SMD LED 19-219/T3D-AQ2R2TY/3T Datasheet - Dimensions 1.6x0.8x0.77mm - Voltage 2.6-3.0V - Power 95mW - Pure White - Technical Documentation

1. Product Overview

19-219/T3D-AQ2R2TY/3T ni kifaa kidogo cha LED cha aina ya SMD, kilichoundwa kwa matumizi ya kisasa ya elektroniki yanayohitaji viashiria vya mwanga vyenye kuegemea na taa za nyuma. LED hii ya rangi moja hutoa mwanga mweupe safi, ambapo kanuni yake ya kutokwa na mwanga inafanywa kupitia chip ya InGaN iliyofungwa ndani ya resini njano yenye kutawanyika. Ikilinganishwa na LED za jadi za fremu ya waya, faida yake kuu ni kupunguza kwa kiasi kikubwa ukubwa wa kifungashio, na hivyo kuongeza msongamano wa vipengele kwenye PCB, kupunguza mahitaji ya uhifadhi, na hatimaye kuchangia katika kupunguzwa kwa ukubwa wa vifaa vya mwisho. Kipengele hiki hakina risasi na kinakidhi maagizo ya RoHS, na kinafaa kwa miundo inayolenga mazingira.

1.1 Core Features and Advantages

• Kifungashio cha Ukubwa Mdogo:Vipimo vidogo vya umbo (1.6mm x 0.8mm) vinasaidia mpangilio wa bodi ya mzunguko wenye msongamano mkubwa na bidhaa za mwisho ndogo zaidi.
• Uwiano na Otomatiki:Inapatikana kwa namna ya mkanda wa kubeba wa 8mm na reeli ya inchi 7, inalingana kabisa na vifaa vya kawaida vya usakinishaji wa kiotomatiki.
• Utendaji Imara wa Kuunganisha:Inalingana na mchakato wa reflow wa infrared na reflow wa mvuke, kuhakikisha ubora wa kuaminika wa utengenezaji.
• Uzingatiaji wa Mazingira:Bidhaa haina risasi na inaendelea kukidhi mahitaji ya kanuni za RoHS.
• Uzito Mwepesi:Chaguo bora kwa matumizi ya kubebebebwa na madogo ambapo uzito ni kipengele muhimu.

1.2 Target Application Areas

This LED is versatile and suitable for the following key areas:

• Telecommunications Equipment:Used as status indicators in telephones and fax machines, and for backlighting keys and displays.
• Display Backlighting:Suitable for flat backlighting of LCD panels, and for backlighting switches and symbols.
• General Indication:Can be used in various consumer electronics, industrial controls, and automotive interiors requiring a compact white light source.

2. Detailed Technical Specifications

Sehemu hii inachambua kwa kina viwango vya juu kabisa visivyopitishwa na vigezo muhimu vya uendeshaji vya LED. Kufuata vikwazo hivi ni muhimu ili kuhakikisha uimara wa muda mrefu na kuzuia uharibifu wa kifaa.

2.1 Absolute Maximum Ratings

Viwango hivi vinafafanua mipaka ya mkazo ambayo inaweza kusababisha uharibifu wa kudumu wa kifaa. Haipendekezwi kufanya kazi chini ya hali zinazofikia au kukaribia mipaka hii.

• Voltage ya Kinyume (V_R):5V. Kuzidi voltage hii chini ya upendeleo wa kinyume kunaweza kusababisha kuvunjika kwa junction.
• Mwendo wa Mbele unaoendelea (I_F):25mA. Maximum continuous DC current.
• Peak forward current (I_FP):100mA (duty cycle 1/10, frequency 1kHz). Allows brief high-current pulses, suitable for multiplexing or pulsed operation.
• Power dissipation (P_d):95mW. Maximum power that the package can dissipate, calculated as V_F* I_F.
• Electrostatic discharge (ESD):150V (Human Body Model). Proper ESD handling procedures must be followed during assembly and operation.
• Operating temperature (T_opr):-40°C to +85°C. Guaranteed ambient temperature range for reliable operation.
• Storage temperature (T_stg):-40°C to +90°C.
• Soldering temperature:Reflow: Maximum 260°C for a duration not exceeding 10 seconds. Hand soldering: Maximum 350°C per terminal for a duration not exceeding 3 seconds.

2.2 Electro-Optical Characteristics

Hizi ni vigezo vya kawaida vya utendaji vilivyopimwa kwa joto la mazingira (T_a) la 25°C. Mbuni wanapaswa kutumia thamani za kawaida kwa mahesabu ya awali, lakini muundo unapaswa kuwa unaoweza kukabiliana na anuwai ya chini/ya juu.

• Nguvu ya mwanga (I_v):90.0 - 180 mcd (thamani ya chini hadi ya juu, imegawanywa katika viwango). Ilipimwa wakati mkondo wa mbele (I_F) ulikuwa 5mA. Anuwai pana inadhibitiwa kupitia mfumo wa kugawanya viwango ulioelezwa baadaye.
• Pembe ya mtazamo (2θ_1/2):Digrii 130 (thamani ya kawaida). Pembe hii pana ya mtazamo inafanya iweze kutumika katika matumizi yanayohitaji taa ya pembe pana au kuonekana kutoka pembe nyingi.
• Voltage ya mbele (V_F):2.6V - 3.0V (chini ya hali ya I_F=5mA). Kigezo hiki pia kimegawanywa katika viwango. Lazima utumie kipingamkondo mfululizo na LED, kulingana na voltage ya usambazaji na V_F range.
• Reverse current (I_R):Maximum 50 µA (at V_R=5V condition). This indicates the leakage current level when the device is reverse biased.

3. Binning System Description

To ensure consistency in brightness and color during production, LEDs are sorted into different grades based on measured performance. The 19-219 LED employs three independent grading criteria.

3.1 Luminous Intensity Binning

LEDs are classified into different grades (Q1, R1, R2) based on their luminous intensity measured at a 5mA current. This allows designers to select the appropriate brightness level for their application, ensuring a uniform appearance in multi-LED designs.

• Gear Q1:90.0 - 112 mcd
• Gear R1:112 - 140 mcd
• Gear R2:140 - 180 mcd

3.2 Forward Voltage Binning

LEDs are also binned according to their forward voltage (V_F) Perform binning. Matching V_FBinning helps achieve more uniform current distribution when LEDs are connected in parallel.

• Bin 28:2.6V - 2.7V
• Bin 29:2.7V - 2.8V
• Bin 30:2.8V - 2.9V
• Bin 31:2.9V - 3.0V

3.3 Chromaticity Coordinate Binning

For white LEDs, color consistency is critical. Products are divided into six bins (1-6) based on their measured CIE 1931 (x, y) chromaticity coordinates under I_F=5mA conditions. Each bin defines a quadrilateral area on the CIE chromaticity diagram. The specification requires a coordinate tolerance of ±0.01. In applications where color matching is important, it is crucial to select LEDs from the same chromaticity bin.

4. Performance Curve Analysis

The datasheet provides several characteristic curves that illustrate the LED's behavior under different conditions. Understanding these curves is key to optimizing circuit design.

4.1 Forward Current vs. Forward Voltage (I-V Curve)

Mkunjo huu unaonyesha uhusiano usio wa mstari kati ya mkondo na voltage. Voltage ya mbele huongezeka kadri mkondo unavyoongezeka. Mkunjo huu ni muhimu kwa kuchagua thamani sahihi ya upinzani wa kuzuia mkondo. Mabadiliko madogo ya voltage yanasababisha mabadiliko makubwa ya mkondo, jambo linaloangazia umuhimu wa udhibiti wa mkondo.

4.2 Luminous Intensity vs. Forward Current

Mchoro huu unaonyesha kuwa, katika anuwai ya kufanya kazi, pato la mwanga ni takriban sawia na mkondo wa mbele. Hata hivyo, katika mikondo ya juu sana, ufanisi unaweza kupungua kwa sababu ya ongezeko la joto.

4.3 Luminous Intensity vs. Ambient Temperature

Pato la mwanga la LED hupungua kadri joto la kiungo linavyopanda. Mkunjo huu hupima uhusiano huu wa kupunguza nguvu. Kwa mazingira ya joto la juu au uendeshaji wa nguvu ya juu, ni lazima kuzingatia usimamizi wa joto ili kudumisha mwangaza.

4.4 Forward Current Derating Curve

Mkunjo huu unafafanua uhusiano kati ya mkondo wa juu unaoruhusiwa unaoendelea mbele na joto la mazingira. Kadiri joto linavyoongezeka, ni lazima kupunguza mkondo wa juu ili kuzuia kuzidi kikomo cha matumizi ya nguvu ya kifaa na kuhakikisha uaminifu.

4.5 Spectral Distribution

Mkunjo wa pato la wigo unaonyesha nguvu ya jamaa ya LED hii nyeupe katika urefu tofauti wa mawimbi. Kwa kawaida ina kilele cha bluu kinachotokana na chip ya InGaN na utoaji mpana wa manjano kutoka kwa fosforasi, yote yakiunganishwa kutoa mwanga mweupe.

4.6 Radiation Pattern

Mchoro huu wa kuratibu polar unaonyesha wazi usambazaji wa anga wa mwanga (hali ya pembe ya maoni), ukithibitisha pembe ya kawaida ya maoni ya digrii 130.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The compact LED package measures 1.6mm (length) x 0.8mm (width), with a typical height of 0.77mm. Key dimensions include pad pitch and size. A recommended land pattern is provided to ensure reliable solder joint connections and proper alignment during the reflow process. The cathode is identified by a specific pad marking or a chamfer on the package bottom view.

5.2 Polarity Identification

Correct polarity is crucial. The cathode pad is clearly marked in the package outline drawing. The polarity orientation is also indicated on the carrier tape to guide automated assembly equipment.

6. Soldering and Assembly Guide

6.1 Mkunjo wa Joto wa Reflow Soldering

For lead-free soldering, a specific temperature profile must be followed:

• Preheating:150-200°C for 60-120 seconds.
• Time above liquidus (217°C):60-150 seconds.
• Peak temperature:Maximum 260°C, with a dwell time not exceeding 10 seconds.
• Heating/Cooling rate:Kiwango cha juu cha 3°C/s wakati wa kupanda hadi 255°C, kiwango cha juu cha jumla cha 6°C/s.

Idadi ya mara ya kuunganishwa kwa mkondo wa reflow kwa LED moja haipaswi kuzidi mara mbili.

6.2 Uchomeaji wa Mikono

Ikiwa ni lazima kufanya uunganishaji wa mikono, tahadhari ya ziada inahitajika. Tumia chuma cha kuunganishia chenye joto la ncha chini ya 350°C, na usichome kila ncha ya kuunganishia kwa zaidi ya sekunde 3. Nguvu ya chuma cha kuunganishia inapaswa kuwa 25W au chini. Weka muda wa angalau sekunde 2 kati ya kuunganisha kila ncha ya kuunganishia ili kuzuia mshtuko wa joto.

6.3 Uhifadhi na Uvumilivu wa Unyevu

LED imefungwa kwenye mfuko wa kuzuia unyevu ulio na kikaushi.

• Kabla ya Kufungua:Hifadhi chini ya hali ya ≤30°C na ≤90% unyevunyevu wa jamaa (RH).
• After Opening (Workshop Life):Can be stored for 1 year under conditions of ≤30°C and ≤60% RH. Unused components should be resealed.
• Baking:If the desiccant indicator changes color or the storage time is exceeded, bake at 60±5°C for 24 hours before using the reflow soldering process.

6.4 Uangalizi Muhimu

• Current Limiting:An external series resistor must be used. Without it, minor power supply voltage fluctuations can cause massive, destructive current surges.
• Mechanical Stress:Avoid applying stress to the LED body during soldering or final application. Do not bend the PCB after assembly.
• Rework:Rework after soldering is strongly discouraged. If unavoidable, a dedicated dual-tip soldering iron must be used to simultaneously heat both solder terminals to prevent mechanical stress caused by thermal expansion mismatch.

7. Ufungaji na Taarifa za Kuagiza

7.1 Vipimo vya Reel na Tape ya Kubeba

Components are supplied on 8mm wide carrier tape wound on standard 7-inch diameter reels. Each reel contains 3000 pieces. Detailed reel and tape dimensions are provided to ensure compatibility with automated assembly equipment.

7.2 Maelezo ya Lebo

Lebo la rejareja lina misimbo kadhaa:

• P/N:Nambari ya Bidhaa (mfano, 19-219/T3D-AQ2R2TY/3T).
• CAT:Ngazi ya Ukali wa Mwanga (mfano, Q1, R1, R2).
• HUE:Viwianishi vya Rangi na Ngazi ya Urefu wa Wimbi Kuu (mfano, 1-6).
• REF:Forward Voltage Class (e.g., 28-31).
• LOT No:Traceable production lot number.

These codes allow for precise identification and traceability of product performance characteristics.

8. Mazingatio ya Ubunifu wa Matumizi

8.1 Circuit Design

The most critical aspect of driving this LED is current regulation. For many applications, a simple series resistor is sufficient. The resistor value (R_s) can be calculated using Ohm's Law: R_s= (V_supply- V_F) / I_F. Always use the maximum V value within the gear range to ensure that when V is at its maximum, the current does not exceed the required I._Fvalue, to ensure that when V_Fsupply_{is at its maximum, the current does not exceed the required I.}. To maintain stability during temperature changes or with variable supply voltage, consider using a constant current driver.

8.2 Thermal Management

Ingawa matumizi ya nguvu ni ya chini, katika hali ya joto kali au nafasi iliyofungwa, joto la kiungo linaweza kupanda, na hivyo kupunguza mwanga unaotolewa na maisha ya matumizi. Hakikisha upangaji wa PCB una mtiririko wa hewa wa kutosha au muundo wa kupoeza, hasa wakati LED nyingi zimepangwa kwa karibu.

8.3 Optical Design

Pembe ya kuona ya digrii 130 hutoa mwanga mpana na uliosambaa. Kwa matumizi yanayohitaji boriti iliyolenga zaidi, vifaa vya sekondari vya macho (lensi) vinahitajika. Mbao ya manjano inayosambaza husaidia kufikia muonekano wa mwanga sawasawa.

9. Technical Comparison and Positioning

LED ya 19-219 ni ya kundi la SMD LED ndogo sana. Tofauti yake kuu ni ukubwa wake mdogo sana wa ufungaji wa 1.6mm x 0.8mm, ambao ni mdogo kuliko ufungaji wa kawaida wa 0603 (eneo sawa lakini umbo tofauti) au 0805. Hii inafanya iwe chaguo bora kwa matumizi yenye nafasi ndogo, ambapo kila milimita ya mraba ni muhimu. Ikilinganishwa na LED kubwa zaidi za PLCC au zilizopitishwa, inatoa msongamano mkubwa wa ufungaji na ni muhimu kwa usanikishaji wa kisasa wa otomatiki. Nyeupe safi inayopatikana kupitia chip ya mwanga wa bluu na poda ya manjano, hutoa halijoto ya rangi ya nyeupe ya wastani hadi baridi inayofaa kwa viashiria vya mwanga na taa za nyuma.

10. Maswali Yanayoulizwa Mara kwa Mara (FAQ)

10.1 Kwa nini Upinzani wa Kikomo wa Mkondo ni Muhimu Kabisa?

LED ni diode, na mkunjo wake wa I-V katika eneo la mbele ni mwinuko sana. Tofauti ndogo ya voltage inayozidi V ya kawaida_Fhusababisha ongezeko kubwa lisilo sawa la mkondo, ambalo linaweza kuharibu kifaa mara moja kwa joto kupita kiasi. Upinzani hutoa punguzo la voltage laini na lenye kutabirika, na hivyo kudumisha mkondo.

10.2 Je, Ninaweza Kuendesha LED Hii Kwa Kifaa cha Umeme cha 5V?

Ndiyo, lakini lazima utumie upinzani uliosanidiwa mfululizo. Kwa mfano, ili kufikia I_Fya 20mA wakati V_Fni 3.0V (kiwango cha juu), thamani ya upinzani inapaswa kuwa R = (5V - 3.0V) / 0.020A = 100 ohms. Nguvu inayotumiwa na upinzani ni P = I²R = (0.02^2)*100 = 0.04W, kwa hivyo upinzani wa kawaida wa 1/8W au 1/10W utatosha.

10.3 Nini Maana ya Msimbo wa Kugawa Daraja kwa Muundo Wangu?

If your design uses multiple LEDs and requires uniform brightness, you should specify LEDs from the same luminous intensity bin (CAT) and chromaticity bin (HUE). If you drive LEDs in parallel, using the same forward voltage bin (REF) helps achieve more balanced current distribution, although using a separate resistor for each LED remains the most reliable method.

How sensitive is this LED to ESD?

Its ESD rating is 150V (HBM), indicating moderate sensitivity. Standard ESD precautions should be observed during handling: use grounded workstations, wrist straps, and conductive containers. The automatic tape and reel packaging helps minimize manual handling.

11. Design and Application Case Studies

11.1 Case Study: Multi-LED Status Indicator Panel

Consider designing a compact control panel with 12 white status indicator lights. Using the 19-219 LED allows them to be placed at very tight pitch. To ensure a uniform appearance, the designer specified all LEDs from bin R1 (112-140 mcd) and chromaticity bin 3. Each LED is driven from a 5V supply rail through a 150-ohm series resistor, setting the current to approximately 13mA (assuming V_F~ 3.0V), which is well below the 25mA limit and provides ample brightness while maximizing lifespan. The PCB layout incorporates the recommended pad geometry and provides small thermal relief connections to the pads to facilitate soldering while maintaining a good thermal path.

12. Introduction to Technical Principles

This white LED is based on a semiconductor principle called electroluminescence. Its core is an indium gallium nitride (InGaN) chip that emits blue light when a forward current is applied across its p-n junction. This blue light then strikes a layer of yellow phosphor (ceramic particles) encapsulated in epoxy resin. The phosphor absorbs a portion of the blue light and re-emits it as yellow light. The remaining blue light and the converted yellow light combine to be perceived by the human eye as white light. The specific ratio of chip emission to phosphor conversion efficiency determines the exact color temperature (warm white, neutral white, cool white) and chromaticity coordinates of the resulting white light.

13. Industry Trends and Development

The trend for indicator and backlight LEDs continues towards miniaturization, higher efficiency, and improved color consistency. Packages like the 19-219 represent ongoing efforts to reduce size while maintaining or improving optical performance. Furthermore, to meet automotive and industrial standards, the industry is continuously pushing for higher reliability across wider temperature ranges and harsher environmental conditions. The adoption of lead-free and RoHS-compliant materials has become standard. Future developments may include smaller form factors, integration of driver circuits within the package, and tunable color temperature LEDs for smart lighting applications. However, for simple indicator roles, the core technology of blue chip + phosphor will remain dominant due to its cost-effectiveness and reliability.