, inayoamua upana wa boriti ya mwanga. | Inapata ushawishi kwenye upeo wa mwanga na usawa wake. |
| Joto la rangi (CCT) | K (Kelvin), kama 2700K/6500K | Joto la rangi ya mwanga, thamani ya chini inaelekea manjano/joto, thamani ya juu inaelekea nyeupe/baridi. | Huamua mazingira ya taa na matumizi yanayofaa. |
| Color Rendering Index (CRI / Ra) | Unitless, 0–100 | The ability of a light source to reproduce the true colors of objects, with Ra≥80 being preferable. | Inaathiri ukweli wa rangi, hutumika katika maeneo yenye mahitaji makubwa kama maduka makubwa, majumba ya sanaa. |
| Tofauti ya uvumilivu wa rangi (SDCM) | MacAdam ellipse steps, such as "5-step" | A quantitative metric for color consistency; a smaller step number indicates better color consistency. | Ensure no color variation among luminaires from the same batch. |
| Mdomo mkuu (Dominant Wavelength) | nm (nanomita), k.m. 620nm (nyekundu) | Wavelength values corresponding to the colors of colored LEDs. | Determines the hue of monochromatic LEDs such as red, yellow, and green. |
| Spectral Distribution | Mkunjo wa Urefu wa Mawimbi dhidi ya Ukubwa | Inaonyesha usambazaji wa ukubwa wa mwanga unaotolewa na LED katika urefu wa mawimbi tofauti. | Inapotosha uhalisi wa rangi na ubora wa rangi. |
II. Vigezo vya Umeme
| Terminology | Ishara | Layman's Explanation | Mazingatio ya Ubunifu |
|---|---|---|---|
| Forward Voltage (Forward Voltage) | Vf | The minimum voltage required to light up an LED, similar to a "starting threshold". | The driving power supply voltage must be ≥ Vf; the voltages add up when multiple LEDs are connected in series. |
| Mwendo wa Mbele (Forward Current) | If | The current value required for the LED to emit light normally. | Constant current drive is commonly used, as the current determines brightness and lifespan. |
| Maximum Pulse Current | Ifp | Kilele cha mkondo kinachoweza kustahimili kwa muda mfupi, kinachotumika kwa kudimisha au kumulika. | Upanaaji wa upana wa msukumo na uwiano wa kazi lazima udhibitiwe kwa uangalifu, vinginevyo kunaweza kuharibika kwa joto kupita kiasi. |
| Reverse Voltage | Vr | Upeo wa voltage ya nyuma ambayo LED inaweza kustahimili, ikiwa unazidi hii inaweza kuvunjika. | Katika mzunguko, ni muhimu kuzuia kuzungushwa kwa njia isiyo sahihi au mshtuko wa voltage. |
| Upinzani wa Joto (Thermal Resistance) | Rth (°C/W) | Upinzani wa joto unaposogea kutoka kwenye chip hadi kwenye sehemu ya kuunganishia, thamani ya chini inaonyesha usambazaji bora wa joto. | Upinzani wa juu wa joto unahitaji muundo wenye nguvu zaidi wa kupoza joto, vinginevyo joto la kiungo litaongezeka. |
| ESD Immunity | V (HBM), kama 1000V | Uwezo wa kupiga umeme tuli, thamani ya juu inamaanisha uwezo mkubwa wa kuzuia uharibifu wa umeme tuli. | Hatua za kinga dhidi ya umeme tuli zinahitajika katika uzalishaji, hasa kwa LED zenye usikivu mkubwa. |
III. Thermal Management and Reliability
| Terminology | Key Indicators | Layman's Explanation | Athari |
|---|---|---|---|
| Joto la Kiungo (Junction Temperature) | Tj (°C) | The actual operating temperature inside the LED chip. | For every 10°C reduction, the lifespan may double; excessively high temperatures cause lumen depreciation and color shift. |
| Lumen Depreciation | L70 / L80 (hours) | The time required for the brightness to drop to 70% or 80% of its initial value. | Ufafanuzi wa moja kwa moja wa "maisha ya huduma" ya LED. |
| Lumen Maintenance | % (e.g., 70%) | The percentage of remaining brightness after a period of use. | Characterizes the ability to maintain brightness after long-term use. |
| Mabadiliko ya rangi (Color Shift) | Δu′v′ au MacAdam ellipse | Kiwango cha mabadiliko ya rangi wakati wa matumizi. | Inaathiri uthabiti wa rangi katika eneo la taa. |
| Thermal Aging | Kupungua kwa utendaji wa nyenzo | Uharibifu wa nyenzo za ufungaji unaosababishwa na joto la juu kwa muda mrefu. | Inaweza kusababisha kupungua kwa mwangaza, mabadiliko ya rangi au kushindwa kwa mzunguko wazi. |
Nne. Ufungaji na Nyenzo
| Terminology | Aina za Kawaida | Layman's Explanation | Sifa na Matumizi |
|---|---|---|---|
| Aina za Ufungaji | EMC, PPA, Ceramic | A housing material that protects the chip and provides optical and thermal interfaces. | EMC offers good heat resistance and low cost; ceramic provides superior heat dissipation and long lifespan. |
| Muundo wa Chip | Usanidi wa Kawaida, Usanidi wa Kugeuzwa (Flip Chip) | Chip electrode arrangement method. | Flip-chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications. |
| Phosphor coating. | YAG, silicate, nitride | Coated on the blue LED chip, partially converted to yellow/red light, mixed to form white light. | Different phosphors affect luminous efficacy, color temperature, and color rendering. |
| Lens/Optical Design | Flat, microlens, total internal reflection | The optical structure on the packaging surface controls the light distribution. | Determines the emission angle and light distribution curve. |
V. Udhibiti wa Ubora na Uainishaji
| Terminology | Yaliyomo katika Uainishaji | Layman's Explanation | Kusudi |
|---|---|---|---|
| Mgawanyiko wa Flux ya Mwanga | Msimbo kama 2G, 2H | Group by brightness level, each group has a minimum/maximum lumen value. | Ensure consistent brightness for products in the same batch. |
| Voltage binning | Codes such as 6W, 6X | Grouped by forward voltage range. | Inafaa kwa kuendana na chanzo cha umeme, kuboresha ufanisi wa mfumo. |
| Kugawanya kwa makundi kulingana na rangi | 5-step MacAdam ellipse | Group by color coordinates to ensure colors fall within an extremely small range. | Ensure color consistency to avoid color unevenness within the same luminaire. |
| Color temperature grading | 2700K, 3000K, etc. | Group by color temperature, each group has a corresponding coordinate range. | Kukidhi mahitaji ya joto la rangi katika hali tofauti. |
Sita, Upimaji na Uthibitishaji
| Terminology | Standard/Test | Layman's Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen Maintenance Test | Long-term operation under constant temperature conditions, recording luminance attenuation data. | For estimating LED lifetime (in conjunction with TM-21). |
| TM-21 | Lifetime projection standard | Projecting lifespan under actual use conditions based on LM-80 data. | Providing scientific life prediction. |
| IESNA Standard | Illuminating Engineering Society Standard | Covers optical, electrical, and thermal testing methods. | Msingi wa upimaji unaokubaliwa na tasnia. |
| RoHS / REACH | Uthibitisho wa Mazingira | Hakikisha bidhaa hazina vitu hatari (kama risasi, zebaki). | Masharti ya kuingia kwenye soko la kimataifa. |
| ENERGY STAR / DLC | Uthibitisho wa ufanisi wa nishati | Uthibitishaji wa ufanisi wa nishati na utendaji wa bidhaa za taa. | Inatumika kwa kawaida katika ununuzi wa serikali na miradi ya ruzuku, kuimarisha ushindani wa soko. |