LTS-5325CTB-P LED Digital Tube Datasheet - 0.56-Inch Character Height - Blue - 3.8V Forward Voltage - 70mW Power Consumption - Simplified Chinese Technical Documentation

1. Product Overview

LTS-5325CTB-P is a surface-mount device (SMD) designed as a single-digit character display. Its primary function is to provide clear, bright numeric or limited character indications in electronic equipment. Its core technology is based on an InGaN blue LED chip grown on a sapphire substrate, a technology renowned for producing efficient and bright blue light. The device employs a gray panel for high contrast and uses white segment material for light diffusion, thereby achieving excellent character appearance.

1.1 Key Features and Advantages

• Ukubwa wa Nambari:Inatumia urefu wa herufi mkubwa wa inchi 0.56 (milimita 14.22), kuhakikisha kuonekana bora hata kwa umbali.
• Ubora wa Sehemu za Maonyesho:Provide continuous, uniform segments to achieve consistent and professional visual output without gaps or irregularities.
• Energy Efficiency:Low power consumption design, suitable for battery-powered or energy-efficiency-focused applications.
• Optical Performance:Provides high brightness and high contrast, ensuring clear readability even in well-lit environments.
• Viewing Angle:Inatoa mtazamo mpana, kuruhusu kusoma wazi maudhui ya onyesho kutoka maeneo tofauti.
• Uaminifu:Shukrani kwa uaminifu thabiti, hakuna sehemu zinazosonga, na hivyo kuwa na maisha marefu ya huduma, na kuwa na uwezo wa kukabiliana na mshtuko na mtikisiko.
• Udhibiti wa ubora:Vifaa vinapangwa katika makundi kulingana na nguvu ya mwanga ili kuhakikisha kiwango cha mwangaza kinabaki ndani ya safu maalum kwa agizo fulani.
• Uzingatiaji wa Mazingira:Ufungaji umeundwa bila risasi na unazingatia maagizo ya RoHS (Kizuizi cha Vitu Hatari).

1.2 Usanidi wa Kifaa

This is a common cathode display. The specific model LTS-5325CTB-P indicates a blue (B) display with a right-side decimal point (DP). The common cathode configuration simplifies circuit design when using microcontrollers or driver ICs that sink current.

2. Vigezo vya Kiufundi: Ufafanuzi wa kina na usio na upendeleo

This section provides a detailed and objective analysis of the device's operational limits and performance characteristics under specified conditions.

2.1 Absolute Maximum Ratings

Hizi ndizo mipaka ya mkazo isiyopaswa kuzidi chini ya hali yoyote, vinginevyo kunaweza kusababisha uharibifu wa kudumu wa kifaa. Uendeshaji unapaswa kudumishwa daima ndani ya mipaka ya hali zinazopendekezwa za uendeshaji zitakazoelezewa baadaye.

• Matumizi ya nguvu kwa kila sehemu:Upeo wa 70 mW. Hii ndiyo jumla ya nguvu ya umeme (sasa * voltage) inayoweza kubadilishwa kwa usalama kuwa mwanga na joto ndani ya sehemu moja.
• Peak forward current per segment:Maximum 30 mA, but only under pulse conditions (1/10 duty cycle, 0.1 ms pulse width). This rating applies to brief high-current pulses, not continuous operation.
• Continuous forward current per segment:The maximum current is 25 mA at 25°C. When the ambient temperature (Ta) exceeds 25°C, this current is linearly derated by 0.28 mA for every 1°C increase. For example, at 85°C, the maximum continuous current is approximately: 25 mA - [0.28 mA/°C * (85°C - 25°C)] = 25 mA - 16.8 mA = 8.2 mA.
• Operating and Storage Temperature Range:-35°C to +105°C. The device can be stored or operated within this full range.
• Soldering Temperature:Capable of withstanding 260°C soldering iron for 3 seconds, with the iron tip placed at least 1/16 inch (≈1.6 mm) below the package mounting plane.

2.2 Electrical and Optical Characteristics

These parameters define the typical performance of the device when operating under its recommended conditions (Ta=25°C).

• Nguvu ya wastani ya mwanga inayotolewa (I_V):Wakati mkondo wa mbele (I_F) ni 10 mA, ni kati ya 8600 µcd (kiwango cha chini) hadi 28500 µcd (kiwango cha kawaida). Anuwai hii pana inaonyesha kifaa kimepangwa katika makundi; kiwango maalum cha nguvu kitaainishwa katika taarifa za kuagiza.
• Forward voltage per chip (V_F):At I_F=5 mA, the typical value is 3.8V, and the maximum value is 3.8V. This is the voltage drop across the LED when it is lit. Designers must ensure that the driving circuit can provide this voltage.
• Peak emission wavelength (λ_p):468 nm. This is the wavelength at which the emitted light intensity is highest, located precisely in the blue region of the visible spectrum.
• Wavelength kuu (λ_d):470 nm. Hii ndiyo urefu wa wimbi mmoja unaotambuliwa na jicho la binadamu unaowakilisha rangi ya mwanga, karibu sana na urefu wa wimbi wa kilele.
• Upana wa nusu ya mstari wa wigo (Δλ):25 nm. Hii inaashiria usafi wa wigo; thamani ndogo inamaanisha rangi ya mwanga inakuwa ya monokromati zaidi (rangi safi zaidi). 25 nm ni thamani ya kawaida ya LED ya bluu ya kawaida.
• Reverse current (I_R):At a reverse voltage (V_R) of 5V, maximum 100 µA. This parameter is for test purposes only; the device is not designed for reverse bias operation.
• Luminous intensity matching ratio:Within the same "similar light zone," the maximum ratio between segment codes is 2:1. This means the brightness of the brightest segment should not exceed twice that of the dimmest segment to ensure uniformity.
• Crosstalk:Specified as ≤ 2.5%. This refers to unwanted light leakage or electrical interference between adjacent segment codes.

2.3 Electrostatic Discharge (ESD) Protection

LED ni nyeti sana kwa kutokwa kwa umeme tuli. Mwongozo unapendekeza kwa nguvu kutumia hatua za udhibiti wa ESD wakati wa usindikaji na usanikishaji ili kuzuia uharibifu unaoweza kutokea au wa kubwa:

• Wafanyikazi wanapaswa kutumia mkanda wa mkono wenye kutuliza au glavu za kuzuia umeme tuli.
• Kituo chote cha kazi, vifaa na vifaa vya uhifadhi lazima viwe na uingizaji sahihi wa ardhi.
• Inashauriwa kutumia kifaa cha upepo wa ioni (kipulizia ioni) ili kusawazisha malipo ya umeme ya tuli yanayoweza kukusanyika kwenye uso wa kifuniko cha plastiki kutokana na msuguano wakati wa usindikaji, hasa kwa aina zisizo na kusambaa (N/D).

3. Maelezo ya Mfumo wa Kugawanya

Mwongozo unaelezea wazi kifaa "kimeainishwa kulingana na nguvu ya mwanga." Hii inamaanisha kuwepo kwa mfumo wa kugawanya darasa, ingawa maelezo maalum ya misimbo ya darasa hayajatolewa katika dondoo hili. Kwa kawaida, mifumo kama hii inajumuisha:

• Mgawanyo wa nguvu ya mwanga:LED katika kundi la uzalishaji hupimwa na kugawanywa katika makundi tofauti (darasa) kulingana na pato lao la mwanga lililopimwa chini ya mkondo wa kawaida wa majaribio (kwa mfano 10 mA). Hii inahakikisha mteja anapokea LED zenye mwangaza thabiti ndani ya safu iliyobainishwa mapema (kwa mfano 8600-12000 µcd, 12000-18000 µcd, n.k). Safu mpana kutoka kiwango cha chini hadi kiwango cha kawaida katika jedwali la sifa (8600 hadi 28500 µcd) inasaidia mazoea haya.
• Forward Voltage Binning:Although not explicitly mentioned here, LEDs are typically also binned based on forward voltage (V_F) to ensure uniform current distribution when multiple LEDs are connected in parallel.
• Wavelength Binning:For applications with stringent color requirements, LEDs may also be binned according to dominant wavelength or peak wavelength to ensure color consistency. A tight specification (λ_d= 470 nm) indicates a controlled process, but binning may still be performed for high-end grades.

4. Performance Curve Analysis

The datasheet contains a "Typical Electrical/Optical Characteristics Curves" section. While specific curves are not provided in the text, these typically include the following curves crucial for design:

• Ukubwa wa mwanga wa jamaa dhidi ya mkondo wa mbele (Mkondo wa I-V):Inaonyesha jinsi pato la mwanga linavyobadilika kadri mkondo wa kuendesha unavyoongezeka. Kwa kawaida sio laini, na huelekea kujaa kwenye mikondo ya juu.
• Voltage ya mbele dhidi ya mkondo wa mbele:It illustrates the relationship between voltage and current, which is crucial for designing current-limiting circuits or constant-current drivers.
• Relative Luminous Intensity vs. Ambient Temperature:It shows how the light output decreases as the LED junction temperature increases. This is critical for thermal management in applications.
• Usambazaji wa Nguvu ya Wigo:Chati inayoonyesha ukubwa wa mwanga unaotolewa kwa kila urefu wa wimbi, kuthibitisha bluu na upana wa wigo.

Wabunifu wanapaswa kurejelea mikondo hii ili kuboresha mkondo wa kuendesha kwa mwangaza unaohitajika, kuelewa mahitaji ya voltage, na kupanga athari za joto.

5. Mechanical and Packaging Information

5.1 Vipimo vya Ufungaji

This device complies with specific SMD package dimensions. Key dimension descriptions include:

• All dimensions are in millimeters, and unless otherwise specified, the general tolerance is ±0.25 mm.
• Segment area quality standards: Foreign matter ≤ 10 mil, ink contamination ≤ 20 mil, bubbles ≤ 10 mil.
• The curvature of the reflector must be ≤ 1% of its length.
• Chonge kwenye pini za plastiki zisizidi milimita 0.14.

Mhandisi anatakiwa kutumia mchoro wa vipimo uliotolewa (haujaelezewa kamili katika maandishi) kuunda muundo sahihi wa PCB pad.

5.2 Usanidi wa Pini na Upekee

The device uses a 10-pin configuration. Pin 1 is indicated in the diagram. The pin arrangement is as follows:

• Pin 1: Segment E Anode
• Pin 2: Segment D Anode
• Pin 3: Common Cathode 1
• Pin 4: Segment C Anode
• Pin 5: Decimal Point (DP) Anode
• Pin 6: Segment B Anode
• Pin 7: Segment B Anode
• Pin 8: Common Cathode 2
• Pin 9: Segment F Anode
• Pin 10: Segment G Anode

The internal circuit diagram shows that all segment anodes are independent, while the cathodes of all segments are internally connected to two pins (3 and 8), which must be connected together on the PCB to form a common cathode.

5.3 Recommended Land Pattern

Sura ya uipendekezayo ya pad ya PCB imetolewa ili kuhakikisha muundo thabiti wa mnyororo wakati wa upakiaji tena na usawa sahihi. Sura hii inazingatia vipimo vya kifurushi na mahitaji ya kiasi cha mchanga wa solder.

6. Mwongozo wa Uchomeaji na Usanikishaji

6.1 SMT Welding Instructions

Maelekezo Muhimu ya Usanikishaji wa Vifaa Vinavyobandikwa kwenye Uso:

• Reflow soldering (Njia kuu):
  • Upashaji joto awali: 120–150°C.
  • Muda wa upashaji joto awali: Sio zaidi ya sekunde 120.
  • Joto la kilele: hadi 260°C.
  • Muda juu ya mstari wa kioevu: hadi sekunde 5.
• Soldering with soldering iron (for repair/rework only):
  • Soldering iron temperature: maximum 300°C.
  • Contact time: maximum 3 seconds per solder joint.
• Critical limitation:The device can withstand a maximum of two reflow process cycles. After the first reflow, the board must be completely cooled to room temperature before the second reflow process (e.g., for double-sided assembly).

6.2 Moisture Sensitivity and Storage

Vionyeshi vya SMD husafirishwa kwenye mfuko wa kinga ya unyevu. Ili kuzuia "janga la popcorn" (ufa wa kifuniko unaosababishwa na upanuzi wa haraka wa mvuke wakati wa mchakato wa reflow), lazima kufuata masharti yafuatayo ya uhifadhi:

• Uhifadhi:Mizifungu isiyofunguliwa inapaswa kuhifadhiwa katika mazingira yenye joto ≤ 30°C na unyevu wa jamaa ≤ 60%.
• Muda wa kufichuliwa:Mara tu mfuko uliofungwa ufunguliwe, mchakato wa kunyonya unyevu huanza. Vipengele vina "maisha ya kiwanda" vya kikomo chini ya hali ya mazingira.
• Kupasha joto:If components are exposed to ambient humidity beyond their safe limits, they must be baked before reflow to remove moisture. Baking should be performed only once to avoid thermal stress.
  • Components on reels: Bake at 60°C for ≥ 48 hours.
  • Bulk components: Bake at 100°C for ≥ 4 hours or at 125°C for ≥ 2 hours.

7. Packaging and Ordering Information

7.1 Packaging Specifications

The device is supplied in tape and reel format, suitable for automatic surface-mount assembly.

• Mkanda wa usafirishaji:Imeundwa kwa mchanganyiko wa polystireni yenye umeme mweusi. Vipimo vinakubaliana na kiwango cha EIA-481-D.
• Vipimo vya mkanda wa usafirishaji:Includes specific pocket dimensions to securely hold components. Warpage controlled to not exceed 1mm over a length of 250mm.
• Reel information:
  • Standard packaging length per 22-inch reel: 44.5 meters.
  • Idadi ya vipengele kwa kila spooli ya inchi 13: vipengele 700.
  • Kiwango cha chini cha kuagiza kwa mabaki/mwisho wa spooli: vipengele 200.
• Lead Tape and Tail Tape:The reel contains a lead tape (at least 400 mm) and a tail tape (at least 40 mm) for machine feeding.

8. Application Suggestions and Design Considerations

8.1 Typical Application Scenarios

• Test and Measurement Equipment:Digital multimeters, oscilloscopes, power supplies require clear digital readouts.
• Consumer Electronics:Vikuza sauti, skrini za vifaa vya nyumbani (tanuri ya microwave, tanuri), vifaa vya mazoezi.
• Udhibiti wa Viwanda:Paneli za mita, viashiria vya mchakato, maonyesho ya timer.
• Soko la baada ya mauzo ya magari:Inahitaji dashibodi na skrini zenye mwangaza mkubwa.

8.2 Design Considerations

• Current drive:Always use a constant current driver or a current limiting resistor in series with each segment anode. According to the supply voltage (V_cc), typical LED forward voltage (V_F~ 3.8V) and the required forward current (I_F, for example, to achieve good brightness within limits, take 10-20 mA) to calculate the resistance value. Example: R = (V_cc- V_F) / I_F.
• Usimamizi wa joto:Ingawa matumizi ya nguvu kwa kila sehemu ni ya chini, ikiwa sehemu nyingi zimewashwa kwa wakati mmoja kwa muda mrefu, haswa katika hali ya joto kali ya mazingira, hakikisha eneo la kutosha la shaba la PCB au mashimo ya upitishaji joto. Kumbuka kanuni za kupunguza sasa.
• Kiolesura cha Microcontroller:Kwa maonyesho ya cathode ya pamoja, pini za microcontroller kawaida hukamata mkondo (kama swichi ya ardhi). Tumia pini za GPIO zilizosanidiwa kama matokeo ya chini ya mfereji wazi au IC maalum ya kuendesha LED yenye uwezo wa kutosha wa kukamata mkondo. Hakikisha mkondo wa jumla unaokamuliwa kutoka kwa chanzo cha umeme uko ndani ya kiwango chake kilichopimwa.
• Ulinzi wa ESD katika mzunguko:Katika matumizi ya mwisho, fikiria kuongeza diode ya kukandamiza voltage ya muda mfupi (TVS) au hatua zingine za ulinzi kwenye mistari inayounganishwa na kionyeshi, haswa ikiwa mistari hiyo inafichuliwa kwa kiolesura cha mtumiaji au viunganishi vya nje.

9. Ulinganishi wa Kiufundi na Tofauti

Ingawa maelezo ya maelezo hayalinganishi moja kwa moja na aina nyingine, kulingana na maelezo yake, tofauti kuu ya LTS-5325CTB-P ni:

• Ikilinganishwa na onyesho la ukubwa mdogo (kama inchi 0.3):Kwa urefu wake mkubwa wa herufi wa inchi 0.56, hutoa uonekano bora zaidi kwa umbali mrefu.
• Ikilinganisha na maonyesho ya LED ya kuingizwa moja kwa moja:Ufungaji wa SMD unaunga mkono usanikishaji wa otomatiki, hupunguza nafasi ya PCB, na huruhusu bidhaa ya mwisho kuwa na urefu wa sehemu ya chini.
• Ikilinganisha na LED ya mwangaza wa kawaida:Uwongo wake wa kawaida wa mwangaza (hadi 28500 µcd kwenye 10mA) unaufanya ufanisi kwa matumizi yanayohitaji mwangaza mkubwa.
• Ikilinganishwa na LED zisizogawanywa katika makundi:Uainishaji wa nguvu ya mwangaza huwapa wabunifu mwangaza unaotabirika zaidi na sawa kwenye sehemu zote na vitengo vingi, jambo muhimu kwa vifaa vyenye muonekano wa kitaalamu.

10. Maswali Yanayoulizwa Mara kwa Mara (kulingana na vipimo vya kiufundi)

1. Swali: Je, kuna tofauti gani kati ya urefu wa wimbi la kilele (468 nm) na urefu wa wimbi kuu (470 nm)?
   Jibu: Urefu wa wimbi la kilele ni msimamo ambapo mwanga unatoka kwa nguvu zaidi kimaumbile. Urefu wa wimbi kuu ni urefu wa wimbi mmoja unaowakilisha rangi ya mwanga kama inavyohisiwa na jicho la binadamu. Kwa kawaida hivi karibu, kama inavyoonyeshwa hapa, lakini inaweza kuwa tofauti kwa baadhi ya rangi. Zote mbili zathibitisha kuwa hii ni LED ya mwanga wa bluu.
2. Swali: Je, naweza kuendesha kionyeshi hiki kwa kutumia chanzo cha umeme cha 5V na upinzani mmoja?
   A: Ndiyo. Kwa kutumia chanzo cha umeme cha 5V (V_cc) na thamani ya kawaida ya V_Fya 3.8V, unahitaji upinzani wa kudhibiti mkondo. Kwa I_F=10 mA: R = (5V - 3.8V) / 0.01A = 120 Ω. Tumia thamani ya kawaida inayofuata, kwa mfano 120 Ω au 150 Ω. Hakikisha kuthibitisha mwangaza halisi na matumizi ya nguvu.
3. Q: Kwa nini kuna pini mbili za cathode za pamoja (3 na 8)?
   Jibu: Hii ni kwa ajili ya kubadilika katika usindikaji wa mkondo na mpangilio wa PCB. Jumla ya mkondo wa cathode ni jumla ya mikondo ya sehemu zote zilizowashwa. Kuwa na pini mbili huruhusu kugawanya mkondo huu, kupunguza msongamano wa mkondo kwa kila pini na kuboresha uaminifu. Pini zote mbili lazima ziunganishwe kwenye ardhi kwenye PCB yako.
4. Swali: Idadi ya juu ya reflow ni mara mbili. Nini cha kufanya ikiwa nahitaji kurekebisha bodi kwa mara ya tatu?
   Jibu: Hii haipendekezi kabisa. Reflow ya tatu itaweka kifurushi cha plastiki na viunganisho vya ndani chini ya mkazo mwingi wa joto, na kuongeza kwa kiasi kikubwa hatari ya kushindwa kufanya kazi. Kwa ajili ya kurekebisha, tumia chuma cha kuuza kwa uangalifu mkubwa sana kwenye viungo maalum vinavyohitaji matengenezo pekee (hadi 300°C, sekunde 3), epuka kupokanzza kipengele kizima.
5. Swali: Je, unaelewaje uwiano wa 2:1 wa kulinganisha ukali wa mwanga?
   Jibu: Hii inamaanisha kuwa ndani ya kitengo kimoja cha kuonyesha, chini ya hali sawa za kuendesha, mwangaza wa sehemu yenye mwanga zaidi haupaswi kuzidi mara mbili ya mwangaza wa sehemu yenye mwanga mdogo zaidi. Hii inahakikisha usawa wa kuona wa herufi zinazoonyeshwa.

11. Ubunifu wa Kivitendo na Mfano wa Matumizi

Mfano: Kubuni usomaji rahisi wa kipima volti cha nambari

Mbunizi anatumia microcontroller yenye ADC kuunda voltamita ya DC ya 0-30V. LTS-5325CTB-P ilichaguliwa kwa sababu ya usomaji mzuri wake.

1. Ubunifu wa saketi:The microcontroller's I/O pins are connected to the segment anodes (A-G, DP) through 150 Ω current-limiting resistors (calculated for a 5V system). The two common cathode pins are tied together and connected to a single NPN transistor (e.g., 2N3904) used as a low-side switch, controlled by a microcontroller pin. This allows for multiplexing when needed, but for a single digit, it can be kept constantly illuminated.
2. Software:The microcontroller reads the ADC value, converts it to a voltage, and then maps this value to the correct 7-segment pattern (0-9). The segment data is sent to the corresponding I/O pins.
3. PCB Layout:Use the recommended land pattern from the datasheet as the footprint. Add thermal relief pads at pad connections to facilitate soldering. Ensure a robust ground connection for the common cathode.
4. Assembly:Bodi ya mzunguko imekusanywa kwa kutumia mkunjo wa kawaida usio na risasi, kuhakikisha joto la kilele halizidi 260°C. Vipengele vimepitia mzunguko mmoja tu wa kuyeyusha.
5. Matokeo:Bidhaa ya mwisho inaonyesha usomaji wa voltage wa bluu ulio wazi, mkali na sawasawa.

12. Utangulizi wa Kanuni ya Uendeshaji

LTS-5325CTB-P inafanya kazi kulingana na kanuni ya mwanga unaotokana na umeme katika kiunganishi cha p-n cha semikondukta. Nyenzo yake yenye ufanisi ni InGaN (indiamu-galliamu nitrati). Wakati voltage chanya inayozidi voltage ya kuwasha diode (takriban 3.3-3.8V) inatumika, elektroni kutoka eneo la aina-n na mashimo kutoka eneo la aina-p huingizwa kwenye eneo lenye ufanisi. Wakati hizi vibeba malipo zinapounganishwa tena, hutoa nishati yao kwa njia ya fotoni (mwanga). Muundo maalum wa aloi ya InGaN huamua nishati ya pengo la bendi, na kwa hivyo hufafanua urefu wa wimbi la mwanga unaotolewa (rangi) — katika mfano huu, ni bluu (~470 nm). Substrate ya sapphire hutoa kiolezo cha fuwele cha kukua safu za InGaN zenye ubora wa juu. Paneli ya kijivu na nyenzo nyeupe za sehemu za nambari huchukua nafasi ya kusambaza na kuimarisha tofauti, kuchonga mwanga kuwa sehemu za nambari zinazotambulika.

13. Mwelekeo wa Kiufundi na Mazingira

Kifaa hiki kinawakilisha teknolojia iliyokomaa na inayotumiwa sana. Utengenezaji wa LED ya bluu kwa kutumia InGaN kwenye sapphire ni mchakato wa kiwango cha tasnia. Mwelekeo wa teknolojia ya kuonyesha unaotoa mazingira kwa sehemu hii ni pamoja na:

• Miniaturization:Although the 0.56-inch is a common size, there is a trend towards even smaller, high-brightness SMD digital tubes for ultra-compact devices.
• Efficiency Improvement:Uendelevu wa maendeleo ya sayansi ya nyenzo umeboresha ufanisi wa mwanga wa InGaN LED (lumeni/wati), kuruhusu mwangaza wa juu zaidi au kupunguza mzigo wa joto kwa sasa ya chini.
• Ujumuishaji:Kuna mwelekeo wa kuunganisha skrini za LED na IC zake za kuendesha na kudhibiti-kidogo katika moduli kamili zaidi za "onyesho akili", na hivyo kurahisisha muundo wa bidhaa ya mwisho.
• Chaguo za rangi na RGB:Ingawa hii ni kioleza cha mwanga wa bluu wenye rangi moja, teknolojia ya msingi ya InGaN pia ndio msingi wa uzalishaji wa taa za LED zenye mwanga wa kijani kibichi na pia mwanga mweupe kwa kuchanganya fosforasi. Violeza vya RGB vyenye rangi kamili vinavyotumia taa ndogo za SMD pia vinazidi kuwa vya kawaida, vinatumika kwa maonyesho ya michoro changamano zaidi.
• Teknolojia Mbadala:Kwa matumizi fulani, violeza vya OLED (diodi inayotoa mwanga wa kikaboni) vina faida katika upana na mtazamo wa pembe, lakini vinaweza kuwa na sifa tofauti za uhai na mwangaza ikilinganishwa na taa za LED zisizo za kikaboni kama hizi.

For digital display applications requiring simplicity, brightness, durability, and a preference for SMD assembly, the LTS-5325CTB-P remains a robust, reliable, and cost-effective solution.

Detailed Explanation of LED Specification Terminology

Complete Explanation of LED Technical Terminology

I. Viashiria Muhimu vya Utendaji wa Umeme na Mwanga

Istilahi	Unit/Representation	Layman's Explanation	Why It Matters
Ufanisi wa Mwanga (Luminous Efficacy)	lm/W (lumen/watt)	Kiasi cha mwanga kinachotolewa kwa kila wati ya umeme, cha juu zaidi ndivyo kinavyotumia nishati kwa ufanisi zaidi.	Huamua moja kwa moja kiwango cha ufanisi wa nishati ya taa na gharama ya umeme.
Luminous Flux	lm (lumen)	Jumla ya kiasi cha mwanga kinachotolewa na chanzo cha mwanga, kinachojulikana kwa kawaida kama "mwangaza".	Kuamua kama taa ina mwanga wa kutosha.
Pembe ya kuangazia (Viewing Angle)	° (digrii), kama vile 120°	Pembe wakati ukubwa wa mwanga unapungua kwa nusu, huamua upana wa boriti ya mwanga.	Huathiri eneo la mwangaza na usawa wake.
Joto la rangi (CCT)	K (Kelvin), k.m. 2700K/6500K	Joto la rangi ya mwanga, thamani ya chini huelekea manjano/joto, thamani ya juu huelekea nyeupe/baridi.	Huamua mazingira ya taa na matumizi yanayofaa.
Kielelezo cha Uonyeshi Rangi (CRI / Ra)	No unit, 0–100	The ability of a light source to reproduce the true colors of objects, Ra≥80 is recommended.	Affects color fidelity, used in high-demand places such as shopping malls and art galleries.
Tofauti ya rangi (SDCM)	Hatua za duaradufu ya MacAdam, k.m. "5-step"	Kipimo cha nambari cha usawa wa rangi, hatua ndogo zaidi inaonyesha usawa mkubwa wa rangi.	Kuhakikisha hakuna tofauti ya rangi kati ya taa za kundi moja.
Dominant Wavelength	nm (nanomita), k.m. 620nm (nyekundu)	Thamani ya wavelength inayolingana na rangi ya LED ya rangi.	Amua rangi ya LED za rangi moja kama nyekundu, manjano, kijani, n.k.
Spectral Distribution	Wavelength vs. Intensity Curve	Inaonyesha usambazaji wa ukubwa wa mwanga unaotolewa na LED katika urefu tofauti wa wimbi.	Huathiri ubora wa kuonyesha rangi na ubora wa rangi.

II. Vigezo vya Umeme

Istilahi	Ishara	Layman's Explanation	Uzingatiaji wa Ubunifu
Forward Voltage	Vf	Voltage ya chini inayohitajika kuwasha LED, kama "kizingiti cha kuanzisha".	Voltage ya chanzo cha umeme inapaswa kuwa ≥ Vf, voltage inajumlishwa wakati LED nyingi zimeunganishwa mfululizo.
Forward Current	If	The current value required for the LED to emit light normally.	Mara nyingi hutumia usukumaji wa mkondo wa mara kwa mara, mkondo huamua mwangaza na maisha ya taa.
Mkondo wa juu wa msukumo (Pulse Current)	Ifp	Kilele cha mkondo kinachoweza kustahimili kwa muda mfupi, kinachotumika kwa kudimisha au kumulika.	Upana wa msukumo na uwiano wa wakati lazima udhibitiwe kwa uangalifu, vinginevyo kunaweza kuharibika kwa joto.
Reverse Voltage	Vr	The maximum reverse voltage that an LED can withstand; exceeding it may cause breakdown.	Mzunguko unahitaji kuzuia uunganishaji wa nyuma au mshtuko wa voltage.
Thermal Resistance	Rth (°C/W)	Upinzani wa joto kutoka kwenye chip hadi kwenye sehemu ya kuunganishia, thamani ya chini inaonyesha usambazaji bora wa joto.	Upinzani mkubwa wa joto unahitaji muundo wenye nguvu zaidi wa kupoza joto, vinginevyo joto la kiungo litaongezeka.
Electrostatic Discharge Immunity (ESD Immunity)	V (HBM), e.g., 1000V	Uwezo wa kupiga umeme wa tuli, thamani ya juu zaidi haifai kuharibiwa na umeme wa tuli.	Hatua za kinga za umeme wa tuli zinahitajika katika uzalishaji, hasa kwa LED zenye usikivu mkubwa.

Tatu, Usimamizi wa Joto na Uaminifu

Istilahi	Viashiria Muhimu	Layman's Explanation	Athari
Joto la Kiungo (Junction Temperature)	Tj (°C)	Joto halisi la kufanya kazi ndani ya Chip ya LED.	For every 10°C reduction, the lifespan may double; excessively high temperatures cause lumen depreciation and color shift.
Lumen Depreciation	L70 / L80 (saa)	Muda unaohitajika ili mwangaza upunguke hadi 70% au 80% ya thamani ya awali.	Kufafanua moja kwa moja "maisha ya huduma" ya LED.
Lumen Maintenance	% (e.g., 70%)	Asilimia ya mwangaza uliobaki baada ya kutumia kwa muda fulani.	Inaonyesha uwezo wa kudumisha mwangaza baada ya matumizi ya muda mrefu.
Color Shift	Δu′v′ or MacAdam Ellipse	The degree of color change during usage.	Inaathiri usawa wa rangi katika mandhari ya taa.
Uzeefu wa joto (Thermal Aging)	Kupungua kwa utendaji wa nyenzo	Uharibifu wa nyenzo za ufungaji unaosababishwa na joto la muda mrefu.	Inaweza kusababisha kupungua kwa mwangaza, mabadiliko ya rangi, au kushindwa kwa mzunguko wazi.

IV. Ufungaji na Nyenzo

Istilahi	Aina za Kawaida	Layman's Explanation	Sifa na Matumizi
Aina ya Ufungashaji	EMC, PPA, Kauri	Nyenzo za kifuniko zinazolinda chip na kutoa mwingiliano wa mwanga na joto.	EMC ina msimamo mzuri wa joto na gharama nafuu; kauri ina usambazaji bora wa joto na maisha marefu.
Muundo wa chip	Front-side, Flip Chip	Chip Electrode Layout.	Inverted mounting offers better heat dissipation and higher luminous efficacy, making it suitable for high-power applications.
Phosphor coating	YAG, Silicate, Nitride	Coated on the blue LED chip, partially converted to yellow/red light, mixed to form white light.	Different phosphors affect luminous efficacy, color temperature, and color rendering.
Lens/Optical Design	Flat, Microlens, Total Internal Reflection	Optical structures on the encapsulation surface control light distribution.	Determines the emission angle and light distribution curve.

V. Quality Control and Binning

Istilahi	Bin Content	Layman's Explanation	Purpose
Luminous Flux Binning	Codes such as 2G, 2H	Grouped by brightness level, each group has a minimum/maximum lumen value.	Hakikisha mwangaza wa bidhaa za kundi moja ni sawa.
Voltage binning	Codes such as 6W, 6X	Grouped by forward voltage range.	Facilitates driver power matching and improves system efficiency.
Color Grading	5-step MacAdam ellipse	Group by color coordinates to ensure colors fall within a minimal range.	Ensure color consistency to avoid uneven colors within the same luminaire.
Color temperature binning	2700K, 3000K, n.k.	Pangwa kwa kundi la joto la rangi, kila kundi kina safu maalum ya kuratibu.	Kukidhi mahitaji ya joto la rangi kwa matukio tofauti.

Sita, Uchunguzi na Uthibitishaji

Istilahi	Kigezo/Uchunguzi	Layman's Explanation	Maana
LM-80	Upimaji Udumishaji wa Lumeni	Long-term illumination under constant temperature conditions, recording brightness attenuation data.	Used to estimate LED lifetime (combined with TM-21).
TM-21	Standard for Life Projection	Projecting the lifespan under actual operating conditions based on LM-80 data.	Kutoa utabiri wa kisayansi wa maisha ya taa.
IESNA standard	Illuminating Engineering Society Standards	Covers optical, electrical, and thermal testing methods.	Industry-recognized testing basis.
RoHS / REACH	Uthibitisho wa usawa na mazingira	Hakikisha bidhaa haina vitu hatari (kama risasi, zebaki).	Masharti ya kuingia katika soko la kimataifa.
ENERGY STAR / DLC	Uthibitisho wa Ufanisi wa Nishati	Uthibitisho wa Ufanisi wa Nishati na Utendaji kwa Bidhaa za Taa.	Inatumika kwa shughuli za ununuzi wa serikali na miradi ya ruzuku, kuimarisha ushindani wa soko.