Table of Contents
- 1. Product Overview
- 1.1 Core Features and Compliance
- 1.2 Matumizi Lengwa
- 2. Vigezo vya Kiufundi: Ufafanuzi wa Kimsingi
- 2.1 Absolute Maximum Ratings
- 2.2 Photoelectric Characteristics
- 3. Binning System Description
- 3.1 Luminous Intensity Binning
- 3.2 Dominant Wavelength Binning
- 3.3 Forward Voltage Binning
- 4. Uchambuzi wa Mkunjo wa Utendaji
- 5. Taarifa za Mitambo na Ufungaji
- 5.1 Package Dimensions and Polarity
- 5.2 Moisture Sensitivity and Packaging
- 5.3 Reel and Tape Specifications
- 6. Mwongozo wa Uchomeaji na Usanikishaji
- 6.1 Uhifadhi na Uendeshaji
- 6.2 Reflow Soldering Temperature Profile
- 6.3 Manual Soldering and Rework
- 7. Application Suggestions and Design Considerations
- 7.1 Rate limiting must be used.
- 7.2 Thermal management.
- 7.3 Optical Design
- 8. Technical Comparison and Differentiation
- 8.1 Kanuni ya Ufanyaji Kazi
- 9. Maswali Yanayoulizwa Mara kwa Mara (Kulingana na Vigezo vya Kiufundi)
- 10. Mifano Halisi ya Uundaji na Matumizi
- 11. Mwelekeo wa Teknolojia
1. Product Overview
This document details the specifications of a surface-mount deep red LED in a compact 17-21 package. Designed for modern electronic assembly, this component significantly reduces size and weight compared to traditional lead-frame LEDs. Its key advantages include enabling smaller printed circuit board (PCB) designs, higher component assembly density, and ultimately contributing to more compact and lightweight end-user devices.
1.1 Core Features and Compliance
该 LED 以 8mm 载带形式提供,卷绕在 7 英寸直径的卷盘上,完全兼容自动化贴片组装设备。它适用于红外(IR)和气相回流焊工艺。该器件为单色类型,发射深红光。采用无铅材料制造,并符合关键的环境与安全法规,包括欧盟 RoHS 指令、欧盟 REACH 法规以及无卤素要求(Br <900 ppm,Cl <900 ppm,Br+Cl < 1500 ppm)。
1.2 Matumizi Lengwa
Hii LED inafaa kwa matumizi mbalimbali ya viashiria na mwanga wa nyuma. Matumizi ya kawaida ni pamoja na: mwanga wa nyuma wa dashibodi na swichi, viashiria vya hali na mwanga wa nyuma wa kibodi katika vifaa vya mawasiliano kama vile simu na faksi, mwanga wa nyuma wa gorofa wa LCD, na matumizi ya jumla ya viashiria yanayohitaji chanzo cha mwanga mwekundu kidogo na cha kuaminika.
2. Vigezo vya Kiufundi: Ufafanuzi wa Kimsingi
Sura zifuatazo zinatokana na vigezo vya karatasi ya data, na zinachambua kwa kina na kwa usahihi sifa za umeme, mwanga na joto za LED. Isipokuwa imebainishwa vinginevyo, viwango vyote vimebainishwa kwa joto la mazingira (Ta) la 25°C.
2.1 Absolute Maximum Ratings
These ratings define the limits beyond which permanent damage to the device may occur. Operation under or beyond these conditions is not guaranteed and should be avoided in circuit design.
- Reverse Voltage (VR):5V. Exceeding this reverse voltage may cause junction breakdown.
- Continuous Forward Current (IF):25 mA. This is the maximum DC current recommended for reliable long-term operation.
- Peak Forward Current (IFP):60 mA. This current is only permitted under pulse conditions with a duty cycle of 1/10 and a frequency of 1 kHz, and must not be used continuously.
- Power Dissipation (Pd):60 mW. Hii ndiyo nguvu ya juu inayoweza kutawanywa na kifuniko bila kuzidi kikomo chake cha joto.
- Utoaji wa umeme wa tuli (ESD) kwa mfano wa mwili wa binadamu (HBM):2000V. Hii inaonyesha usikivu wa kifaa kwa umeme wa tuli; ni lazima kufuata taratibu sahihi za usindikaji wa ESD.
- Joto la uendeshaji (Topr):-40°C to +85°C. This is the specified ambient temperature range over which the device is designed to operate.
- Storage Temperature (Tstg):-40°C to +90°C. This is the storage temperature range for the device when it is not powered.
- Welding temperature (Tsol):For reflow soldering, the peak temperature is specified as 260°C for a maximum of 10 seconds. For manual soldering, the soldering iron tip temperature should not exceed 350°C, for a maximum of 3 seconds per terminal.
2.2 Photoelectric Characteristics
Vigezo hivi vinafafanua utoaji wa mwanga na tabia ya umeme ya LED chini ya hali ya kawaida ya uendeshaji (IF=20mA, Ta=25°C).
- Nguvu ya mwanga (Iv):Anuwai kutoka kiwango cha chini cha 36.00 mcd hadi kiwango cha juu cha 90.00 mcd. Thamani ya kawaida haijabainishwa, ikionyesha utendakazi unasimamiwa kupitia mfumo wa kugawa darasa (angalia Sehemu ya 3).
- Viewing Angle (2θ1/2):The typical full viewing angle at half intensity is 140 degrees, providing a wide emission pattern.
- Peak Wavelength (λp):Wavelength ya kawaida yenye pato la juu zaidi la nguvu ya mwanga ni 639 nanometers (nm), iko katika eneo la nyekundu ya kina la wigo.
- Wavelength kuu (λd):Safu ya wavelength ya rangi inayohisiwa ni kutoka 625.5 nm hadi 637.5 nm. Hii pia inasimamiwa kwa kufanya grading.
- Upana wa wigo (Δλ):The typical Full Width at Half Maximum (FWHM) of the emission spectrum is 20 nm.
- Forward Voltage (VF):At 20mA, the range is from 1.75V to 2.35V. This parameter is binned.
- Reverse Current (IR):Maximum 10 μA when a 5V reverse voltage is applied. The datasheet clearly states that this device is not designed for reverse operation; this test parameter is for quality assurance only.
Important Note:Mwongozo wa data unabainisha uvumilivu wa utengenezaji: nguvu ya mwanga (±11%), wavelength kuu (±1nm) na voltage ya mbele (±0.1V). Hizi zinatumika kwa maadili yaliyopangwa kwa makundi.
3. Binning System Description
Ili kuhakikisha uthabiti katika uzalishaji wa kiwango kikubwa, LED zinapangwa kwa makundi kulingana na vigezo muhimu vya utendaji (binning). Hii inawaruhusu wabunifu kuchagua vipengele vinavyokidhi mahitaji maalum ya mwangaza na rangi kwa matumizi yao.
3.1 Luminous Intensity Binning
Kulingana na kiwango cha mwanga kilichopimwa wakati IF=20mA, LED zimegawanywa katika vikundi vinne (N2, P1, P2, Q1). Kwa mfano, kiwango cha mwanga cha LED ya kundi Q1 kitakuwa kati ya 72.00 hadi 90.00 mcd.
3.2 Dominant Wavelength Binning
Rangi inayohisiwa (hue) inadhibitiwa kupitia vigezo vitatu vya urefu wa wimbi (E6, E7, E8). LED za kiwango cha E6 zina urefu wa wimbi kuu kati ya 625.50 nm hadi 629.50 nm, na ikilinganishwa na kiwango cha E8 (633.50 nm hadi 637.50 nm), hutoa hue nyekundu tofauti kidogo.
3.3 Forward Voltage Binning
Forward voltage is divided into three groups (0, 1, 2). This is crucial for designing current-limiting circuits, especially when driving multiple LEDs in series, to ensure uniform current distribution. The VF of group 0 LEDs ranges from 1.75V to 1.95V, while that of group 2 LEDs ranges from 2.15V to 2.35V.
4. Uchambuzi wa Mkunjo wa Utendaji
Although the provided PDF excerpt indicates the "Typical Electro-Optical Characteristics Curves" section, the specific charts (e.g., IV curve, relative intensity vs. current, relative intensity vs. temperature, spectral distribution) are not included in the text content. In the full datasheet, these curves are essential for design. They typically show:
- Mkondo wa mbele dhidi ya voltage ya mbele (mkunjo wa IV):Inaonyesha uhusiano usio na mstari, unaosaidia kubainisha upinzani wa nguvu na voltage inayohitajika ya kuendesha kwa mkondo fulani.
- Nguvu ya mwanga jamaa dhidi ya mkondo wa mbele:Inaonyesha jinsi pato la mwanga linavyoongezeka kwa kuongezeka kwa mkondo, kwa kawaida huonyesha athari ya kutosheleza kwenye mikondo ya juu.
- Mwangaza wa jamaa dhidi ya joto la mazingira:Inaonyesha kupungua kwa pato la mwanga kadiri joto la kiungo linavyoongezeka, ambalo ni muhimu kwa usimamizi wa joto.
- Usambazaji wa wigo uliokadiriwa:Chora grafu ya uhusiano wa nguvu ya jamaa na urefu wa wimbi, ili kuthibitisha kwa macho urefu wa wimbi wa kilele (639nm) na upana wa wigo (20nm).
Wabunifu wanapaswa kukagua hati kamili ya data iliyo na michoro, ili kuiga kwa usahihi tabia ya LED chini ya hali zisizo za kawaida (mtofauti wa umeme au joto).
5. Taarifa za Mitambo na Ufungaji
5.1 Package Dimensions and Polarity
This LED uses a standard 17-21 SMD package outline. The key dimensions (in millimeters) are critical for PCB pad pattern design. The package is marked with a cathode for polarity identification. A typical pad pattern should have two pads corresponding to the anode and cathode terminals respectively, with recommended pad sizes and spacing to ensure proper soldering and mechanical stability. The exact dimensions should be obtained from the "Package Dimensions" drawing in the datasheet.
5.2 Moisture Sensitivity and Packaging
Kifaa hiki kimefungwa kwenye mfuko wa kizuizi cha unyevu ulio na kikaushi, ili kuzuia kunyonya unyevunyevu wa anga, ambao unaweza kusababisha "popcorn" (ufa wa ufungaji) wakati wa upitishaji joto wa juu wa reflow. Lebo kwenye mfuko ina maelezo muhimu ya kufuatilia na utumiaji: Nambari ya Bidhaa ya Mteja (CPN), Nambari ya Bidhaa (P/N), Idadi ya Ufungaji (QTY), na msimbo maalum wa kiwango cha mwanga (CAT), urefu wa wimbi kuu (HUE), na voltage ya mbele (REF).
5.3 Reel and Tape Specifications
Vipengele vinapatikana katika umbo la tape ya uchakavu ya kujitokeza, vilivyoviringishwa kwenye spool ya inchi 7. Vipimo vya tape ya uchakavu (ukubwa wa mfuko, umbali) na vipimo vya spool (kipenyo cha shimoni, kipenyo cha flange) vimewekwa kiwango, ili kuendana na vifaa vya usanikishaji otomatiki. Idadi ya mzigo kwa kila spool imebainishwa kuwa vipande 3000.
6. Mwongozo wa Uchomeaji na Usanikishaji
Kufuata miongozo hii ni muhimu kwa mavuno bora ya usanikishaji na uimara wa muda mrefu.
6.1 Uhifadhi na Uendeshaji
- Usifungue mfuko wa kuzuia unyevunyevu kabla ya matumizi.
- Baada ya kufunguliwa, LED zisizotumika zinapaswa kuhifadhiwa katika mazingira ya ≤30°C na unyevu wa jamaa (RH) ≤60%.
- "Maisha ya kiwanda" baada ya kufungua mfuko ni saa 168 (siku 7). Sehemu zisizotumika zaidi ya kipindi hiki lazima zikaushwe upya (60±5°C, saa 24) na kufungwa tena kwa draya mpya kabla ya matumizi.
- Fuata daima taratibu salama za ESD (utokaji umeme tuli).
6.2 Reflow Soldering Temperature Profile
Defines the temperature profile for lead-free reflow soldering. Key parameters include:
- Preheat:150-200°C, for 60-120 seconds.
- Time above liquidus (217°C):60-150 seconds.
- Peak temperature:Kiwango cha juu cha 260°C.
- Muda ndani ya ±5°C ya kiwango cha juu cha joto:Kwa upeo wa sekunde 10.
- Kiwango cha juu cha kupanda kwa joto:6°C/sekunde.
- Muda wa joto kuwa zaidi ya 255°C:Kwa upeo wa sekunde 30.
- Kasi ya juu ya baridi:3°C/sekunde.
Kanuni muhimu:The same LED should not undergo reflow soldering more than twice.
6.3 Manual Soldering and Rework
If manual soldering is necessary, use a soldering iron with a tip temperature ≤350°C and heat each terminal for ≤3 seconds. Use a low-power soldering iron (≤25W) and allow a cooling interval of ≥2 seconds between terminals. The datasheet strongly advises against rework after LED soldering. If absolutely necessary, a dedicated dual-tip soldering iron must be used to simultaneously heat both terminals during removal to avoid mechanical stress, and the impact on LED characteristics must be verified.
7. Application Suggestions and Design Considerations
7.1 Rate limiting must be used.
LED ni kifaa kinachoendeshwa na mkondo. Mwongozo wa data unatahadharisha wazi, ni lazima kutumia upinzani wa kizuizi cha mkondo uliosanidiwa mfululizo. Voltage ya mbele ina mgawo hasi wa joto, na kwa sababu ya sifa za kielelezo za IV za diode, mabadiliko madogo yanaweza kusababisha mabadiliko makubwa ya mkondo, yanayoweza kusababisha kukosekana kwa udhibiti wa joto na kushindwa kufanya kazi.LazimaMatumizi. Voltage chanya ina mgawo hasi wa joto. Kutokana na sifa za kielelezo za IV za diode, mabadiliko madogo yanaweza kusababisha mabadiliko makubwa ya mkondo, na hivyo kuweza kusababisha udhibiti mbaya wa joto na hitilafu.
7.2 Thermal management.
Ingawa kifurushi ni kidogo, ni lazima kuzingatia kikomo cha matumizi ya nguvu cha 60mW. Kufanya kazi katika halijoto ya juu ya mazingira au mkondo wa juu utapunguza pato la mwanga na maisha ya huduma. Ukifanya kazi karibu na viwango vya juu zaidi vilivyowekwa, hakikisha unatumia eneo la kutosha la shaba la PCB au mashimo ya kupoza joto.
7.3 Optical Design
Pembe ya maono ya 140° hutoa muundo wa mwanga mpana na uliosambaa, unaofaa kwa taa za eneo au viashiria vinavyohitaji kuonekana kutoka kila pembe. Kwa mwanga uliolenga zaidi, lenzi au kioakisi cha nje kinahitajika.
8. Technical Comparison and Differentiation
Tofauti kuu ya LED hii ya nyekundu nyeusi 17-21 iko katika mchanganyiko wake wa nyenzo maalum za semiconductor (AIGaInP) na ufungaji mwembamba sana wa kusakinishwa kwenye uso.
- Ikilinganisha na LED za zamani za mashimo ya kupita:Hutoa akiba kubwa ya nafasi, kupunguza uzito, na usawa na usanikishaji wa otomatiki wa kasi, na hivyo kupunguza gharama za jumla za utengenezaji.
- Ikilinganisha na LED nyekundu zingine za SMD:Ikilinganisha na mifumo mingine ya nyenzo zinazotumika kwa utoaji wa mwanga nyekundu, teknolojia ya AIGaInP kwa kawaida hutoa ufanisi wa juu na utulivu bora wa utendaji wa joto. Uchaguzi wa rangi maalum ya 639nm ya kilele/nyekundu nyangavu unaweza kutokana na upekee wake wa kuona au ufanisi katika matumizi fulani ya sensor.
- Ikilinganisha na vifurushi vikubwa vya SMD (k.m. 3528, 5050):Kifurushi cha 17-21 ni kidogo sana, kinaruhusu muundo mdogo sana, lakini kwa sababu ya ukubwa mdogo wa chip na mipaka ya joto, pato la jumla la mwanga kwa kawaida ni la chini.
8.1 Kanuni ya Ufanyaji Kazi
Mwanga hutolewa kupitia mchakato wa umeme-utulivu ndani ya chipu ya semikondukta ya AIGaInP (Aluminium-Gallium-Indium-Phosphide). Unapotumia voltage chanya, elektroni na mashimo huingizwa kwenye eneo lenye uwezo la makutano ya semikondukta. Wakati vibeba hivi vinaungana tena, hutolewa nishati yao kwa namna ya fotoni (mwanga). Muundo maalum wa aloi ya AIGaInP huamua nishati ya pengo la bendi, ambayo moja kwa moja hufafanua urefu wa wimbi la mwanga unaotolewa (rangi) — kwa mfano huu, nyekundu nene takriban 639 nm.
9. Maswali Yanayoulizwa Mara kwa Mara (Kulingana na Vigezo vya Kiufundi)
Swali: Naweza kutumia chanzo cha umeme cha mantiki cha 3.3V au 5V kuendesha LED hii moja kwa moja?
Jibu: Hapana. Lazima utumie daima kipingamanishaji cha mfululizo cha kudhibiti mkondo. Thamani ya kipingamanishaji inayohitajika huhesabiwa kwa kutumia sheria ya Ohm: R = (Voltage ya Chanzo - Voltage ya Mbele ya LED) / Mkondo Unaotarajiwa. Kwa muundo ulio na uangalifu, tumia VF ya juu zaidi (2.35V), chanzo cha 3.3V, na mkondo wa lengo wa 20mA: R = (3.3 - 2.35) / 0.02 = 47.5Ω. Kipingamanishaji cha kawaida cha 47Ω au 51Ω kinafaa.
Swali: Kwa nini nguvu ya mwanga inatolewa kwa njia ya masafa na makundi?
A: Kutokana na tofauti za asili katika utengenezaji wa semiconductor, utendakazi wa LED moja-moja hutofautiana kidogo. Kugawanya katika makundi huwagawa kwenye vikundi vilivyo na thamani za chini na za juu zilizohakikishiwa, huku wabunifu wakiweza kuchagua kiwango cha mwangaza kinachofaa kulingana na mahitaji yao ya gharama na utendakazi.
Q: Nini kitatokea ikiwa maisha ya kiwanda yazidi siku 7 baada ya kufungua mfuko?
A: Unyevu uliokithiri unaweza kugeuka kuwa mvuke wakati wa upasuaji wa reflow, na kusababisha kutengana kwa ndani au kuvunjika. Sehemu hizi lazima zibadilishwe tena kwa kukaanga kwa saa 24 kwenye 60°C kabla ya matumizi.
Q: Je, LED hii inafaa kwa taa za dashibodi za gari?
Ingawa "Mwangaza wa Nyuma wa Dashibodi" imeorodheshwa kama matumizi moja, daftari la data lina sehemu ya "Vikwazo vya Matumizi". Linatahadharisha kwamba matumizi ya uaminifu wa juu kama mifumo ya usalama/usalama wa gari yanaweza kuhitaji bidhaa tofauti, zilizothibitishwa kwa ukali zaidi. Kwa taa zisizo muhimu za dashibodi, inaweza kufaa, lakini kwa viashiria vya usalama muhimu, bidhaa maalum zinazokidhi viwango vya gari (k.m. AEC-Q102) zinapaswa kununuliwa.
10. Mifano Halisi ya Uundaji na Matumizi
Tukio: Buni jopo la kiashiria cha hali kinachobana.A designer needs to use multiple deep red status LEDs on a component-dense control board. They selected the 17-21 LED for its small size. They specified the Q1 brightness bin and E7 wavelength bin to ensure all indicators have a bright, consistent color. For the PCB layout, they used the recommended pad pattern from the datasheet. They designed the drive circuit using a 3.3V regulator, a 51Ω current-limiting resistor per LED (resulting in approximately 18-20mA current), and placed small thermal relief pads. During assembly, they ensured the factory-sealed reels were used within their workshop shelf life and followed the specified reflow soldering temperature profile. This resulted in a reliable, compact indicator system.
11. Mwelekeo wa Teknolojia
The overall trend in LED technology, including indicator lights, is progressing towards several key areas:
- Uboreshaji wa ufanisi:Maboresho ya kuendelea ya sayansi ya nyenzo yanalenga kutoa mwanga zaidi (lumeni) kwa kila kitengo cha nguvu ya umeme (wati), na hivyo kupunguza matumizi ya nishati na mzigo wa joto.
- Udogo:Packaging continues to shrink (e.g., from 17-21 to smaller form factors like 10-05) to enable smaller electronic devices.
- Higher Reliability and Robustness:Improvements in packaging materials and die-attach technologies enhance lifespan and resistance to thermal cycling and moisture.
- Integration:The trend is to integrate multiple LEDs (e.g., RGB), control ICs, and even passive components into a single, smarter modular package.
- Standardization and Compliance:Kanuni za mazingira kali zaidi na pana zaidi (RoHS, REACH, zisizo na halojeni) zinaendelea kusukuma mabadiliko ya nyenzo katika tasnia nzima.
Maelezo ya kina ya istilahi za vipimo vya LED
Maelezo kamili ya istilahi za kiteknolojia ya LED
I. Viashimia vya Msingi vya Utendaji wa Umeme na Mwanga
| Istilahi | Vitengo/Uwakilishi | Popular Explanation | Why It Is Important |
|---|---|---|---|
| Ufanisi wa Mwanga (Luminous Efficacy) | lm/W (lumen/watt) | Mwangaza unaotolewa kwa kila watt ya umeme, ukiongezeka huwa na ufanisi zaidi wa nishati. | Huamua moja kwa moja kiwango cha ufanisi wa nishati ya taa na gharama ya umeme. |
| Luminous Flux | lm (lumen) | Jumla ya mwanga unaotolewa na chanzo cha mwanga, unaojulikana kwa jina la "mwangaza". | Huamua kama taa inatosha kuwa na mwangaza. |
| Pembe ya kuangazia (Viewing Angle) | ° (digrii), kama 120° | Pembe ambapo mwangaza unapungua kwa nusu, huamua upana wa boriti. | Huathiri eneo la mwanga na usawa wake. |
| Joto la rangi (CCT) | K (Kelvin), k.m. 2700K/6500K | Joto la rangi ya mwanga, thamani ya chini inaelekea manjano/joto, thamani ya juu inaelekea nyeupe/baridi. | Inaamua mazingira ya taa na matumizi yanayofaa. |
| Kielelezo cha Uonyeshaji Rangi (CRI / Ra) | Hakuna kitengo, 0–100 | Uwezo wa chanzo cha mwanga kurejesha rangi halisi ya kitu, Ra≥80 ni bora. | Inaathiri ukweli wa rangi, hutumika katika maeneo yenye mahitaji makubwa kama maduka makubwa, majumba ya sanaa n.k. |
| Color Tolerance (SDCM) | MacAdam Ellipse Steps, e.g., "5-step" | A quantitative indicator of color consistency; a smaller step number indicates higher color consistency. | Kuhakikisha hakuna tofauti ya rangi kati ya taa za kundi moja. |
| Dominant Wavelength | nm (nanometer), kama 620nm (nyekundu) | Thamani ya urefu wa wimbi inayolingana na rangi ya LED zenye rangi. | Inaamua hue ya LED ya rangi moja kama nyekundu, manjano, kijani, n.k. |
| Usambazaji wa Wigo (Spectral Distribution) | Mkunjo wa wavelength vs. intensity | Inaonyesha usambazaji wa nguvu ya mwanga unaotolewa na LED katika kila urefu wa wimbi. | Inaathiri ubora wa uonyeshaji rangi na ubora wa rangi. |
II. Vigezo vya Umeme
| Istilahi | Ishara | Popular Explanation | Uzingatiaji wa Ubunifu |
|---|---|---|---|
| Voltage ya Mbele (Forward Voltage) | Vf | Voltage ya chini inayohitajika ili LED iwashwe, kama vile "kizingiti cha kuanzisha". | Voltage ya chanzo cha umeme inahitaji kuwa ≥ Vf, voltage inajumlishwa wakati LED nyingi zimeunganishwa mfululizo. |
| Forward Current | If | The current value that makes the LED emit light normally. | Constant current drive is commonly used, as the current determines brightness and lifespan. |
| Mkondo wa juu zaidi wa msukumo (Pulse Current) | Ifp | Peak current that can be withstood for a short period, used for dimming or flashing. | Pulse width and duty cycle must be strictly controlled to prevent overheating damage. |
| Reverse Voltage | Vr | The maximum reverse voltage that an LED can withstand; exceeding it may cause breakdown. | Mzunguko unahitaji kuzuia uunganishaji kinyume au mshtuko wa voltage. |
| Upinzani wa joto (Thermal Resistance) | Rth (°C/W) | Upinzani wa joto kutoka kwenye chip hadi kwenye sehemu ya kuuzi, thamani ya chini inaonyesha usambazaji bora wa joto. | Upinzani wa juu wa joto unahitaji muundo wa nguvu zaidi wa usambazaji joto, vinginevyo joto la kiungo litaongezeka. |
| Uvumilivu wa Kutokwa na Umeme wa Tuli (ESD Immunity) | V (HBM), kama 1000V | Uwezo wa kukabiliana na mshtuko wa umeme wa tuli, thamani ya juu zaidi inamaanisha uwezo mkubwa wa kuepusha uharibifu kutokana na umeme wa tuli. | Hatua za kinga dhidi ya umeme wa tuli zinahitajika katika uzalishaji, hasa kwa LED zenye usikivu mkubwa. |
Tatu, Usimamizi wa Joto na Uaminifu
| Istilahi | Viashiria Muhimu | Popular Explanation | Athari |
|---|---|---|---|
| Junction Temperature | Tj (°C) | The actual operating temperature inside the LED chip. | Kila kupungua kwa joto la 10°C, maisha ya taa yanaweza kuongezeka mara mbili; joto la juu sana husababisha kupungua kwa mwanga na mabadiliko ya rangi. |
| Kupungua kwa Mwanga (Lumen Depreciation) | L70 / L80 (saa) | Muda unaohitajika ili mwangaza upunguke hadi 70% au 80% ya thamani ya awali. | Inafafanua moja kwa moja "maisha ya huduma" ya LED. |
| Lumen Maintenance | % (e.g., 70%) | The percentage of remaining brightness after a period of use. | Inaonyesha uwezo wa kudumisha mwangaza baada ya matumizi ya muda mrefu. |
| Color Shift | Δu′v′ or MacAdam ellipse | The degree of color change during use. | Affects the color consistency of the lighting scene. |
| Uzeefu wa joto (Thermal Aging) | Kupungua kwa utendaji wa nyenzo | Deterioration of packaging materials due to prolonged high temperatures. | May lead to decreased brightness, color shift, or open-circuit failure. |
IV. Packaging and Materials
| Istilahi | Aina za Kawaida | Popular Explanation | Sifa na Matumizi |
|---|---|---|---|
| Packaging Type | EMC, PPA, Ceramic | A housing material that protects the chip and provides optical and thermal interfaces. | EMC ina msimamo mzuri wa kupinga joto, gharama nafuu; kauri ina ufanisi wa kupoza joto na maisha marefu. |
| Muundo wa chip | Face-up, Flip Chip | Chip electrode arrangement method. | Flip Chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications. |
| Phosphor coating | YAG, silicate, nitride | Inayofunikwa kwenye chip ya mwanga wa bluu, sehemu hubadilishwa kuwa mwanga wa manjano/nyekundu, na kuchanganywa kuwa mwanga mweupe. | Fosfori tofauti huathiri ufanisi wa mwanga, halijoto ya rangi na ubora wa kuonyesha rangi. |
| Lenzi/Usanifu wa Optics | Planar, Microlens, Total Internal Reflection | Optical structures on the packaging surface to control light distribution. | Determine the light emission angle and light distribution curve. |
V. Quality Control and Binning
| Istilahi | Binning Content | Popular Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Grading | Codes such as 2G, 2H | Group by brightness level, each group has a minimum/maximum lumen value. | Ensure consistent brightness for products within the same batch. |
| Mgawanyiko wa voltage | Msimbo kama 6W, 6X | Group by forward voltage range. | Facilitates driver matching and improves system efficiency. |
| Color binning. | 5-step MacAdam Ellipse | Group by color coordinates to ensure colors fall within an extremely small range. | Ensure color consistency to avoid uneven color within the same luminaire. |
| Color temperature binning | 2700K, 3000K, etc. | Pangawiani kulingana na joto la rangi, kila kikundi kina anuwai ya kuratibu inayolingana. | Kukidhi mahitaji ya joto tofauti la rangi kwa matukio mbalimbali. |
Sita, Upimaji na Uthibitishaji
| Istilahi | Kigezo/Upimaji | Popular Explanation | Maana |
|---|---|---|---|
| LM-80 | Upimaji wa Kudumisha Lumeni | Kurekebisha kwa muda mrefu chini ya hali ya joto la kudumu, kurekodi data ya kupungua kwa mwangaza. | Kutumia kukadiria maisha ya LED (kwa kuchanganya TM-21). |
| TM-21 | Standard for Life Projection | Projecting lifetime under actual use conditions based on LM-80 data. | Toa utabiri wa kisayansi wa maisha. |
| IESNA Standard | Illuminating Engineering Society Standard | Inajumuisha mbinu za kupima mwanga, umeme na joto. | Msingi unaokubalika na tasnia ya upimaji. |
| RoHS / REACH | Environmental Certification | Ensure products are free from hazardous substances (e.g., lead, mercury). | Masharti ya kuingia katika soko la kimataifa. |
| ENERGY STAR / DLC | Uthibitisho wa Ufanisi wa Nishati | Uthibitisho wa Ufanisi wa Nishati na Utendaji kwa Bidhaa za Taa. | Hutumiwa kwa kawaida katika miradi ya ununuzi wa serikali na ruzuku, kuimarisha ushindani wa soko. |