SMD Side-View LED 57-11UTC/S827-1/TR8 Datasheet - P-LCC-4 Package - White - 20mA - Technical Documentation

1. Product Overview

The 57-11UTC/S827-1/TR8 is a high-performance white light-emitting diode (LED) housed in a compact P-LCC-4 surface-mount device (SMD) package. This side-view LED is specifically designed to provide efficient and reliable illumination for a variety of modern electronic applications where space and power consumption are constrained.

Kifaa hiki kinatumia ufungaji mweupe na resini wazi, kikiteknolojia ya chip ya InGaN kutoa mwanga mweupe. Uundaji muhimu wake unajitokeza kupitia muundo ulioboreshwa wa kioakisi cha ndani ndani ya ufungaji uliofanya iwe na mtazamo mpana. Muundo huu umeboresha ufanisi wa kuunganisha mwanga, ukifanya LED hii ifae hasa kwa matumizi ya miongozo ya mwanga inayohitaji mwanga wa upande sawasawa. Hitaji lake la chini la umeme linaifanya iwe chaguo bora kwa vifaa vya kubebea vinavyotumia betri na matumizi mengine yanayohitaji ufanisi wa juu wa nishati.

本产品符合严格的环境和质量标准，采用无铅工艺，符合欧盟RoHS和REACH法规，并满足无卤要求（Br<900ppm， Cl<900ppm， Br+Cl<1500ppm）。同时，已根据JEDEC J-STD-020D Level 3标准进行了湿度敏感度预处理。

1.1 Core Advantages and Target Market

Faida Kuu:

• Nguvu ya Juu ya Mwangaza na Ufanisi wa Juu:Inatoa pato lenye mwangaza wakati wa kuboresha matumizi ya nguvu.
• Pembea pana (takriban 120°):Muundo wa mwanga wa upande unaotumia vichungi ndani unahakikisha usambazaji wa mwanga mpana na sawasawa, na ni chaguo bora kwa taa za ukingo.
• Ufungaji kompaktifu wa P-LCC-4:Sura ndogo inaokoa nafasi ya thamani kwenye bodi ya mzunguko.
• Muundo thabiti:Inajumuisha ulinzi wa ESD (2000V HBM), na imebuniwa kwa mchakato wa kuaminika wa kuunganisha tena.
• Uzingatiaji wa mazingira:Inakidhi mahitaji ya kisasa ya kanuni za vitu hatari.

Target Application:

• Backlighting for full-color LCDs in consumer electronics, industrial panels, and automotive displays.
• Status indicators and backlighting in Office Automation (OA) equipment (e.g., printers, scanners, and multifunction devices).
• Automotive interior lighting, instrument panel illumination, and switch backlighting.
• A universal replacement for traditional miniature bulbs and fluorescent lamps in indicator light applications.

2. In-depth Analysis of Technical Parameters

Sehemu hii inachambua kwa kina na kwa uwazi vigezo muhimu vya umeme, mwanga na joto vilivyoorodheshwa katika hati ya maelezo.

2.1 Absolute Maximum Ratings

Viwango hivi vinaelezea mipaka ambayo inaweza kusababisha uharibifu wa kudumu wa kifaa. Uendeshaji chini ya hali hizi hauhakikishi utendakazi.

• Voltage ya Kinyume (V_R):5V. Kuzidi voltage hii chini ya upendeleo wa kinyume kunaweza kusababisha kuvunjika kwa kiungo.
• Mwendo wa Mbele unaoendelea (I_F):30mA. Upeo wa mkondo wa moja kwa moja unaohakikisha uendeshaji thabiti wa muda mrefu.
• Peak Forward Current (I_FP):100mA (duty cycle 1/10, frequency 1kHz). Allows short high-current pulses, suitable for multiplexing or PWM dimming schemes.
• Power Dissipation (P_d):110mW. The maximum power that the package can dissipate, calculated by the formula V_F* I_F. This limit is crucial for thermal management.
• Operating and Storage Temperature:-40°C to +85°C (operating), -40°C to +90°C (storage). Specifies the complete environmental range for device functionality and non-operational storage.
• ESD Withstand (HBM):2000V. Provides a certain level of electrostatic discharge protection, suitable for handling processes.
• Soldering Temperature:Reflow Soldering: Peak temperature 260°C, maximum 10 seconds. Hand Soldering: Maximum 350°C per lead, maximum 3 seconds. Crucial for assembly process control.

2.2 Electro-Optical Characteristics (Ta=25°C)

These are typical performance parameters measured under standard test conditions.

• Luminous Intensity (I_v):900mcd (min), 1800mcd (max), test condition is I_F=20mA. This is the primary measure of light output. The wide range indicates the use of a binning system (see Section 3). No typical value is given, meaning selection must be based on the specific bin code.
• Viewing Angle (2θ_1/2):120° (typical). Defined as the full angle at which the luminous intensity drops to half of its peak value. This confirms its broad, diffuse emission pattern.
• Forward Voltage (V_F):2.75V (min), 3.95V (max), tested at I_F=20mA. The voltage drop across the LED during operation. This parameter is also binned. Its variation stems from inherent tolerances in the semiconductor process.
• Tolerance:The datasheet specifies that within a given bin, the luminous intensity tolerance is ±11% and the forward voltage tolerance is ±0.1V. This factor must be considered for precise design.

3. Binning System Description

Ili kuhakikisha uthabiti katika uzalishaji wa kiwango kikubwa, LED hutengwa katika vikundi au "kupangwa" kulingana na utendaji. Hii inawawezesha wabunifu kuchagua vifaa vinavyokidhi mahitaji maalum ya mwangaza na umeme.

3.1 Luminous Intensity Binning

Kulingana na nguvu ya mwanga iliyopimwa kwenye 20mA, LED hutengwa katika vikundi vitatu:

• Kundi V2:900 mcd hadi 1120 mcd
• Kundi W1:1120 mcd hadi 1420 mcd
• Bin W2:1420 mcd to 1800 mcd

This binning ensures that brightness variation is controlled within the same production lot. For applications requiring uniform brightness across multiple LEDs, specifying a single, narrower bin (e.g., W1) is crucial.

3.2 Forward Voltage Binning

LEDs are also grouped into four categories based on their forward voltage drop:

• Group M5:2.75V to 3.05V
• Kundi 6:3.05V hadi 3.35V
• Kundi 7:3.35V hadi 3.65V
• Kundi 8:3.65V hadi 3.95V

Mgawanyiko wa voltage ni muhimu sana katika kubuni mtandao wa kupinga kikomo cha mkondo, hasa wakati wa kuendesha LED nyingi zilizounganishwa mfululizo. Kutumia LED kutoka kwenye kiwango sawa cha voltage hupunguza kwa kiwango cha juu kutofautiana kwa mkondo katika matawi yanayounganishwa sambamba.

3.3 Chromaticity Coordinate Binning

The chromaticity point of white light is defined by its coordinates on the CIE 1931 chromaticity diagram. The datasheet defines four primary bins:

• 6K, 6L, 7K, 7L:Each bin has a defined quadrilateral area on the x, y chromaticity diagram. For example, bin 6K covers x from 0.3130 to 0.3300 and y from 0.2840 to 0.3300.
• Tolerance:The chromaticity coordinate tolerance is ±0.01, defining the allowable deviation relative to the nominal bin corners.

This binning allows for the selection of LEDs for applications with high color consistency requirements, such as LCD backlighting or multi-LED indicators.

4. Performance Curve Analysis

The provided characteristic curves offer valuable information for understanding LED behavior under non-standard conditions.

4.1 Relationship Between Luminous Intensity and Ambient Temperature

Grafu inaonyesha kuwa, kutoka -40°C hadi takriban 25°C, nguvu ya mwanga inakaa kwa urahisi, ikidumisha karibu 100% ya thamani yake ya joto la kawaida. Nguvu huanza kupungua polepole joto linapozidi 25°C na kuendelea kupanda. Katika joto la juu la uendeshaji la 85°C, pato linaweza kuwa takriban 80-85% ya thamani yake ya 25°C. Athari hii ya kuzima kwa joto ni ya kawaida kwa LED na lazima izingatiwe katika usanidi wa mazingira ya joto kali.

4.2 Forward Current Derating Curve

Mchoro huu unabainisha uhusiano wa mkondo wa juu unaoruhusiwa unaoendelea kama utendakazi wa joto la mazingira. Katika 25°C, mkondo kamili wa 30mA unaruhusiwa. Kadiri joto la mazingira linavyopanda, mkondo wa juu unaoruhusiwa lazima upunguzwe kwa mstari, ili kuzuia kuzidi kikomo cha matumizi ya nguvu cha 110mW na kudhibiti joto la kiungo. Hii ni kanuni muhimu ya usanidi kuhakikisha uaminifu.

4.3 Relationship Between Forward Current and Forward Voltage (I-V Curve)

Grafu hii inaonyesha uhusiano wa kawaida wa kielelezo wa diode. Voltage ya mbele huongezeka kadiri mkondo unavyoongezeka. Katika mkondo wa kawaida wa uendeshaji wa 20mA, V_FTakriban 3.2V hadi 3.4V (kutegemea kiwango). Wakati wa kutumia chanzo cha voltage ya kudumu, mkunjo huu ni muhimu kwa kuchagua thamani sahihi ya upinzani wa kikomo cha mkondo: R = (V_{Chanzo cha umeme}- V_F) / I_F.

。

4.4 Uhusiano wa Nguvu ya Mwanga na Mkondo wa Mbele

The light output increases approximately linearly within the lower current range, but may show signs of saturation or reduced efficiency at higher currents (around 30-40mA). Operating at 20mA represents a good balance between brightness and efficiency/reliability.

4.5 Usambazaji wa Wigo na Mfumo wa Mionzi

The spectral curve shows the typical peak wavelength of a phosphor-converted white LED, likely in the blue region (approximately 450-460nm), with a broad phosphor emission in the yellow spectrum; their combination produces white light. The radiation pattern diagram visually confirms its broad, Lambertian-like emission profile with a viewing angle of 120°.

5. Mechanical and Packaging Information

5.1 Vipimo vya Ufungaji

The LED utilizes a P-LCC-4 package. Key dimensions (unit: mm) include overall size, lead pitch, and the location of the cathode identifier (typically a notch or green mark on the package). A recommended PCB land pattern (footprint) is also provided, showing pad dimensions and spacing to ensure proper soldering and alignment.

5.2 Kutambua Ubaguzi wa Polariti

Uelekezaji sahihi ni muhimu sana. Spec sheet inaonyesha pini ya cathode (has). Kwenye ufungaji, kwa kawaida huwekwa alama kwa nukta ya kijani, notch, au kukata kona upande mmoja wa mwili. Ufungaji wa PCB unapaswa kujumuisha alama ya uelekezaji inayolingana na hii sifa.

6. Mwongozo wa Ufungaji na Usanikishaji

6.1 Mkunjo wa Joto wa Uchimbaji wa Reflow

• Inatoa maelezo ya kina ya mkunjo wa joto wa uchimbaji wa reflow isiyo na risasi:Upashaji joto kabla:
• 150-200°C, kwa muda wa sekunde 60-120 (kiwango cha juu cha kupanda kwa joto ni 3°C/kwa sekunde).Reflow:
• Muda wa joto kuwa zaidi ya 217°C: sekunde 60-150. Joto la kilele: hadi 260°C, kwa muda wa sekunde 10 kwa upeo.Kupoa:

Kuanza kutoka juu ya 255°C, kiwango cha juu cha kupunguza joto ni 6°C/s.

Kufuata mkunjo huu wa joto ni muhimu ili kuzuia mshtuko wa joto, kasoro za sehemu za kuunganisha, au kuharibu epoksi ya LED.

• 6.2 Uhifadhi na Uendeshaji
• Kipengele hiki kina usikivu kwa unyevu (kima cha MSL kinachoeleweka). Mfuko wa kuzuia unyevu (MBB) lazima uwe umeandikwa kabla ya matumizi.
• 推荐的拆封环境为<30°C / 60% RH。
• Ikiwa kadi ya kiashiria cha unyevu inaonyesha unyevu ulio juu sana, inahitajika kuokwa kwa saa 24 kwenye 60°C ±5°C kabla ya kuuza.

Ufungaji wa reflow haupaswi kuzidi mara mbili.

6.3 Manual Soldering and Rework

• If manual soldering is necessary:
• 使用烙铁头温度<350°C的烙铁。Limit contact time per pin to within 3 seconds.
• Use a soldering iron with a rated power ≤25W.
• Allow at least a 2-second cooling interval between soldering each pin.

For rework, it is recommended to use a dual-tip soldering iron to heat both pins simultaneously to avoid mechanical stress. The feasibility of rework without damaging the LED should be verified in advance.

7. Packaging and Ordering Information

7.1 Vipimo vya Ukanda wa Kupanga na Reel

• LED hufungwa kwenye mfuko wa kuzuia unyevunyevu, huwekwa kwenye ukanda wa kubeba wenye mfumo wa chapa na kuviringishwa kwenye reel kwa usambazaji.Idadi ya Ufungaji:
• 500 vipande kwa kila reel.

Detailed dimensions for the carrier tape (pocket size, pitch), cover tape, and reel (diameter, core size, width) are provided to ensure compatibility with automatic placement equipment.

7.2 Maelezo ya lebo

• Lebo ya reel inajumuisha taarifa muhimu:CPN:
• Nambari ya Sehemu ya Mteja (hiari).P/N:
• Nambari ya Sehemu ya Mtengenezaji (57-11UTC/S827-1/TR8).QTY:
• Idadi kwenye reel.CAT:
• Kipimo cha nguvu ya mwanga (mfano, W1, V2).HUE:
• Kipimo cha urefu wa wimbi kuu/ukolezi wa rangi (mfano, 7K).REF:
• Kipimo cha voltage ya mbele (mfano, 6, 7).LOT No:

Traceable lot number.

8. Uzingatiaji wa Ubunifu wa Matumizi

8.1 Udhibiti wa Mkondo Lazima Ufanyike_FMwongozo wa Vipimo unatahadharisha wazi: "Mteja lazima atumie upinzani kwa ulinzi, vinginevyo mabadiliko madogo ya voltage yatasababisha mabadiliko makubwa ya mkondo (inaweza kuchoma kifaa)." LED ni kifaa kinachoendeshwa na mkondo. Wakati wa kutumia chanzo cha voltage, chanzo cha mkondo thabiti au, kwa kawaida zaidi, upinzani wa kuzuia mkondo mfululizo ni muhimu kabisa. Thamani ya upinzani inapaswa kuhesabiwa kwa kutumia V

Fanya hesabu ili kuhakikisha kuwa sasa haizidi viwango vya juu kabisa hata wakati kuna uvumilivu wa voltage ya umeme.

8.2 Usimamizi wa Joto

• Ingawa kifuniko ni kidogo, matumizi ya nguvu (hadi 110mW) hutoa joto. Kwa uendeshaji endelevu chini ya mikondo ya juu au mazingira ya joto, zingatia:
• Follow the forward current derating curve.
• Provide sufficient copper foil area under and around the LED pad as a heat sink.

Hakikisha mtiririko mzuri wa hewa katika matumizi ya mwisho.

8.3 Achieving Uniformity in Multi-LED Arrays

• For backlight or indicator arrays where brightness and color consistency are critical:_vSpecify tight bins for luminous intensity (I
• ) and chromaticity (x, y)._FFor LEDs connected in parallel, use devices from the same forward voltage (V
• ) LEDs for the gear position, and/or use individual series resistors for each LED to balance the current.

Zingatia kutumia kiendeshi cha sasa thabiti kuendesha mnyororo wa LED uliounganishwa mfululizo, ili kuhakikisha sasa sawa inapita kwenye kila kifaa.

9. Technical Comparison and Differentiation

• Compared to general-purpose SMD LEDs, the 57-11UTC/S827-1/TR8 series offers specific advantages:Side-Emitting vs. Top-Emitting:
• Unlike common top-emitting LEDs, this side-emitting package is designed to emit light parallel to the PCB plane, which is crucial for light guide plates and edge-lighting applications.Optimized Optical Design:
• Kiunganishi cha kioo cha ndani kinakifanya kitofautiane na LED ya msingi inayotoa mwanga kwa upande, huku kikitoa mtazamo mpana na sawa zaidi.Uainishaji kamili:
• Uainishaji wa kina wa tatu-mwelekeo (nguvu, voltage, rangi) unatoa kiwango cha juu cha uthabiti wa utendaji na uhuru wa kuchagua ikilinganishwa na vifaa vilivyoainishwa kwa urahisi au visivyoainishwa kabisa.Uimara:

Inajumuisha ulinzi wa ESD pamoja na viwango vya kuunganishwa kwa mkondo usio na risasi, na kufanya iweze kutumika katika mchakato wa kisasa wa usanikishaji wa kiotomatiki.

10. Maswali Yanayoulizwa Mara kwa Mara (FAQ)

10.1 Je, mkondo wa kawaida wa uendeshaji ni upi?_FTabia za optiki-elektroniki katika I

= Imetathminiwa chini ya hali ya 20mA, ambayo ndio sehemu ya kawaida ya kazi inayopendekezwa ya usawa wa mwangaza, ufanisi na maisha. Mkondo kamili wa juu zaidi unaoendelea ni 30mA.

10.2 How to choose a suitable current-limiting resistor?_{Use the formula: R = (V}Chanzo cha umeme_F- V_F) / I_F. Use the maximum V_F(e.g., 3.95V for gear 8) and your desired I²(e.g., 20mA). For a 5V power supply: R = (5V - 3.95V) / 0.02A = 52.5Ω. Select the next higher standard value (e.g., 56Ω), and ensure the resistor's power rating is sufficient (P = I

* R).

10.3 Can I use PWM for dimming?_FPNdiyo, PWM (Pulse Width Modulation) ni njia bora ya kudimisha taa za LED. Ya juu ya mkondo katika msukumo haipaswi kuzidi I_Frating ya 100mA (duty cycle 1/10). Hakikisha mkondo wa wastani wa muda mrefu hauzidi I

Rated value 30mA.

10.4 Kwa nini pembe ya maono ni muhimu kwa matumizi ya mionzi ya mwanga?

The wide viewing angle ensures light is emitted within a broad cone angle. When coupled to the edge of a light guide (a transparent plastic light guide bar), this wide incidence angle promotes total internal reflection and effectively distributes light along the length of the guide, achieving uniform backlighting and minimizing hotspots.

11. Practical Design and Usage Examples

11.1 Mwanga wa Nyuma wa Vitufe vya Vifaa vya Rununu

In smartphones, several such side-emitting LEDs can be placed along the edge of the main PCB, directly coupled into a thin, complex-shaped light guide plate to uniformly illuminate capacitive touch keys or navigation icons. The low current consumption helps extend battery life.

11.2 Kiolesura cha Udhibiti wa Hewa ya Gari

Dashibodi au skrini ya kituo cha udhibiti inaweza kutumia safu moja ya LED kama hizi upande mmoja au pande zote mbili za paneli ndogo ya LCD. Bomba la kuongoza mwanga husambaza mwanga mweupe kwa usawa kwenye eneo lote la kuonyesha. Anuwai yake pana ya joto la kufanya kazi (-40°C hadi +85°C) hufanya iwe inafaa kwa mazingira ya magari.

11.3 Vionyeshi vya Paneli ya Viwango vya Viwanda

LED hii inaweza kutumika kama kiashiria cha hali chenye mng'ao mkali na pembe pana ya mtazamo kwenye paneli ya udhibiti wa viwanda (mfano, umeme umewashwa, kengele). Uaminifu wake na utangamano na usanikishaji wa SMD wa otomatiki hurahisisha mchakato wa utengenezaji.

12. Utangulizi wa Kanuni ya Uendeshaji

Hii ni LED nyeupe ya kubadilisha fosforesheni. Kiini chake ni chip ya semikondukta iliyotengenezwa kwa indiamu-galliamu nitraidi (InGaN), ambayo hutoa mwanga wa bluu wakati umeme unapita kwenye makutano yake ya P-N (umeme-luminiscence). Sehemu ya mwanga wa bluu hunyonywa na mipako ya fosforesheni ya manjano iliyowekwa ndani ya kifurushi. Fosforesheni hutoa tena anuwai pana ya mwanga wa manjano. Mwanga wa bluu uliobaki unachanganyika na mwanga wa manjano uliobadilishwa, na kutambuliwa na jicho la mwanadamu kama mwanga mweupe. Kifurushi cha wazi cha resini kinalinda chip na fosforesheni, wakati huo huo kuruhusu uchimbaji bora wa mwanga. Muundo wa kioakisi cha ndani unaozunguka chip husaidia kuelekeza mwanga zaidi uliotolewa kuelekea upande wa kifurushi, na hivyo kuunda pembe pana ya mtazamo.

13. Mwelekeo wa Kiufundi na Usuli

• LED zinazotokeza kwa upande kama mfululizo wa 57-11 zinawakilisha suluhisho zilizokomaa na zilizoboreshwa kwa vikwazo maalum vya nafasi katika usanifu wa elektroniki. Mwelekeo wa maendeleo katika uwanja huu unaendelea kuzingatia:Kuboresha ufanisi (lm/W):
• Kuongeza pato la mwanga kwa kila pembejeo ya umeme, na hivyo kufikia matumizi ya nguvu ya chini au mwangaza wa juu zaidi.Kielezo cha Juu cha Uwakilishi wa Rangi (CRI):
• Kwa taa za nyuma za maonyesho, LED zilizo na wigo mpana zaidi na zinazoendelea zinatengenezwa ili kuonyesha rangi kwa usahihi zaidi.Miniaturization:
• Achieving smaller package sizes while maintaining or improving optical performance to support thinner end products.Enhanced Reliability and Lifespan:
• Continuous improvements in materials (epoxy, phosphor) and chip technology to withstand higher operating temperatures and longer operating times.Integration:

The emergence of integrated LED modules, combining LED, driver IC, and passive components into a single package, simplifies design for end users.