SMD LED 18-225A/R6GHW-B01/3T Datasheet - Package 3.2x1.6x1.3mm - Voltage 2.0V/3.3V - High Brightness Red/Green - Technical Documentation

1. Product Overview

Msururu wa 18-225A unawakilisha suluhisho la LED la aina ya SMD (Surface Mount Device) lenye ukubwa mdogo na utendakazi wa hali ya juu. Upekee huu unashughulikia aina mbili kuu za nyenzo za chip: R6 (AlGaInP) kwa utoaji wa mwanga nyekundu wenye mng'aro mkali na GH (InGaN) kwa utoaji wa mwanga kijani wenye mng'aro mkali. Kifaa hiki kimefunikwa kwa mfuko wa rangi nyeupe wenye kutawanyika. Faida yake kuu ni kwamba, ikilinganishwa na LED za aina ya mfumo wa waya wa kawaida, inachukua eneo dogo sana kwenye bodi, na hivyo kuongeza msongamano wa vifaa kwenye PCB, kupunguza mahitaji ya nafasi ya uhifadhi, na hatimaye kuchangia katika kupunguzwa kwa ukubwa wa vifaa vya mwisho. Muundo wake mwepesi unaufanya uwe bora katika matumizi ambapo nafasi na uzito ni vikwazo muhimu.

2. In-depth Analysis of Technical Parameters

2.1 Viwango vya Juu Kabisa

Kufanya kazi kifaa zaidi ya mipaka hii kunaweza kusababisha uharibifu wa kudumu. Viwango vimebainishwa kwa joto la mazingira (Ta) la 25°C.

• Reverse voltage (V_R):5 V (applicable to both R6 and GH). Exceeding this value may cause junction breakdown.
• Forward current (I_F):25 mA (continuous DC for R6 and GH).
• Peak forward current (I_FP):R6 is 60 mA, GH is 100 mA. This value is specified at a duty cycle of 1/10 and a frequency of 1 kHz, applicable for pulse operation.
• Power Consumption (P_d):R6 is 60 mW, GH is 95 mW. This is the maximum allowable power that the package can dissipate without exceeding its thermal limits.
• Electrostatic Discharge (ESD) Human Body Model (HBM):R6 is 2000 V, GH is 150 V. The GH (InGaN) variant is more sensitive to ESD and requires stricter handling precautions.
• Operating temperature (T_opr):-40°C to +85°C. This defines the ambient temperature range for reliable operation.
• Storage temperature (T_stg):-40°C to +90°C.
• Welding temperature (T_sol):Reflow soldering: Peak temperature 260°C, maximum 10 seconds. Hand soldering: 350°C, maximum 3 seconds.

2.2 Tabia za Umeme-Mwanga

These parameters are measured at Ta=25°C, standard test current I_FMeasurements are taken at =10mA unless otherwise specified. They define the LED's light output and electrical behavior.

• Luminous Intensity (I_v):R6: 28.5 to 72.0 mcd (typ.). GH: 72.0 to 180 mcd (typ.). Under identical driving conditions, the GH chip produces a significantly higher luminous intensity.
• Viewing Angle (2θ_1/2):130 degrees (typical). This wide viewing angle is characteristic of the white diffused resin package, providing a Lambertian-like emission pattern suitable for area lighting and indicator lights.
• Peak wavelength (λ_p):R6: 632 nm (typical). GH: 518 nm (typical). This is the wavelength at which the spectral power distribution reaches its maximum.
• Dominant wavelength (λ_d):R6: 615-625 nm. GH: 520-535 nm. Hii ndio urefu wa wimbi mmoja unaotambuliwa na jicho la binadamu kwa rangi ya LED. Upungufu unaoruhusiwa ni ±1nm.
• Upana wa mionzi ya wigo (Δλ):R6: 20 nm (kawaida). GH: 35 nm (kawaida). Hii inaashiria usafi wa wigo; upana mdogo zaidi, rangi inakuwa iliyojaa zaidi.
• Voltage ya mbele (V_F):R6: 1.7-2.4 V (typical 2.0V). GH: 2.7-3.7 V (typical 3.3V). The voltage drop is a function of the semiconductor material bandgap. Tolerance is ±0.10V.
• Reverse current (I_R):R6: Maximum 10 μA at V_R=5V. GH: Maximum 50 μA at V_R=5V.

3. Maelezo ya Mfumo wa Kupanga

LED huchaguliwa (kuainishwa) kulingana na vigezo muhimu vya optiki, ili kuhakikisha uthabiti ndani ya kundi la uzalishaji na kukidhi mahitaji ya muundo.

3.1 Luminous Intensity Binning

R6 (nyekundu):

• Kiwango N: 28.5 - 45.0 mcd
• Gear P: 45.0 - 72.0 mcd

GH (Green):

• Gear Q1: 72.0 - 90.0 mcd
• Gear Q2: 90.0 - 112 mcd
• Gear R1: 112 - 140 mcd
• Gear R2: 140 - 180 mcd

The luminous intensity tolerance is ±11%.

3.2 Dominant Wavelength Binning (GH Green only)

LED za kijani kibichi zaidi hupangwa kulingana na wavelength kuu ili kudhibiti uthabiti wa rangi.

• Kundi 1: 520 - 525 nm
• Kundi 2: 525 - 530 nm
• Gear 3: 530 - 535 nm

The dominant wavelength tolerance is ±1nm.

4. Performance Curve Analysis

4.1 R6 (AlGaInP Red) Characteristics

The provided curves illustrate the key relationships:

• Forward Current vs. Forward Voltage (I-V Curve):Inaonyesha uhusiano wa kielelezo. Voltage chanya huongezeka kwa kuongezeka kwa mkondo na hupungua kidogo kwa kuongezeka kwa joto.
• Uzito wa mwanga dhidi ya mkondo chanya:Katika anuwai ya kawaida ya uendeshaji kabla ya athari ya kutosheka, pato la mwanga huongezeka kwa mstari na mkondo.
• Uzito wa mwanga dhidi ya joto la mazingira:Mwanga wa pato hupungua kadiri joto la mazingira linavyoongezeka, kutokana na ufanisi wa ndani wa quantum kupungua na mchanganyiko usio na mionzi kuongezeka. Kupunguzwa huku ni muhimu kwa usimamizi wa joto.
• Mkunjo wa Kupunguzwa wa Mkondo wa Mbele:Inabainisha mkondo wa juu unaoruhusiwa unaoendelea wa mbele kama utendakazi wa joto la mazingira. Mkondo lazima upunguzwe katika hali ya joto la juu, ili kukaa ndani ya mipaka ya matumizi ya nguvu.
• Spectral Distribution:Shows an emission peak around 632 nm, with a typical bandwidth of 20 nm.
• Radiation Pattern:Ilionyesha usambazaji wa nguvu wa anga, uthibitisho wa pembe ya upana wa digrii 130 inayokaribia muundo wa Lambertian.

4.2 GH (InGaN Green) Characteristics

Mkunjo wa GH unaonyesha uhusiano sawa, lakini kwa thamani tofauti:

• Voltage ya mbele ya juu zaidi (kawaida 3.3V, ikilinganishwa na 2.0V ya R6).
• Ukubwa wa mwanga na voltage ya mbele vina utegemezi tofauti wa joto.
• Kituo cha wigo kiko karibu na 518 nm, na upana wa ukanda ni mpana zaidi, yaani 35 nm.
• Due to their different power dissipation ratings (95 mW vs. 60 mW), they have different forward current derating curves.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The SMD package has the following key dimensions (unit: mm, tolerance ±0.1mm unless specified):

• Length: 3.2 mm
• Width: 1.6 mm
• Urefu: 1.3 mm ±0.2 mm
• Upana wa pini: 0.4 mm ±0.15 mm
• Pin length: 0.7 mm ±0.1 mm
• Pin pitch: 1.6 mm

5.2 Polarity Identification and Pad Design

The cathode is marked. A recommended pad layout is provided with dimensions: pad width 0.8mm, length 0.8mm, and pad pitch 0.4mm. This is a suggestion; pad design should be optimized based on specific PCB fabrication processes and thermal requirements. The document emphasizes that pad dimensions can be modified according to individual needs.

6. Soldering and Assembly Guide

6.1 Mchakato wa Uchomeaji

Kifaa hiki kinaendana na michakato ya infrared na ya mvuke. Mkunjo wa uchomeleaji usio na risasi umebainishwa:

• Joto la awali: 150-200°C, kwa sekunde 60-120.
• Time above liquidus (217°C): 60-150 seconds.
• Peak temperature: Maximum 260°C.
• Time within ±5°C of peak temperature: Maximum 10 seconds.
• Kasi ya kupanda kwa joto: hadi 3°C kwa sekunde.
• Kasi ya kupoa: hadi 6°C kwa sekunde.

Vidokezo Muhimu:Uchimbaji wa reflow usizidi mara mbili. Msongo usiwekwe kwenye LED wakati wa joto. PCB isiwe na kupinda baada ya uchimbaji.

6.2 Mahitaji ya Uhifadhi na Kinga ya Unyevu

Komponenti yamepakwa kwenye mfuko wa kuzuia unyevunyevu wenye kivundo kavu.

• Kabla ya kufungua:Hifadhi chini ya hali ya ≤30°C na ≤90% RH.
• Baada ya kufungua:Chini ya hali ya ≤30°C na ≤60% RH, "maisha ya kiwandani" ni mwaka 1. Vipengele visivyotumika lazima vifungwe tena kwenye mfuko unaokinga unyevunyevu.
• Kupika:Ikiwa kiashiria cha kikaushi cha unyevu kimebadilisha rangi au muda wa uhifadhi umepita kikomo, kabla ya matumizi, inapaswa kupikwa kwa 60±5°C kwa masaa 24 ili kuondoa unyevu uliovutwa na kuzuia athari ya "popcorn" wakati wa kuunganishwa tena kwa kulehemu.

7. Habari ya Ufungaji na Uagizaji

7.1 Reel and Carrier Tape Specifications

LED hutolewa kwa umbo la mkanda wa kubeba wenye upana wa mm 8 uliochapishwa, umewindwa kwenye spool yenye kipenyo cha inchi 7. Idadi ya kujaza kwa kila spool ni vipande 3000. Vipimo vya kina vya spool na mkanda wa kubeba vinatolewa kwenye hati ya maelezo.

7.2 Label Description

Lebo ya spool inajumuisha misimbo kadhaa:

• P/N: Nambari ya Bidhaa (mfano, 18-225A/R6GHW-B01/3T).
• QTY: Package Quantity.
• CAT: Luminous Intensity Grade (Binning Code, e.g., P, R1).
• HUE: Chromaticity coordinates and dominant wavelength grade (e.g., grade 2).
• REF: Forward voltage grade.
• LOT No: Traceable lot number.

8. Mapendekezo ya Utumiaji

8.1 Typical Application Scenarios

Kama ilivyoorodheshwa katika maelezo ya maelezo:

• Mwanga wa nyuma wa dashibodi ya gari na swichi.
• Vifaa vya mawasiliano: viashiria vya hali na mwanga wa nyuma wa kibodi katika simu na mashine ya faksi.
• Backlighting ya ndege kwa LCD ndogo, swichi, na alama.
• Taa za kiashiria na taa za hali za jumla katika elektroniki za watumiaji, udhibiti wa viwanda, na vifaa vya nyumbani.

8.2 Key Design Considerations

Current Limiting:An external current limiting resistor isabsolutely essential.The forward voltage of an LED has a negative temperature coefficient and tight tolerances. A small increase in the supply voltage can cause a large, potentially destructive increase in forward current. The resistor value must be selected based on the supply voltage (V_CC), and the typical forward voltage (V_F) na mkondo unaohitajika wa mwelekeo mzuri (I_F) hesabu: R = (V_CC- V_F) / I_F. Usimamizi wa joto:Ingawa ni kifaa kidogo cha SMD, ni muhimu kuzingatia matumizi ya nguvu (GH inaweza kufikia 95mW), hasa katika hali ya joto kali ya mazingira. Fuata mkunjo wa kupunguza mkondo wa mbele. Hakikisha eneo la kutosha la shaba la PCB (kwa kutumia muundo wa pedi ya joto) ili kuhamisha joto kutoka kwenye kiungo cha LED.Ulinzi wa ESD:Tekeleza taratibu za kawaida za usindikaji wa ESD, hasa kwa aina nyeti zaidi za GH (InGaN). Ikiwa LED iko katika eneo linaloweza kuguswa na mtumiaji, zingatia kutumia vifaa vya ulinzi wa ESD kwenye nyeti za mstari.

9. Ulinganishi wa Teknolojia na Tofauti

The 18-225A series offers distinct advantages over larger through-hole LEDs in terms of PCB space and automated assembly compatibility. Within the realm of SMD LEDs, its primary differentiating features include:

• Wide Viewing Angle (130°):Nyenzo ya kueneza nyeupe hutoa muundo mpana sana na sawasawa wa utoaji, unaofaa sana kwa matumizi yanayohitaji kuonekana kwa pembe pana badala ya boriti iliyolenga.
• Chaguo za nyenzo za chip mbili:Inatoa AlGaInP (R6) na InGaN (GH) ndani ya kifuniko kimoja cha ukubwa, ikitoa urahisi wa kubuni kwa jozi za taa nyekundu/kijani au matumizi ya rangi nyingi.
• Uainishaji wa kina:Multiple luminous intensity and wavelength bins are provided, enabling designers to select components for applications requiring strict brightness or color consistency.
• Robust Reflow Compatibility:Well-defined Pb-free reflow profiles and moisture sensitivity level information support modern, high-volume manufacturing processes.

10. Maswali Yanayoulizwa Mara Kwa Mara (Kulingana na Vigezo vya Kiufundi)

Q1: Je, naweza kutumia moja kwa moja chanzo cha umeme cha mantiki cha 5V au 3.3V kuendesha LED hii?A:No.You must always use a series current-limiting resistor. For example, to drive a green LED (V_F~3.3V), I_F=20mA with a 5V supply: R = (5V - 3.3V) / 0.020A = 85 ohms. Use the next standard value (e.g., 82 or 100 ohms) and verify the actual current and power dissipation.

Q2: Kwa nini kiwango cha ESD cha LED ya kijani (GH) ni cha chini kuliko ile nyekundu (R6)?A: Hii ni sifa ya msingi ya nyenzo. LED zinazotokana na InGaN (za bluu, kijani, nyeupe) kwa kawaida huwa na kiwango cha chini cha uvumilivu wa ESD ikilinganishwa na LED zinazotokana na AlGaInP (nyekundu, ya manjano ya machungwa). Hii inahitaji usindikaji makini zaidi kwa aina ya kijani.

Q3: Rangi ya "White diffused" ya resini inamaanisha nini kwa pato la mwanga?A: The diffuser resin scatters light from the chip, creating a wider, more uniform viewing angle (130°) and giving the unpowered LED a white appearance. It softens the light output, making it less like a point source and more suitable for panel lighting.

Q4: How to interpret the binning codes when ordering?A: Specify the required CAT (luminance) and HUE (color of the green LED) binning codes based on your application's tolerance for brightness variation and color shift. For non-critical indicator lights, a wider bin may be acceptable and cost-effective. For backlight arrays where uniformity is critical, specifying tight bins is essential.

11. Uchunguzi wa Kesi za Ubunifu

Scenario:Design a compact control panel with multi-state indicator lights.Requirements:Nyekundu inaonyesha "Hitilafu", kijani inaonyesha "Tayari". Nafasi ni ndogo sana. Taa za kiashiria lazima ziweze kuonekana wazi kutoka pembe pana. Mchakato wa usanikishaji unatumia SMD ya kiotomatiki na unyevushaji wa kuyeyusha tena.Utekelezaji wa Suluhisho:

1. Uchaguzi wa Vipengele:Rangi nyekundu tumia 18-225A/R6, rangi ya kijani tumia 18-225A/GH. Eneo la bodi la 3.2x1.6mm linalofanana linarahisisha mpangilio wa PCB.
2. Ubunifu wa Sakiti:Kwa mfumo wa usambazaji wa umeme wa 3.3V:
   • Red LED: R = (3.3V - 2.0V) / 0.010A = 130 ohms. Use a 130Ω or 120Ω resistor. Resistor power dissipation: (1.3V^2)/130Ω ≈ 13mW.
   • Green LED: R = (3.3V - 3.3V) / 0.010A = 0 ohms. This is problematic. The 3.3V supply is exactly at the typical V_Fof the green LED, leaving no voltage headroom for a resistor. Solutions: a) Use a lower current (e.g., 5mA), b) Use a higher supply voltage for the LED circuit, or c) Use a constant current driver.
3. PCB layout:Place the LED near the edge of the panel. Use the recommended or slightly larger pads and connect them to a small copper pour for heat dissipation. Ensure the polarity marking on the silkscreen matches the cathode marking on the LED.
4. Manufacturing:Program the pick-and-place machine for the 3.2x1.6mm component size. Follow the specified reflow profile precisely. Store opened reels in a dry cabinet if not used immediately.
5. Grading:For this panel with multiple identical indicator lights, specify a single brightness grade (e.g., CAT P for red, CAT R1 for green) to ensure a uniform appearance across all units.

12. Ufafanuzi Mfupi wa Kanuni za Teknolojia

LED ni diodi ya semiconductor inayotoa mwanga kupitia mwangaza wa umeme. Wakati voltage chanya inatumika kwenye kiungo cha p-n, elektroni na mashimo huingizwa kwenye eneo lenye ufanisi, ambapo huchanganyika. Nishati inayotolewa wakati wa mchakato wa kuchanganyika hutolewa kwa njia ya fotoni (mwanga). Rangi ya mwanga unaotolewa (urefu wa wimbi) imedhamiriwa na nishati ya pengo la bendi ya nyenzo ya semiconductor inayotumika katika eneo lenye ufanisi.

• R6 (AlGaInP):Aluminiumi-Galiamu-Indiamu-Fosforasi ni mfumo wa nyenzo unaotumika kutengeneza LED zenye ufanisi wa juu katika anuwai ya wigo nyekundu, machungwa na ya kahawia. Ina pengo la bendi la moja kwa moja linalofaa kwa utoaji wa mwanga wenye ufanisi.
• GH (InGaN):Indium gallium nitride is the material system used for blue, green, and white LEDs. By varying the indium content, the bandgap can be tuned. Within this material system, achieving high-efficiency green light emission (the "green gap") has been a longstanding historical challenge.

Light from the tiny semiconductor chip is encapsulated within an epoxy or silicone package. The "white diffusive" resin contains scattering particles that randomize the direction of photons, resulting in a broad, uniform emission pattern. The package also provides mechanical protection, electrical contacts, and aids in heat dissipation.

13. Mwelekeo wa Sekta

Soko la SMD LED linaendelea kukua kutokana na mahitaji ya ukubwa mdogo, ufanisi zaidi, na gharama ya chini. Mienendo inayohusiana na vifaa kama vile 18-225A ni pamoja na:

• Uboreshaji wa ufanisi:Uboreshaji endelevu wa ukuaji wa epitaxial na muundo wa chipi umesababisha ufanisi wa juu wa mwanga (uzalishaji wa mwanga zaidi kwa kila wati), na hivyo kuwezesha viashiria vya mwanga mkali zaidi au matumizi ya nguvu ya chini.
• Uboreshaji wa uthabiti wa rangi:Maendeleo katika Udhibiti wa Utengenezaji na Mikakati ya Uainishaji Iliyochanganyika Zaidi yamefanya uvumilivu wa rangi na mwangaza kuwa mkali zaidi, jambo muhimu kwa matumizi kama vile safu za taa za nyuma na skrini za rangi kamili.
• Upanuzi wa Anuwai ya Rangi:Uundaji wa fosforasi mpya na vitoa mionzi nyembamba (kama vile quantum dots) umefanya LED ziwe na rangi zilizojaa zaidi, na kupanua nafasi ya rangi inayowezekana kwa skrini.
• Integration:The trend of integrating multiple LED chips (RGB, RGBW), control ICs, and even passive components into a single package module continues, simplifying the assembly of end products.
• Reliability Focus:As LEDs penetrate into automotive, industrial, and medical markets, increasing emphasis is placed on long-term reliability data, failure mode analysis, and certification under harsh environmental conditions (high temperature, high humidity, thermal cycling).

While newer and smaller package forms exist (e.g., 0201, 01005), the 3.2x1.6mm footprint remains a popular and reliable workhorse for general indicator and backlight applications, offering a good balance between size, brightness, ease of handling, and thermal performance.