Table of Contents
- 1. Product Overview
- 2. In-depth Technical Parameter Analysis
- 2.1 Absolute Maximum Ratings
- 2.2 Electro-Optical Characteristics
- 3. Maelezo ya Mfumo wa Kupanga
- 3.1 Luminous Intensity Binning
- 3.2 Dominant Wavelength Binning
- 3.3 Forward Voltage Binning
- 4. Performance Curve Analysis
- 5. Taarifa za Mitambo na Ufungashaji
- 5.1 Package Size
- 5.2 Polarity Identification
- 6. Welding and Assembly Guide
- 6.1 Reflow Soldering Temperature Profile
- 6.2 Manual Soldering
- 6.3 Storage and Moisture Sensitivity
- 7. Packaging and Ordering Information
- 7.1 Vipimo vya Reel na Tape Carrier
- 7.2 Maelezo ya Lebo
- 8. Mapendekezo ya Utumiaji
- 8.1 Typical Application Scenarios
- 8.2 Key Design Considerations
- 9. Ulinganishi wa Teknolojia na Tofauti
- 10. Maswali Yanayoulizwa Mara kwa Mara (FAQ)
- 11. Mifano ya Uundaji na Matumizi Halisi
- 12. Introduction to Working Principles
- 13. Technology Trends and Development
1. Product Overview
17-215/G6C-FN2P2B/3T ni LED ya kifaa cha ufungaji wa uso (SMD) iliyoundwa kwa ajili ya usanikishaji wa elektroniki wenye msongamano mkubwa. Kipengele hiki kinatumia chipu ya semikondukta ya AIGaInP (aluminium-gallium-indium-phosphide) iliyotoa mwanga wa kijani-kimanjano mkali. Faida yake kuu ni ukubwa mdogo wa ufungaji, ambao husaidia kupunguza kwa kiasi kikubwa ukubwa wa bodi ya mzunguko wa kuchapishwa (PCB), kuongeza msongamano wa usanikishaji wa vipengele, na hatimaye kukuza uundaji wa vifaa vya mwisho-vitumiaji vidogo na vyepesi zaidi. Kifaa hiki kinapatikana katika umbo la mkanda wa kubeba wa kiwango cha tasnia ya milimita 8, umefungwa kwenye spool yenye kipenyo cha inchi 7, na inaendana kabisa na vifaa vya usanikishaji wa kipande-kiotomatiki, na hivyo kuwezesha mchakato wa utengenezaji wa wingi mkubwa.
该 LED 属于单色类型,采用无铅 (Pb-free) 材料制造。它符合主要的国际环境与安全法规,包括欧盟的《有害物质限制指令》(RoHS)、《化学品注册、评估、授权和限制法规》(REACH) 以及无卤标准(溴含量 <900 ppm,氯含量 <900 ppm,总和 <1500 ppm)。这种合规性确保了其适用于全球范围内对材料有严格要求的广泛市场和各类应用。
2. In-depth Technical Parameter Analysis
2.1 Absolute Maximum Ratings
Absolute maximum ratings define the stress limits that may cause permanent damage to the device. These values are not intended for normal operating conditions. For the 17-215 LED, the maximum continuous forward current (IF) rating is 25 mA. Under pulsed conditions with a duty cycle of 1/10 and a frequency of 1 kHz, the peak forward current (IFP) Inaweza fikia 60 mA. Upeo wa voltage ya kurudia inayoruhusiwa (VR) ni 5 V; ni muhimu kuzingatia kuwa kifaa hiki hakikusudiwa kufanya kazi kwa upendeleo wa kurudia, rating hii inatumika hasa kwa hali ya majaribio ya mkondo wa kurudia (IR). Jumla ya matumizi ya nguvu (Pd) haipaswi kuzidi 60 mW, thamani hii inakokotolewa kutokana na bidhaa ya voltage ya mbele na mkondo wa mbele. Kulingana na mfano wa mwili wa binadamu (HBM), kifaa hiki kinaweza kustahimili utokaji umeme tuli (ESD) wa 2000 V. Safu ya joto ya uendeshaji (Topr) is -40°C to +85°C, while the storage temperature (Tstg) is slightly wider, up to +90°C.
2.2 Electro-Optical Characteristics
Photoelectric performance is specified under standard test conditions with an ambient temperature (Ta) of 25°C and a forward current of 20 mA. The typical range of luminous intensity (Iv) is from 36.00 mcd to 72.00 mcd, with a specified tolerance of ±11%. The spatial distribution of light features a wide viewing angle (2θ1/2) as a feature, providing broad illumination. The spectral characteristics are defined by the peak wavelength (λp) 575 nm and the dominant wavelength (λd) range 570.00 nm to 574.50 nm (tolerance ±1nm). The spectral bandwidth (Δλ) is approximately 20 nm. At a current of 20 mA, the forward voltage (VFThe typical range for ) is 1.75 V to 2.35 V, with a tolerance of ±0.1 V. When a 5 V reverse voltage is applied, the reverse current (IR) is guaranteed to be less than or equal to 10 μA.
3. Maelezo ya Mfumo wa Kupanga
To ensure consistency in mass production, LEDs are sorted into different bins based on key performance parameters. This allows designers to select components that meet the requirements of specific applications in terms of brightness, color, and electrical behavior.
3.1 Luminous Intensity Binning
Nguvu ya mwanga imegawanywa katika vikundi vitatu kuuFchini ya hali ya I = 20 mA:
- Gear N2:36.00 mcd (min) to 45.00 mcd (max)
- Gear P1:45.00 mcd (minimum) to 57.00 mcd (maximum)
- Gear P2:57.00 mcd (minimum) to 72.00 mcd (maximum)
3.2 Dominant Wavelength Binning
Dominant wavelength is closely related to perceived color and is divided into three grades:
- Grade CC2:570.00 nm (minimum) to 571.50 nm (maximum)
- Gear CC3:571.50 nm (minimum) to 573.00 nm (maximum)
- Gear CC4:573.00 nm (minimum) to 574.50 nm (maximum)
3.3 Forward Voltage Binning
Forward voltage is divided into three levels to assist circuit design, particularly for current-limiting resistor calculation and power supply design:
- Level 0:1.75 V (min) to 1.95 V (max)
- Level 1:1.95 V (minimum) to 2.15 V (maximum)
- Gear 2:2.15 V (minimum) to 2.35 V (maximum)
4. Performance Curve Analysis
Ingawa faili ya PDF inaonyesha kuwa ukurasa wa 5 una mkunjo wa kawaida wa sifa za optoelektroniki, maudhui ya maandishi hayatoi chati maalum. Kwa kawaida, maelezo kama haya ya vipimo yanajumuisha mikunjo inayoonyesha uhusiano kati ya sasa ya mwelekeo mzuri na ukubwa wa mwanga, uhusiano kati ya voltage ya mwelekeo mzuri na sasa ya mwelekeo mzuri, na ukubwa wa jamaa wa mwanga unavyobadilika kulingana na joto la mazingira. Mikunjo hii ni muhimu sana kwa wabunifu kuelewa tabia ya kifaa chini ya hali zisizo za kawaida. Kwa mfano, ukubwa wa mwanga kwa kawaida hupungua kadiri joto la mazingira linavyoongezeka. Voltage ya mwelekeo mzuri pia ina mgawo hasi wa joto, ikimaanisha kuwa itapungua kidogo kadiri joto linavyoongezeka. Wabunifu wanapaswa kurejelea data ya michoro, kupunguza utendaji kwa kadiri inavyofaa kulingana na mazingira yao maalum ya uendeshaji, na kuhakikisha kuendesha kwa sasa thabiti ndani ya anuwai ya joto lengwa.
5. Taarifa za Mitambo na Ufungashaji
5.1 Package Size
The 17-215 SMD LED utilizes a compact package. Key dimensions (in millimeters) are as follows, with a general tolerance of ±0.1 mm unless otherwise specified: overall package length is 2.0 mm, width is 1.25 mm, and height is 0.8 mm. The device features two anode/cathode terminals for electrical connection. A detailed dimensional drawing, including pad pitch, terminal dimensions, and lens geometry, is provided in the datasheet to guide PCB pad pattern design for optimal soldering and mechanical stability.
5.2 Polarity Identification
Correct polarity is crucial for LED operation. The package outline in the datasheet clearly indicates the anode and cathode terminals. Typically, one terminal may feature a marking or have a distinct shape (e.g., a notch or chamfer) for visual identification during manual assembly or inspection. Designers must ensure the PCB footprint pattern aligns with this polarity to prevent misplacement.
6. Welding and Assembly Guide
6.1 Reflow Soldering Temperature Profile
LED hii inaendana na mchakato wa reflow soldering wa infrared na mvuke. Kwa uchomeaji usio na risasi, lazima kufuata mkunjo maalum wa joto:
- Preheating:Heat from ambient temperature to 150-200°C within 60-120 seconds.
- Soak/Reflow:Weka kwa sekunde 60-150 kwenye joto la juu ya 217°C (joto la liquidus). Joto la kilele halipaswi kuzidi 260°C, na muda wa kuwa juu ya 255°C lazima udhibitiwe hadi sekunde 30 tu.
- Kupoa:Kiwango cha juu cha kupoa hakipaswi kuzidi digrii 6 kwa sekunde.
6.2 Manual Soldering
If manual soldering cannot be avoided, extra care must be taken. The soldering iron tip temperature should be below 350°C, and the contact time with each terminal must not exceed 3 seconds. The soldering iron power should be 25W or lower. At least 2 seconds should elapse between soldering each terminal. The use of a dual-tip soldering iron for rework is recommended to minimize thermal stress, but rework after initial soldering is generally discouraged.
6.3 Storage and Moisture Sensitivity
LED imefungwa kwenye mfuko wa kinga ya unyevu ulio na kivundo cha kukausha. Usifungue mfuko kabla ya kujiandaa kutumia kipengele. Baada ya kufungua:
- LED zisizotumiwa zinapaswa kuhifadhiwa katika mazingira ya 30°C au chini, unyevunyevu wa jamaa (RH) 60% au chini.
- "Urefu wa maisha wa kiwanda" baada ya kufungua mfuko ni saa 168 (siku 7).
- Ikiwa hazijatumiwa ndani ya muda huu, LED zilizobaki lazima zipakwe tena kwenye mfuko wenye desiccant.
- Ikiwa kiashiria cha desiccant kimebadilisha rangi au wakati wa mfiduo umezidi uliowekwa, inahitaji kukaushwa kwa 60°C ±5°C kwa saa 24 kabla ya matumizi.
7. Packaging and Ordering Information
7.1 Vipimo vya Reel na Tape Carrier
The product is supplied in standard "ammo pack" style carrier tape, 8 mm in width, wound on 7-inch (178 mm) diameter reels. Each reel contains 3000 devices. Detailed dimensions for the reel, tape pocket, and cover tape are provided to ensure compatibility with automatic feeders.
7.2 Maelezo ya Lebo
Lebo ya ufungashaji inajumuisha misimbo muhimu kadhaa inayotumika kwa kufuatilia na kwa vipimo:
- CPN:Nambari ya Bidhaa ya Mteja (iliyobainishwa na mnunuzi).
- P/N:Nambari ya Bidhaa ya Mtengenezaji (17-215/G6C-FN2P2B/3T).
- QTY:Idadi ya ufungashaji (mfano, 3000).
- CAT:Ngazi ya ukali wa mwanga (mfano, N2, P1, P2).
- HUE:Viwianishi vya rangi na ngazi ya urefu wa wimbi kuu (mfano, CC2, CC3, CC4).
- REF:Forward voltage level (e.g., 0, 1, 2).
- LOT No:Production lot number, used for traceability.
8. Mapendekezo ya Utumiaji
8.1 Typical Application Scenarios
Rangi ya manjano ya kijani kibichi na ukubwa mdogo hufanya LED hii ifae kwa viashiria mbalimbali vya mwanga na kazi ya mwanga wa nyuma:
- Interior ya Gari:Mwanga wa nyuma wa vifaa vya dashibodi, swichi na paneli za udhibiti.
- Vifaa vya Mawasiliano:Viashiria vya hali na taa za nyuma za kibodi katika simu, mashine za faksi na vifaa vingine vya mawasiliano.
- Elektroniki za matumizi ya kawaida:Mwanga wa nyuma wa gorofa, taa za swichi na viashiria vya alama kwa skrini ndogo za LCD.
- Uonyeshaji wa jumla:Viashiria vya hali ya umeme, uteuzi wa hali, na maonyo katika vifaa mbalimbali vya elektroniki.
8.2 Key Design Considerations
Lazima kuzuia mkondo:LED is a current-driven device. An external current-limiting resistor must always be connected in series with the LED. The resistor value is determined based on the supply voltage (Vsupply) and the LED's forward voltage (VF, inayotolewa kutoka kwenye kiwango chake) na mkondo wa mbele unaohitajika (IF, kawaida ni 20 mA au chini) kuhesabu. Fomula ni: R = (Vsupply- VF) / IF. Bila upinzani huu, hata ongezeko dogo la voltage ya usambazaji linaweza kusababisha ongezeko kubwa na linaloharibu la mkondo.
Usimamizi wa joto:Ingawa matumizi ya nguvu ni ya chini, kuhakikisha eneo la kutosha la shaba la PCB karibu na pedi ya LED husaidia katika upotezaji wa joto, hasa katika hali ya joto kali ya mazingira au wakati inaendeshwa kwa mkondo wa juu zaidi unaoendelea. Hii husaidia kudumisha mwanga wa pato na maisha ya huduma.
Mipaka ya matumizi:Hii LED ya kiwango cha kibiashara haijabuniwa au kuthibitishwa kwa matumizi ya uaminifu wa juu ambapo hitilafu inaweza kusababisha hatari ya usalama. Hii inajumuisha, lakini sio tu, mifumo ya kijeshi/anga, mifumo muhimu ya usalama wa magari (kwa mfano, taa za breki, viashiria viairbag), na vifaa vya matibabu vinavyoshikilia maisha. Kwa matumizi kama haya, vipengele vilivyo na sifa husika na data ya uaminifu vinapaswa kununuliwa.
9. Ulinganishi wa Teknolojia na Tofauti
Sababu kuu za kutofautisha za LED ya 17-215 ni pamoja na muundo wake wa chip maalum ya AIGaInP kuzalisha mwanga mkali wa manjano-kijani, ukubwa wake mdogo sana wa ufungaji wa 2012 (2.0x1.25mm), na kufuata viwango vya kisasa via mazingira (bila risasi, bila halojeni, RoHS, REACH). Inafanikiwa kupunguza ukubwa kwa kiasi kikubwa ikilinganishwa na LED za zamani za kupenyeza mashimo au SMD kubwa zaidi. Ikilinganishwa na LED nyingine za manjano-kijani, teknolojia ya AIGaInP kwa kawaida hutoa ufanisi mkubwa wa mwanga na utulivu bora wa rangi (kubadilika kwa joto na mkondo) kuliko vifaa mbadala vingine vya semiconductor vinavyotumiwa kwa rangi sawa. Pembe pana ya mtazamo wa digrii 130 pia ni sifa muhimu kwa matumizi yanayohitaji mwanga mpana na sawa badala ya boriti iliyolengwa.
10. Maswali Yanayoulizwa Mara kwa Mara (FAQ)
Q1: Kuna tofauti gani kati ya urefu wa wimbi la kilele (λp) na urefu wa wimbi kuu (λd)?
A1: Urefu wa wimbi la kilele ni urefu wa wimbi ambapo usambazaji wa nguvu ya wigo unafikia thamani yake ya juu kabisa. Urefu wa wimbi kuu ni urefu wa wimbi wa mwanga wa monokromati unaolingana na rangi inayohisiwa ya LED. Kwa LED zenye wigo dhaifu kiasi, hizi mbili kwa kawaida ziko karibu, lakini λd ina umuhimu zaidi katika maombi kwa ajili ya vipimo vya rangi.
Q2: Je, nikitumia chanzo cha voltage ya kudumu kilichowekwa kwa voltage ya mbele ya LED, naweza kuendesha LED hii bila kupinga kikomo cha mkondo?
A2: Hapana, haipendekezwi kufanya hivyo, na kuna uwezekano mkubwa wa kuharibu LED. Voltage ya mbele ina uvumilivu na mgawo hasi wa joto. Mabadiliko madogo ya voltage ya usambazaji au ongezeko la joto la LED yanaweza kusababisha ongezeko kubwa na lisilodhibitiwa la mkondo, na kusababisha joto kupita kiasi na kushindwa kufanya kazi. Hakikisha unatumia upinzani wa mfululizo au kiendesha kikomo cha mkondo maalum.
Q3: Kwa nini kuna kikomo cha "maisha ya karakana" kali baada ya kufungua mfuko wa kuzuia unyevu?
A3: SMD components absorb moisture from the atmosphere. During high-temperature reflow soldering, this trapped moisture can rapidly vaporize, creating internal pressure that may lead to package cracking (the "popcorn" effect) or delamination, resulting in failure. Floor life and baking procedures are used to manage this Moisture Sensitivity Level (MSL).
Q4: How to interpret the binning codes (CAT, HUE, REF) when ordering?
A4: You can specify the exact binning codes you require based on your application's needs for brightness (CAT), color (HUE), and forward voltage (REF). Ordering tighter bins ensures higher consistency in the final product's appearance and electrical performance. If not specified, you will receive components from the standard production bins.
11. Mifano ya Uundaji na Matumizi Halisi
Mfano 1: Taa ya Nyuma ya Swichi ya Dashibodi
Katika dashibodi ya gari, LED nyingi za 17-215 zinaweza kuwekwa nyuma ya kofia ya swichi wazi. Pini ya GPIO ya microcontroller inaweza kuwashwa kutoka kwa mfumo wa 12V wa gari kupitia transistor. Kokotoa upinzani wa mfululizo kwa kila LED. Kwa mfano, kwa kutumia usambazaji wa umeme wa 12V, VFni 2.1V (Kiwango 1), lengo IFFor 20mA: R = (12V - 2.1V) / 0.02A = 495 ohms. A standard 510 ohm resistor will be suitable, resulting in IF≈ 19.4 mA. The wide viewing angle ensures the switch is evenly illuminated.
Example 2: Network Equipment Status Indicator
For the "Link Activity" indicator on a router, a single LED can be driven directly by a 3.3V logic signal. Using VF= 1.9V (gear 0) and IF= 15 mA to reduce power consumption and extend lifespan: R = (3.3V - 1.9V) / 0.015A ≈ 93.3 ohms. A 100-ohm resistor will be used. The bright yellow-green color is very eye-catching and is often associated with network activity.
12. Introduction to Working Principles
A light-emitting diode (LED) is a semiconductor device that emits light through a process called electroluminescence. The 17-215 LED uses an AIGaInP (aluminum gallium indium phosphide) compound semiconductor. When a forward voltage is applied across the p-n junction, electrons from the n-type region and holes from the p-type region are injected into the active region. When these charge carriers (electrons and holes) recombine, they release energy. In AIGaInP material, this energy is released primarily as photons (light particles) with a wavelength corresponding to the bandgap energy of the semiconductor material. The specific composition of Al, Ga, In, and P atoms is engineered to create a bandgap that produces yellow-green light with a peak wavelength of approximately 575 nm. An epoxy resin lens encapsulates the chip, protecting it and shaping the light output to achieve the desired 130-degree viewing angle.
13. Technology Trends and Development
Mwelekeo wa jumla wa teknolojia ya SMD LED unaendelea kuelekea maeneo machache muhimu:Uboreshaji wa Ufanisi:Maboresho ya kuendelea ya sayansi ya nyenzo na usanifu wa chip yanalenga kutoa idadi kubwa ya lumens kwa kila watt (lm/W), na hivyo kupunguza matumizi ya nishati kwa pato fulani la mwanga.Udogo:Ukubwa wa ufungaji unaendelea kupungua (kwa mfano, kutoka 2012 hadi 1608, vipimo vya metriki 1005) ili kusaidia vifaa vya matumizi ya kawaida vinavyokuwa vidogo zaidi.Uboreshaji wa Utofautishaji wa Rangi na Uthabiti:Maendeleo katika teknolojia ya fosforasi (inayotumika kwenye LED nyeupe) na mchakato wa ukuaji wa epitaxial (kwa LED za rangi kama vile AIGaInP) yameleta uainishaji mkali zaidi wa rangi na utendakazi thabiti zaidi katika mzunguko mzima wa maisha na anuwai ya joto.Uboreshaji wa Uaminifu:Nyenzo za ufungaji zilizoboreshwa na michakato ya utengenezaji zinapanua maisha ya LED, na kuongeza uwezo wa kukabiliana na mkazo wa joto na mazingira.Suluhisho za Ujumuishaji:Soko la LED zilizo na upinzani wa kudhibiti mkondo, diode za ulinzi na hata IC za kuendesha linakua, jambo linalorahisisha muundo wa saketi. 17-215 inawakilisha ufungaji na teknolojia iliyothibitishwa na inayotumiwa sana, inayofaidika na maboresho haya yanayoendelea katika uzalishaji wa tasnia nzima kuhusu uzalishaji bora na utendaji.
Maelezo ya Istilahi za Vipimo vya LED
Ufafanuzi kamili wa istilahi za kiteknolojia ya LED
I. Viashiria Muhimu vya Utendaji wa Umeme na Mwanga
| Terminology | Unit/Representation | Layman's Explanation | Kwa Nini Ni Muhimu |
|---|---|---|---|
| Ufanisi wa Mwanga (Luminous Efficacy) | lm/W (lumens per watt) | The luminous flux emitted per watt of electrical power; the higher the value, the more energy-efficient. | It directly determines the energy efficiency rating of the luminaire and the electricity cost. |
| Mfumuko wa Mwanga (Luminous Flux) | lm (lumeni) | Jumla ya mwanga unaotolewa na chanzo cha mwanga, unaojulikana kwa jina la "mwangaza". | Huamua kama taa inatosha kuwa na mwangaza. |
| Pembe ya kuona (Viewing Angle) | ° (digrii), kama 120° | Pembe ambapo nguvu ya mwanga hupungua hadi nusu, huamua upana wa boriti ya mwanga. | Inayoathiri eneo la mwanga na usawa wake. |
| Joto la rangi (CCT) | K (Kelvin), kama 2700K/6500K | Joto la rangi ya mwanga, thamani ya chini inaelekea manjano/joto, thamani ya juu inaelekea nyeupe/baridi. | Huamua mazingira ya taa na matumizi yanayofaa. |
| Color Rendering Index (CRI / Ra) | Unitless, 0–100 | The ability of a light source to reproduce the true colors of objects; Ra≥80 is considered good. | Inaathiri ukweli wa rangi, hutumika katika maeneo yenye mahitaji makubwa kama maduka makubwa, majumba ya sanaa. |
| Tofauti ya uvumilivu wa rangi (SDCM) | MacAdam ellipse steps, such as "5-step" | A quantitative metric for color consistency; a smaller step number indicates better color consistency. | Ensures no color variation among luminaires from the same batch. |
| Mdomo mkuu (Dominant Wavelength) | nm (nanomita), k.m. 620nm (nyekundu) | Wavelength values corresponding to the colors of colored LEDs. | Determines the hue of monochromatic LEDs such as red, yellow, and green. |
| Spectral Distribution | Mkunjo wa Muda wa Mwamba dhidi ya Nguvu | Inaonyesha usambazaji wa nguvu za mwanga unaotolewa na LED katika kila muda wa mwamba. | Inapotosha uhalisi wa rangi na ubora wa rangi. |
II. Vigezo vya Umeme
| Terminology | Ishara | Layman's Explanation | Mazingatio ya Ubunifu |
|---|---|---|---|
| Forward Voltage (Forward Voltage) | Vf | The minimum voltage required to light up an LED, similar to a "starting threshold". | The driving power supply voltage must be ≥ Vf; the voltages add up when multiple LEDs are connected in series. |
| Forward Current | If | The current value required for the LED to emit light normally. | Constant current drive is commonly used, as the current determines brightness and lifespan. |
| Maximum Pulse Current | Ifp | Kilele cha mkondo kinachoweza kustahimili kwa muda mfupi, kinachotumika kwa kudimisha au kumulika. | Upanaaji wa upana wa msukumo na uwiano wa kazi lazima udhibitiwe kwa uangalifu, vinginevyo kunaweza kuharibika kwa joto kupita kiasi. |
| Reverse Voltage | Vr | Upeo wa voltage ya nyuma ambayo LED inaweza kustahimili, ikiwa unazidi hii inaweza kuharibika. | Katika mzunguko, ni muhimu kuzuia kuunganishwa kinyume au mshtuko wa voltage. |
| Upinzani wa Joto (Thermal Resistance) | Rth (°C/W) | Upinzani wa joto unaposogea kutoka kwenye chip hadi kwenye sehemu ya kuunganishia, thamani ya chini inaonyesha usambazaji bora wa joto. | Upinzani wa joto wa juu unahitaji muundo wenye nguvu zaidi wa kupoza joto, vinginevyo joto la kiungo litaongezeka. |
| ESD Immunity | V (HBM), kama 1000V | Uwezo wa kukabiliana na mshtuko wa umeme wa tuli, thamani ya juu zaidi inamaanisha uwezekano mdogo wa kuharibika na umeme wa tuli. | Hatua za kinga dhidi ya umeme wa tuli zinahitajika katika uzalishaji, hasa kwa LED zenye usikivu mkubwa. |
Tatu: Usimamizi wa Joto na Uaminifu
| Terminology | Viashiria Muhimu | Layman's Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | The actual operating temperature inside the LED chip. | For every 10°C reduction, the lifespan may double; excessively high temperatures cause lumen depreciation and color shift. |
| Lumen Depreciation | L70 / L80 (hours) | The time required for the brightness to drop to 70% or 80% of its initial value. | Kufafanua moja kwa moja "maisha ya huduma" ya LED. |
| Lumen Maintenance | % (e.g., 70%) | The percentage of remaining brightness after a period of use. | Characterizes the ability to maintain brightness after long-term use. |
| Mabadiliko ya rangi (Color Shift) | Δu′v′ au MacAdam ellipse | Kiwango cha mabadiliko ya rangi wakati wa matumizi. | Inaathiri uthabiti wa rangi katika eneo la taa. |
| Thermal Aging | Deterioration of material properties | Degradation of packaging materials due to prolonged high temperatures. | Inaweza kusababisha kupungua kwa mwangaza, mabadiliko ya rangi au kushindwa kwa mzunguko wazi. |
Nne. Ufungaji na Nyenzo
| Terminology | Aina za Kawaida | Layman's Explanation | Sifa na Matumizi |
|---|---|---|---|
| Aina ya Ufungaji | EMC, PPA, Ceramic | A housing material that protects the chip and provides optical and thermal interfaces. | EMC offers good heat resistance and low cost; ceramic provides superior heat dissipation and long lifespan. |
| Muundo wa Chip | Usakinishaji wa Kawaida, Usakinishaji wa Kichwa-chini (Flip Chip) | Chip electrode arrangement method. | Flip-chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications. |
| Phosphor coating. | YAG, silicate, nitride | Coated on the blue LED chip, partially converted to yellow/red light, mixed to form white light. | Different phosphors affect luminous efficacy, color temperature, and color rendering. |
| Lens/Optical Design | Planar, microlens, total internal reflection | The optical structure on the packaging surface controls the light distribution. | Determines the emission angle and light distribution curve. |
V. Udhibiti wa Ubora na Uainishaji
| Terminology | Yaliyomo ya Uainishaji | Layman's Explanation | Kusudi |
|---|---|---|---|
| Kugawanya kwa mwangaza | Msimbo kama 2G, 2H | Group by brightness level, each group has a minimum/maximum lumen value. | Ensure consistent brightness for products within the same batch. |
| Voltage binning | Codes such as 6W, 6X | Grouped by forward voltage range. | Inafaa kwa kuendana na chanzo cha umeme cha kuendesha, kuboresha ufanisi wa mfumo. |
| Kugawanya kwa makundi kulingana na rangi | 5-step MacAdam ellipse | Group by color coordinates to ensure colors fall within an extremely small range. | Ensure color consistency to avoid color unevenness within the same luminaire. |
| Kugawa joto | 2700K, 3000K, n.k. | Pangwa kulingana na joto la rangi, kila kikundi kina anuwai maalum ya kuratibu. | Kukidhi mahitaji ya joto la rangi katika mazingira tofauti. |
Sita, Uchunguzi na Uthibitisho
| Terminology | Standard/Test | Layman's Explanation | Meaning |
|---|---|---|---|
| LM-80 | Lumen Maintenance Test | Long-term operation under constant temperature conditions, recording luminance attenuation data. | For projecting LED lifetime (in conjunction with TM-21). |
| TM-21 | Lifetime projection standard | Projecting lifespan under actual use conditions based on LM-80 data. | Providing scientific life prediction. |
| IESNA Standard | Illuminating Engineering Society Standard | Covers optical, electrical, and thermal testing methods. | Msingi wa vipimo unaokubaliwa na tasnia. |
| RoHS / REACH | Uthibitisho wa Mazingira | Hakikisha bidhaa hazina vitu hatari (kama risasi, zebaki). | Masharti ya kuingia kwenye soko la kimataifa. |
| ENERGY STAR / DLC | Uthibitishaji wa ufanisi wa nishati | Uthibitishaji wa ufanisi wa nishati na utendaji kwa bidhaa za taa. | Inatumika kwa kawaida katika ununuzi wa serikali na miradi ya ruzuku, kuimarisha ushindani wa soko. |