LTL1CHKGTLC 3.1mm Through-Hole Green LED Datasheet - 2.4V Forward Voltage - 75mW Power Dissipation - Technical Documentation

1. Product Overview

Waraka huu unaelezea kwa kina vipimo vya kiufundi vya LED ya moja kwa moja yenye ufanisi wa juu na ya kijani kibichi. Kifaa hiki kimeundwa mahsusi kwa matumizi ya viashiria vya jumla, na kinafaa katika mazingira yanayohitaji uaminifu, matumizi ya nguvu ya chini, na nguvu ya mwanga ya juu. Soko kuu linalolengwa linajumuisha vifaa vya matumizi ya kaya, paneli za udhibiti wa viwanda, vifaa vya mawasiliano, na vifaa mbalimbali vya nyumbani vinavyohitaji viashiria vya hali.

Faida kuu ya kipengele hiki cha LED ni kwamba kinakidhi viwango vya mazingira visivyo na risasi na RoHS, na kinaweza kutoa pato la nguvu ya mwanga ya juu katika kifurushi cha kompakt chenye kipenyo cha 3.1mm. Kina sifa ya matumizi ya nguvu ya chini, na kwa sababu ya mahitaji yake ya chini ya umeme, kinaendana vizuri na saketi zilizojumuishwa, na kwa hivyo kinafaa kabisa kwa muundo wa kisasa wa elektroniki.

2. In-depth Interpretation of Technical Parameters

2.1 Viwango vya Juu Kabisa

These ratings define the stress limits of the device. Exceeding these limits may cause permanent damage. Operation at or beyond these limits is not recommended.

• Power Dissipation (Pd):75 mW. This is the maximum power that the LED can dissipate in the form of heat when the ambient temperature (T_A) is 25°C.
• DC Forward Current (I_F):30 mA. Upeo wa juu wa mkondo unaoweza kupita kwenye LED kwa muda mrefu.
• Upeo wa mkondo wa mbele:60 mA. Mkondo huu unaruhusiwa tu chini ya hali ya msukumo (1/10 ya uwiano wa wakati, upana wa msukumo 0.1ms) ili kufikisha mwanga zaidi kwa muda mfupi bila kupata joto kupita kiasi.
• Voltage ya nyuma (V_R):5 V. Exceeding this voltage under reverse bias may cause immediate junction breakdown.
• Operating temperature range:-40°C to +100°C. This is the ambient temperature range within which the LED is designed to operate normally.
• Pin soldering temperature:260°C, kwa sekunde 5, sehemu ya kipimo iko umbali wa mm 2.0 kutoka kwa mwili wa LED. Hii inafafanua mahitaji ya mkunjo wa joto kwa ufundi au unyunyizaji wa wimbi.

2.2 Tabia za Umeme/Optiki

Hizi ziko kwenye T_ATypical performance parameters measured at =25°C, defining the normal operating behavior of the device.

• Luminous intensity (I_V):At a test current (I_F) of 2mA, it is 18 to 52 mcd (min to max). This wide range is managed through a binning system (see Section 3). Intensity measurement is performed using a sensor filtered to match the human eye's photopic response (CIE curve).
• Forward voltage (V_F):Katika I_F= 2mA, thamani ya kawaida ni 2.1V hadi 2.4V. Parameta hii ni muhimu sana kwa kubuni upinzani wa kikomo cha mkondo katika mzunguko wa kuendesha.
• Pembe ya mtazamo (2θ_1/2):45 degrees. This is the full angle at which the luminous intensity drops to half of the axial measured value. The 45° angle provides a fairly wide viewing cone.
• Peak Emission Wavelength (λ_P):575 nm. This is the wavelength at which the spectral power output is highest.
• Dominant Wavelength (λ_d):572 nm. This value is derived from the CIE chromaticity diagram and represents the perceived color of the light, which is a pure green.
• Spectral line half-width (Δλ):11 nm. This indicates spectral purity; the narrower the width, the more saturated and pure the color.
• Reverse current (I_R):At V_RWhen = 5V, the maximum is 100 µA.
• Capacitance (C):Typical value is 40 pF at zero bias and 1MHz frequency, relevant to high-frequency switching applications.

3. Bin System Description

Ili kuhakikisha watumiaji wa mwisho wanapata mwangaza na rangi sawia, LED zinagawanywa katika vikundi tofauti kulingana na utendakazi uliopimwa.

3.1 Luminous Intensity Binning

The unit is millicandela (mcd), measured at 2 mA. The tolerance for each grade limit is ±15%.

• Grade 3Y:18 mcd (min) to 23 mcd (max)
• Gear 3Z:23 mcd to 30 mcd
• Gear A:30 mcd hadi 38 mcd
• Kiwango B:38 mcd hadi 52 mcd

Alama ya msimbo wa kiwango iko kwenye mfuko wa ufungaji, inaruhusu wabunifu kuchagua LED yenye safu maalum ya mwangaza kwa matumizi yao.

3.2 Dominant Wavelength Binning

The unit is nanometers (nm), measured at 2 mA. The tolerance for each bin limit is ±1 nm. This ensures strict control over the perceived green color.

• Gear H06:566.0 nm to 568.0 nm
• Gear H07:568.0 nm to 570.0 nm
• Gear H08:570.0 nm to 572.0 nm
• Gear H09:572.0 nm to 574.0 nm
• Gear H10:574.0 nm to 576.0 nm
• Gear H11:576.0 nm to 578.0 nm

4. Uchambuzi wa Mkunjo wa Utendaji

Mwongozo unarejelea safu za tabia za kawaida, ambazo ni muhimu kwa kuelewa tabia ya kifaa chini ya hali zisizo za kawaida. Ingawa michoro maalum haijarudiwa katika maandishi, uchambuzi wa maana yake umewasilishwa hapa chini.

4.1 Mkondo wa Mbele dhidi ya Voltage ya Mbele (Mkunjo wa I-V)

Tabia ya I-V sio ya mstari. Kwa LED kama hii ya AlInGaP, voltage ya mbele inaonyesha mgawo hasi wa joto. Hii inamaanisha kuwa joto la kiungo linapoinuka, voltage ya mbele inayohitajika kufikia mkondo sawa itapungua kidogo. Tabia hii ni muhimu katika muundo wa kuendesha mkondo wa mara kwa mara ili kuhakikisha pato la nuru thabiti.

4.2 Luminous Intensity vs. Forward Current

Katika safu ya kawaida ya uendeshaji, pato la mwanga (nguvu ya mwangaza) ni takriban sawia na mkondo wa mbele. Hata hivyo, kwenye mikondo ya juu sana, ufanisi unaweza kupungua kwa sababu ya ongezeko la joto (athari ya kupungua kwa ufanisi). Kufanya kazi kwenye mkondo wa DC ulipendekezwa au chini yake kunahakikisha ufanisi bora na maisha marefu.

4.3 Luminous Intensity vs. Ambient Temperature

Pato la mwanga la LED hupungua kadiri joto la kiungo linavyoongezeka. Kwa nyenzo za AlInGaP, athari hii ya kuzima kwa joto ni dhahiri. Wabunifu lazima wazingatie usimamizi wa joto, hasa katika mazingira yenye joto la juu la mazingira au wakati wa kuendesha LED kwa mkondo mkubwa, ili kudumisha mwangaza thabiti.

4.4 Spectral Distribution

The reference spectrum will show a peak at approximately 575 nm with a typical FWHM of 11 nm. The dominant wavelength of 572 nm defines the perceived green color point on the CIE chart.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The device utilizes a standard 3.1mm diameter circular through-hole package. Key dimensional specifications include:

• All dimensions are in millimeters (inches in parentheses).
• Unless otherwise specified, the standard tolerance is ±0.25mm.
• The maximum resin protrusion under the flange is 1.0mm.
• Pin pitch is measured at the point where the pins extend from the package body, which is crucial for PCB layout.

5.2 Polarity Identification

For through-hole LEDs, the cathode is typically identified by a flat edge on the lens or a shorter lead. The datasheet implies standard industry practice; the longer lead is the anode (+), and the shorter lead is the cathode (-). Correct polarity must be observed during assembly.

6. Mwongozo wa Uchomeaji na Usanikishaji

Usindikaji sahihi ni muhimu ili kuzuia uharibifu na kuhakikisha uaminifu.

6.1 Masharti ya Uhifadhi

LED zinapaswa kuhifadhiwa katika mazingira yenye joto lisilozidi 30°C na unyevu wa jamaa usiozidi 70%. Ikiwa zitachukuliwa kwenye mfuko wa asili wa kuzuia unyevu, zinapaswa kutumika ndani ya miezi mitatu. Kwa uhifadhi wa muda mrefu zaidi nje ya ufungashaji wa asili, tumia chombo kilichofungwa chenye kivutio-chemchemi au mazingira ya nitrojeni.

6.2 Lead Forming

• Bending must be performed at a position at least 3mm away from the base of the LED lens.
• Do not use the root of the lead frame as a fulcrum.
• Pini za umbo lazima zifanyike kwenye joto la kawaida, na在kukamilika kabla ya mchakato wa kuunganisha.
• Wakati wa kuingiza kwenye PCB, tumia nguvu ndogo ya kushinikiza ili kuepuka mkazo wa mitambo kwenye kifurushi.

6.3 Soldering Process

• Weka umbali wa chini kutoka kwenye mzizi wa lenzi hadi kwenye sehemu ya kuchomelea kuwa mm 2. Usiweke lenzi ndani ya chuma cha kuchomelea.
• Wakati LED inapokuwa moto kutokana na uchomeleaji, epuka kutumia mkazo wa nje kwenye pini.
• Recommended welding conditions:
  • Manual soldering (soldering iron):Maximum temperature 300°C, maximum soldering time per pin 3 seconds (only once).
  • Wave soldering:Maximum preheat temperature 100°C, maximum 60 seconds. Maximum solder wave temperature 260°C, maximum 5 seconds.
• Excessive temperature or time may cause lens deformation or catastrophic failure.

6.4 Cleaning

Ikiwa unahitaji kusafisha, tumia tu vimumunyisho vya aina ya pombe, kama vile isopropanol. Kemikali zenye kukwaruza zinaweza kuharibu nyenzo za lenzi.

7. Ufungaji na Taarifa za Kuagiza

7.1 Vipimo vya Ufungaji

The standard packaging process is as follows:

• LED zimepakuliwa kwa mifuko ya vipande 1000, 500, au 250 kwa kila mfuko.
• Mifuko kumi (10) huwekwa kwenye sanduku la ndani (jumla ya vipande 10,000).
• Sanduku nane (8) za ndani huwekwa kwenye kisanduku cha nje cha usafirishaji (jumla ya vipande 80,000).
• Ndani ya kundi moja la usafirishaji, tu mfuko wa mwisho unaweza kuwa na idadi isiyo kamili.

8. Application Recommendations

8.1 Typical Application Scenarios

This LED is suitable for a wide range of indicator light applications, including but not limited to:

• Power status indicators on consumer electronics (TVs, audio equipment, chargers).
• Signal and status lights on network routers, modems, and communication equipment.
• Panel indicator lights on industrial control systems, test equipment, and instrumentation.
• Backlighting for switches, buttons, and indicators in household appliances.

Important Notice:The datasheet clearly states that this LED is suitable for general electronic equipment. For applications requiring extremely high reliability, especially where failure could endanger life or health (aviation, medical, traffic safety), consultation with the manufacturer is required in advance.

8.2 Drive Circuit Design

LED ni kifaa kinachoendeshwa na mkondo. Ili kuhakikisha mwangaza sawa unapotumia LED nyingi,Inashauriwa kwa nguvuUnganisha kipingamizi cha kudhibiti mkondo kwa kila LED mfululizo (Mfumo wa Saketi A).

• Mfumo wa Saketi A (Inapendekezwa):Kila LED ina kipingamizi chake cha mfululizo kilichounganishwa na chanzo cha umeme. Hii inalipa tofauti asilia kati ya LED mbalimbali za voltage ya mbele (V_F), na kuhakikisha kila LED inapata mkondo sawa, na hivyo kuwa na mwangaza unaofanana.
• Mfano wa Sakiti B (Haipendekezwi):LED nyingi zimeunganishwa sambamba, zikitumia upinzani mmoja. Kutokana na tofauti za V_F, mkondo hautagawanyika sawasawa, na kusababisha tofauti dhahiri katika mwangaza kati ya LED.

Thamani ya upinzani (R) inahesabiwa kwa kutumia Sheria ya Ohm: R = (V_{Power supply}- V_F) / I_F. Use the maximum V from the datasheet_FConservative design using a value (2.4V) to ensure the current does not exceed the required I_F.

。

8.3 Electrostatic Discharge (ESD) Protection

LEDs are sensitive to electrostatic discharge. ESD damage may manifest as high reverse leakage current, low forward voltage, or failure to illuminate at low current.

• Hatua za Kuzuia:
• Wafanyakazi wanapaswa kuvaa mkanda wa mkono wenye uendeshaji au glavu za kinga ya umeme tuli.
• Vifaa vyote, vituo vya kazi na rafu za kuhifadhia lazima viwe na upatanishi wa kusawazisha umeme kwa usahihi.

Tumia kizazi cha ioni kupunguza malipo ya umeme ya tuli ambayo yanaweza kujilimbikizia kwenye lenzi za plastiki.ESD uthibitisho wa majaribio:_FTo check a suspicious LED, measure its forward voltage at a very low current (e.g., 0.1mA). A "good" AlInGaP LED under this test condition should have a V

Inapaswa kuwa zaidi ya 1.4V.

9. Technical Comparison and Differentiation

• Hii LED hii ya kijani inayotokana na AlInGaP ina faida maalum:Ikilinganishwa na LED ya kijani ya jadi ya GaP:
• Teknolojia ya AlInGaP hutoa ufanisi mkubwa zaidi wa mwanga, pamoja na rangi ya kijani iliyojaa na safi zaidi (wavelength kuu takriban 572nm) kuliko rangi ya manjano-kijani ya LED za zamani za GaP.Ikilinganisha na InGaN LED ya kijani:
• Ingawa InGaN LED inaweza kufikia mwangaza wa juu sana, AlInGaP LED kwa kawaida ina utendaji bora zaidi katika wigo wa rangi ya kahawia hadi nyekundu na katika masafa maalum ya urefu wa wimbi wa kijani, na inaweza kuwa na voltage chanya ya chini na uthabiti bora.Sababu Muhimu za Tofauti:

Mchanganyiko wa kifurushi cha 3.1mm, pembe ya maono ya 45° iliyowazi, mfumo kamili wa kiwango unaojumuisha nguvu na urefu wa wimbi, na maelekezo wazi ya matumizi, hufanya iwe chaguo la kuaminika na lenye kutabirika kwa matumizi ya kiwango cha kiashiria.

10. Maswali Yanayoulizwa Mara kwa Mara (Kulingana na Vigezo vya Kiufundi)

10.1 Je, naweza kuendesha LED hii moja kwa moja na usambazaji wa umeme wa 5V bila kupinga?Hapana, hii itaharibu LED.

LED ina upinzani wa nguvu mdogo sana inapopitishwa mbele. Kuunganisha moja kwa moja kwenye chanzo cha voltage kama vile 5V kutasababisha mkondo mkubwa kupita, unaozidi kiwango cha juu kabisa cha 30mA DC, na kusababisha joto la ghafla na kushindwa. Wakati wa kutumia chanzo cha voltage, daima ni muhimu kutumia upinzani wa kuzuia mkondo kwa mfululizo.

10.2 Kwa nini anuwai ya nguvu ya mwanga ni pana sana (18-52 mcd)?

Safu hii inawakilisha upana wa jumla wa usambazaji wa uzalishaji. LED binafsi hupangwa katika "vigezo" maalum (3Y, 3Z, A, B) vilivyo na safu nyembamba zaidi. Kwa kubainisha msimbo wa kigezo kinachohitajika wakati wa kuagiza, wabunifu wanaweza kuhakikisha usawa wa mwangaza kwa vitengo vyote katika kundi lao la uzalishaji.

10.3 Je, kuna tofauti gani kati ya Peak Wavelength na Dominant Wavelength?_PPeak Wavelength (λ):
Upeo wa mwanga wa kiwango cha juu zaidi unaotolewa na LED. Ni sehemu ya juu zaidi kwenye grafu ya pato la wigo._dDominant Wavelength (λ):_dThamani iliyohesabiwa kulingana na utambuzi wa rangi wa jicho la binadamu (chati ya CIE). Ni urefu wa wigo wa mwanga wa rangi moja safi unaoonekana sawa na rangi ya pato la LED. λ

It is more relevant for describing perceived color, which is why it is used for grading.

10.4 Jinsi ya kuchagua mkondo unaofaa kwa matumizi yangu?_dHali ya majaribio ni 2mA, hii ni thamani ya chini ya sasa ya kawaida ya LED ya kiashiria. Kwa mwangaza wa kawaida wa kiashirio, kawaida hufanya kazi kati ya 2mA hadi 10mA. Kwa mwangaza wa juu zaidi, inaweza kukaribia thamani ya juu ya DC ya 20mA, lakini ni lazima kuzingatia ongezeko la matumizi ya nguvu (P_F= V_F* I

), to ensure it remains below 75mW, especially at higher ambient temperatures. Always refer to the derating curve (linear decrease of 0.4mA per °C starting from 50°C).

11. Practical Design and Usage CasesScenario:

1. Design a power "on" indicator for a device powered by a 12V DC power adapter. A green LED is required.Parameter Selection:_FThe goal is a clearly visible but not glaring indicator light. Select a working current (I
2. ) of 5mA.Resistance Calculation:_FKwa usalama wa muundo, tumia V ya juu kabisa.
   Thamani 2.4V._{R = (V}Power supply_F- V_F) / I
   = (12V - 2.4V) / 0.005A = 9.6V / 0.005A = 1920 Ω.
3. The closest standard E24 resistor values are 1.8kΩ or 2.2kΩ. Choosing 2.2kΩ will result in a slightly lower current (approximately 4.36mA), which is acceptable and can extend the lifespan. P_{Ukaguzi wa matumizi ya nguvu:}Matumizi ya nguvu ya kipingamizi P_F²= I²* R = (0.00436)
   P_LED* 2200 ≈ 0.042W. Standard 1/8W (0.125W) or 1/4W resistors are more than sufficient._FLED power consumption P_F= V
4. * I≈ 2.4V * 0.00436A ≈ 0.0105W (10.5mW), ambayo ni chini sana kuliko kiwango cha juu cha 75mW.

Muundo wa PCB:

Unganisha kipingamizi kwenye anodi ya LED kwa mfululizo. Hakikisha umbali wa mashimo unalingana na umbali wa pini za LED pale zinapotoka kwenye mwili wa LED. Toa eneo la kuzuia la angalau 2mm kuzunguka mzizi wa LED ili kurahisisha uendeshaji wa kuuza.

12. Utangulizi wa Kanuni

LED hii inategemea nyenzo za semiconductor za alumini-indiamu-galiamu-fosforasi (AlInGaP). Wakati voltage chanya inapotumiwa, elektroni kutoka eneo la aina-n na mashimo kutoka eneo la aina-p huingizwa kwenye eneo lenye uwezo. Wakati vibeba malipo hivi vinapojumlishwa, hutoa nishati kwa njia ya fotoni (mwanga). Muundo maalum wa aloi ya AlInGaP huamua nishati ya pengo la bendi ya semiconductor, ambayo huamua moja kwa moja urefu wa wimbi la mwanga unaotolewa (rangi). Katika mfano huu, aloi hiyo imeundwa kutoa fotoni katika wigo wa kijani kibichi, yenye urefu wa wimbi kuu wa takriban nanomita 572. Lenzi ya epoksi yenye uwazi hutumiwa kulinda chip ya semiconductor, kuunda boriti ya mwanga inayotolewa (kutengeneza pembe ya maono ya 45°) na kuongeza kiwango cha mwanga unaotolewa kutoka kwa kifurushi.