SMD LED Yellow 120-Degree Viewing Angle - Electrical/Optical Characteristics - Automotive Accessories Application - Technical Documentation

1. Product Overview

Hii hati hii inatoa maelezo kamili ya kiufundi ya kifaa cha juu cha utendaji cha LED cha SMD. Kifaa hiki kimeundwa kwa uimara na utendaji katika mazingira magumu, hasa kwa matumizi ya zana za ziada katika sekta ya magari. Ukubwa wake mdogo wa ufungashaji na umbo la kawaida hufanya iwe inafaa kwa mchakato wa usanikishaji wa otomatiki wa PCB na muundo wenye nafasi ndogo.

1.1 Core Features and Advantages

LED hii inajumuisha sifa muhimu kadhaa zinazochangia uimara wake na urahisi wa kuunganishwa:

• Uzingatiaji wa mazingira:Bidhaa inafuata maagizo ya RoHS (Vizuizi vya Vitu Vinavyoweza Kuumiza).
• Usindikaji wa kiotomatiki:Vifaa vinapatikana kwenye reeli yenye kipenyo cha inchi 7 vilivyowekwa kwenye mkanda wa kubebea wa mm 12, vinavyolingana na vifaa vya kawaida vya kukandamiza kiotomatiki.
• Kigezo cha Uaminifu wa Juu:Vifaa vimepitia utayarishaji wa kuharakishwa hadi kiwango cha JEDEC Level 2 na vimeidhinishwa kulingana na kigezo cha AEC-Q101 Rev D, ambacho ni kigezo cha msingi kwa vipengele vya semiconductor tofauti katika matumizi ya magari.
• Uwezo wa kufanana na mchakato wa utengenezaji:Imebuniwa kufanana na mchakato wa IR reflow soldering, ambao ni mchakato wa kawaida katika utengenezaji wa kisasa wa elektroniki.
• Kiunganishi cha umeme:Kifaa kinapatana na mzunguko wa jumuishi (I.C.), na hurahisisha muundo wa saketi ya kuendesha.

1.2 Soko Lengwa na Matumizi

Matumizi makuu yanayotarajiwa niMfumo wa Vifaa vya Nyongeza vya Magari. Hii inajumuisha utendakazi wa taa za mambo ya ndani na nje ambazo hazijajumuishwa katika mfumo mkuu wa taa muhimu kwa usalama (kwa mfano taa za mbele, taa za breki). Mfano unaweza kujumuisha taa za kiashiria cha dashibodi, taa za mazingira, taa za kuangazia chini ya gari, au taa za hali za mifumo mbalimbali ndogo ya gari. Mchanganyiko wa mwangaza wa juu, pembe pana ya mtazamo, na uthibitisho wa kiwango cha gari hufanya iweze kutumika kwa matumizi haya.

2. Vigezo vya Kiufundi: Ufafanuzi wa kina na usio na upendeleo

Sehemu hii inachambua kwa undani sifa za umeme, za macho na za joto za kifaa. Isipokuwa imebainishwa vinginevyo, vigezo vyote vinabainishwa kwa joto la mazingira (Ta) la 25°C.

2.1 Absolute Maximum Ratings

Viwango hivi vinabainisha mipaka ambayo inaweza kusababisha uharibifu wa kudumu kwa kifaa. Hakuna uhakikisho wa utendakazi kwenye au chini ya mipaka hii.

• Power Dissipation (Pd):530 mW. This is the maximum power the device can dissipate in the form of heat.
• Peak Forward Current (I_F(PEAK)):400 mA. Hii ndiyo kiwango cha juu cha mkondo wa msukumo unaoruhusiwa, kwa kawaida hufafanuliwa chini ya hali maalum (1/10 ya uwiano wa kazi, upana wa msukumo wa 0.1ms) ili kudhibiti joto la kiungo.
• Mkondo wa moja kwa moja wa mbele (I_F):5 mA hadi 200 mA. Huu ndio safu inayopendekezwa ya uendeshaji endelevu. Mkondo wa chini huhakikisha mwanga unaotoka kwa utulivu, wakati mkondo wa juu unazuia joto kupita kiasi.
• Operating and Storage Temperature Range:-40°C to +110°C. This wide range is typical for automotive-grade components.
• Infrared Soldering Conditions:Inaweza kukimya joto la 260°C kwa sekunde 10, ambayo inalingana na mkunjo wa kawaida wa kulehemu tena bila risasi (Pb-free).

2.2 Thermal Characteristics

Udhibiti wa joto ni muhimu kwa utendaji na maisha ya LED. Vigezo hivi vinafafanua jinsi joto linavyopitishwa kutoka kwenye kiungo cha semiconductor.

• Thermal Resistance, Junction-to-Ambient (R_θJA):Typical value 50 °C/W. Measured on an FR4 PCB (1.6mm thick) with a 16mm² copper pad. This value indicates the rise in junction temperature per watt of power dissipated relative to the ambient air.
• Thermal Resistance, Junction-to-Solder Point (R_θJS):Typical value 30 °C/W. This is often a more useful metric because it describes the thermal path to the PCB, which is the primary heat sink. Lower values are better.
• Maximum Junction Temperature (T_J):125 °C. The absolute upper limit for semiconductor junction temperature.

2.3 Electrical and Optical Characteristics

These are typical performance parameters under standard test conditions (I_F= 140mA, Ta=25°C).

• Luminous Intensity (I_V):4.5 cd (minimum) to 11.2 cd (maximum). Measured using a sensor with a filter matched to the photopic (human eye) response curve (CIE). Actual values are binned (see Section 3).
• Viewing angle (2θ_1/2):Typical value 120 degrees. This is the full angle at which the luminous intensity drops to half of its peak (on-axis) value. Such a wide viewing angle provides a broad, uniform illumination pattern.
• Peak Emission Wavelength (λ_P):Typical value 592 nm. This is the wavelength at which the spectral power output is highest.
• Dominant Wavelength (λ_d):583 nm to 595 nm. This is the single wavelength that best represents the perceived color of the light, derived from the CIE chromaticity diagram. Binning is performed to ensure consistency.
• Spectral Line Half-Width (Δλ):Typical value 18 nm. This indicates spectral purity; a narrower width means more saturated and purer color.
• Forward voltage (V_F):1.90 V (min) to 2.65 V (max) at 140mA. This is the voltage drop across the LED during operation. Binning is performed to aid circuit design.
• Reverse current (I_R):At V_R= 12V, the maximum is 10 μA. This device is not designed for reverse bias operation; this parameter is for test purposes only.

3. Maelezo ya Mfumo wa Kugawanya

To ensure color and performance consistency in production, LEDs are sorted into different bins based on key parameters. The lot code follows the format: Vf / Iv / Wd (e.g., D/DA/3).

3.1 Kugawanya kwa Voltage ya Mbele (Vf)

Ugawaji wa kategoria huhakikisha kuwa LED zina punguzo la voltage sawa, jambo muhimu kwa ushiriki wa sasa katika saketi zinazofanana au muundo unaotabirika wa kiendeshi.

• Gear Code:C (1.90-2.05V), D (2.05-2.20V), E (2.20-2.35V), F (2.35-2.50V), G (2.50-2.65V).
• Tolerance:±0.1V ndani ya kila kiwango.

3.2 Luminous Intensity (Iv) Binning

Hii inategemea kikundi cha mwangaza wa pato la mwanga wa LED.

• Gear Code:DA (4.5-5.6 cd), DB (5.6-7.1 cd), EA (7.1-9.0 cd), EB (9.0-11.2 cd).
• Tolerance:±11% within each bin.

3.3 Grading of Dominant Wavelength (Wd)

This ensures the consistency of perceived yellowness across different production batches.

• Gear Code:3 (583-586 nm), 4 (586-589 nm), 5 (589-592 nm), 6 (592-595 nm).
• Tolerance:±1 nm ndani ya kila kiwango.

4. Performance Curve Analysis

Graphical data provides in-depth insights into the behavior of LEDs under various conditions.

4.1 Spatial Distribution (Beam Pattern)

The provided polar plot (Figure 2) visually illustrates the 120-degree viewing angle. It shows the relative luminous intensity as a function of the angle from the central axis. For such wide-viewing-angle LEDs, the pattern is typically Lambertian or near-Lambertian, meaning the intensity decreases with the cosine of the angle.

4.2 Forward Current vs. Forward Voltage / Luminous Intensity

While no explicit graph is provided in the excerpt, typical curves for AlInGaP LEDs show a non-linear relationship. The forward voltage (V_F) increases logarithmically with current. The luminous intensity (I_V) Kwa kawaida huwa sawia na mkondo wa mwelekeo chanya ndani ya safu fulani, na baada ya kuzidi safu hiyo, ufanisi hupungua kwa sababu ya ongezeko la joto na athari nyingine za semiconductor. Kufanya kazi kwenye 140mA iliyopendekezwa kuna uwezekano mkubwa wa kuwa katika eneo la ufanisi wa juu.

4.3 Temperature Dependence

Utendaji wa LED unaathiriwa na joto. Kadiri halijoto ya kiungo inavyopanda:

• Forward voltage (V_F):Hupungua kidogo (kigezo cha halijoto hasi).
• Luminous Intensity (I_V):Kupungua. Mwanga wa pato hupungua kwa kiasi kikubwa chini ya joto la juu, ndiyo maana usimamizi wa joto (R_θJS) ni muhimu sana.
• Dominant Wavelength (λ_d):Kuhama kidogo kunaweza kutokea, ambayo kunaweza kuathiri rangi inayohisiwa, hasa katika matumizi yenye viwango vikali vya kugawanya.

5. Mechanical and Packaging Information

5.1 Package Dimensions and Polarity Identification

The LED adopts a standard EIA package outline. Key dimensions include length, width, and height, with a typical tolerance of ±0.2mm. A critical design point is that,the anode lead frame also serves as the primary heat sink for the LEDThis means the anode pad design on the PCB should maximize heat dissipation, as it is the main path for heat to leave the LED junction and enter the PCB.

5.2 Recommended PCB Mounting Pad Design

Provides the land pattern diagram for infrared reflow soldering. Adhering to this recommendation is crucial for achieving proper solder joint formation, ensuring good electrical connection, and (critically) maximizing heat transfer from the anode/thermal pad to the PCB copper layer. The size and shape of this pad directly affect the effective thermal resistance (R_θJS).

6. Soldering and Assembly Guide

6.1 Mkunjo wa Uchimbaji wa Infrared Reflow

A detailed reflow profile is specified, compliant with the J-STD-020 lead-free process standard. Key parameters include:

• Preheating:Ramp up to 150-200°C.
• Soak/Preheat Time:Maximum 120 seconds for temperature stabilization and flux activation.
• Peak Temperature:Maximum 260°C.
• Time Above Liquidus (TAL):The dwell time above the solder's melting point is critical; the profile ensures it stays within the specified limits (typically 60-90 seconds) to form reliable solder joints without causing thermal damage to components.
• Number of Soldering Cycles:Mzunguko wa juu wa reflow mara mbili.

6.2 Manual Welding (if necessary)

Ikiwa utahitaji kurekebisha kwa mikono:

• Joto la chuma cha kulehemu:Kiwango cha juu cha 300°C.
• Muda wa kulehemu:Muda upeo wa kila mshono wa umeme ni sekunde 3.
• Idadi ya ukarabati:Uchomaji mkono unaruhusiwa mara moja tu, ili kupunguza mkazo wa joto.

6.3 Cleaning

Ikiwa unahitaji kusafisha baada ya kuchomea, tumia tu vilainishi vilivyobainishwa ili kuepuka kuharibu kifurushi cha LED. Vinapendekezwa ni ethanol au isopropanol. LED zinapaswa kuzamishwa kwa chini ya dakika moja kwenye joto la kawaida.

7. Tahadhari za Uhifadhi na Uendeshaji

7.1 Uwezo wa Kuvumilia Unyevu

According to JEDEC J-STD-020, this product is classified asMoisture Sensitivity Level (MSL) 2。

• Ufungaji uliofungwa:Hifadhi kwa ≤30°C na ≤70% unyevunyevu jamaa (RH). Maisha ya rafu ni mwaka mmoja kutoka tarehe ya msimbo wakati imehifadhiwa kwenye mfuko wa asili wa kuzuia unyevu na kikaushi.
• Ufungaji uliofunguliwa:For components removed from sealed bags, the storage environment must not exceed 30°C and 60% RH. It is recommended to complete infrared reflow soldering within 365 days after opening.
• Long-term storage (opened):Store in a sealed container with desiccant or in a nitrogen dryer.
• Baking:If components have been exposed to ambient conditions for more than 365 days, they must be baked at approximately 60°C for at least 48 hours prior to soldering to remove absorbed moisture and prevent "popcorn" damage during reflow.

7.2 Uzingatiaji wa Matumizi

This LED is designed for general electronic and automotive accessory equipment. For applications where failure could directly endanger life or health (e.g., aviation primary systems, medical life support, critical safety equipment), specific reliability assessment and consultation with the manufacturer are required before design adoption.

8. Ufungaji na Taarifa za Kuagiza

8.1 Vipimo vya Tape ya Kubeba na Reel

The device is supplied in industry-standard embossed carrier tape format.

• Carrier tape width:12 mm.
• Reel diameter:Inchi 7 (178 mm).
• Idadi kwa kila reel:Kawaida vipande 1000, kiwango cha chini cha agizo kwa kila reel ni vipande 500.
• Cover Tape:The cavity is sealed with top cover tape.
• Missing Component:Kulingana na vipimo, inaruhusiwa kwa upeo wa taa za LED mbili zinazokosekana mfululizo (shimo).
• Kigezo:Ufungaji unalingana na kigezo cha ANSI/EIA-481.

8.2 Label Information

Lebo la rejareja lina msimbo wa maelezo ya kundi, umbo la Vf_Bin/Iv_Bin/Wd_Bin (mfano, D/DA/3), inaruhusu kufuatilia sifa za umeme na za nuru za kundi.

9. Application Suggestions and Design Considerations

9.1 Mandhari ya Kawaida ya Utumiaji

• Automotive Interior:Dashboard indicator lights, gear shift position indicators, audio system status lights, footwell or center console ambient lighting.
• Exterior Automotive Lighting:Puddle lights, door handle illumination, non-critical marker or decorative lights.
• General Indicator Lights:LED za hali katika vifaa vingine vya usafiri au viwanda, ambapo mtazamo mpana na mwangaza wa juu ni muhimu.

9.2 Mambo Muhimu ya Ubunifu

1. Usimamizi wa Joto:Hii ndiyo kipengele muhimu zaidi. Mpangilio wa PCB lazima uweze kuongeza kiwango cha juuPad ya anodiukubwa na muunganisho wa joto (kutumia mashimo ya kupita kwa kuunganisha kwa safu za ndani au za nyuma za shaba), kwani ndiyo njia kuu ya joto. Kukosa kufanya hivyo kutasababisha joto la juu la kiungo, pato la mwanga lililopungua, kuzorota kwa mwanga kwa kasi na maisha mafupi.
2. Kuendesha sasa:Use a constant current drive circuit, rather than a simple current-limiting resistor connected to a variable voltage source, to achieve stable and consistent light output. Ensure the driver can provide the required current (5-200mA DC) and can handle the forward voltage bin of the LED used.
3. Optical Design:A 120-degree viewing angle provides broad, diffuse light. For a focused beam, secondary optics (lenses) are required. "Water clear" lens means the LED emits the native yellow light without diffusion.
4. ESD Protection:Although not explicitly stated as sensitive devices, implementing basic ESD protection on the control lines driving LEDs is a good practice for enhancing robustness.

10. Ulinganisho wa Teknolojia na Tofauti

Ingawa maelezo haya hayatoi kulinganisha moja kwa moja na aina nyingine, lakini tofauti kuu za LED hii zinaweza kudhaniwa kutokana na vipimo vyake:

• Ikilinganishwa na LED za kibiashara za kawaida:Tofauti kuu ni:AEC-Q101 CertificationAnd an extended temperature range (-40°C to +110°C), making it suitable for automotive environments where extreme temperatures and vibrations are common.
• Compared to narrow-angle LEDs:其120-degree viewing angleMuch wider than many indicator LEDs (which may be 30-60 degrees), making it more suitable for area lighting or applications where the LED might be viewed from off-axis angles.
• Compared to unbinned LEDs:KamiliVigezo vitatu vya kugawanya (Vf, Iv, Wd)Inahakikisha muunganiko wa juu wa mwangaza, rangi na tabia ya umeme ndani ya kundi la uzalishaji, jambo muhimu sana kwa matumizi yanayohitaji muonekano sawa au utendakazi unaotabirika wa saketi.

11. Maswali Yanayoulizwa Mara kwa Mara (Kulingana na Vigezo vya Teknolojia)

Q1: Je, kuna tofauti gani kati ya urefu wa wimbi la kilele na urefu wa wimbi kuu?
A: Urefu wa wimbi la kilele (λ_P) ni urefu wa wimbi la kimwili ambapo LED hutoa nguvu kubwa zaidi ya mwanga. Urefu wa wimbi kuu (λ_d) is a calculated value based on the entire emission spectrum and the CIE color-matching functions, representing the color perceived by the human eye. λ_dIt is more relevant for color specification.

Q2: Why is there a minimum forward current (5mA)?
A: At extremely low currents, the light output of an LED can become unstable and non-linear. Specifying a minimum value ensures the device operates within a predictable and stable region of its performance curve.

Q3: Naweza kutumia chanzo cha umeme cha 12V na kipingamizi kuendesha LED hii?
A: Kiufundi inawezekana, lakini hairuhusiwi kwa utendaji bora au uthabiti. Hesabu R = (12V - V_F) / I_Fni rahisi, lakini mabadiliko yoyote ya voltage ya chanzo au voltage ya mbele ya LED (kutokana na kiwango au joto) yatasababisha mabadiliko makubwa ya mkondo na mwangaza. Inapendekezwa sana kutumia kiendesha cha mkondo wa kudumu.

Q4: The anode is the heat sink. Does this mean the cathode pad is thermally insignificant?
A: Correct. The primary thermal path is intentionally designed through the anode. While the cathode connection also conducts some heat, the PCB layout should concentrate thermal management measures (large copper areas, thermal vias) entirely on the anode pad for maximum effectiveness.

12. Mifano ya Uundaji na Matumizi Halisi

Scenario: Designing ambient light strips for the car center console.

1. Requirements Analysis:Inafikisha taa ya mwanga wa manjano laini na sawasawa kwenye ukanda wa sentimita 30, inayoonekana kutoka viti mbalimbali. Voltage ya kufanya kazi ni mfumo wa gari wa 12V. Anuwai ya hali ya joto kutoka kuanzishwa baridi hadi jikoni la moto.
2. Uchaguzi wa vipengele:LED hii inafaa kwa sababu ya kiwango cha gari, mtazamo mpana (kwa usambazaji sawasawa) na rangi ya manjano. Mwangaza wa juu unaruhusu kuendeshwa chini ya mkondo wa juu zaidi, kwa ufanisi zaidi na maisha marefu zaidi.
3. Usanifu wa saketi:Select a switching constant-current LED driver IC, configured to deliver 100mA per LED. This is below the 140mA test point, providing margin for thermal derating. The driver's current setting is independent of fluctuations in the vehicle's 9-16V electrical system.
4. PCB Layout:The design employs a linear LED array. The most critical step is to design a large solid copper pour area for the anode pad of each LED, connected via multiple thermal vias to a dedicated internal ground plane serving as a heat sink. The cathode pads are connected using thin traces.
5. Optical Integration:The LED is placed behind a milky or textured light guide plate/diffuser, scattering the 120-degree beam into completely uniform light and hiding the individual LED "hot spots."
6. Verification:Test components across the entire temperature range to ensure that the light output meets requirements at high temperatures and that condensation-related failures do not occur during humidity cycling (verification followed the MSL-2 handling procedure).

13. Technical Introduction

This LED utilizesAlInGaPMfumo wa nyenzo za semiconductor. Nyenzo hii ni bora sana katika kutoa mwanga katika maeneo ya rangi ya manjano, machungwa, nyekundu na kahawia ya wigo. Faida kuu za AlInGaP ni pamoja na ufanisi wa juu wa quantum ndani na utulivu mzuri wa joto ikilinganishwa na baadhi ya mifumo mingine ya nyenzo. Lensi za "maji safi" kawaida hufanywa kwa epoksi ya joto kali au silikoni ambayo ni uwazi kwa urefu wa mawimbi ya utoaji, na kuruhusu rangi safi ya chip ya semiconductor ionekone bila kubadilishwa au kutawanywa.

14. Mienendo ya Maendeleo ya Sekta

Mwelekeo wa jumla wa SMD LED, hasa kwa matumizi ya magari na viwanda, unaelekea kwenye mwelekeo ufuatao:

1. Kuongeza ufanisi (lm/W):Uboreshaji endelevu wa ukuaji wa epitaxial na usanidi wa chip, unaozalisha mwanga zaidi kwa pembejeo sawa ya umeme, na hivyo kupunguza matumizi ya nguvu na mzigo wa joto.
2. Msongamano wa nguvu wa juu zaidi na usimamizi bora wa joto:The new package design incorporates improved thermal pathways (such as the dedicated anode heatsink here) and materials to handle higher drive currents within a smaller footprint.
3. Enhanced Reliability and Stringent Certification:Standards like AEC-Q101 are continuously revised, requiring components to pass more rigorous testing for longer lifespans, especially in automotive applications where 10-15 years of service life is common.
4. Stricter Binning and Color Consistency:Kadri matumizi kama taa za mazingira yanavyozidi kuwa makini kwa upendeleo, mahitaji ya LED zenye kuratibu za rangi (zaidi ya urefu wa wimbi kuu) na nguvu zisizobadilika sana kati ya vikundi vya uzalishaji yanaongezeka.
5. Ujumuishaji:Kuna mwelekeo wa kuunganisha chipi nyingi za LED, saketi za udhibiti, na wakati mwingine vipengele vya optiki katika "moduli moja ya LED" yenye akili zaidi, ili kurahisisha muundo wa mtumiaji wa mwisho.