SMD LED Njano AlInGaP - Karatasi ya Data ya Kiufundi - Kifurushi cha SMD - Voltage ya Mbele 1.8-2.4V - Mwanga hadi 2.13lm

1. Muhtasari wa Bidhaa Hati hii inaelezea kwa kina vipimo vya LED ya kifaa cha kusakinishwa kwenye uso (SMD) inayotumia nyenzo ya semiconductor ya Aluminium Indium Gallium Phosphide (AlInGaP) kutoa mwanga wa njano. Kifaa hiki kimewekwa kwenye kifurushi cha lenzi wazi, kilichoundwa kwa michakato ya usanikishaji otomatiki na matumizi yenye nafasi ndogo. Kazi yake kuu ni kutumika kama kiashiria cha hali, taa ya ishara, au sehemu ya mwanga wa nyuma ya jopo mbele katika vifaa mbalimbali vya elektroniki.

1.1 Vipengele Muhimu na Faida Inatii maagizo ya RoHS (Vizuizi vya Vitu Hatari). Imefungwa kwenye tepi ya mm 8 iliyoviringishwa kwenye reeli yenye kipenyo cha inchi 7, inayofaa kwa vifaa vya otomatiki vya kuchukua na kuweka kwa kasi. Ina muundo wa kawaida wa kifurushi wa EIA (Muungano wa Viwanda vya Elektroniki). Viwango vya mantiki vinavyolingana na IC kwa ujumuishaji rahisi na saketi za udhibiti. Inalingana kabisa na michakato ya kuuza ya IR reflow, inayounga mkono profaili za kuuza zisizo na risasi. Imetayarishwa kwa kasi hadi kiwango cha unyevu cha JEDEC cha 3, ikionyesha maisha ya sakafu ya saa 168 kwa joto la <30°C/60% RH baada ya kufungua mfuko.

1.2 Soko Lengwa na Matumizi LED hii imeundwa kwa uaminifu na utendaji katika sekta mbalimbali. Maeneo muhimu ya matumizi ni pamoja na: Mawasiliano: Viashiria vya hali katika simu zisizo na waya, simu za mkononi, na vifaa vya mtandao. Otomatiki ya Ofisi: Viashiria vya jopo katika printer, skana, na kompyuta za mkononi. Vifaa vya Nyumbani: Viashiria vya kuwashwa, hali, au kazi katika vifaa mbalimbali vya nyumbani. Vifaa vya Viwanda: Viashiria vya hali ya uendeshaji na hitilafu katika jopo la udhibiti na mashine. Uonyeshaji wa Jumla: Matumizi ya taa ya ishara na alama, pamoja na mwanga wa nyuma wa jopo mbele ambapo mwanga sawa unahitajika.

• 2. Uchambuzi wa kina wa Vigezo vya Kiufundi Sehemu zifuatazo zinatoa muhtasari wa kina wa mipaka ya uendeshaji na tabia ya utendaji wa kifaa chini ya hali za kawaida za majaribio (Ta=25°C).
• 2.1 Viwango Vya Juu Kabisa Thamani hizi zinawakilisha mipaka ya mkazo ambayo kifaa kinaweza kuharibika kabisa. Uendeshaji karibu na mipaka hii haupendekezwi kwa muda mrefu. Kupoteza Nguvu (Pd): 72 mW. Hii ndiyo kiwango cha juu cha nguvu ambacho kifaa kinaweza kupoteza kama joto. Sasa ya Mbele ya Kilele (I F(PEAK) ): 80 mA. Hii ndiyo sasa ya juu ya papo hapo ya mbele, ambayo kwa kawaida imebainishwa chini ya hali ya mipigo (mzunguko wa kazi 1/10, upana wa mipigo 0.1ms) ili kuzuia kupata joto kupita kiasi. Sasa ya DC ya Mbele ya Kuendelea (I ): 30 mA. Hii ndiyo sasa ya juu inayopendekezwa kwa uendeshaji wa kuendelea. Voltage ya Nyuma (V ): 5 V. Kutumia voltage ya nyuma inayozidi thamani hii inaweza kusababisha kuvunjika kwa kiunganishi. Safu ya Joto la Uendeshaji: -40°C hadi +85°C. Safu ya joto la mazingira ambayo kifaa kimeundwa kufanya kazi. Safu ya Joto la Kuhifadhi: -40°C hadi +100°C. Safu ya joto la kuhifadhi isiyo ya uendeshaji.
• 2.2 Tabia za Umeme na Mwanga Vigezo hivi vinabainisha utendaji wa kawaida wa LED inapodhibitiwa chini ya hali maalum za majaribio (I = 20mA). Mwanga (Φ ): 0.67 lm (Chini) hadi 2.13 lm (Juu). Hii ndiyo nguvu ya jumla ya mwanga inayotolewa na chanzo, inayopimwa kwa lumens (lm). Safu mpana inadhibitiwa kupitia kugawa katika makundi. Uzito wa Mwanga (I ): 224 mcd (Chini) hadi 710 mcd (Juu). Hii ndiyo mwanga kwa pembe thabiti katika mwelekeo fulani, inayopimwa kwa millicandelas (mcd). Ni thamani ya kumbukumbu inayotokana na kipimo cha mwanga. Pembe ya Kuangalia (2θ 1/2 ): 120° (Kawaida). Hii ndiyo pembe kamili ambapo uzito wa mwanga ni nusu ya thamani kwenye mhimili wa mwanga (0°), ikionyesha muundo mpana sana wa kuangalia. Urefu wa Wimbi wa Juu wa Kutolewa (λ ): 591 nm (Kawaida). Urefu wa wimbi ambapo usambazaji wa nguvu wa wigo wa mwanga unaotolewa uko kiwango cha juu. Urefu wa Wimbi Mkuu (λ ): 584.5 nm hadi 594.5 nm. Urefu wa wimbi mmoja unaobainisha rangi inayoonekana ya mwanga, na uvumilivu wa ±1 nm kwa kila kundi. Upana wa Nusu ya Mstari wa Wigo (Δλ): 15 nm (Kawaida). Upana wa wigo wa utoaji kwa nusu ya uzito wake wa juu, ukionyesha usafi wa rangi. Voltage ya Mbele (V ): 1.8 V (Chini) hadi 2.4 V (Juu) kwa 20mA. Kupungua kwa voltage kwenye LED wakati sasa inapita, na uvumilivu wa ±0.1V kwa kila kundi. Sasa ya Nyuma (I ): 10 µA (Juu) kwa V =5V. Sasa ndogo ya uvujaji inayopita wakati kifaa kinapotolewa voltage ya nyuma.
• 3. Maelezo ya Mfumo wa Kugawa katika Makundi Ili kuhakikisha uthabiti katika uzalishaji, LED zinagawanywa katika makundi ya utendaji kulingana na vigezo muhimu. Hii inaruhusu wabunifu kuchagua sehemu zinazokidhi mahitaji maalum ya matumizi kwa mwangaza, rangi, na voltage.
• 3.1 Kugawa katika Makundi kulingana na Mwanga LED imegawanywa katika makundi kulingana na pato lake la jumla la mwanga. Uvumilivu ndani ya kila kundi la uzito ni ±11%. Kundi D2: 0.67 lm hadi 0.84 lm (224 mcd hadi 280 mcd) Kundi E1: 0.84 lm hadi 1.07 lm (280 mcd hadi 355 mcd) Kundi E2: 1.07 lm hadi 1.35 lm (355 mcd hadi 450 mcd) Kundi F1: 1.35 lm hadi 1.68 lm (450 mcd hadi 560 mcd) Kundi F2: 1.68 lm hadi 2.13 lm (560 mcd hadi 710 mcd)
• 3.2 Kugawa katika Makundi kulingana na Voltage ya Mbele LED pia zinagawanywa kulingana na kupungua kwa voltage ya mbele kwa 20mA, na uvumilivu wa ±0.1V kwa kila kundi. Hii ni muhimu sana kwa hesabu ya kizuizi cha sasa na muundo wa usambazaji wa nguvu. Kundi D2: 1.8 V hadi 2.0 V Kundi D3: 2.0 V hadi 2.2 V Kundi D4: 2.2 V hadi 2.4 V

3.3 Kugawa katika Makundi kulingana na Rangi / Urefu wa Wimbi Kugawa katika makundi kunahakikisha uthabiti wa rangi. Urefu wa wimbi mkuu, ambao unabainisha rangi ya njano inayoonekana, umegawanywa katika safu maalum na uvumilivu wa ±1 nm kwa kila kundi. Kundi H: 584.5 nm hadi 587.0 nm Kundi J: 587.0 nm hadi 589.5 nm Kundi K: 589.5 nm hadi 592.0 nm Kundi L: 592.0 nm hadi 594.5 nm

4. Uchambuzi wa Mviringo wa Utendaji Ingawa data maalum ya picha inarejelewa kwenye karatasi ya data, mwenendo wa kawaida wa utendaji wa LED za AlInGaP unaweza kuchambuliwa: 4.1 Sasa dhidi ya Voltage (I-V) Voltage ya mbele (V ) inaonyesha uhusiano wa logarithmic na sasa ya mbele (I ). Inaongezeka kwa njia isiyo ya mstari, na ongezeko kali zaidi kwa sasa ndogo (karibu na voltage ya kuwasha) na ongezeko la mstari zaidi kwa sasa kubwa kutokana na upinzani wa mfululizo ndani ya semiconductor na kifurushi. 4.2 Mwanga dhidi ya Sasa ya Mbele Pato la mwanga (mwanga) kwa ujumla linalingana na sasa ya mbele katika safu kubwa ya uendeshaji. Hata hivyo, ufanisi (lumens kwa watt) kwa kawaida hufikia kilele kwa sasa maalum na inaweza kupungua kwa sasa kubwa sana kutokana na ongezeko la joto na kupungua kwa ufanisi. 4.3 Utegemezi wa Joto Vigezo muhimu vinathiriwa na joto la kiunganishi (T ): Voltage ya Mbele (V ): Hupungua kwa ongezeko la joto (mgawo hasi wa joto). Mwanga/Uzito wa Mwanga: Kwa ujumla hupungua kwa ongezeko la joto. Kiwango cha kupungua ni jambo muhimu kwa usimamizi wa joto katika matumizi ya nguvu kubwa au joto la juu la mazingira. Urefu wa Wimbi Mkuu (λ ): Unaweza kubadilika kidogo na joto, na kusababisha rangi inayoonekana kubadilika.

• 5. Maelezo ya Mitambo na Kifurushi 5.1 Vipimo vya Kifurushi Kifaa hiki kinatii muundo wa kawaida wa kifurushi cha SMD cha EIA. Vipimo vyote muhimu, ikiwa ni pamoja na urefu wa mwili, upana, urefu, na nafasi ya waya, vinatolewa kwenye karatasi ya data na uvumilivu wa kawaida wa ±0.2 mm isipokuwa imebainishwa vinginevyo. Nyenzo ya lenzi wazi kwa kawaida ni msingi wa epoxy au silicone. 5.2 Kutambua Ubaguzi na Muundo wa Pad Kathodi kwa kawaida imewekwa alama kwenye mwili wa kifaa, mara nyingi kwa notch, nukta ya kijani, au kiashiria kingine cha kuona. Karatasi ya data inajumuisha muundo ulipendekezwa wa mchoro wa bodi ya saketi iliyochapishwa (PCB) (pad ya kiambatisho) kwa kuuza ya IR au reflow ya awamu ya mvuke. Muundo huu umeundwa ili kuhakikisha uundaji sahihi wa kiunganishi cha kuuza, usawa wakati wa reflow, na kiambatisho cha kuegemea cha mitambo.6. Miongozo ya Kuuza na Usanikishaji 6.1 Profaili Inayopendekezwa ya IR Reflow Kifaa hiki kinaendana na michakato ya kuuza isiyo na risasi (Pb-free). Karatasi ya data inarejelea profaili inayolingana na J-STD-020B. Vigezo muhimu kwa kawaida hujumuisha: Joto la Awali: 150°C hadi 200°C, na muda wa juu wa sekunde 120 ili kupokanzwa polepole usanikishaji na kuamilisha flux. Joto la Kilele: Kiwango cha juu cha 260°C. Muda juu ya joto la kioevu cha solder (k.m., 217°C kwa SAC305) lazima udhibitiwe. Muda wa Jumla wa Kuuza: Kiwango cha juu cha sekunde 10 kwa joto la kilele, na kiwango cha juu cha mizunguko miwili ya reflow inaruhusiwa. Kumbuka: Profaili bora inategemea muundo maalum wa PCB, vipengele, mchuzi wa solder, na tanuri. Profaili iliyotolewa ni mwongozo ambao lazima ubainishwe kwa usanidi halisi wa uzalishaji.
• 6.2 Kuuza kwa Mkono Ikiwa kuuza kwa mkono ni muhimu, tahadhari kubwa lazima ichukuliwe: Joto la Chuma: Kiwango cha juu 300°C. Muda wa Kuuza: Kiwango cha juu sekunde 3 kwa kila kiunganishi. Kikomo: Mzunguko mmoja tu wa kuuza unaruhusiwa kwa kuuza kwa mkono ili kupunguza mkazo wa joto kwenye kifurushi cha LED.6.3 Kusafisha Vidonge vya kusafisha vilivyobainishwa tu vinapaswa kutumika. Kemikali zisizobainishwa zinaweza kuharibu lenzi ya epoxy au kifurushi. Ikiwa kusafisha kunahitajika baada ya kuuza, kuzamishwa kwenye pombe ya ethyl au isopropyl kwa joto la kawaida kwa chini ya dakika moja kunapendekezwa.
• 6.4 Kuhifadhi na Kushughulikia Kuhifadhi sahihi ni muhimu sana kutokana na kiwango cha unyevu cha kifaa (MSL 3): Kifurushi Kilichofungwa: Hifadhi kwa ≤30°C na ≤70% Unyevu wa Jamaa (RH). Tumia ndani ya mwaka mmoja kutoka tarehe ya muhuri wa mfuko. Kifurushi Kilichofunguliwa: Hifadhi kwa ≤30°C na ≤60% RH. Vipengele lazima viwe na IR-reflow ndani ya saa 168 (siku 7) ya kufichuliwa kwa hewa ya mazingira. Ufichuaji Uliopanuliwa: Kwa kuhifadhi zaidi ya saa 168, hifadhi kwenye chombo kilichofungwa na dawa ya kukausha au katika mazingira ya nitrojeni. Vipengele vilivyofichuliwa kwa zaidi ya saa 168 vinahitaji kuokwa kwa takriban 60°C kwa angalau saa 48 kabla ya kuuza ili kuondoa unyevu uliokamatiwa na kuzuia "popcorning" wakati wa reflow.7. Ufungaji na Maelezo ya Kuagiza 7.1 Vipimo vya Tape na Reel LED hutolewa kwenye tepi ya kawaida ya viwanda ya kubeba iliyochongwa: Upana wa Tape: 8 mm. Kipenyo cha Reel: Inchi 7. Idadi kwa Reel: Vipande 2000 (reel kamili ya kawaida). Kiwango cha Chini cha Agizo (MOQ): Vipande 500 kwa idadi iliyobaki. Tape imefungwa na tepi ya jalada la juu. Ufungaji unalingana na vipimo vya ANSI/EIA-481, na ruhusa ya kiwango cha juu cha vipengele viwili mfululizo vilivyokosekana.
• 8. Maelezo ya Matumizi na Mazingatio ya Muundo 8.1 Kizuizi cha Sasa Kizuizi cha sasa cha mfululizo ni lazima kwa uendeshaji unaotegemewa. Thamani ya kizuizi (R ) inaweza kuhesabiwa kwa kutumia Sheria ya Ohm: R = (V usambazaji - V ) / I . Tumia V ya juu kutoka kwa kundi au karatasi ya data ili kuhakikisha sasa haizidi I inayotaka chini ya hali mbaya zaidi. Kiwango cha nguvu cha kizuizi lazima kikatoshe: P = (I )² * R 8.2 Usimamizi wa Joto Ingawa hiki ni kifaa cha nguvu ndogo, muundo sahihi wa joto unaongeza maisha na kudumisha utulivu wa pato la mwanga. Hakikisha eneo la kutosha la shaba kwenye PCB iliyounganishwa na pad ya joto ya LED (ikiwa inatumika) au waya ili kupoteza joto. Epuka kufanya kazi kwa sasa ya juu kabisa na kupoteza nguvu katika joto la juu la mazingira. 8.3 Muundo wa Mwanga Pembe ya kuangalia ya 120° hutoa boriti mpana sana. Kwa matumizi yanayohitaji boriti iliyolengwa zaidi, optics ya sekondari (lenzi, mabomba ya mwanga) lazima itumike. Lenzi wazi inafaa kwa matumizi ambapo picha ya die sio muhimu; kwa muonekano wa kutawanyika zaidi, lenzi iliyotawanyika ya maziwa au yenye rangi itahitajika.9. Maswali Yanayoulizwa Mara kwa Mara (FAQ) 9.1 Kuna tofauti gani kati ya Mwanga na Uzito wa Mwanga? Mwanga (lm) Hupima jumla ya kiasi cha mwanga unaoonekana unaotolewa na chanzo kwa pande zote. Uzito wa Mwanga (mcd) Hupima jinsi chanzo kinavyoonekana kuwa mkali katika mwelekeo maalum. LED yenye uzito mkubwa inaweza kuwa na boriti nyembamba, wakati LED yenye mwanga mwingi hutoa mwanga zaidi wa jumla, labda juu ya eneo pana zaidi. Katika karatasi hii ya data, uzito ni thamani ya kumbukumbu inayotokana na kipimo cha mwanga. 9.2 Kwa nini kugawa katika makundi ni muhimu? Tofauti za uzalishaji husababisha tofauti katika V , pato la mwanga, na rangi kati ya LED binafsi. Kugawa katika makundi huzipanga katika vikundi vilivyo na vigezo vilivyodhibitiwa vizuri. Kwa matumizi yanayohitaji muonekano sawa (k.m., maonyesho ya LED nyingi, taa za nyuma) au udhibiti sahihi wa sasa, kubainisha kundi moja au mchanganyiko wa makundi kutoka kwa kikundi kimoja ni muhimu sana. 9.3 Je, naweza kuendesha LED hii bila kizuizi cha sasa? LED ni diode yenye tabia isiyo ya mstari ya I-V. Ongezeko dogo la voltage juu ya V yake inaweza kusababisha ongezeko kubwa, linaloweza kuharibu, la sasa. Kizuizi cha mfululizo (au kiongozi cha sasa thabiti) kila wakati kinahitajika kuweka hatua ya uendeshaji kwa usalama. 9.4 Nini hufanyika ikiwa nitazidi muda wa kuhifadhi au reflow baada ya kufungua mfuko? Unyevu uliokamatiwa ndani ya kifurushi cha plastiki unaweza kuyeyuka kwa kasi wakati wa mchakato wa kuuza wa joto la juu la reflow, na kusababisha kutenganishwa kwa ndani, kuvunjika, au uharibifu wa waya wa dhamana ("popcorning"). Kufuata miongozo ya MSL 3 (maisha ya sakafu ya saa 168) na kufanya kuokwa kunahitajika ikiwa kimezidi ni muhimu sana kwa mavuno ya usanikishaji na uaminifu wa muda mrefu.
• 10. Kanuni ya Uendeshaji na Teknolojia 10.1 Teknolojia ya Semiconductor ya AlInGaP LED hii hutumia mchanganyiko wa semiconductor ya Aluminium Indium Gallium Phosphide (AlInGaP) kwa eneo lake linalofanya kazi. Kwa kudhibiti kwa usahihi uwiano wa vipengele hivi wakati wa ukuaji wa fuwele, bandgap ya nyenzo imeundwa ili kutoa mwanga katika eneo la njano la wigo unaoonekana (karibu 590 nm) wakati elektroni na mashimo zinapounganishwa tena kwenye bandgap (electroluminescence). Teknolojia ya AlInGaP inajulikana kwa ufanisi wake wa juu katika urefu wa wimbi wa nyekundu, machungwa, na njano. 10.2 Ujenzi wa Kifurushi cha SMD Die ya semiconductor imewekwa kwenye fremu ya kuongoza, ambayo hutoa viunganisho vya umeme (anodi na kathodi) na mara nyingi hufanya kazi kama kizuizi cha joto. Waya wa dhamana huunganisha juu ya die kwa terminal nyingine ya fremu ya kuongoza. Usanikishaji huu kisha umefungwa kwenye mchanganyiko wa kuunda wa epoxy au silicone unaoonekana ambao huunda lenzi. Umbo la lenzi linabainisha pembe ya kuangalia na hutoa ulinzi wa mitambo na wa mazingira.Signal and symbol luminary applications, as well as front panel backlighting where uniform illumination is required.

. In-Depth Technical Parameter Analysis

The following sections provide a detailed breakdown of the device's operational limits and performance characteristics under standard test conditions (Ta=25°C).

.1 Absolute Maximum Ratings

These values represent the stress limits beyond which permanent damage to the device may occur. Operation at or near these limits is not recommended for extended periods.

• Power Dissipation (Pd): mW. This is the maximum amount of power the device can dissipate as heat.
• Peak Forward Current (I_F(PEAK)): mA. This is the maximum instantaneous forward current, typically specified under pulsed conditions (1/10 duty cycle, 0.1ms pulse width) to prevent overheating.
• Continuous DC Forward Current (I_F): mA. This is the recommended maximum current for continuous operation.
• Reverse Voltage (V_R): V. Applying a reverse voltage exceeding this value can cause junction breakdown.
• Operating Temperature Range:-40°C to +85°C. The ambient temperature range over which the device is designed to function.
• Storage Temperature Range:-40°C to +100°C. The temperature range for non-operational storage.

.2 Electrical and Optical Characteristics

These parameters define the typical performance of the LED when driven under specified test conditions (I_F= 20mA).

• Luminous Flux (Φ_v):.67 lm (Min) to 2.13 lm (Max). This is the total perceived power of light emitted by the source, measured in lumens (lm). The wide range is managed through binning.
• Luminous Intensity (I_v): mcd (Min) to 710 mcd (Max). This is the luminous flux per solid angle in a given direction, measured in millicandelas (mcd). It is a referenced value derived from the luminous flux measurement.
• Viewing Angle (2θ_/2):° (Typical). This is the full angle at which the luminous intensity is half the value at the optical axis (0°), indicating a very wide viewing pattern.
• Peak Emission Wavelength (λ_p): nm (Typical). The wavelength at which the spectral power distribution of the emitted light is maximum.
• Dominant Wavelength (λ_d):.5 nm to 594.5 nm. The single wavelength that defines the perceived color of the light, with a tolerance of ±1 nm per bin.
• Spectral Line Half-Width (Δλ): nm (Typical). The spectral width of the emission at half its maximum intensity, indicating color purity.
• Forward Voltage (V_F):.8 V (Min) to 2.4 V (Max) at 20mA. The voltage drop across the LED when current is flowing, with a tolerance of ±0.1V per bin.
• Reverse Current (I_R): µA (Max) at V_R=5V. The small leakage current that flows when the device is reverse-biased.

. Binning System Explanation

To ensure consistency in production runs, LEDs are sorted into performance bins based on key parameters. This allows designers to select parts that meet specific application requirements for brightness, color, and voltage.

.1 Luminous Flux / Intensity Binning

The LED is categorized into bins based on its total light output. The tolerance within each intensity bin is ±11%.

• Bin D2:.67 lm to 0.84 lm (224 mcd to 280 mcd)
• Bin E1:.84 lm to 1.07 lm (280 mcd to 355 mcd)
• Bin E2:.07 lm to 1.35 lm (355 mcd to 450 mcd)
• Bin F1:.35 lm to 1.68 lm (450 mcd to 560 mcd)
• Bin F2:.68 lm to 2.13 lm (560 mcd to 710 mcd)

.2 Forward Voltage Binning

LEDs are also sorted by their forward voltage drop at 20mA, with a tolerance of ±0.1V per bin. This is crucial for current-limiting resistor calculation and power supply design.

• Bin D2:.8 V to 2.0 V
• Bin D3:.0 V to 2.2 V
• Bin D4:.2 V to 2.4 V

.3 Hue / Dominant Wavelength Binning

This binning ensures color consistency. The dominant wavelength, which defines the perceived yellow hue, is sorted into specific ranges with a tolerance of ±1 nm per bin.

• Bin H:.5 nm to 587.0 nm
• Bin J:.0 nm to 589.5 nm
• Bin K:.5 nm to 592.0 nm
• Bin L:.0 nm to 594.5 nm

. Performance Curve Analysis

While specific graphical data is referenced in the datasheet, typical performance trends for AlInGaP LEDs can be analyzed:

.1 Current vs. Voltage (I-V) Characteristic

The forward voltage (V_F) exhibits a logarithmic relationship with forward current (I_F). It increases non-linearly, with a sharper rise at lower currents (near the turn-on voltage) and a more linear increase at higher currents due to series resistance within the semiconductor and package.

.2 Luminous Flux vs. Forward Current

The light output (luminous flux) is generally proportional to the forward current over a significant operating range. However, efficiency (lumens per watt) typically peaks at a specific current and may decrease at very high currents due to increased heat generation and efficiency droop.

.3 Temperature Dependence

Key parameters are affected by junction temperature (T_j):

• Forward Voltage (V_F):Decreases with increasing temperature (negative temperature coefficient).
• Luminous Flux/Intensity:Generally decreases with increasing temperature. The rate of decrease is a critical factor for thermal management in high-power or high-ambient-temperature applications.
• Dominant Wavelength (λ_d):May shift slightly with temperature, affecting the perceived color.

. Mechanical and Package Information

.1 Package Dimensions

The device conforms to an EIA standard SMD package outline. All critical dimensions, including body length, width, height, and lead spacing, are provided in the datasheet with a standard tolerance of ±0.2 mm unless otherwise specified. The water-clear lens material is typically epoxy or silicone-based.

.2 Polarity Identification and Pad Design

The cathode is typically marked on the device body, often with a notch, green dot, or other visual indicator. The datasheet includes a recommended printed circuit board (PCB) land pattern (attachment pad) for infrared or vapor phase reflow soldering. This pattern is designed to ensure proper solder joint formation, self-alignment during reflow, and reliable mechanical attachment.

. Soldering and Assembly Guidelines

.1 Recommended IR Reflow Profile

The device is compatible with lead-free (Pb-free) soldering processes. The datasheet references a profile compliant with J-STD-020B. Key parameters typically include:

• Pre-heat:°C to 200°C, with a maximum time of 120 seconds to gradually heat the assembly and activate the flux.
• Peak Temperature:Maximum of 260°C. The time above the liquidus temperature of the solder (e.g., 217°C for SAC305) must be controlled.
• Total Soldering Time:Maximum of 10 seconds at peak temperature, with a maximum of two reflow cycles allowed.

Note:The optimal profile depends on the specific PCB design, components, solder paste, and oven. The provided profile is a guideline that must be characterized for the actual production setup.

.2 Hand Soldering

If hand soldering is necessary, extreme care must be taken:

• Iron Temperature:Maximum 300°C.
• Soldering Time:Maximum 3 seconds per joint.
• Limit:Only one soldering cycle is permitted for hand soldering to minimize thermal stress on the LED package.

.3 Cleaning

Only specified cleaning agents should be used. Unspecified chemicals may damage the epoxy lens or package. If cleaning is required post-soldering, immersion in ethyl alcohol or isopropyl alcohol at room temperature for less than one minute is recommended.

.4 Storage and Handling

Proper storage is critical due to the device's moisture sensitivity level (MSL 3):

• Sealed Package:Store at ≤30°C and ≤70% Relative Humidity (RH). Use within one year of the bag seal date.
• Opened Package:Store at ≤30°C and ≤60% RH. Components must be IR-reflowed within 168 hours (7 days) of exposure to ambient air.
• Extended Exposure:For storage beyond 168 hours, store in a sealed container with desiccant or in a nitrogen ambient. Components exposed for more than 168 hours require baking at approximately 60°C for at least 48 hours before soldering to remove absorbed moisture and prevent "popcorning" during reflow.

. Packaging and Ordering Information

.1 Tape and Reel Specifications

The LEDs are supplied in industry-standard embossed carrier tape:

• Tape Width: mm.
• Reel Diameter: inches.
• Quantity per Reel: pieces (standard full reel).
• Minimum Order Quantity (MOQ): pieces for remainder quantities.
• The tape is sealed with a top cover tape. The packaging conforms to ANSI/EIA-481 specifications, with allowances for a maximum of two consecutive missing components.

. Application Notes and Design Considerations

.1 Current Limiting

A series current-limiting resistor is mandatory for reliable operation. The resistor value (R_s) can be calculated using Ohm's Law: R_s= (V_supply- V_F) / I_F. Use the maximum V_Ffrom the bin or datasheet to ensure the current does not exceed the desired I_Funder worst-case conditions. The power rating of the resistor must be sufficient: P_R= (I_F)² * R_s.

.2 Thermal Management

While this is a low-power device, proper thermal design extends lifetime and maintains light output stability. Ensure adequate copper area on the PCB connected to the LED's thermal pad (if applicable) or leads to dissipate heat. Avoid operating at the absolute maximum current and power dissipation in high ambient temperatures.

.3 Optical Design

The 120° viewing angle provides a very wide beam. For applications requiring a more focused beam, secondary optics (lenses, light pipes) must be used. The water-clear lens is suitable for applications where the die image is not critical; for a more diffuse appearance, a milky or colored diffused lens would be required.

. Frequently Asked Questions (FAQ)

.1 What is the difference between Luminous Flux and Luminous Intensity?

Luminous Flux (lm)measures the total amount of visible light emitted by the source in all directions.Luminous Intensity (mcd)measures how bright the source appears in a specific direction. A high-intensity LED may have a narrow beam, while a high-flux LED emits more total light, potentially over a wider area. In this datasheet, intensity is a referenced value derived from the flux measurement.

.2 Why is binning important?

Manufacturing variations cause differences in V_F, light output, and color between individual LEDs. Binning sorts them into groups with tightly controlled parameters. For applications requiring uniform appearance (e.g., multi-LED displays, backlights) or precise current drive, specifying a single bin or a mix of bins from the same group is essential.

.3 Can I drive this LED without a current-limiting resistor?

No.An LED is a diode with a non-linear I-V characteristic. A small increase in voltage above its V_Fcan cause a large, potentially destructive increase in current. A series resistor (or a constant-current driver) is always required to set the operating point safely.

.4 What happens if I exceed the storage or reflow time after opening the bag?

Moisture absorbed into the plastic package can vaporize rapidly during the high-temperature reflow soldering process, causing internal delamination, cracking, or bond wire damage ("popcorning"). Following the MSL 3 guidelines (168 hours floor life) and performing the required bake-out if exceeded is critical for assembly yield and long-term reliability.

. Operational Principle and Technology

.1 AlInGaP Semiconductor Technology

This LED uses an Aluminum Indium Gallium Phosphide (AlInGaP) semiconductor compound for its active region. By precisely controlling the ratios of these elements during crystal growth, the bandgap of the material is engineered to emit light in the yellow region of the visible spectrum (around 590 nm) when electrons and holes recombine across the bandgap (electroluminescence). AlInGaP technology is known for its high efficiency in the red, orange, and yellow wavelengths.

.2 SMD Package Construction

The semiconductor die is mounted onto a leadframe, which provides the electrical connections (anode and cathode) and often acts as a heat sink. Bond wires connect the top of the die to the other leadframe terminal. This assembly is then encapsulated in a transparent epoxy or silicone molding compound that forms the lens. The lens shape determines the viewing angle and provides mechanical and environmental protection.