Table of Contents
- 1. Product Overview
- 1.1 Features
- 1.2 Matumizi yaliyokusudiwa
- 2. Vigezo vya kiufundi: Uchambuzi wa kina
- 2.1 Absolute Maximum Ratings
- 2.2 Electrical and Optical Characteristics
- 3. Binning System Description
- 3.1 Kugawanya kwa Voltage ya Mwelekeo Sahihi (VF)
- 3.2 Kugawanya kwa Nguvu ya Mwanga (IV)
- 3.3 Hue (Dominant Wavelength) Binning
- 4. Uchambuzi wa Mkunjo wa Utendaji
- 4.1 Mkondo wa Mwelekeo wa Moja kwa Moja dhidi ya Voltage ya Mwelekeo wa Moja kwa Moja (Mkunjo wa I-V)
- 4.2 Luminous Intensity vs. Forward Current
- 4.3 Spectral Distribution
- 4.4 Temperature Dependence
- 5. Mechanical and Packaging Information
- 5.1 Package Dimensions
- 5.2 Recommended PCB Land Pattern
- 5.3 Polarity Identification
- 6. Welding and Assembly Guide
- 6.1 Infrared Reflow Soldering Profile (Lead-Free)
- 6.2 Manual Soldering
- 6.3 Storage and Handling
- 6.4 Cleaning
- 7. Ufungaji na Taarifa za Kuagiza
- 7.1 Carrier Tape Reel Specifications
- 8. Application Design Considerations
- 8.1 Current Limiting
- For lower-rated devices, the current will not exceed the required level.
- Ingawa matumizi ya nguvu ni ya chini (kiwango cha juu cha 75 mW), joto bado linaweza kuathiri utendaji na maisha ya kifaa. Hakikisha PCB ina eneo la shaba linalotosha kuunganishwa na pedi ya kupoeza ya LED (ikiwepo) au ndege ya ardhini iliyo karibu kutumika kama kipoezi. Epuka kuweka LED karibu na vifaa vingine vinavyotoa joto.
- Pembea ya digrii 130 inatoa mwangaza mpana sana wa kutawanyika. Kwa matumizi yanayohitaji boriti iliyolenga zaidi, vifaa vya pili vya optiki vinahitajika (k.m. lenzi, mfereji wa mwanga). Lensi ya Water Clear ni bora zaidi kudumia usafi wa rangi na pato la juu la mwanga.
- Inaendana kabisa na usanikishaji wa SMT uliojaa na wa kiotomatiki na upakiaji upya wa infrared usio na risasi, na hupunguza utata na gharama za utengenezaji.
- 10. Maswali Yanayoulizwa Mara kwa Mara (Kulingana na Vigezo vya Kiufundi)
- Inahusiana zaidi na kuendana kwa rangi.
- Ndio, 30mA ni kiwango cha juu cha mwendelezo wa mkondo wa moja kwa moja. Hata hivyo, ili kupata maisha bora na kuzingatia kupanda kwa joto linalowezekana katika matumizi, ni desturi na njia salama ya kuendesha chini ya hali ya majaribio ya 20mA au chini.
- Kuweka viwango vikali ni muhimu.
- MSL 3 inamaanisha mfuko utachukua kiwango cha hatari cha unyevu kutoka kwa hewa ya mazingira. Mara tu mfuko wa muhuri ufunguliwe, chini ya hali ya ≤ 30°C/60% RH, una masaa 168 (wiki 1) kukamilisha mchakato wa reflow ya solder. Ikiwa muda huu unazidi, vipengee lazima vipikwe kabla ya kuuzalisha ili kuondoa unyevu, kuzuia athari ya "popcorn" au ufa wa mfuko wakati wa reflow.
- LED huhifadhiwa ndani ya mfuko wake uliofungwa hadi mstari wa uzalishaji uwe tayari. Usanikishaji wa PCB hutumia mkunjo wa reflow unaodhibitiwa na kufuata viwango vya JEDEC ili kuhakikisha uaminifu wa mshono wa solder bila kuharibu LED.
- LED hii inategemea teknolojia ya semiconductor ya alumini-indiamu-galiamu-fosforasi (AlInGaP). Wakati voltage chanya inapowekwa kwenye kiunganishi p-n, elektroni na mashimo hujumuika katika eneo lenye shughuli na kutolea nishati kwa namna ya fotoni (mwanga). Muundo maalum wa AlInGaP alloy huamua nishati ya pengo la bendi, ambayo inalingana moja kwa moja na urefu wa wimbi la mwanga unaotolewa (rangi) — katika mfano huu, manjano (takriban 588 nm). AlInGaP inajulikana kwa ufanisi wake wa juu wa ndani wa quantum, na ikilinganishwa na mifumo ya zamani ya nyenzo kama GaAsP, inaleta mwangaza zaidi na utulivu wa rangi. Chip kisha hufungwa ndani ya mfuko wa epoxy, ambao huunda pato la mwanga na kutoa ulinzi wa mitambo na wa mazingira.
1. Product Overview
Waraka huu unaelezea kwa kina vipimo vya kiufundi vya taa ndogo ya LED ya kusakinishwa kwenye uso, kifaa kilichobuniwa kwa ajili ya usanikishaji wa bodi za saketi za kuchapishwa kwa kiotomatiki na matumizi yenye nafasi mdogo. Kifaa hutumia chip ya semiconductor ya AlInGaP yenye mwangaza mkubwa kutoa mwanga wa manjano, na imefungwa ndani ya lenzi wazi kama maji. Lengo kuu la kubuni ni kufikia ufanisi wa juu wa utoaji mwanga, ulinganifu na michakato ya kisasa ya utengenezaji, na kudumisha uaminifu katika mazingira mapana ya uendeshaji.
1.1 Features
- Inakubaliana na amri ya mazingira ya RoHS.
- Profili ya chini sana, urefu wa milimita 0.80 tu.
- Inatumia teknolojia ya chip ya AlInGaP, kufikia mwangaza wa juu.
- Imeviringishwa kwenye mkanda wa kubeba wa 8mm kwenye reeli ya kipenyo cha inchi 7, inafaa kwa usakinishaji wa otomatiki.
- Umbo la kifurushi la EIA lililosanifishwa, linahakikisha utangamano wa muundo.
- Mahitaji ya kiendeshaji yanayolingana na kiwango cha mantiki.
- Iliyoundaliwa kwa usawa na vifaa vya kusanikishaji kiotomatiki.
- Inafaa kwa mchakato wa kuunganishia kwa joto wa IR (Infrared) reflow.
1.2 Matumizi yaliyokusudiwa
This LED is suitable for various electronic devices with extensive requirements for compact size, high brightness, and reliable performance. The main application areas include:
- Communication equipment (e.g., mobile phones, cordless phones).
- Vifaa vya otomatiki ya ofisi (mfano: kompyuta ya mkononi, mifumo ya mtandao).
- Vifaa vya nyumbani na bidhaa za kielektroniki za matumizi ya kawaida.
- Udhibiti wa viwanda na paneli za vyombo vya kupimia.
- Mwangaza wa nyuma wa kibodi na vitufe.
- Vionyeshi vya hali na vya nguvu.
- Uwashi na maonyesho na taa za alama.
- Taa za uwashi wa ishara na alama.
2. Vigezo vya kiufundi: Uchambuzi wa kina
Sehemu ifuatayo inatoa maelezo ya kina na ya uwazi kuhusu sifa muhimu za umeme, za macho na za joto za kifaa. Isipokuwa imebainishwa vinginevyo, data zote zimeainishwa kwa joto la mazingira (Ta) la 25°C.
2.1 Absolute Maximum Ratings
These ratings define the stress limits that may cause permanent damage to the device. To ensure long-term reliability, operation at or near these limits is not recommended.
- Power Dissipation (Pd):75 mW. This is the maximum power the package can dissipate as heat.
- Peak forward current (IFP):80 mA. Permitted only under pulse conditions (1/10 duty cycle, 0.1ms pulse width) to prevent overheating.
- Continuous Forward Current (IF):30 mA DC. This is the recommended maximum current for continuous operation.
- Reverse Voltage (VR):5 V. Exceeding this voltage under reverse bias may cause junction breakdown.
- Operating Temperature Range:-30°C to +85°C. The device is guaranteed to operate normally within this ambient temperature range.
- Storage Temperature Range:-40°C to +85°C.
- Infrared Welding Conditions:Capable of withstanding a peak temperature of 260°C for 10 seconds, compliant with Pb-free solder reflow process standards.
2.2 Electrical and Optical Characteristics
Hizi ni vigezo vya kawaida vya utendaji chini ya hali ya kawaida ya majaribio.
- Nguvu ya mwanga (IV):Katika IF= 20mA, ni 45.0 hadi 180.0 millicandela (mcd). Imepimwa kwa kutumia sensor iliyosanifishwa na kichujio kinacholingana na mkunjo wa kukisia wa kuona wa wazi wa kiwango cha CIE. Masafa mapana yanasimamiwa kupitia mfumo wa kugawanya daraja.
- Angle (2θ1/2):130 degrees. This is the full angle at which the luminous intensity drops to half of its axial (0°) value, indicating a very wide emission pattern suitable for area lighting.
- Peak emission wavelength (λP):588.0 nm (nominal value). This is the wavelength with the highest spectral power output.
- Dominant wavelength (λd):Katika IF= 20mA, it is 584.5 to 597.0 nm. This is the single wavelength perceived by the human eye as the color (yellow), derived from CIE chromaticity coordinates.
- Spectral line half-width (Δλ):Takriban 15 nm. Hii inaonyesha usafi wa wigo; upana mdogo zaidi, rangi inakuwa iliyojaa na safi zaidi.
- Voltage ya mbele (VF):Katika IF= 20mA, ni 1.8 hadi 4 volts. Kushuka kwa voltage wakati LED inapita mkondo.
- Mkondo wa nyuma (IR):Katika VRWakati voltage ya reverse bias ni = 5V, mkondo wa juu ni 10 μA. Mkondo mdogo wa uvujaji wakati kifaa kiko kwenye bias ya nyuma.
3. Binning System Description
Ili kuhakikisha uthabiti wa utendaji katika uzalishaji, LED zinagawanywa katika vikundi tofauti kulingana na vigezo muhimu. Hii inawawezesha wabunifu kuchagua vipengele vinavyokidhi mahitaji maalum ya mwangaza, rangi na voltage.
3.1 Forward Voltage (VF) Grading
For yellow, test at 20mA.
- Grade F2: VF= 1.80V to 2.10V.
- Gear F3: VF= 2.10V to 2.40V.
- Toleleo kwa kila kiwango: ±0.1 volts.
3.2 Mwangaza wa mwanga (IV) Grading
For yellow, test at 20mA.
- Kiwango P:45.0 to 71.0 mcd.
- Gear Q:71.0 to 112.0 mcd.
- Gear R:112.0 to 180.0 mcd.
- Tolerance per gear: ±15%.
3.3 Hue (Dominant Wavelength) Binning
For yellow, test at 20mA.
- Grade H: λd= 584.5 to 587.0 nm.
- Grade J: λd= 587.0 to 589.5 nm.
- Gear K: λd= 589.5 to 592.0 nm.
- Gear L: λd= 592.0 to 594.5 nm.
- Gear M: λd= 594.5 to 597.0 nm.
- Tolerance per step: ±1 nm.
4. Uchambuzi wa Mkunjo wa Utendaji
Ingawa maelezo ya uundaji yanarejelea safu maalum za picha, maana yake ni muhimu sana kwa muundo.
4.1 Mkondo wa Mwelekeo wa Moja kwa Moja dhidi ya Voltage ya Mwelekeo wa Moja kwa Moja (Mkunjo wa I-V)
Tabia ya I-V ina uhusiano wa kielelezo. Wakati wa kubuni mzunguko wa kikomo cha mkondo, lazima izingatiwe V ya kawaida kwenye 20mA.FMbalimbali (1.8-2.4V). Ili kufikia mwanga thabiti, hasa wakati joto linabadilika, inashauriwa kikamilifu kutumia chanzo cha mkondo thabiti badala ya upinzani mfululizo rahisi.
4.2 Luminous Intensity vs. Forward Current
Ndani ya mipaka iliyoidhinishwa, pato la mwanga kawaida huwa sawia na mkondo wa mbele. Hata hivyo, kwenye mikondo ya juu sana, ufanisi unaweza kupungua kwa sababu ya ongezeko la joto. Inashauriwa kufanya kazi chini ya au sawa na hali ya kawaida ya majaribio ya 20mA, ili kupata ufanisi bora na maisha marefu.
4.3 Spectral Distribution
The spectral output curve is centered at 588 nm (yellow) with a typical FWHM of 15 nm. This relatively narrow bandwidth ensures good color saturation. The dominant wavelength (λd) is the parameter used for color binning, as it is directly related to the human eye's color perception.
4.4 Temperature Dependence
Utendaji wa LED unategemea joto. Kwa kawaida, voltage ya mbele (VF) ina mgawo hasi wa joto (hupungua kadri joto linavyoongezeka), wakati ukali wa mwanga hupungua kadri joto la kiungo kinavyoongezeka. Usimamizi sahihi wa joto kwenye PCB ni muhimu ili kudumisha mwangaza na rangi thabiti katika maisha yote ya uendeshaji.
5. Mechanical and Packaging Information
5.1 Package Dimensions
This device adopts the industry-standard chip LED package outline. Key dimensions include a body height of 0.80 mm (maximum), making it suitable for ultra-thin applications. Unless otherwise specified, all dimensional tolerances are ±0.1 mm. The package material is designed to withstand the thermal stress of infrared reflow soldering.
5.2 Recommended PCB Land Pattern
It provides a recommended pad layout to ensure reliable soldering and correct alignment. This design helps form good solder fillets while preventing solder bridging between the anode and cathode terminals. Following this recommendation is crucial for achieving high yield in automated assembly.
5.3 Polarity Identification
The cathode terminal is usually marked, for example, by a notch, a green indicator, or different pad sizes/shapes on the carrier tape reel packaging. Correct polarity orientation during placement is essential for the proper operation of the device.
6. Welding and Assembly Guide
6.1 Infrared Reflow Soldering Profile (Lead-Free)
This device complies with lead-free soldering process requirements. A recommended reflow profile conforming to JEDEC standards is provided.
- Preheat:150°C hadi 200°C.
- Muda wa kuwasha moto:Kwa upeo wa sekunde 120.
- Kiwango cha juu cha joto:Maximum 260°C.
- Time Above Liquidus (at Peak):Maximum 10 seconds. Under this condition, the device can withstand a maximum of two reflow cycles.
Kumbuka:Mkunjo bora unategemea muundo maalum wa PCB, ufinye wa kuuzia na tanuru. Mkunjo uliotolewa unatumika kama lengo la jumla, na usindikaji wa sifa unapendekezwa.
6.2 Manual Soldering
Ikiwa unahitaji kuchomea kwa mikono, lazima uwe mwangalifu sana.
- Joto la chuma cha kuchomea:Hadi 300°C.
- Muda wa kulehemu:Pini moja kwa moja isizidi sekunde tatu.
- Ulehemu wa mikono unapaswa kudumishwa kwa matengenezo ya mara moja tu, na haufai kwa uzalishaji wa wingi.
6.3 Storage and Handling
- ESD Precautions:LEDs are sensitive to Electrostatic Discharge (ESD). Use wrist straps, grounded workstations, and antistatic packaging.
- Moisture Sensitivity Level (MSL):This device is classified as MSL 3. Once the original moisture barrier bag is opened, infrared reflow soldering must be completed within one week (168 hours) under factory floor conditions (≤ 30°C/60% RH).
- Extended Storage (Opened Bag):Ikiwa inahitajika kuhifadhi zaidi ya wiki moja, vipengele lazima vihifadhiwe kwenye chombo kilichofungwa kikamilifu chenye kivukizi au katika mazingira ya nitrojeni. Ikiwa muda wa kuhifadhi unazidi maisha ya karakana, inahitajika kukausha kwa angalau saa 20 kwenye joto la 60°C kabla ya kuchomelea.
6.4 Cleaning
Ikiwa usafishaji baada ya kuchomelea unahitajika, tumia tu kutengenezea kilichoidhinishwa. Kutumia ethanoli au isopropanoli kwenye joto la kawaida la chumba kunapendekezwa. Muda wa kuzamishwa unapaswa kuwa chini ya dakika moja. Epuka kutumia vimumunyisho vya kemikali visivyojulikana ambavyo vinaweza kuharibu lenzi ya epoksi au ufungaji.
7. Ufungaji na Taarifa za Kuagiza
7.1 Carrier Tape Reel Specifications
Components are supplied in embossed carrier tape, suitable for automated assembly.
- Carrier tape width:8 mm.
- Reel diameter:Inchi 7 (178 mm).
- Idadi kwa kila reel:Vipande 4000 (reel kamili ya kawaida).
- Minimum Package Quantity:The remaining reel is 500 pieces.
- Cover Tape:Nafasi tupu imefungwa kwa mkanda wa kifuniko cha juu.
- Kifaa kimekosekana:Kulingana na vipimo, kuruhusiwa kukosa mfululizo wa taa mbili pekee.
- Kigezo:Ufungaji unakidhi viwango vya ANSI/EIA-481.
8. Application Design Considerations
8.1 Current Limiting
A current-limiting resistor must be used, or preferably, a constant current driver in series with the LED. The resistor value can be calculated using Ohm's Law: R = (VPower Supply- VF) / IF. Tumia V ya juu zaidi kwenye maelezo ya kiufundiFthamani (2.4V), ili kuhakikisha kuwa hata V yaF part.
For lower-rated devices, the current will not exceed the required level.
8.2 Thermal Management
Ingawa matumizi ya nguvu ni ya chini (kiwango cha juu cha 75 mW), joto bado linaweza kuathiri utendaji na maisha ya kifaa. Hakikisha PCB ina eneo la shaba linalotosha kuunganishwa na pedi ya kupoeza ya LED (ikiwepo) au ndege ya ardhini iliyo karibu kutumika kama kipoezi. Epuka kuweka LED karibu na vifaa vingine vinavyotoa joto.
8.3 Optical Design
Pembea ya digrii 130 inatoa mwangaza mpana sana wa kutawanyika. Kwa matumizi yanayohitaji boriti iliyolenga zaidi, vifaa vya pili vya optiki vinahitajika (k.m. lenzi, mfereji wa mwanga). Lensi ya Water Clear ni bora zaidi kudumia usafi wa rangi na pato la juu la mwanga.
9. Technical Comparison and Differentiation
- Kifaa hiki kina faida muhimu kadhaa katika kategoria yake:Unene:
- Urefu wa 0.80mm umefanya iwe mojawapo ya LED za chip nyembamba zaidi, zinazofaa kwa muundo wa vifaa vya kisasa vyembamba.Mwangaza:
- Kwa kutumia teknolojia ya AlInGaP, ikilinganishwa na LED za kawaida za GaAsP au GaP, inatoa ufanisi bora wa kutolea mwanga, na hivyo kufikisha pato la mcd kubwa zaidi chini ya mkondo sawa wa umeme.Rangi:
- Ikilinganisha na teknolojia ya zamani, AlInGaP inazalisha rangi ya manjano iliyojazwa zaidi na thabiti zaidi, na inafanya kazi bora zaidi chini ya mabadiliko ya joto.Ustahiki wa Mchakato:
Inaendana kabisa na usanikishaji wa SMT uliojaa na wa kiotomatiki na upakiaji upya wa infrared usio na risasi, na hupunguza utata na gharama za utengenezaji.
10. Maswali Yanayoulizwa Mara kwa Mara (Kulingana na Vigezo vya Kiufundi)
10.1 Je, kuna tofauti gani kati ya urefu wa wimbi la kilele na urefu wa wimbi kuu?PUrefu wa wimbi la kilele (λd) ni urefu wa wimbi la kimwili ambapo LED hutoa nguvu kubwa zaidi ya mwanga. Urefu wa wimbi kuu (λd) is a value calculated based on the CIE chromaticity diagram, representing the single color wavelength perceived by the human eye. For design, λ
Inahusiana zaidi na kuendana kwa rangi.
10.2 Can I drive this LED continuously at 30mA?
Ndio, 30mA ni kiwango cha juu cha mwendelezo wa mkondo wa moja kwa moja. Hata hivyo, ili kupata maisha bora na kuzingatia kupanda kwa joto linalowezekana katika matumizi, ni desturi na njia salama ya kuendesha chini ya hali ya majaribio ya 20mA au chini.
10.3 Kwa nini grading ni muhimu?FGrading inahakikisha uthabiti wa rangi na mwangaza ndani ya kundi la uzalishaji na kati ya makundi mbalimbali. Kwa matumizi ambayo usawa wa muonekano ni muhimu (mfano, taa za nyuma za safu za LED), kwa VV, IdNa λ
Kuweka viwango vikali ni muhimu.
10.4 Je, unaelejeaje kiwango cha MSL 3?
MSL 3 inamaanisha mfuko utachukua kiwango cha hatari cha unyevu kutoka kwa hewa ya mazingira. Mara tu mfuko wa muhuri ufunguliwe, chini ya hali ya ≤ 30°C/60% RH, una masaa 168 (wiki 1) kukamilisha mchakato wa reflow ya solder. Ikiwa muda huu unazidi, vipengee lazima vipikwe kabla ya kuuzalisha ili kuondoa unyevu, kuzuia athari ya "popcorn" au ufa wa mfuko wakati wa reflow.
11. Mfano wa Kesi ya Utumiaji wa Ubunifu
Scenario: Status indicator light on portable medical equipment
- The designer requires a low-power, high-reliability yellow status LED for a battery-powered handheld monitor. Space is extremely limited, and the device must meet medical reliability standards.Component Selection:
- LTST-C190KSKT ilichaguliwa kwa sababu ya urefu wake wa 0.80mm, kufuata kanuni za RoHS, na uaminifu wake uliothibitishwa.Ubunifu wa Saketi:LED inaendeshwa kupitia kipingamizi cha mfululizo cha 100Ω kutoka kwa pini ya GPIO ya microcontroller (kwa kudhani chanzo cha umeme ni 3.3V: (3.3V - 2.1VTypical value
- ) / 0.020A ≈ 60Ω, using 100Ω to leave margin). The current is limited to approximately 12-15mA, well below the maximum of 30mA, to conserve battery life and ensure ultra-long service life.PCB layout:
- Use the recommended pad pattern. A small thermal connection to the ground plane was added to aid heat dissipation without making soldering difficult.Ununuzi:
- Mbuni anabainisha kiwango cha nguvu ya mwanga Q au R ili kuhakikisha taa ya kiashiria inaonekana wazi, na anabainisha kiwango cha urefu wa wimbi kuu J au K ili kupata tone la rangi ya manjano ya kawaida thabiti katika vitengo vyote vya uzalishaji.Usanikishaji:
LED huhifadhiwa ndani ya mfuko wake uliofungwa hadi mstari wa uzalishaji uwe tayari. Usanikishaji wa PCB hutumia mkunjo wa reflow unaodhibitiwa na kufuata viwango vya JEDEC ili kuhakikisha uaminifu wa mshono wa solder bila kuharibu LED.
12. Introduction to Technical Principles
LED hii inategemea teknolojia ya semiconductor ya alumini-indiamu-galiamu-fosforasi (AlInGaP). Wakati voltage chanya inapowekwa kwenye kiunganishi p-n, elektroni na mashimo hujumuika katika eneo lenye shughuli na kutolea nishati kwa namna ya fotoni (mwanga). Muundo maalum wa AlInGaP alloy huamua nishati ya pengo la bendi, ambayo inalingana moja kwa moja na urefu wa wimbi la mwanga unaotolewa (rangi) — katika mfano huu, manjano (takriban 588 nm). AlInGaP inajulikana kwa ufanisi wake wa juu wa ndani wa quantum, na ikilinganishwa na mifumo ya zamani ya nyenzo kama GaAsP, inaleta mwangaza zaidi na utulivu wa rangi. Chip kisha hufungwa ndani ya mfuko wa epoxy, ambao huunda pato la mwanga na kutoa ulinzi wa mitambo na wa mazingira.
13. Mienendo ya Sekta
- Soko la LED zinazowekwa kwenye uso linaendelea kukua, likionyesha mienendo kadhaa wazi:Miniaturization:
- The pursuit of slimmer designs in consumer electronics drives the demand for thinner and smaller packages, such as this chip with a height of 0.80mm.Efficiency Improvement:
- Ongoing advancements in materials science aim to increase lumens per watt (luminous efficacy), reducing power consumption for the same light output.Uaminifu na uthabiti wa juu zaidi:
- Maendeleo katika nyenzo za ufungaji na muundo wa chip yanalenga kudumisha nukta ya rangi na mtiririko wa mwanga chini ya maisha marefu na hali ngumu ya mazingira.Kupanua anuwai ya rangi:
- Ingawa sehemu hii inatoa mwanga wa manjano wa rangi moja, tasnia pia inaendeleza suluhisho za ubadilishaji wa fosforesheni na chip nyingi, ili kufikia nukta nyeupe sahihi na rangi kamili zinazotumika kwa taa za nyuma za maonyesho na taa za jumla.Ujumuishaji:
Maelezo ya Istilahi za Vigezo vya LED
Kamusi Kamili ya Istilahi za Teknolojia ya LED
I. Viashiria Muhimu vya Utendaji wa Kielektroniki na Mwanga
| Istilahi | Unit/Penunjukan | Penjelasan Populer | Kwa nini ni muhimu |
|---|---|---|---|
| Ufanisi wa Mwanga (Luminous Efficacy) | lm/W (lumens per watt) | The luminous flux emitted per watt of electrical power; the higher the value, the more energy-efficient. | Directly determines the energy efficiency rating and electricity cost of the luminaire. |
| Fluxi ya Mwanga (Luminous Flux) | lm (lumen) | Jumla ya kiasi cha mwanga kinachotolewa na chanzo cha mwanga, kinachojulikana kwa kawaida kama "mwangaza". | Huamua kama taa inatosha kuwa na mwangaza. |
| Pembe ya kuona (Viewing Angle) | ° (degree), such as 120° | The angle at which light intensity drops to half, determining the beam width. | Affects the illumination range and uniformity. |
| Joto la rangi (CCT) | K (Kelvin), k.m. 2700K/6500K | Joto la rangi ya mwanga, thamani ya chini huelekea manjano/joto, thamani ya juu huelekea nyeupe/baridi. | Huamua mazingira ya taa na matumizi yanayofaa. |
| Kielelezo cha Uonyeshaji Rangi (CRI / Ra) | Unitless, 0–100 | The ability of a light source to reproduce the true colors of objects, with Ra≥80 being preferable. | Inaathiri usahihi wa rangi, hutumika katika maeneo yenye mahitaji makubwa kama vile maduka makubwa, majumba ya sanaa. |
| Tofauti ya uvumilivu wa rangi (SDCM) | Hatua za duaradufu ya MacAdam, kama vile "5-step" | A quantitative indicator of color consistency; the smaller the step number, the better the color consistency. | Ensure no color difference among luminaires from the same batch. |
| Wavelengthu Kuu (Dominant Wavelength) | nm (nanomita), k.m. 620nm (nyekundu) | Thamani ya wavelength inayolingana na rangi ya LED ya rangi. | Determines the hue of monochromatic LEDs such as red, yellow, and green. |
| Spectral Distribution | Wavelength vs. Intensity Curve | It shows the intensity distribution of light emitted by an LED across various wavelengths. | It affects color rendering and color quality. |
Vigezo vya Umeme
| Istilahi | Ishara | Penjelasan Populer | Vidokezo vya Ubunifu |
|---|---|---|---|
| Voltage ya Mbele (Forward Voltage) | Vf | Voltage ya chini inayohitajika kuwasha LED, kama "kizingiti cha kuanzisha". | Voltage ya chanzo cha umeme inahitaji kuwa ≥ Vf, voltage inajumlishwa wakati LED nyingi zimeunganishwa mfululizo. |
| Forward Current | If | The current value that enables the LED to emit light normally. | Inatumika kwa kawaida kuendesha mkondo wa kudumu, mkondo huamua mwangaza na maisha ya huduma. |
| Mkondo wa juu wa msukumo (Pulse Current) | Ifp | Peak current that can be withstood for a short period, used for dimming or flashing. | Pulse width and duty cycle must be strictly controlled, otherwise overheating damage will occur. |
| Reverse Voltage | Vr | Upeo wa juu wa voltage ya nyuma ambayo LED inaweza kustahimili, ukizidi huo unaweza kusababisha kuvunjika. | Mzunguko unahitaji kuzuia uunganishaji wa kinyume au mshtuko wa voltage. |
| Thermal Resistance | Rth (°C/W) | Upinzani wa joto kutoka kwenye chip hadi kwenye sehemu ya kuuza, thamani ya chini inaonyesha usambazaji bora wa joto. | Upeo wa juu wa upinzani wa joto unahitaji muundo wa upoaji joto wenye nguvu zaidi, vinginevyo joto la kiungo litaongezeka. |
| Uvumilivu wa Utoaji Umeme wa Tuli (ESD Immunity) | V (HBM), kama vile 1000V | Uwezo wa kupiga umeme tuli, thamani ya juu zaidi inamaanisha uwezo mdogo wa kuharibiwa na umeme tuli. | Hatua za kinga dhidi ya umeme tuli zinahitajika katika uzalishaji, hasa kwa LED zenye usikivu mkubwa. |
III. Usimamizi wa Joto na Uaminifu
| Istilahi | Viashiria Muhimu | Penjelasan Populer | Athari |
|---|---|---|---|
| Joto la Kiungo (Junction Temperature) | Tj (°C) | The actual operating temperature inside the LED chip. | For every 10°C reduction, the lifespan may double; excessively high temperatures lead to lumen depreciation and color shift. |
| Lumen Depreciation | L70 / L80 (saa) | Muda unaohitajika kwa mwangaza kushuka hadi 70% au 80% ya thamani ya awali. | Kufafanua moja kwa moja "maisha ya huduma" ya LED. |
| Kiwango cha Kudumisha Lumini (Lumen Maintenance) | % (kama 70%) | Asilimia ya mwangaza uliobaki baada ya kutumia kwa muda fulani. | Inaonyesha uwezo wa kudumisha mwangaza baada ya matumizi ya muda mrefu. |
| Color Shift | Δu′v′ or MacAdam Ellipse | The degree of color change during use. | Inaathiri uthabiti wa rangi katika eneo la taa. |
| Thermal Aging | Kupungua kwa sifa za nyenzo. | Uharibifu wa nyenzo za ufungaji unaosababishwa na joto la juu kwa muda mrefu. | Inaweza kusababisha kupungua kwa mwangaza, mabadiliko ya rangi, au kushindwa kwa mzunguko wazi. |
Nne. Ufungaji na Nyenzo
| Istilahi | Aina za Kawaida | Penjelasan Populer | Sifa na Matumizi |
|---|---|---|---|
| Aina ya Ufungashaji | EMC, PPA, Ceramic | A housing material that protects the chip and provides optical and thermal interfaces. | EMC offers good heat resistance and low cost; ceramics provide superior heat dissipation and long lifespan. |
| Chip Architecture | Face-up, Flip Chip | Chip Electrode Layout. | Flip-chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications. |
| Phosphor coating | YAG, silicates, nitrides | Coated on the blue LED chip, partially converted to yellow/red light, mixed to form white light. | Different phosphors affect luminous efficacy, color temperature, and color rendering. |
| Lens/Usanifu wa Optics | Uso wa gorofa, microlens, kutafakari kwa jumla | Optical structure of the encapsulation surface, controlling light distribution. | Determines the emission angle and light distribution curve. |
V. Quality Control and Binning
| Istilahi | Yaliyomo ya Uainishaji | Penjelasan Populer | Kusudi |
|---|---|---|---|
| Luminous flux binning | Codes such as 2G, 2H | Grouped by brightness level, each group has a minimum/maximum lumen value. | Ensure consistent brightness within the same batch of products. |
| Voltage binning | Codes such as 6W, 6X | Group by forward voltage range. | Facilitates driver power matching and improves system efficiency. |
| Color binning | 5-step MacAdam ellipse | Group by color coordinates to ensure colors fall within an extremely narrow range. | Ensure color consistency to avoid uneven color within the same luminaire. |
| Color temperature binning | 2700K, 3000K, n.k. | Pangilia kwa makundi kulingana na joto la rangi, kila kundi lina anuwai maalum ya kuratibu. | Inakidhi mahitaji ya joto la rangi katika mazingira tofauti. |
Sita, Uchunguzi na Uthibitishaji
| Istilahi | Kigezo/Uchunguzi | Penjelasan Populer | Significance |
|---|---|---|---|
| LM-80 | Lumen Maintenance Test | Long-term operation under constant temperature conditions, recording luminance attenuation data. | Used for estimating LED lifetime (combined with TM-21). |
| TM-21 | Lifetime projection standard | Kukadirisha maisha ya matumizi halisi kulingana na data ya LM-80. | Kutoa utabiri wa kisayansi wa maisha. |
| IESNA standard | Illuminating Engineering Society Standard | Covers optical, electrical, and thermal test methods. | Misingizo ya upimaji inayokubaliwa na tasnia. |
| RoHS / REACH | Uthibitisho wa mazingira | Hakikisha bidhaa hazina vitu hatari (kama risasi, zebaki). | Masharti ya kuingia kwenye soko la kimataifa. |
| ENERGY STAR / DLC | Energy Efficiency Certification | Energy efficiency and performance certification for lighting products. | Commonly used in government procurement and subsidy programs to enhance market competitiveness. |