SMD LED LTST-E683FGBW Datasheet - Orange/Green/Blue Tri-Color - 20mA - 80mW - Technical Documentation

1. Product Overview

This document details the specifications of the surface-mount device (SMD) LED component model LTST-E683FGBW. This device is a multi-color LED component that integrates three independent light-emitting chips within a single package: an orange AlInGaP chip, a green InGaN chip, and a blue InGaN chip. The device is designed for automated assembly processes, is compatible with infrared reflow soldering, and is suitable for high-volume electronics manufacturing. Its diffused lens provides a wide viewing angle, enhancing visibility from different perspectives.

2. Detailed Technical Parameters

2.1 Absolute Maximum Ratings

The operating limits of the device are defined under the condition of an ambient temperature (Ta) of 25°C. Exceeding these ratings may cause permanent damage.

• Power Dissipation (Pd):Orange: 72 mW; Green/Blue: 80 mW. This parameter indicates the maximum power that the LED can safely dissipate as heat under continuous DC operation.
• Peak Forward Current (IFP):Orange: 80 mA; Green/Blue: 100 mA. This is the maximum allowable pulsed current, specified at a 1/10 duty cycle and 0.1ms pulse width, suitable for brief, high-intensity flashes.
• Direct forward current (IF):Orange: 30 mA; Green/Blue: 20 mA. This is the recommended maximum continuous forward current to ensure long-term reliable operation.
• Temperature range:Operating temperature: -40°C to +85°C; Storage temperature: -40°C to +100°C. These ranges define the environmental conditions the device can withstand during use and in an inactive state.

2.2 Electrical and Optical Characteristics

Key performance indicators are measured at Ta=25°C and a standard test current (IF) of 20mA, unless otherwise specified.

• Mwangaza wa Mwanga (Iv):Inapimwa kwa milikandela (mcd), inawakilisha mwangaza unaohisiwa wa chanzo cha mwanga. Masafa ya kawaida ya LED ya machungwa na ya bluu ni 140-355 mcd, wakati LED ya kijani ni nyepesi zaidi, na masafa ya 355-900 mcd. Upimaji unafuata mkunjo wa majibu ya kuona ya wazi ya CIE.
• Pembe ya Mtazamo (2θ1/2):Thamani ya kawaida ni digrii 120. Hii ni pembe kamili wakati ukali wa mwanga unapungua hadi nusu ya thamani yake ya kilele cha mhimili, ikionyesha muundo wa utoaji unaoenea sana.
• Vigezo vya urefu wa wimbi:
  • Urefu wa wimbi wa kilele (λP):Wavelength at which the spectral power distribution reaches its maximum. Typical values: Orange: 611 nm, Green: 518 nm, Blue: 468 nm.
  • Dominant Wavelength (λd):The single wavelength that matches the perceived color of the LED. Typical values: Orange: 605 nm, Green: 525 nm, Blue: 470 nm. This value is derived from the CIE chromaticity diagram.
  • Spectral Half-Width (Δλ):The bandwidth of the emission spectrum at half of its maximum intensity. Typical values: Orange: 17 nm (narrow), Green: 35 nm, Blue: 25 nm.
• Forward Voltage (VF):The voltage drop across the LED when it conducts a specified current. Range: Orange: 1.8-2.4V; Green/Blue: 2.8-3.8V. Tolerance is +/- 0.1V. This is crucial for driver circuit design.
• Reverse Current (IR):At a reverse voltage (VR) of 5V, maximum is 10 μA. This device is not designed for reverse bias operation; this parameter is for leakage current characterization only.

3. Grading System Description

LED zimegawanywa katika makundi kulingana na nguvu ya mwanga inayopimwa kwenye 20mA, ili kuhakikisha uthabiti wa rangi na mwangaza ndani ya kundi la uzalishaji.

• Mgawanyo wa rangi ya machungwa na bluu:Kwa kutumia misimbo R2, S1, S2, T1, anuwai ya nguvu ni kutoka 140.0 mcd (kiwango cha chini cha R2) hadi 355.0 mcd (kiwango cha juu cha T1).
• Green Bin:Using codes T2, U1, U2, V1, with a higher intensity range, from 355.0 mcd (T2 minimum) to 900.0 mcd (V1 maximum).
• Tolerance:Kila kiwango cha nguvu kina uvumilivu wa +/-11% kwenye thamani ya kawaida, kwa kuzingatia mabadiliko madogo.

Wabunifu wanapaswa kubainisha msimbo wa kiwango kinachohitajika wakati wa kuagiza, ili kuhakikisha matumizi yao yafikie kiwango cha mwanga kinachotarajiwa, hasa katika safu nyingi za LED ambazo usawa ni muhimu.

4. Uchambuzi wa Mkunjo wa Utendaji

Mwongozo unarejelea safu za tabia za kawaida (ambazo hazijaelezwa kikamilifu katika dondoo zilizotolewa). Safu hizi zinazochorwa kwa kawaida ni pamoja na:

• Safu ya I-V (sasa-voltage):Inaonyesha uhusiano kati ya sasa ya mbele na voltage ya mbele kwa kila chipi ya rangi. Inaonyesha tabia ya kipeo ya diode inayowasha, na inasaidia kuchagua upinzani wa kudhibiti sasa au kubuni kiredio cha sasa thabiti.
• Mwangaza dhidi ya Sasa ya Mbele:Inaelezea jinsi pato la mwanga linavyobadilika na ongezeko la sasa, kwa kawaida lina uhusiano wa takriban mstari ndani ya safu ya kazi inayopendekezwa, na ufanisi hupungua kwa sasa kubwa sana.
• Mwangaza dhidi ya Joto la Mazingira:Inaonyesha kuwa pato la mwanga hupungua kadri joto la kiungo linavyoongezeka, jambo muhimu katika usimamizi wa joto kwa matumizi ya nguvu kubwa au hali ya joto ya juu ya mazingira.
• Usambazaji wa wigo:Chora grafu ya nguvu ya mionzi ya jamaa dhidi ya urefu wa wimbi kwa kila LED, ikionyesha wazi urefu wa wimbi wa kilele, urefu wa wimbi kuu na upana wa nusu ya wigo.

5. Taarifa za Mitambo na Ufungaji

5.1 Package Dimensions

This device complies with the EIA standard SMD package outline. All dimensions are in millimeters. Unless otherwise specified, the general tolerance is ±0.2 mm. The detailed dimension drawing will show the length, width, height, lead pitch, and lens geometry.

5.2 Pin Definitions

This tri-color LED uses a common-cathode or common-anode configuration (implied by the single package). The pinout is: Pin 1: Orange anode, Pin 3: Blue anode, Pin 4: Green anode (common cathode likely on Pin 2 and/or 5, conforming to standard 4-pin RGB LED packages). Verification against detailed package drawings is essential to ensure correct PCB layout.

5.3 Tape and Reel Packaging

Components are supplied in industry-standard embossed carrier tape, wound on 7-inch (178 mm) diameter reels for automated SMT assembly.

• Carrier Tape Dimensions:Upana wa mkanda, umbali kati ya mifuko na vipimo vya mifuko vimewekwa ili kuhakikisha utangamano na vifaa vya kawaida vya usambazaji.
• Vipimo vya reel:Reel ya kawaida ya inchi 7 inajumuisha vipande 2000. Kiwango cha chini cha agizo kwa reel iliyobaki ni vipande 500.
• Mkanda wa kufunika:Empty pockets are sealed with top cover tape.
• Quality:Compliant with ANSI/EIA-481 specification. The maximum number of consecutive missing components allowed in the carrier tape is two.

6. Mwongozo wa Uchomeaji na Usanikishaji

6.1 Mkunjo wa Joto wa Reflow Soldering

Kifaa hiki kinaendana na mchakato wa reflow soldering wa infrared (IR). Inashauriwa kutumia mkunjio wa joto wa reflow usio na risasi unaolingana na kiwango cha J-STD-020B.

• Upashaji joto kabla:150-200°C, kwa muda wa sekunde 120 kwa upeo, ili kupasha joto bodi ya mzunguko polepole na kuamilisha kioevu cha kusaidia kulehemu.
• Joto la kilele:Should not exceed 260°C. The time above liquidus (e.g., 217°C) should be controlled according to the solder paste manufacturer's recommendations.
• Soldering Time:The total time at peak temperature should be limited to a maximum of 10 seconds. Reflow soldering can be performed up to two times.

Kumbuka:Mkunjo bora wa joto unategemea muundo maalum wa PCB, ufuta wa kuuza na tanuri ya reflow. Mkunjo unaotokana na JEDEC unaweza kutumika kama lengo la jumla.

6.2 Manual Soldering

Ikiwa ni lazima kufanya ufungaji wa mikono, ni muhimu kuwa mwangalifu sana:

• Joto la chuma cha kuuza:Juu zaidi 300°C.
• Soldering Time:Kila kiungo cha kuunganishwa kwa umeme kisizidi sekunde tatu.
• Vizuizi:Uunganishaji wa umeme kwa mkono ufanyike mara moja tu, ili kuepuka uharibifu wa mkazo wa joto kwenye kifurushi cha LED au waya za kuunganisha.

6.3 Cleaning

Unapaswa kuepuka kutumia vifaa vya kemikali visivyobainishwa, kwani vinaweza kuharibu lenzi ya epoksi ya LED au ufungaji. Ikiwa unahitaji kusafisha baada ya kuchomelea:

• Tumia viyeyusho vya aina ya pombe, kama vile ethanol au isopropanol.
• Soak the LED at room temperature.
• Limit the soaking time to within 1 minute.

6.4 Uhifadhi na Uendeshaji

• Ufungashaji Uliofungwa Kabisa:Hifadhi katika mazingira ya ≤30°C na unyevunyevu jamaa (RH) ≤70%. Maisha ya rafu ni mwaka mmoja wakati unahifadhiwa kwenye mfuko wa kuzuia unyevu wa asili wenye kivundo kavu.
• Ufungashaji Uliofungwuliwa:Vipengee vilivyo wazi kwa hewa ya mazingira vinapaswa kuhifadhiwa katika mazingira ya ≤30°C na unyevu wa jamaa ≤60%. Inapendekezwa sana kukamilisha mchakato wa kuunganishwa kwa mkondo wa infrared ndani ya masaa 168 (siku 7) baada ya kufungua mfuko, ili kuzuia kunyonya unyevu, ambayo kunaweza kusababisha "popcorn" wakati wa kuunganishwa tena.
• Upanuzi wa uhifadhi (umefunguliwa):Kwa uhifadhi unaozidi masaa 168, tafadhali weka kipengee ndani ya chombo kilichofungwa chenye kikaushi au kikaushi kilichosafishwa kwa nitrojeni.
• Baking:Components stored outside their original packaging for more than 168 hours must be baked at approximately 60°C for at least 48 hours prior to soldering to remove absorbed moisture.

7. Mapendekezo ya Utumiaji

7.1 Mandhari ya Kawaida ya Utumiaji

This tri-color SMD LED is designed for general indicator and backlighting applications in consumer and industrial electronics that require multiple status colors from a single compact component. Examples include:

• Multi-state indicators on network equipment, routers, or servers (e.g., power/activity/error).
• Mwanga wa nyuma wa vifungo au alama kwenye paneli ya udhibiti, kifaa cha kudhibiti kwa mbali, au vifaa vya umeme.
• Taa za mapambo au maonyesho ya hali ndani ya gari (sio kazi muhimu).
• Viashiria vya hali ya vifaa vya kielektroniki vinavyobebeka.

Vikwazo Muhimu vya Utumizi:Mwongozo wa vipimo unasisitiza kwamba LED hizi zinakusudiwa kwa "vifaa vya kawaida vya kielektroniki." Hazijapitishwa kwa uthibitisho wa usalama kwa matumizi muhimu ya usalama, ambapo hitilafu inaweza kuhatarisha maisha au afya, kama vile anga, mifumo ya usaidizi wa maisha ya matibabu, au usalama wa usafiri barabarani. Kwa matumizi kama hayo, ni lazima kununua vipengele vilivyo na uthibitisho unaolingana wa uaminifu.

7.2 Design Considerations

• Current Limiting:Always use an external current-limiting resistor or constant-current driver for each color channel. Calculate the resistor value based on the supply voltage, the LED's forward voltage (VF, use the maximum value for safety), and the desired forward current (IF, which must not exceed the DC rating).
• Usimamizi wa joto:Ingawa matumizi ya nguvu ni ya chini, ikiwa inafanya kazi katika hali ya joto ya juu ya mazingira au ya sasa ya juu kabisa, hakikisha eneo la kutosha la shaba la PCB au mashimo ya upitishaji joto ili kudumisha halijoto ya kiungo ndani ya mipaka, na kuhakikisha uimara wa muda mrefu na pato la mwanga thabiti.
• Ubunifu wa pedi ya PCB:Fuata mpangilio wa pad ya chuma iliyopendekezwa kwenye mchoro wa kifurushi ili kuhakikisha umbo sahihi la mwamba wa kuuza wakati wa upakiaji tena na kudumisha utulivu wa mitambo.
• Ulinzi dhidi ya Umeme wa Tuli (ESD):Ingawa haijasemwa wazi, inashauriwa kufuata tahadhari za kawaida za uendeshaji dhidi ya ESD wakati wa usakinishaji wa vifaa vya semiconductor.

8. Technical Comparison and Differentiation

Ingawa maelezo haya ya pekee hayatoi ulinganisho wa moja kwa moja na aina nyingine, sifa muhimu za kipekee za sehemu hii zinaweza kudaiwa:

• Rangi Tatu katika Kifuniko Kimoja:Inatega rangi tatu tofauti, ikipunguza nafasi ya PCB na gharama ya usanikishaji ikilinganishwa na kutumia LED tatu za rangi moja.
• Pembe ya mtazamo pana (120°):Lenzi iliyotawanywa hutoa uonekano wa pande zote, bora kuliko LED za pembe nyembamba zinazotumika kwa miale iliyolenga.
• Kuwaka kwa kijani kibichi kwa nguvu:Ikilinganishwa na rangi ya machungwa na bluu, chipi ya kijani hutoa mwangaza mkubwa zaidi (hadi mcd 900), ambayo inaweza kuwa kusudi la kusawazisha mwangaza unaohisiwa wa kila rangi kutokana na utofauti wa usikivu wa jicho la binadamu.
• Ufungaji Imara:Uwezo wa kuingiliana na upigaji mshumaa wa infrared na usakinishaji wa kiotomatiki unaonyesha kuwa ufungaji huu umeundwa kwa ajili ya mchakato wa kisasa na unaotegemeka wa usakinishaji wa SMT.
• Standardized Binning:A well-defined binning structure enables predictable and consistent optical performance across production batches.

9. Maswali Yanayoulizwa Mara kwa Mara (Kulingana na Vigezo vya Kiufundi)

Q1: Je, naweza kuendesha rangi zote tatu kwa wakati mmoja kwa mkondo wa juu wa moja kwa moja (machungwa 30mA, kijani/bluu 20mA)?
A: Hapana. Jumla ya nguvu inayotumiwa (Pd) kwenye viwango vya juu kabisa haipaswi kuzidi. Kufanya kazi kwa mkondo wa juu kwa wakati mmoja kutasababisha jumla ya nguvu inayotumiwa kuzidi kikomo cha 80mW cha kifurushi (kikokotolewa kama VF*IF kwa kila chip kisha kujumlishwa). Lazima upunguze mkondo wa uendeshaji au utumie uendeshaji wa msukumo ili kukaa ndani ya kikomo cha jumla cha Pd.

Q2: Je, kuna tofauti gani kati ya urefu wa wimbi la kilele na urefu wa wimbi kuu?
A: Peak wavelength (λP) is the physical peak of an LED's emission spectrum. Dominant wavelength (λd) is a calculated value representing the perceived color hue on the CIE chart as a single wavelength. For monochromatic LEDs, they are typically close; for broader spectra (e.g., green), they can differ more significantly. λd is more relevant for color matching.

Q3: Why is the reverse current rating important if the LED is not used in reverse operation?
A: The IR rating (max 10 μA at 5V) is a leakage current specification. It ensures the device does not draw excessive current if a small reverse voltage is accidentally applied (e.g., during circuit transients or in multiplexed designs). This is a reliability parameter, not an operating condition.

Q4: How critical is the 168-hour floor life after opening the moisture barrier bag?
A: Ni muhimu sana kwa upachikaji wa kufanya mkondo tena. Unyevu uliokithiri katika ufungaji wa plastiki unageuka kuwa mvuke haraka wakati wa mzunguko wa joto wa juu wa kufanya mkondo tena, na kusababisha tabaka la ndani, ufa, au "popcorn" jambo, na kusababisha kushindwa. Kufuata muda wa saa 168 au kufuata utaratibu wa kuchoma ni muhimu kwa asilimia ya uzalishaji mzuri na uaminifu.

10. Mfano Halisi wa Ubunifu

Mandhari:Buni kiolezo cha onyesho la hali kwa kifaa kinachotumia reli ya umeme ya 5V. Kiolezo lazima kiweze kuonyesha rangi ya machungwa kwa "kusubiri", kijani kwa "utendaji wa kawaida", na bluu kwa "hitilafu". Rangi moja tu iwashwe kwa wakati mmoja.

Hatua za Ubunifu:

1. Chagua mkondo wa kufanya kazi:Chagua thamani ya kawaida salama kwa rangi zote, kwa mfano 15mA, ambayo ni chini sana kuliko thamani ya juu ya DC, ili kuhakikisha umri wa huduma na kupunguza mzigo wa joto.
2. Hesabu upinzani wa kudhibiti mkondo:
   • Ili kuweka ukingo wa usalama, tumia thamani ya juu ya VF kwenye maelezo ya kiufundi: rangi ya machungwa: 2.4V, kijani: 3.8V, bluu: 3.8V.
   • Voltage ya usambazaji (Vs) = 5V. Fomula: R = (Vs - VF) / IF.
     • R_machungwa = (5V - 2.4V) / 0.015A ≈ 173 Ω (tumia thamani ya kawaida ya 180 Ω).
     • R_green = (5V - 3.8V) / 0.015A ≈ 80 Ω (using the standard value of 82 Ω).
     • R_blue = (5V - 3.8V) / 0.015A ≈ 80 Ω (using the standard value of 82 Ω).
   • Recalculate the actual current using standard resistors: I_orange = (5-2.4)/180 ≈ 14.4mA (safe).
3. Check power dissipation:
   • Worst-case single LED power dissipation: P = VF * IF. Estimate using typical VF: P_green ≈ 3.3V * 0.0144A ≈ 47.5 mW, below the 80 mW limit for green/blue chips. Orange chip power dissipation is even lower. Since only one lights up at a time, the total package Pd is not exceeded.
4. PCB Layout:Place the LED and its three resistors close together. Use the pad layout recommended in the mechanical drawing. Ensure the correct pin definitions (1=orange, 3=blue, 4=green) are mapped to the drive circuit (e.g., microcontroller GPIO pins with series resistors).
5. Drive Circuit:Tumia pini ya microcontroller iliyosanidiwa kwa kufungua shimo au yenye upinzani wa mfululizo, ili kumwaga mkondo kwenye ardhi (ikiwa ni cathode ya pamoja) au kuvuta mkondo kutoka kwa usambazaji wa nguvu (ikiwa ni anode ya pamoja).

11. Utangulizi wa Kanuni ya Uendeshaji

Diodi ya Kutoa Mwanga (LED) ni kifaa cha semiconductor kinachotoa mwanga kupitia mwangaza wa umeme. Wakati voltage ya mbele inatumika kwenye makutano ya p-n, elektroni kutoka kwa nyenzo za aina-n huchanganyika na mashimo kutoka kwa nyenzo za aina-p katika eneo lenye ufanisi. Mchanganyiko huu hutoa nishati kwa njia ya fotoni (mwanga). Urefu maalum wa wimbi wa mwanga unaotolewa (rangi) umedhamiriwa na nishati ya pengo la bendi ya nyenzo za semiconductor zinazotumiwa katika eneo lenye ufanisi.

• Orange LED:Uses aluminum indium gallium phosphide (AlInGaP) semiconductor, whose band gap corresponds to red/orange/amber light.
• Green and blue LED:Inatumia semiconductor ya InGaN. Kwa kubadilisha uwiano wa indiamu/gali, pengo la bendi linaweza kurekebishwa ili kutoa mwanga wa bluu, kijani na cyan. Kufikia utoaji wa mwanga wa kijani wenye ufanisi kwa kutumia InGaN ni changamoto zaidi kuliko bluu, jambo hili linaonyeshwa katika sifa tofauti za utendaji (mfano, voltage ya mbele, ufanisi).

Chipi tatu zimewekwa kwenye kizio cha kutafakari ndani ya kifurushi cha plastiki. Lensi ya epoksi iliyotawanyika hufunga chipi, hutoa ulinzi wa mazingira, huunda boriti ya mwanga inayotolewa (pembe ya maono ya 120°), na huchanganya mwanga kutoka kwa chipi mbalimbali wakati chipi nyingi zinawashwa wakati mmoja ili kutoa rangi nyingine (mfano, nyeupe, ikiwa kuna fosforasi, lakini katika kifaa hiki cha RGB hakuna).

12. Technology Development Trends

Teknolojia inayowakilishwa na kijenzi hiki iko katika mwelekeo mpana wa optoelektroniki:

• Uboreshaji wa ufanisi:Uboreshaji endelevu wa sayansi ya nyenzo na usanidi wa chip unaoendelea kuongeza ufanisi wa mwanga wa LED (lumeni kwa kila watt), kuruhusu pato lenye mwangaza zaidi kwa umeme mdogo au kupunguza matumizi ya nishati.
• Miniaturization:Although this is a standard package, the industry is moving towards smaller Chip Scale Package (CSP) LEDs to achieve ultra-compact designs, albeit often at the expense of thermal performance and ease of handling.
• Improved Color Consistency:Uboreshaji wa mchakato wa ukuaji wa epitaxial na uainishaji umefanya usambazaji wa urefu wa wimbi na ukubwa kuwa mkusanyiko zaidi, jambo muhimu sana kwa matumizi yanayohitaji muonekano wa rangi unaolingana kati ya vitengo vingi.
• Ujumuishaji:Mbali na chipi nyingi kwenye kifurushi kimoja, mwelekeo ni kujumuisha IC ya kuendesha LED (chanzo cha mkondo wa mara kwa mara, kudhibiti PWM) ndani ya kifurushi cha LED yenyewe, na hivyo kurahisisha muundo wa saketi.
• Uaminifu na Uimara:Nyenzo za ufungaji zilizoboreshwa na mbinu za ujenzi zimeimarisha ukinzani dhidi ya mzunguko wa joto, unyevunyevu na mkazo wa mitambo, na kuongeza maisha ya kazi kwa kiasi kinachozidi mipaka ya jadi, na kufanya LED zifae kwa mazingira magumu zaidi.

Sehemu hii maalum inaonyesha matumizi ya ufundi na ya gharama nafuu ya teknolojia ya LED kwa matumizi ya kawaida ya viashiria vya mwanga, ikilinganisha utendaji, uaminifu na uwezekano wa kutengenezwa.