SMD Reflective LED 67-22/R6BHC-B07/2T Datasheet - P-LCC-4 Package - Red/Blue Bicolor - 20mA - Simplified Chinese Technical Documentation

1. Product Overview

Waraka huu unaelezea kwa kina vipimo vya kiufundi vya 67-22/R6BHC-B07/2T, ambayo ni LED ya aina ya Surface Mount Device (SMD) yenye kifuniko cha P-LCC-4 na kioo cha ndani kilichojumuishwa cha kutafakari. Kipengele hiki kimeundwa kutoa mwangaza wa juu na uwanja mpana wa kuona, na ni chaguo bora kwa matumizi yanayohitaji kiashiria cha kuona wazi au taa ya usawa ya nyuma. Bidhaa hutoa aina mbili tofauti za chip: R6 (nyekundu angavu) na BH (bluu), zote zikiwa zimefunikwa kwenye dirisha la wazi la mwamba. Muundo wake unatumia kioo cha kutafakari cha ndani ili kuboresha ufanisi wa utoaji wa mwanga na mwelekeo wake.

Faida kuu za LED hii ni pamoja na: usawa na vifaa vya kiotomatiki vya kupachika, ufaafu kwa mchakato wa unyunyizaji wa mvuke, na utoaji wa ufungaji wa reeli ya mkanda kwa ajili ya uzalishaji mkubwa. Ni kipengele kisicho na risasi na kinatii kanuni zinazohusiana na mazingira. Soko kuu lengwa ni vifaa vya mawasiliano, elektroniki za watumiaji, na paneli za udhibiti wa viwanda, ambapo inaweza kutumika kama kiashiria cha kuaminika, chanzo cha taa ya nyuma kwa LCD na swichi, au kama chanzo cha mwanga kwa sehemu za mwongozo wa mwanga.

2. Technical Parameter Analysis

2.1 Absolute Maximum Ratings

The operating limits of the device are defined under specific environmental conditions (Ta=25°C). Exceeding these ratings may cause permanent damage.

• Reverse Voltage (VR):Maximum 5V. This is a key parameter for circuit protection; applying a reverse bias exceeding this value will damage the LED junction.
• Forward Current (IF):The continuous DC forward current rating varies by chip: 50 mA for R6 (red), 25 mA for BH (blue). The typical operating condition specified in the datasheet is 20mA.
• Peak Forward Current (IFP):Both chips are rated at 100 mA, suitable for pulse operation at the specified duty cycle.
• Power Dissipation (Pd):R6 ni 120 mW, BH ni 95 mW. Kigezo hiki, pamoja na upinzani wa joto (ulio thibitishwa), huamua nguvu ya juu inayoruhusiwa chini ya hali fulani za joto.
• Masafa ya joto:Joto la uendeshaji (Topr) ni -40°C hadi +85°C; joto la uhifadhi (Tstg) ni -40°C hadi +90°C.
• Joto la kuchomelea:Kipengele hiki kinaweza kukabili joto la kilele la 260°C kwa muda wa sekunde 10 kwa reflow soldering, au joto la 350°C kwa muda wa sekunde 3 kwa mkono soldering.

2.2 Electro-Optical Characteristics

Viashiria muhimu vya utendaji vinapimwa chini ya hali ya Ta=25°C na IF=20mA, isipokuwa ikibainishwa vinginevyo.

• Luminous Intensity (Iv):The range for both R6 and BH chips is from a minimum of 90 mcd to a maximum of 225 mcd. Typical values fall within this binning range.
• Viewing Angle (2θ1/2):The full width at half maximum is typically 120 degrees, providing a very broad emission pattern, which is ideal for large-area lighting.
• Wavelength:
  • R6 (Red):Urefu wa wimbi wa kilele (λp) kwa kawaida ni 632 nm. Anuwai ya urefu wa wimbi kuu (λd) ni kutoka 621 nm hadi 631 nm.
  • BH (Buluu):Urefu wa wimbi wa kilele (λp) kwa kawaida ni 468 nm. Anuwai ya urefu wa wimbi kuu (λd) ni kutoka 466.5 nm hadi 471.5 nm.
• Spectral radiation bandwidth (Δλ):R6 is approximately 20 nm, and BH is approximately 25 nm, defining the spectral purity of the emitted light.
• Forward voltage (VF):
  • R6 (Red):Katika 20mA, anuwai ni 1.75V hadi 2.35V.
  • BH (Buluu):Katika 20mA, anuwai ni 2.9V hadi 3.7V. Voltage hii ya mbele ya juu ni sifa ya kawaida ya LED ya bluu yenye msingi wa InGaN.
• Reverse current (IR):Kiasi cha juu cha 10 μA wakati voltage ya nyuma ya 5V inatumika.

Maelezo ya Toleo:Uainishaji unabainisha toleo la utengenezaji: nguvu ya mwanga (±11%), wavelength kuu (±1nm) na voltage ya mbele (±0.1V). Hizi ni muhimu kwa uthabiti wa muundo.

3. Grading System Description

Ili kuhakikisha uthabiti wa rangi na mwangaza katika uzalishaji, LED hupangwa katika vikundi tofauti kulingana na vigezo muhimu.

3.1 Luminous Intensity Binning

Wakati hupimwa chini ya IF=20mA, chipsi za R6 na BH zote hupangwa katika vikundi vinne vya nguvu (Q2, R1, R2, S1). Vikundi hivi hufafanua thamani ya chini na ya juu, huku zikiruhusu wabunifu kuchagua kiwango sahihi cha mwangaza kwa matumizi yao, kuanzia mwangaza wa kawaida (Q2: 90-112 mcd) hadi mwangaza wa juu (S1: 180-225 mcd).

3.2 Dominant Wavelength Binning

For the R6 (red) chip, the dominant wavelength is divided into two codes: FF1 (621-626 nm) and FF2 (626-631 nm). This allows for the selection of a specific red hue. The BH (blue) chip has a narrower specified range (466.5-471.5 nm), indicating higher consistency in blue wavelength output.

3.3 Forward Voltage Binning

Forward voltage is also binned to assist circuit design, particularly for current-limiting resistor calculation and power supply design.

• R6 (Red):Bins 0 (1.75-1.95V), 1 (1.95-2.15V), and 2 (2.15-2.35V).
• BH (Buluu):Gear 11 (2.90-3.10V), 12 (3.10-3.30V), 13 (3.30-3.50V), and 14 (3.50-3.70V).

4. Performance Curve Analysis

The datasheet provides characteristic curves for both the R6 and BH models to facilitate a deeper understanding of performance under different conditions.

4.1 Uhusiano wa Nguvu ya Mwanga ya Jamaa na Mkondo wa Mbele

Mkunjo huu unaonyesha kuwa, kabla ya kufikia kiwango cha sasa kilichopangwa, umeme wa mbele na utoaji wa mwanga una uhusiano wa karibu na mstari. Inathibitisha kuwa 20mA ndio sehemu ya kawaida ya kufanya kazi ambapo rangi zote mbili ziko ndani ya eneo la mstari. Kuendesha LED kwa sasa ya juu zaidi kutaongeza utoaji, lakini pia kutaongeza joto la kiungo na kuharakisha kupungua kwa mwanga.

4.2 Forward Current Derating Curve

This chart is crucial for thermal management. It illustrates the maximum allowable continuous forward current as a function of ambient temperature (Ta). As Ta increases, the maximum allowable current decreases linearly. For reliable operation in high-temperature environments (e.g., +85°C), the forward current must be significantly derated from its 25°C rating.

4.3 Spectral Distribution

Grafu ya wigo inaonyesha uhusiano kati ya nguvu ya mionzi iliyosanidiwa na urefu wa wigo. Mkunjo R6 una kituo cha 632 nm na upana wa kiwango cha kawaida, wakati mkunjo BH una kituo cha 468 nm. Michoro hii ni muhimu kwa matumizi yanayohitaji maudhui maalum ya wigo.

4.4 Relationship Between Forward Voltage and Forward Current

Mkunjo huu wa sifa za IV unaonyesha uhusiano wa kielelezo wa kawaida wa diode. Voltage huongezeka kwa logariti ya sasa. Mkunjo huu husaidia kuelewa upinzani wa mwendo wa LED, jambo muhimu sana katika kubuni saketi bora za kuendesha.

4.5 Radiation Pattern

Mchoro wa kuratibu polar unaonyesha wazi pembe ya maono ya kawaida ya 120°. Ukubwa umeorodheshwa kwa thamani ya kilele (axial). Mchoro huu unaonyesha muundo unaofanana na usambazaji wa Lambert, jambo la kawaida katika LED zenye lenzi au vikunjio vinavyotawanyika, kutoa mwanga mpana na sawasawa.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The LED is packaged in a P-LCC-4 (Plastic Leaded Chip Carrier, 4-pin) package. The detailed dimension drawing specifies overall dimensions, lead pitch, and cavity details. Key dimensions include the pad size, which is crucial for PCB pad design. The package incorporates a built-in reflector cup surrounding the LED chip to collimate light and enhance forward luminous intensity. The anode and cathode are clearly marked on the package drawing.

6. Soldering and Assembly Guide

6.1 Mkunjo wa Joto la Reflow Soldering

Inatoa maelezo ya kina ya mkunjo wa joto wa upakiaji tena usio na risasi. Hatua muhimu ni pamoja na:

• Upashaji joto kabla:150-200°C, kwa muda wa sekunde 60-120, kiwango cha juu cha kupanda kwa joto ni 3°C/kwa sekunde.
• Reflow (above liquidus):The time above 217°C should be 60-150 seconds. The peak temperature must not exceed 260°C, and the time within ±5°C of the peak temperature should be no more than 10 seconds.
• Cooling:Kasi ya juu ya baridi ni 6°C/s.

Ujumbe Muhimu:Uchimbaji wa rejeshi haupaswi kuzidi mara mbili, ili kuzuia uharibifu wa mfuko na waya za kuunganisha kutokana na mkazo wa joto.

6.2 Tahadhari za Uhifadhi na Uendeshaji

• Uwezo wa Nyeti kwa Unyevu:Kipengele hiki kimepakwa kwenye mfuko wa kuzuia unyevu ulio na kikaushi. Usifungue mfuko huo kabla ya kuandaa kutumia sehemu. Maisha ya kiwanda baada ya kufunguliwa ni saa 168 chini ya hali ya ≤30°C na ≤60% RH.
• Kupikwa:If the storage time is exceeded or the desiccant indicator changes color, baking at 60 ±5°C for 24 hours before reflow soldering is required to prevent the "popcorn" phenomenon (package cracking due to vapor pressure).
• Current Protection:An external current-limiting resistor must be used. LEDs are current-driven devices; a small variation in forward voltage can cause a large change in current, potentially leading to instantaneous failure.
• Mechanical Stress:Avoid applying mechanical stress to the LED body during the soldering process.

7. Maelezo ya Ufungaji na Uagizaji

7.1 Tape and Reel Specifications

The product is supplied in 8mm carrier tape format, wound on standard reels. Each reel contains 2000 pieces. Detailed drawings of the carrier tape pocket dimensions and reel dimensions are provided to ensure compatibility with automated assembly equipment feeders.

7.2 Label Description

Lebo ya reel ina misimbo kadhaa:

• P/N:Nambari ya Sehemu ya Mtengenezaji (67-22/R6BHC-B07/2T).
• QTY:Idadi ya vipengee kwenye reel.
• CAT, HUE, REF:Codes corresponding to luminous intensity binning, dominant wavelength binning, and forward voltage binning, respectively.
• LOT No:Traceable lot number.

8. Mapendekezo ya Utumiaji

8.1 Mandhari ya Kawaida ya Utumiaji

• Vifaa vya Mawasiliano:Viwango vya hali kwenye ruta, modem, simu na mashine ya faksi.
• Mwanga wa nyuma wa LCD:Mwanga wa nyuma wa aina ya kuingia kwa upande au kushuka moja kwa moja kwa skrini ndogo za LCD zenye rangi moja au zenye rangi kwenye vifaa vya nyumbani, vyombo na vifaa vinavyoshikwa mkononi.
• Uwashi wa swichi na alama:Backlighting for membrane switches, keypads, and panel legends.
• Light Guide Applications:As a light source for acrylic or PC light guides, transmitting light from the PCB to the front panel or display.
• Ujumla wa Maonyesho ya Hali:Taa za mwanga za umeme, shughuli, kengele au hali katika vifaa vya kielektroniki vilivyoenea.

8.2 Design Considerations

• Current Limiting:A series resistor must be used. Calculate the resistor value using the formula R = (Vsupply - Vf) / If, where Vf should be selected as the maximum rating value (e.g., 2.35V for R6, 3.7V for BH) to ensure a conservative design where the current never exceeds 20mA, even accounting for power supply voltage tolerance and Vf variation.
• Thermal Management:Kwa uendeshaji endelevu katika hali ya joto la juu la mazingira au karibu na mkondo wa juu zaidi, inapaswa kuzingatiwa mpangilio wa PCB. Tumia shaba ya kutosha iliyounganishwa kwenye pedi ya joto ya LED (ikiwepo) au pini ya cathode, kufanya kama kifaa cha kupoza joto.
• Usanifu wa Optics:Pembe ya upana ya 120° inaweza kuhitaji bomba la kuongoza mwanga, sahani ya kutawanya au lenzi ili kuunda boriti ya mwanga kwa matumizi maalum. Kioakisi cha jumla hutoa nguvu nzuri ya mbele, lakini huenda kisifaa kwa mahitaji ya boriti nyembamba sana.
• Ulinzi wa ESD:Ingawa hakuna kiwango maalum cha ESD kilichobainishwa, tahadhari za kawaida za uendeshaji wa ESD zinapaswa kufuatwa wakati wa usanikishaji ili kuzuia uharibifu unaowezekana kwa kiunga cha semiconductor.

9. Ulinganisho wa Teknolojia na Tofauti

Ikilinganishwa na LED ya kawaida ya SMD isiyo na kiolezo cha mwanga kilichojumuishwa, kipengele hiki hutoa nguvu kubwa zaidi ya mwanga wa mbele chini ya mkondo sawa wa kuendesha, kutokana na athari ya kuzingatia mwanga ya kikombe cha kiolezo. Kifurushi cha P-LCC-4 kinatoa muundo wa mitambo imara zaidi kuliko kifurushi cha kiwango cha chip, na kwa kawaida hutoa utendaji bora wa joto kupitia pini zake. Ikilinganishwa na LED zisizo na daraja au zenye safu mpana, utoaji wa maelezo ya kina ya nguvu, urefu wa wimbi, na uwekaji wa voltage, huruhusu usanidi mkali zaidi wa mfumo na uthabiti bora wa bidhaa ya mwisho. Mchanganyiko wa pembe mpana ya mtazamo na nguvu nzima, hufanya kuwa chaguo la matumizi mengi kwa programu zinazohitaji uonekano wa pembe za mbali na utendaji mkali wa mhimili.

10. Maswali Yanayoulizwa Mara kwa Mara (Kulingana na Vigezo vya Kiufundi)

10.1 What is the difference between Peak Wavelength and Dominant Wavelength?

Peak wavelength (λp) is the wavelength at which the spectral power distribution reaches its maximum. Dominant wavelength (λd) is the wavelength of monochromatic light that most closely matches the perceived color of the LED light. For design purposes, especially in color-sensitive applications, the dominant wavelength and its binning are more relevant.

10.2 Can I drive this LED with 30mA?

While the absolute maximum rating for continuous forward current is 50mA (R6) or 25mA (BH), the photometric characteristics are specified at 20mA. Driving at 30mA will produce more light but also increases power dissipation, junction temperature, and may accelerate lumen depreciation. It is essential to refer to the derating curves and ensure the junction temperature remains within safe limits. For long-term reliable operation, it is recommended to follow the typical condition of 20mA.

10.3 Why is the forward voltage of a blue LED higher than that of a red one?

Hii imedhamiriwa na nyenzo za msingi za semiconductor. LED nyekundu ya R6 hutumia AlGaInP (aluminium-gallium-indium-phosphide), ambayo ina nishati ya pengo la bendi ndogo. LED ya bluu ya BH hutumia InGaN (indium-gallium-nitride), ambayo ina pengo la bendi pana zaidi. Pengo pana linahitaji nishati zaidi kwa elektroni kuvuka, na hii hubadilika kuwa voltage ya mbele ya juu zaidi chini ya mkondo sawa.

10.4 How to Interpret the Grading Code When Placing an Order?

When placing an order, you can specify the required CAT (intensity), HUE (wavelength), and REF (voltage) bin codes to ensure the received LED performance parameters fall within your specific design window. For example, to achieve consistent bright red output, you can specify CAT=S1 and HUE=FF2. If not specified, you will receive parts from the standard production bins.

11. Design and Use Case Studies

Scenario: Designing a multi-status indicator light panel for a network switch.The panel requires a red LED for "critical alarm", a blue LED for "system activity", and needs to be visible from all angles in a rack-mounted unit. Therefore, the 67-22/R6BHC-B07/2T was selected.

Implementation Plan:Models R6 (red) and BH (blue) were used. The designer selected the S1 intensity bin for maximum brightness and specified tight wavelength bins (e.g., FF2 for red) to ensure color consistency across all units. A simple drive circuit was designed using a 5V power supply. For the blue LED (max Vf=3.7V @20mA), the current-limiting resistor was calculated: R = (5V - 3.7V) / 0.02A = 65 ohms. A standard 68-ohm resistor was chosen. For the red LED (max Vf=2.35V), R = (5V - 2.35V) / 0.02A = 132.5 ohms; a 130-ohm resistor was used. The wide 120° viewing angle ensures the indicator is clearly visible even when technicians are not directly facing the panel. Components were placed using automated equipment with the provided tape and reel.

12. Working Principle

A Light Emitting Diode (LED) is a semiconductor device that emits light through electroluminescence. When a forward voltage is applied across the p-n junction, electrons from the n-type material recombine with holes from the p-type material in the active region. This recombination process releases energy in the form of photons (light). The specific wavelength (color) of the emitted light is determined by the bandgap energy of the semiconductor material used in the active region. The AlGaInP material system produces red, orange, and yellow light, while the InGaN system produces blue, green, and white light (when combined with a phosphor). The integrated reflector in this package is a molded cavity, typically made of a highly reflective material, surrounding the chip. It redirects light that would otherwise be emitted sideways or backward toward the front of the package, thereby increasing the useful forward luminous intensity and controlling the beam pattern.

13. Technology Trends

Maendeleo ya SMD LED za aina hii yanafuata mwelekeo mpana zaidi wa tasnia: kupunguza ukubwa, kuboresha ufanisi (lumeni kwa wati) na kuaminika zaidi. Matumizi ya teknolojia ya kioakisi ndani ya ukubwa wa kawaida wa kifurushi ni njia ya kiuchumi na yenye ufanisi wa kuboresha utendaji bila kugeukia aina za gharama kubwa za Chipu kwenye Bodi (COB) au kifurushi cha hali ya juu. Tasnia inaendelea kusukuma kuboresha ufanisi wa nyenzo za AlGaInP (nyekundu) na InGaN (bluu/kijani), na hivyo kupata mwangaza wa juu zaidi kwa mkondo sawa wa umeme, au mwangaza sawa kwa nguvu ya chini. Uvumbuzi wa kifurushi unalenga usimamizi bora wa joto kukabiliana na msongamano ulioongezeka wa nguvu, na kuboresha usawa wa rangi katika muundo wote wa utoaji na usawa wa rangi wa pembe (ACU). Kama inavyoonyeshwa kwenye maelezo huu ya kiufundi, msisitizo juu ya kutokuwa na risasi na kufuata RoHS, unaonyesha mabadiliko ya tasnia nzima kuelekea utengenezaji endelevu wa kimazingira.