SMD LED 19-213/GHC-XS1T1N/3T Datasheet - Bright Green - 120° Viewing Angle - Clear Resin - 2.7-3.7V - 25mA - Technical Documentation

1. Product Overview

19-213/GHC-XS1T1N/3T ni LED ya kifaa kilichobandikwa kwenye uso (SMD), iliyoundwa kwa matumizi ya kisasa ya elektroniki yenye ukubwa mdogo. Ikilinganishwa na LED za jadi za fremu ya waya, inawakilisha maendeleo makubwa ya kiteknolojia, ikitoa faida halisi katika utumiaji bora wa nafasi kwenye bodi ya mzunguko, ufanisi wa usanikishaji, na kupunguza ukubwa wa bidhaa ya mwisho.

1.1 Core Advantages and Product Positioning

Faida kuu ya LED hii iko katika ukubwa mdogo wa kifuniko chake, ambacho husaidia moja kwa moja katika kubuni bodi ndogo za saketi za uchapishaji (PCB), msongamano mkubwa wa usanikishaji wa vipengele, na kupunguza mahitaji ya nafasi ya uhifadhi. Muundo wake mwepesi unaufanya kuwa chaguo bora kwa matumizi ambapo uzito ni jambo muhimu. Bidhaa hii inaelekezwa kama suluhisho la kuaminika na la jumla la taa za kiashiria na taa za nyuma zinazofaa kwa uzalishaji wa kiotomatiki kwa wingi.

1.2 Target Market and Applications

This device targets a wide range of industries requiring compact and efficient lighting. The main application areas include:

• Automotive Interior:Mwanga wa Nyuma wa Vipimo, Swichi na Paneli za Udhibiti.
• Vifaa vya Mawasiliano:Viashiria vya Hali na Mwanga wa Nyuma wa Kibodi katika Simu, Mashine za Faksi na Vifaa vingine vya Mawasiliano.
• Consumer Electronics:Flat backlighting, switch illumination, and indicator symbols for Liquid Crystal Displays (LCD).
• General Domain:Program yoyote inayohitaji kiashiria cha mwanga kijani kibichi kidogo na cha mkali.

2. Technical Specifications and Objective Interpretation

Sehemu hii inatoa uchambuzi wa kina na wa kitu halisi wa sifa za umeme, za mwanga na za joto za LED zilizofafanuliwa katika hati ya vipimo.

2.1 Absolute Maximum Ratings

These ratings define the stress limits that may cause permanent damage to the device. Operation at or beyond these limits is not guaranteed.

• Reverse Voltage (V_R):5V. Exceeding this voltage under reverse bias may cause immediate junction breakdown.
• Continuous forward current (I_F):25mA. The maximum DC current for guaranteed long-term reliable operation.
• Peak forward current (I_FP):100mA (duty cycle 1/10, frequency 1kHz). Suitable for pulse operation, not for DC.
• Power dissipation (P_d):95mW. The maximum power that the package can dissipate without exceeding its thermal limit.
• Electrostatic Discharge (ESD):150V (Human Body Model). Indicates moderate sensitivity; standard ESD precautions must be observed.
• Operating and Storage Temperature:-40°C to +85°C (operating), -40°C to +90°C (storage). Suitable for industrial and extended temperature range applications.
• Soldering temperature:Reflow soldering: up to 260°C, maximum 10 seconds. Hand soldering: up to 350°C per pin, maximum 3 seconds.

2.2 Photoelectrical Characteristics (T_a=25°C)

Hizi ni vigezo vya kawaida vya utendaji chini ya hali ya kawaida ya majaribio.

• Nguvu ya mwanga (I_v):180-360 mcd (kwa I_F(under =20mA conditions). This defines the perceived brightness. The wide range indicates the use of a binning system (see Section 3).
• Viewing angle (2θ_1/2):120 degrees (typical). This wide viewing angle provides a broad, uniform illumination pattern, suitable for backlights and indicator lights viewed from different angles.
• Peak wavelength (λ_p):518 nm (typical). The spectral peak of the emitted light, located in the bright green region.
• Dominant wavelength (λ_d):515-530 nm. Defines the perceived hue. This range is also affected by binning.
• Spectral bandwidth (Δλ):35 nm (typical). The width of the emission spectrum at half of the peak intensity.
• Forward Voltage (V_F):2.70-3.70 V (at I_F=20mA). Important for drive circuit design and power consumption calculation. This parameter is binned.
• Reverse current (I_R):< 50 µA（在 V_R=5V condition). Low leakage current specification.

Key considerations:The datasheet explicitly states that this deviceis not designed for reverse operation. The reverse voltage rating is intended for leakage current testing only.

3. Binning System Description

Ili kuhakikisha uthabiti katika uzalishaji wa kiwango kikubwa, LED zinagawanywa kulingana na vigezo muhimu (kugawanya). 19-213 hutumia mfumo wa kugawanya wa pande tatu.

3.1 Kugawanya Kwa Nguvu ya Mwanga

Binning: S1 (180-225 mcd), S2 (225-285 mcd), T1 (285-360 mcd). Designers must select the appropriate bin to meet the brightness required for their application, taking into account the ±11% tolerance within each bin.

3.2 Kugawanya Kwa Wavelength Kuu

Binning: W (515-520 nm), X (520-525 nm), Y (525-530 nm). This ensures color consistency among multiple LEDs in an array. The tolerance within each bin is ±1 nm.

3.3 Forward Voltage Binning

Bin: 10 (2.70-2.90V), 11 (2.90-3.10V), 12 (3.10-3.30V), 13 (3.30-3.50V), 14 (3.50-3.70V). Selecting LEDs from the same V_Fbin helps achieve uniform current distribution and predictable power supply requirements when connected in parallel. The bin content tolerance is ±0.1V.

4. Analysis of Performance Curves

The datasheet provides several characteristic curves essential for understanding the device's behavior under various conditions.

4.1 Forward Current vs. Forward Voltage (I-V Curve)

This curve illustrates the exponential relationship between current and voltage. For a typical LED, a slight increase in voltage beyond the turn-on point results in a significant increase in current. This highlights the necessity of using a current-limiting resistor or constant-current driver to prevent thermal runaway.

4.2 Relative Luminous Intensity vs. Ambient Temperature

Mwangaza hupungua kadri halijoto ya mazingira inavyoongezeka. Mkunjo huu ni muhimu kwa matumizi yanayofanya kazi katika mazingira ya joto la juu (k.m. ndani ya dashibodi ya gari). Wabunifu lazima kupunguza mwangaza unaotarajiwa kulingana na halijoto ya uendeshaji.

4.3 Relative Luminous Intensity vs. Forward Current

Mwangaza kwa kawaida huwa sawia na mkondo wa mbele, lakini uhusiano sio mstari kabisa, haswa katika mikondo ya juu. Ufanisi unaweza kupungua kwa mikondo ya juu sana kwa sababu ya athari za joto kuongezeka.

4.4 Forward Current Derating Curve

Mchoro huu unafafanua uhusiano kati ya mkondo wa juu unaoruhusiwa wa mbele unaoendelea na halijoto ya mazingira. Kadri halijoto inavyopanda, mkondo wa juu salama hupungua, ili kuzuia kuzidi kikomo cha halijoto ya kiungo na kuhakikisha uimara wa muda mrefu.

4.5 Spectral Distribution

The curve shows a single peak centered at 518 nm, confirming monochromatic green light output. The 35 nm bandwidth indicates that the color is a relatively pure green.

4.6 Radiation Pattern

Illustrates the spatial distribution of light intensity, confirming a 120-degree viewing angle with a typical Lambertian or near-Lambertian emission pattern.

5. Mechanical and Packaging Information

5.1 Package Dimensions

Mwongozo una mchoro wa kina wa vipimo. Sifa muhimu ni pamoja na urefu wa jumla, upana, urefu, mpangilio wa pedi, na kiashiria cha polarity (kawaida ni mfuo au cathode iliyowekwa alama). Isipokuwa imeelezwa vinginevyo, uvumilivu wa kawaida kwa vipimo vyote ni ±0.1mm. Kuzingatia kikamilifu mpangilio wa pedi ulipendekezwa ni muhimu kwa ufungaji wa kuaminika na usawa sahihi wakati wa kuyeyusha tena.

5.2 Polarity Identification

Mwelekeo wa umeme lazima uunganishwe kwa usahihi. Kifuniko kina alama ya kuona (k.m., nukta ya kijani, kona iliyokatwa, au alama ya kathodi) kutambua terminali ya kathodi. Kuunganisha LED kwa mwelekeo wa nyuma kunaweza kuharibu.

6. Mwongozo wa Uchomeaji na Usanikishaji

Usahihi wa kushughulikia na kuchomeka ni muhimu kwa kiwango cha bidhaa bora na uaminifu.

6.1 Mkunjo wa Joto wa Reflow Soldering

Lead-free reflow soldering temperature profile imebainishwa:

• Preheating:150-200°C, for 60-120 seconds.
• Time Above Liquidus (TAL):>217°C，持续60-150秒。
• Joto la kilele:Hadi 260°C, ushike kwa muda wa sekunde 10.
• Kasi ya kupanda/kushuka kwa joto:Kupanda kwa joto: hadi 3°C/s. Kushuka kwa joto: hadi 6°C/s.

Ujumbe Muhimu:Uendeshaji wa reflow soldering haupaswi kuzidi mara mbili.

6.2 Manual Soldering Instructions

Ikiwa ni lazima kufanya uchomeaji kwa mikono:

• 使用烙铁头温度<350°C的烙铁。
• 每个引脚焊接时间限制在3秒以内。使用额定功率<25W的烙铁。焊接每个引脚之间至少间隔2秒。Mwongozo wa maelezo ya kina unatahadharisha, uharibifu kwa kawaida hutokea wakati wa mchakato wa kulehemu kwa mkono.

6.3 Storage and Moisture Sensitivity

This component is moisture-sensitive.

• Before use:Do not open the moisture barrier bag until ready for use.
• After opening:Please use within 168 hours (7 days). Unused components should be stored in an environment of ≤30°C and ≤60% relative humidity.
• Re-bake:Ikiwa muda wa mfiduo unazidi uliowekwa au dawa ya kukausha inaonyesha unyevu, tafadhali oka kwa 60±5°C kwa saa 24.

6.4 Key Considerations

• Ulinzi dhidi ya Mzigo Mkubwa:External current limiting resistor isMandatory requirementA slight voltage change may cause a significant current variation, leading to immediate failure.
• Mechanical stress:Avoid applying stress to the LED body during soldering or final application. Do not twist the PCB after assembly.
• Rework:Rework is not recommended. If absolutely necessary, use a dual-tip soldering iron to heat both pins simultaneously to avoid thermal stress. Verify device functionality after rework.

7. Ufungaji na Taarifa za Kuagiza

7.1 Ufungaji wa Kawaida

Kifaa hiki kinapatikana katika umbo la mkanda wa kubeba wa 8mm, umekunjwa kwenye reel yenye kipenyo cha inchi 7, na inalingana na vifaa vya kawaida vya kukandamiza kiotomatiki. Kila reel ina vipande 3000.

7.2 Moisture-Proof Packaging

Ili kupanua maisha ya rafiki, spool imefungwa ndani ya mfuko wa alumini wa kinga ya unyevu ulio na dries na kadi ya kiashiria cha unyevu.

7.3 Label Instructions

Lebo ya reel ina maelezo muhimu:

• CPN: Nambari ya Sehemu ya Mteja.
• P/N: Manufacturer Part Number (e.g., 19-213/GHC-XS1T1N/3T).
• QTY: Quantity on reel.
• CAT: Luminous intensity bin code (e.g., S1, T1).
• HUE: Chromaticity/Dominant wavelength bin code (e.g., W, X, Y).
• REF: Forward voltage bin code (e.g., 10, 11, 12).
• LOT No.: Traceable batch number.

8. Mapendekezo ya Matumizi na Mazingatio ya Ubunifu

8.1 Design ya Mzunguko wa Kuendesha

Daima tumia kiendeshi cha mkondo wa thabiti kwa LED hii, au tumia upinzani wa mfululizo uliohesabiwa kulingana na voltage ya mbele mbaya zaidi (V_Fya juu) na voltage ya usambazaji, ili kuhakikisha mkondo hauzidi 25mA DC. Kwa mfano, kwa kutumia usambazaji wa 5V na V_Fya 3.7V, unahitaji angalau (5V - 3.7V) / 0.025A = 52 ohms ya upinzani wa mfululizo. Ili kuacha nafasi ya usalama, upinzani wa thamani kubwa zaidi unapendekezwa.

8.2 Usimamizi wa Joto

Ingawa kifuniko ni kidogo, usimamizi bora wa joto kwenye PCB ni muhimu kwa kupanua maisha na kudumisha mwangaza. Tumia eneo la shaba linalotosha kuunganishwa na pedi ya kupoza joto (ikiwepo) au nyuzi za anodi/kathodi ili kupoza joto, hasa unapofanya kazi karibu na mkondo wa juu zaidi au halijoto ya juu ya mazingira.

8.3 Ubunifu wa Optics

Upeo wa kuona wa digrii 120 na resini uwazi hufanya LED hii ifae kwa kiashiria cha pembe pana. Kwa mwanga uliolengwa au muundo maalum wa boriti, vifaa vya pili vya macho (lenzi, bodi ya kuongoza mwanga) vinahitajika. Resini uwazi hutoa pato la juu zaidi la mwanga, lakini inaweza kusababisha "doa" la mwanga linaloonekana; mbadala wa resini iliyotawanyika (sio aina hii) unafaa zaidi kwa taa sawasawa.

9. Uzingatifu na Vipimo vya Mazingira

Bidhaa hii inakidhi viwango muhimu vingi vya kimataifa, na hurahisisha matumizi yake katika soko la ulimwengu:

• In compliance with RoHS:Free of restricted hazardous substances such as lead, mercury, and cadmium.
• In compliance with EU REACH:Inakidhi na kanuni za usajili, tathmini, idhini na vikwazo vya kemikali.
• Bila halojeni.符合严格限制：溴（Br）< 900 ppm，氯（Cl）< 900 ppm，Br+Cl < 1500 ppm。这对于减少火灾时的有毒排放物很重要。
• Bila risasi.Usindikaji wa uso wa kuchomelea na nyenzo zote ni bila risasi ya chuma.

10. Ulinganishi wa Kiufundi na Tofauti

Ikilinganishwa na teknolojia ya zamani ya LED yenye mashimo ya kupita, hii SMD LED inatoa:

• Kupunguza ukubwa:Ukubwa umepunguzwa kwa kiasi kikubwa, kufanikisha umbizo dogo.
• Ufanisi wa utengenezaji:Inafaa na mstari wa usanidi wa SMT wa kiotomatiki kabisa, kupunguza gharama za wafanyikazi, na kuongeza kasi na usahihi wa uwekaji.
• Utendaji:Kwa kawaida hutoa njia bora ya joto kwa PCB kuliko miundo mingi ya mashimo ya kupita, inayoweza kuongeza maisha ya huduma chini ya mkondo wa juu.

Ikilinganishwa na LED nyingine za kijani za SMD, mchanganyiko maalum wa mtazamo wa digrii 120, lenzi wazi, na muundo uliowekwa wazi wa nguvu, urefu wa wimbi, na voltage, ni sababu muhimu ya kutofautisha kwa wabunifu wanaohitaji utendaji unaotabirika.

11. Maswali Yanayoulizwa Mara kwa Mara (FAQ)

Swali: Je, naweza kuendesha LED hii moja kwa moja kutoka kwa pini ya microcontroller ya 3.3V au 5V?Jibu: Hapana. Lazima utumie resistor ya kuzuia mkondo mfululizo. Voltage ya mbele ni takriban 3V, na pini za GPIO haziwezi kutoa/kunyonya mkondo wa 20mA kwa usalamu wakati zinaidhinisha kushuka kwa voltage. Tafadhali tumia transistor au kiendesha maalum cha LED.

Swali: Kwa nini anuwai ya nguvu ya mwanga ni pana sana (180-360 mcd)?Jibu: Hii ndio anuwai ya jumla ya uzalishaji. Vifaa vinagawanywa katika viwango maalum (S1, S2, T1). Ni lazima kubainisha kiwango kinachohitajika wakati wa kuagiza ili kuhakikisha uthabiti wa mwangaza.

Swali: Mwongozo wa spec unasema "Usifungue mfuko kabla ya matumizi." Itakuwaje ikiwa umefungua?A: Unyevu unaweza kunyonywa na kifuniko cha plastiki. Wakati wa upakiaji wa joto, unyevu huu uliofunikwa huongezeka kwa kasi ("athari ya popcorn"), na kusababisha kujitenga na ufa ndani, na kusababisha kushindwa mara moja au baadaye.

Q: Je, naweza kuitumia kwa matumizi ya nje?A: Safu ya joto la kufanya kazi (-40°C hadi +85°C) inasaidia mazingira mengi ya nje. Hata hivyo, mfiduo wa muda mrefu kwa mionzi ya ultraviolet na hali ya hewa unaweza kuharibu dawa. Kwa matumizi magumu ya nje, LED zilizo na vifuniko vya dawa maalum zinazostahimili UV zinapendekezwa.

12. Uchunguzi wa Kesi za Matumizi ya Ubunifu

Scenario: Designing a status indicator panel for an industrial controller. Requirements:Viungo vingi vya LED vya kijani hutumiwa kuonyesha "Mfumo Tayari", "Mawasiliano Yameamilishwa", n.k. Mwangaza sawa na rangi ni muhimu kwa mtazamo wa mtumiaji.

Hatua za Usanifu:

1. Uchaguzi wa Kategoria:Ili kuhakikisha uthabiti, taja kiwango kimoja, madhubuti kwa LED zote: kwa mfano, kiwango cha nguvu ya mwanga T1 (285-360 mcd), kiwango cha wavelength kuu X (520-525 nm), kiwango cha voltage ya mbele 12 (3.10-3.30V). Hii inahakikisha kuwa tabia ya LED zote itakuwa sawa sana.
2. Ubunifu wa saketi:Tumia IC ya kuendesha LED ya mkondo wa kudumu inayoweza kuendesha njia nyingi. Hii hutoa mkondo sawa kwa kila LED, bila kuathiriwa na mabadiliko madogo ya V_F, na kuhakikisha mechi kamili ya mwangaza. Au, ikiwa kila LED inatumia upinzani mmoja, kulingana na V ya juu zaidi kwenye kiwango_F(3.30V) Calculate the resistance value to ensure no LED is overdriven.
3. PCB Layout:Place LEDs in a consistent orientation. Include sufficient copper pour areas connected to the cathode pads to aid heat dissipation, as the panel may be illuminated continuously.
4. Assembly:Fanya kwa usahihi kulingana na mkunjo wa joto wa upakiaji tena. Weka mfuko uliofungwa hadi utakapoweka mkanda kwenye kisambazaji cha mashine ya kukandamiza ili kufuata viwango vya unyevunyevu (MSL).

Njia hii inaweza kutoa paneli ya udhibiti yenye muonekano wa kitaalamu na taa za kiashiria thabiti na zinazotegemewa.

13. Introduction to Working Principles

This LED is based on an indium gallium nitride (InGaN) semiconductor chip. When a forward voltage exceeding the diode's turn-on threshold (V_F) is applied, electrons and holes are injected into the active region of the semiconductor junction. When these charge carriers recombine, they release energy in the form of photons (light). The specific composition of the InGaN material determines the wavelength (color) of the emitted light; in this case, it is tuned to produce a bright green light with a peak at 518 nm. The transparent epoxy encapsulation protects the delicate semiconductor chip, provides mechanical stability, and acts as a primary lens to shape the initial light output pattern.

14. Technology Trends and Background

19-213 LED represents a mature and widely adopted SMD LED technology. Current LED development trends associated with this type of component include:

• Uboreshaji wa ufanisi:Uboreshaji endelevu wa ukuaji wa epitaxial na usanifu wa chipi umesababisha ufanisi mkubwa wa mwanga (uzalishaji wa mwanga zaidi kwa kila wati ya umeme), na hivyo kuwezesha viashiria vya mwanga vyenye mwangaza zaidi au matumizi ya nguvu ya chini.
• Kupunguzwa kwa ukubwa:Utafutaji wa vifaa vidogo bado unaendelea, ukubwa mdogo wa kifurushi (mfano, 0402, 0201 metric) umekuwa wa kawaida katika matumizi yenye nafasi ndogo, ingawa kwa kawaida kuna mabadiliko katika pato la mwanga na utendaji wa joto.
• Uimarishaji wa Uaminifu:Uboreshaji wa nyenzo za kifurushi na teknolojia ya kusanikisha chip zinaendelea kuongeza maisha ya kazi na uwezo wa kukabiliana na mzunguko wa joto na unyevu.
• Suluhisho Zilizounganishwa:Mwelekeo mpana zaidi ni kuunganisha vifaa vya elektroniki vya udhibiti (vikiendeshaji cha mkondo, kikidhibiti cha PWM) moja kwa moja na chipi ya LED katika moduli changamano zaidi, na hivyo kurahisisha muundo wa saketi kwa mtumiaji wa mwisho.

Ingawa aina hii mahususi inaweza isiwe na vipengele vya kisasa zaidi vya LED vidogo sana au vya akili, utendaji wake ulio wazi, ufungashaji thabiti, na upangaji kamili wa viwango, hufanya iwe chaguo la kuaminika na la gharama nafuu katika matumizi mengi ya viashiria vya kawaida na taa za nyuma.