SMD Chip LED Green GaP Datasheet - 3.2x2.8x1.9mm - 2.6V - 72mW - Technical Documentation

1. Product Overview

This document provides the complete technical specifications for a high-brightness, surface-mount green LED. This device is specifically designed for general indicator and backlighting applications in consumer electronics, office equipment, and communication devices. Its main advantages include: compatibility with automated placement equipment, suitability for infrared and reflow soldering processes, and compliance with lead-free (RoHS) requirements. The standard EIA package ensures broad compatibility within the industry.

2. In-depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

The operating limits of the device are defined under the condition of an ambient temperature (Ta) of 25°C. Exceeding these ratings may cause permanent damage.

• Power Dissipation (Pd):72 mW. This is the maximum power that the LED can safely dissipate as heat under continuous operation.
• Peak Forward Current (IFP):80 mA. This is the maximum current allowed under pulse conditions, specified at a duty cycle of 1/10 and a pulse width of 0.1ms. This value is significantly higher than the DC rating to accommodate brief, high-intensity flashes.
• Direct forward current (IF):30 mA. This is the maximum continuous forward current recommended to ensure long-term reliable operation.
• Reverse voltage (VR):5 V. Applying a reverse voltage exceeding this limit may damage the semiconductor junction of the LED.
• Operating temperature range:-40°C to +85°C. The device is rated for reliable operation over this wide industrial temperature range.
• Storage temperature range:-40°C hadi +100°C.

2.2 Electrical and Optical Characteristics

Vigezo muhimu vya utendaji vinapimwa kwa Ta=25°C, mkondo wa kawaida wa majaribio IF=20mA.

• Nguvu ya mwanga (Iv):Inaanzia kiwango cha chini cha 7.1 mcd hadi kiwango cha kawaida cha 45.0 mcd. Nguvu halisi imegawanywa katika viwango, angalia Sehemu ya 3.
• Pembe ya mtazamo (2θ1/2):120 degrees. This wide viewing angle indicates it is a diffused lens, suitable for applications requiring a wide range of visibility.
• Peak Emission Wavelength (λP):565 nm. This is the wavelength at which the spectral output is strongest.
• Wavelength kuu (λd):569 nm. Urefu huu wa wimbi mmoja unaotokana na chati ya rangi ya CIE unafafanua rangi inayoonekana ya LED (kijani).
• Upana wa nusu ya mstari wa wigo (Δλ):30 nm. Kigezo hiki kinaeleza usafi wa wigo; upana mwembamba zaidi unamaanisha chanzo cha mwanga kina rangi moja bora zaidi.
• Voltage ya mbele (VF):Thamani ya kawaida ni 2.6V, kwa safu ya 2.0V hadi 2.6V kwenye 20mA. Thamani ya kawaida ina uvumilivu wa +/- 0.1V.
• Sasa ya nyuma (IR):Maximum 10 µA when a reverse voltage of 5V is applied.

3. Grading System Description

To ensure brightness consistency across different production lots, luminous intensity is classified into different bins. The bin code is part of the part number selection.

• Msimbo wa kiwango K:7.1 mcd (kidogo) hadi 11.2 mcd (kubwa)
• Msimbo wa kiwango L:11.2 mcd to 18.0 mcd
• Gear Code M:18.0 mcd to 28.0 mcd
• Gear Code N:28.0 mcd to 45.0 mcd

A tolerance of +/-15% applies to each intensity gear. Designers should select the appropriate gear based on the brightness level required for their application.

4. Uchambuzi wa Mkunjo wa Utendaji

Mwongozo unarejelea mikunjo ya kawaida ya utendaji ili kuonyesha uhusiano kati ya vigezo muhimu. Ingawa michoro maalum haijarudishwa katika maandishi, maana yake ni muhimu kwa muundo.

• I-V Curve:It shows the relationship between forward current (IF) and forward voltage (VF). It is nonlinear, which is typical for diodes. This curve helps in selecting a suitable current-limiting resistor.
• Luminous Intensity vs. Forward Current:It shows how light output increases with current, typically exhibiting an approximately linear relationship within the operating range. Operating beyond the maximum current leads to diminishing returns and generates more heat.
• Mwangaza wa Mwanga dhidi ya Joto la Mazingira:Inaonyesha kupungua kwa pato la mwanga kadiri joto la kiungo linavyoongezeka. Hii ni muhimu kwa usimamizi wa joto katika matumizi ya nguvu ya juu au ya joto la juu la mazingira.
• Usambazaji wa Wigo:Grafu ya uhusiano wa nguvu ya jamaa na urefu wa wimbi, unaozingatia 565nm na upana wa nusu ya 30nm, unathibitisha utoaji wa mwanga wa kijani.

5. Taarifa za Mitambo na Ufungaji

5.1 Device Dimensions

LED hii inakidhi kifurushi cha kawaida cha EIA SMD. Vipimo muhimu (kwa milimita) ni pamoja na ukubwa wa mwili wa takriban 3.2mm (urefu) x 2.8mm (upana) x 1.9mm (kimo). Isipokuwa imeelezwa vinginevyo, uvumilivu kwa kawaida ni ±0.2mm. Muundo sahihi wa PCB pad unapaswa kurejelea mchoro wa kina wa vipimo.

5.2 Recommended PCB Land Pattern Design

Inatoa mapendekezo ya muundo wa pad unaofaa kwa infrared au reflow ya mvuke. Kufuata muundo huu wa pad unaopendekezwa ni muhimu kwa kufikia muunganisho wa kuaminika wa solder, usawa sahihi wa kujipanga wakati wa reflow, na upitishaji mzuri wa joto. Muundo huu kwa kawaida hujumuisha muundo wa pad ya kutawanya joto kudhibiti halijoto ya soldering.

5.3 Polarity Identification

Cathode kwa kawaida huwa na alama kwenye kifaa, kwa mfano, pengo, nukta ya kijani, au kona iliyokatwa kwenye lenzi au kifurushi. Ni lazima kukagua michoro katika spec sheet ili kuthibitisha mpango halisi wa alama, na kuhakikisha mwelekeo sahihi wakati wa usanikishaji.

6. Mwongozo wa Uchomaji na Usanikishaji

6.1 Mkunjo wa Joto wa Reflow Soldering

Kifaa hiki kinaendana na mchakato wa reflow soldering usio na risasi (Pb-free). Imetumia mkunjo wa joto unaokubaliana na kiwango cha J-STD-020B. Vigezo muhimu ni pamoja na:

• Joto la kukausha kabla ya kuchomeka:150°C hadi 200°C.
• Muda wa kukausha kabla ya kuchomeka:Kwa upeo sekunde 120.
• Kiwango cha juu cha joto:Kwa upeo 260°C.
• Time Above Liquidus:According to the solder paste specification recommended duration.
• Ramp-up/Ramp-down Rate:Inaweza kudhibitiwa ili kuzuia mshtuko wa joto.

Uangalizi Muhimu: Mkunjo bora wa joto unategemea muundo maalum wa PCB, mchanga wa kuuza na tanuri ya reflow. Inashauriwa kufanya uthibitishaji wa kiwango cha kipengele na bodi.

6.2 Manual Soldering

Ikiwa unahitaji kuchomelea kwa mikono, tumia chuma cha kuchomelea chenye joto lisilozidi 300°C. Muda wa mguso kwa kila kiungo cha kuuziwa usizidi sekunde 3, na ufanye mara moja tu, ili kuepuka kuharibu kifuniko cha plastiki au waya za ndani za kuunganisha.

6.3 Cleaning

Ikiwa unahitaji kusafisha baada ya kuuziwa, tumia tu vilainishi vilivyobainishwa. Kuzamisha LED kwenye ethanol au isopropanol kwa si zaidi ya dakika moja kwenye joto la kawaida ni kukubalika. Kemikali zisizobainishwa zinaweza kuharibu lenzi ya epoxy au kifuniko.

6.4 Uhifadhi na Unyevunyevu Nyeti

LED ni nyeti kwa unyevu. Wakati wa kuhifadhiwa kwenye mfuko wa asili uliofungwa vizuri dhidi ya unyevu (wenye draya ndani), inapaswa kuhifadhiwa katika mazingira ya ≤30°C na ≤70% unyevunyevu wa jamaa, na kutumiwa ndani ya mwaka mmoja. Mara tu mfuko unapofunguliwa, mazingira ya uhifadhi hayapaswi kuzidi 30°C na 60% unyevunyevu wa jamaa. Vipengee vilivyo wazi kwa hewa ya mazingira kwa zaidi ya saa 168, vinapaswa kukaushwa kwa takriban 60°C kwa angalau saa 48 kabla ya kulehemu kwa reflow, ili kuzuia "popcorn effect" (ufa wa ufungaji kutokana na shinikizo la mvuke).

7. Packaging and Ordering Information

7.1 Tape and Reel Specifications

The device is supplied in 8mm carrier tape, wound on 7-inch (178mm) diameter reels, compatible with standard automated placement equipment.

• Idadi kwa kila spool: 2000.
• Kiasi cha chini cha kuagiza (MOQ):Minimum order starts from 500 pieces remaining.
• Cover Tape:Empty slots are sealed with top cover tape.
• Missing Parts:According to the specification (EIA-481-1-B), a maximum of two consecutive missing lights is allowed.

7.2 Part Number Structure

Nambari ya sehemu LTST-M670GKT imesimba sifa muhimu:

• LTST:Inaweza kumaanisha mfululizo au familia ya bidhaa.
• M670:Inaweza kurejelea aina maalum ya chip/kidimbwi au muundo wa macho.
• G:Inaashiria rangi ya lenzi (bila rangi, wazi).
• K:Represents the luminous intensity level code (e.g., K grade: 7.1-11.2 mcd).
• T:Inaweza kuashiria ufungaji wa reeli ya mkanda.

Kuchagua kiambishi sahihi (nambari ya kiwango) ni muhimu kupata kiwango cha mwangaza kinachohitajika.

8. Application Recommendations

8.1 Mandhari ya Kawaida ya Utumiaji

This LED is suitable for a wide range of applications requiring bright, reliable green indicator lights, including:

• Status indicators on consumer electronics (routers, modems, audio equipment).
• Backlighting for membrane switches and panels.
• Illumination for instrumentation and control panels.
• General signage and decorative lighting where a wide viewing angle is beneficial.

8.2 Ubunifu wa Sakiti ya Kiendeshi

LED ni kifaa kinachoendeshwa na mkondo wa umeme.Ili kudumisha usawa wa mwangaza, hasa unapoendesha LED nyingi kwa njia ya sambamba,Inashauriwa kwa nguvuTumia kizuizi cha mfululizo kimoja kwa kila LED (Mfano wa Sakiti A). Haishauriwi kudhibiti LED moja kwa moja kutoka kwa chanzo cha voltage kwa usawa (Mfano wa Sakiti B), kwani tofauti ndogo katika sifa za voltage ya mbele (VF) kati ya LED zinaweza kusababisha usambazaji wa sasa usio sawa, na kusababisha mwanga usio sawa. Thamani ya kizuizi cha mfululizo inaweza kuhesabiwa kwa kutumia Sheria ya Ohm: R = (Vcc - VF) / IF, ambapo Vcc ni voltage ya usambazaji, VF ni voltage ya mbele ya LED (tumia thamani ya juu kwa uhakika), na IF ni sasa ya mbele inayotakiwa.

8.3 Usimamizi wa Joto

Ingawa matumizi ya nguvu ni ya chini kiasi (kiwango cha juu cha 72mW), muundo sahihi wa joto unaweza kuongeza maisha ya taa na kudumisha mwanga thabiti. Hakikisha muundo wa PCB pad unatoa usambazaji wa joto wa kutosha. Epuka kutumia LED kwa muda mrefu au karibu na viwango vya juu kabisa vya sasa na joto.

8.4 Ulinzi dhidi ya ESD (Utoaji Umeme Tuli)

Kama vifaa vingi vya semiconductor, LED ni nyeti kwa utoaji wa umeme tuli (ESD). Utaratibu wa kawaida wa usindikaji wa ESD unapaswa kufuatwa wakati wa usanikishaji na uendeshaji, ikiwa ni pamoja na kutumia dawati lililowekwa ardhini, mkanda wa mkono, na vyombo vinavyoweza kufanya umeme.

9. Ulinganishi wa Kiufundi na Tofauti

Ikilinganishwa na teknolojia ya zamani ya LED ya kuingizwa moja kwa moja, kifaa hiki cha SMD kina faida kubwa:

• Ukubwa na Umbo:Eneo la chini la 3.2x2.8mm na urefu mdogo (1.9mm) husaidia kupunguza ukubwa wa bidhaa ya mwisho.
• Uwezekano wa Utengenezaji:Inaendana kabisa na mstari wa SMT wa kujipanga unaokimbia kwa kasi na kiotomatiki, ukapunguza gharama za uzalishaji na kuboresha uaminifu ikilinganishwa na kuchomeka kwa mikono.
• Optical Performance:The combination of high brightness (up to 45 mcd) and a 120-degree wide viewing angle provides excellent visibility.
• Reliability:The package design is suitable for robust infrared/reflow soldering processes and offers a wide operating temperature range (-40°C to +85°C).

The use of GaP (Gallium Phosphide) substrate technology is a mature and reliable process for producing green LEDs with stable color and performance.

10. Maswali Yanayoulizwa Mara kwa Mara (FAQ)

Q1: What is the difference between Peak Wavelength (λP) and Dominant Wavelength (λd)?
A1: The Peak Wavelength (565 nm) is the physical wavelength at which the LED emits its strongest optical power. The Dominant Wavelength (569 nm) is a value calculated based on colorimetry, representing the single wavelength of the perceived color. For monochromatic light sources like this green LED, the two are typically very close.

Q2: Can I operate this LED continuously at 30mA?
A2: Yes, 30mA is the maximum rated DC forward current. For the highest reliability and lifetime, it is generally recommended to operate slightly below this maximum, for example at 20mA (the standard test condition), which also provides sufficient brightness for most indicator applications.

Q3: Kwa nini bado nahitaji kupinga mfululizo hata wakati chanzo changu cha umeme kina kikomo cha sasa?
A3: Upinzani maalum wa mfululizo hutoa njia rahisi, ya kiuchumi, na thabiti ya kuweka sasa. Pia husaidia kunyonya mabadiliko madogo ya voltage ya chanzo na voltage ya mbele ya LED, na kuhakikisha utendakazi thabiti. Kwa sakiti nyingi za jumla za LED, hii inachukuliwa kuwa utendaji bora.

Q4: Je, maisha ya saa 168 ya kiwanda baada ya kufungua mfuko wa kinga ya unyevu yana umuhimu gani?
A4: Hii ni muhimu sana kwa uaminifu wa utengenezaji. Kuzidi muda huu bila kufanya baking, huongeza hatari ya uharibifu wa kifuniko kutokana na unyevunyevu wakati wa upachikaji wa joto la juu la reflow, inayoweza kusababisha kushindwa mara moja au kupunguza uaminifu wa muda mrefu.

11. Design Case Study

Tukio:Design a status indicator panel for a network switch with 24 identical green port activity LEDs.
Design Steps:

1. Brightness Selection:Kwa umbali wa kutazama wa vifaa vya ndani wa mita 1-2, mwangaza wa kati unatosha. Chagua nambari ya kiwango L (11.2-18.0 mcd) kutoka kwenye taarifa ya kuagiza.
2. Saketi ya kiendeshi:Mfumo hutumia reli ya umeme ya 3.3V. Kwa kutumia VF ya juu zaidi ya 2.6V na IF lengo ya 20mA, hesabu upinzani wa mfululizo: R = (3.3V - 2.6V) / 0.020A = 35 ohms. Chagua thamani ya kawaida iliyo karibu zaidi ya ohms 33 au 39, na sasa itarekebishwa kidogo.
3. Mpangilio wa PCB:Use the pad layout recommended in the datasheet. Route the 3.3V and GND traces to all 24 LEDs. Place the current-limiting resistor close to the anode of each LED.
4. Thermal Considerations:Each of the 24 LEDs draws approximately 20mA, resulting in a relatively low total power (about 1.5W). No special heat dissipation is required, but ensure general airflow within the enclosure.
5. Kukusanyiko:Fuata mfano wa joto unaopendekezwa wa kuchoma tena. Baada ya kufungua reel, panga kukamilisha usakinishaji wa SMT wa bodi zote za mzunguko ndani ya dirisha la saa 168, au utekeleze mpango wa kukaanga.

Njia hii inahakikisha mwangaza sawasawa, muunganisho wa kuaminika na utendaji wa muda mrefu.

12. Technical Principle Introduction

LED hii inategemea nyenzo za semiconductor za gallium phosphide (GaP). Wakati voltage chanya inatumika kwenye p-n junction, elektroni na mashimo huingizwa kwenye eneo lenye ufanisi, na huko huchanganyika tena. Katika GaP, mchakato huu wa kuchanganyika tena hutoa nishati kwa njia ya fotoni (mwanga), ambayo wavelength yake inalingana na nishati ya pengo la bendi ya nyenzo, na kwa muundo huu maalum, hutoa mwanga wa kijani (takriban 565-569 nm). Lensi ya "wazi isiyo na rangi" imetengenezwa kwa epoksi, na imekusudiwa kutawanya mwanga, na kuunda pembe ya kuona pana ya digrii 120. Ufungaji wa SMD hufunga chip ya semiconductor, waya za kuunganisha, na fremu ya kuongoza ndani yake, na kutoa ulinzi wa kiufundi pamoja na muunganisho wa joto/umeme.

13. Mienendo na Maendeleo ya Sekta

Ulimwengu wa optoelectronics unaendelea kukua. Ingawa LED hii ya kijani inayotegemea GaP inawakilisha teknolojia iliyokomaa na ya kuaminika sana, mwelekeo unajumuisha:

• Uboreshaji wa ufanisi:Uendelezaji endelevu wa nyenzo mpya (kama vile InGaN kwa anuwai ya rangi pana) na muundo wa chip, ili kufikia lumens kwa wati zaidi (lm/W), na hivyo kupunguza matumizi ya nguvu kwa pato la mwanga lililopewa.
• Udogo:Develop smaller package sizes (e.g., 0201, 01005) for space-constrained applications, such as wearable devices and ultra-compact consumer electronics.
• Integrated Solutions:LEDs with built-in drivers (constant current ICs), protection diodes (for ESD/reverse voltage), or multi-color (RGB) capabilities in a single package are increasingly common, simplifying circuit design.
• Mahitaji ya Uaminifu wa Juu:Upanuzi wa matumizi katika sekta ya magari, viwanda na matibabu, unaochochea mahitaji ya anuwai ya joto pana zaidi, ukinzani mkubwa wa mtikisiko na maisha marefu ya kufanya kazi (kwa kawaida yanayopimwa kwa L70 au L90, yaani muda wa mwanga kufifia hadi 70% au 90% ya mwangaza wa awali).

Kifaa kinachoelezewa katika maelezo ya vipimo hiki kiko imara katika sehemu ya soko iliyokomaa na yenye kiwango kikubwa cha uzalishaji, na kinapendwa kutokana na utendakazi uliothibitishwa, ufanisi wa gharama na urahisi wa kuunganishwa.