Taa ya LED ya Kijani ya Kupenyeza Shimo - 525nm - Kipenyo 3.0mm - 2.4-3.3V - 64mW - Waraka wa Kiufundi wa Kiswahili

1. Muhtasari wa Bidhaa Hati hii inaelezea kwa kina maelezo ya taa ya LED ya kijani ya kupenyeza shimo iliyoundwa kutumika kwenye kishikio cha pembe-mraba cha plastiki nyeusi (CBI - Kiashiria cha Bodi ya Saketi). Bidhaa hii ni chanzo cha mwanga thabiti kinachotoa matumizi ya nguvu ya chini na ufanisi wa juu. Ni bidhaa isiyo na risasi inayolingana na maagizo ya RoHS. Rangi inayotolewa ni kijani yenye urefu wa wimbi kuu la 525nm, ikitumia teknolojia ya InGaN. Kifaa hiki kinasambazwa kwenye ufungaji wa mkanda na reel kwa michakato ya usanikishaji ya otomatiki.

1.1 Faida Kuu Iliyoundwa kwa urahisi wa usanikishaji wa bodi ya saketi. Uthabiti wa hali thabiti na maisha marefu ya uendeshaji. Matumizi ya nguvu ya chini na ufanisi wa juu wa mwanga. Uumbaji wa kirafiki kwa mazingira, bila risasi, na unaolingana na RoHS. Inapatikana katika umbo la kishikio la pembe-mraba linaloweza kusonganishwa kwa ufungaji mbalimbali. Inasambazwa kwenye mkanda na reel kwa uzalishaji wa ufanisi wa wingi.

1.2 Matumizi Lengwa LED hii inafaa kwa anuwai ya matumizi katika tasnia nyingi, zikiwemo: Vifaa vya kompyuta na viashiria vya hali. Vifaa vya mawasiliano. Vifaa vya umeme vya watumiaji. Paneli za udhibiti wa viwanda na mashine.

• 2. Uchambuzi wa kina wa Vigezo vya Kiufundi
• 2.1 Viwango vya Juu Kabisa Viwango vifuatavyo vinabainisha mipaka ambayo kifaa kinaweza kuharibika kabisa. Thamani zote zimeainishwa kwa joto la mazingira (TA) la 25°C. Matumizi ya Nguvu (Pd): 64 mW - Nguvu ya juu kabisa ambayo LED inaweza kutawanya kwa usalama kama joto. Mkondo wa Mbele wa Kilele (IFP): 60 mA - Inaruhusiwa tu chini ya hali ya mipigo (mzunguko wa kazi ≤ 1/10, upana wa mipigo ≤ 10μs). Mkondo wa Mbele wa DC (IF): 20 mA - Mkondo wa mbele unaoendelea wa juu kabisa unaopendekezwa kwa uendeshaji wa kuaminika. Safu ya Joto la Uendeshaji: -30°C hadi +85°C - Safu ya joto la mazingira kwa kazi ya kawaida ya kifaa. Safu ya Joto la Uhifadhi: -40°C hadi +100°C - Safu ya joto salama kwa kifaa wakati hakinafanya kazi. Joto la Kuuza ya Risasi: 260°C kwa sekunde 5 kiwango cha juu, kipimo cha 2.0mm kutoka kwa mwili wa LED. Hii ni muhimu kwa michakato ya kuuza ya wimbi au kwa mkono.
• 2.2 Sifa za Umeme na Optiki Vigezo hivi vinabainisha utendaji wa kawaida wa LED chini ya hali za kawaida za majaribio (TA=25°C, IF=10mA isipokuwa imeainishwa). Nguvu ya Mwanga (Iv): 180 hadi 880 mcd. Safu hii pana inasimamiwa kupitia mfumo wa kugawanya kwenye makundi (tazama Sehemu ya 4). Kipimo hutumia sensor/filta inayokaribia mkunjo wa jibu la jicho la CIE photopic. Pembe ya Kuona (2θ1/2): Digrii 100. Hii ndiyo pembe kamili ambayo nguvu ya mwanga hupungua hadi nusu ya thamani yake ya axial (kwenye mhimili), ikionyesha muundo wa kuona unaoenea kwa kawaida kwa lenzi iliyotawanyika. Urefu wa Wimbi la Kilele la Utoaji (λP): 530 nm (kawaida). Urefu wa wimbi ambapo usambazaji wa nguvu ya wigo ni wa juu zaidi. Urefu wa Wimbi Kuu la Mwanga (λd): 525 hadi 535 nm. Hii ndiyo urefu wa wimbi mmoja unaoonwa na jicho la binadamu unaobainisha rangi ya LED, unaotokana na chati ya rangi ya CIE. Nusu-Upana wa Mstari wa Wigo (Δλ): 25 nm (kawaida). Upana wa wigo uliopimwa kwa nusu ya nguvu ya juu kabisa, ukionyesha usafi wa rangi. Voltage ya Mbele (VF): 2.4 hadi 3.3 V kwa 10mA. Safu hii lazima izingatiwe wakati wa kubuni saketi ya kuzuia mkondo. Mkondo wa Nyuma (IR): 10 μA kiwango cha juu kwa VR=5V. Muhimu: Kifaa hakijabuniwa kwa uendeshaji wa upendeleo wa nyuma; hali hii ya majaribio ni kwa tabia tu.
• 3. Uainishaji wa Mfumo wa Kugawanya kwenye Makundi Ili kuhakikisha uthabiti wa rangi na mwangaza katika uzalishaji, LED zinasagwa katika makundi. Wabunifu lazima wabainishe misimbo ya makundi wanapoagiza ili kuhakikisha utendaji ndani ya safu iliyobainishwa.
• 3.1 Kugawanya kwenye Makundi kulingana na Nguvu ya Mwanga Kugawanya kwenye makundi hufanyika kwa mkondo wa mbele wa 10mA. Uvumilivu kwa kila kikomo cha kikundi ni ±15%. Kikundi HJ: 180 mcd (Chini) hadi 310 mcd (Juu) Kikundi KL: 310 mcd (Chini) hadi 520 mcd (Juu) Kikundi MN: 520 mcd (Chini) hadi 880 mcd (Juu)
• 3.2 Kugawanya kwenye Makundi kulingana na Wimbi Kuu la Mwanga Kugawanya kwenye makundi hufanyika kwa mkondo wa mbele wa 10mA. Uvumilivu kwa kila kikomo cha kikundi ni ±1nm. Kikundi G09: 516.0 nm (Chini) hadi 520.0 nm (Juu) Kikundi G10: 520.0 nm (Chini) hadi 527.0 nm (Juu) Kikundi G11: 527.0 nm (Chini) hadi 535.0 nm (Juu)

4. Uchambuzi wa Mviringo wa Utendaji Ingawa miviringo maalum ya picha inarejelewa kwenye waraka wa maelezo, tafsiri zifuatazo zinatokana na tabia ya kawaida ya LED na vigezo vilivyotolewa:

4.1 Mviringo wa Mkondo wa Mbele dhidi ya Voltage ya Mbele (Mviringo wa I-V) Voltage ya mbele (VF) ina safu maalum ya 2.4V hadi 3.3V kwa 10mA. Tabia ya I-V ni ya kielelezo. Kuendesha LED juu ya mkondo wake uliokadiriwa kutasababisha ongezeko kubwa la voltage ya mbele na matumizi ya nguvu, kwa uwezekano wa kuzidi viwango vya juu kabisa. Dereva wa mkondo wa mara kwa mara unapendekezwa sana kuliko chanzo cha voltage ya mara kwa mara ili kuhakikisha utoaji thabiti wa mwanga na umri mrefu.

• 4.2 Nguvu ya Mwanga dhidi ya Mkondo wa Mbele Nguvu ya mwanga ni takriban sawia na mkondo wa mbele ndani ya safu ya uendeshaji iliyopendekezwa. Hata hivyo, ufanisi unaweza kupungua kwa mikondo ya juu sana kutokana na athari za joto zilizoongezeka. Thamani za Iv zilizobainishwa ni kwa 10mA; kuendesha kwa mkondo wa juu kabisa wa DC wa 20mA kutaongeza nguvu lakini lazima ifanyike kwa usimamizi wa makini wa joto.
• 4.3 Utegemezi wa Joto Nguvu ya mwanga ya LED kwa kawaida hupungua kadiri joto la kiunganishi linapoongezeka. Ingawa waraka wa maelezo unatoa mipaka ya joto la uendeshaji (-30°C hadi +85°C), utoaji halisi wa mwanga kwenye kikomo cha juu utakuwa wa chini kuliko kwa 25°C. Kwa matumizi yanayohitaji mwangaza thabiti katika safu pana ya joto, ubunifu wa joto kwenye PCB na fidia ya uwezekano wa mwangaza katika saketi ya kuendesha inapaswa kuzingatiwa.
• 5. Maelezo ya Mitambo na Ufungaji
• 5.1 Vipimo vya Umbo na Usanikishaji LED imeundwa kwa kushirikiana na kishikio maalum cha pembe-mraba cha plastiki nyeusi. Vidokezo muhimu vya mitambo ni pamoja na: Vipimo vyote viko kwa milimita, na uvumilivu wa jumla wa ±0.25mm isipokuwa imeainishwa vinginevyo. Nyenzo za kishikio ni plastiki nyeusi. Taa ya LED yenyewe ina lenzi ya kijani iliyotawanyika. Kwa usanikishaji, risasi lazima zipikwe kwa uhakika angalau 3mm kutoka kwa msingi wa lenzi ya LED. Msingi wa fremu ya risasi haipaswi kutumika kama msaada wakati wa kupinda.

5.2 Maelezo ya Ufungaji Kifaa kinasambazwa katika umbo la kawaida la tasnia la mkanda na reel. Mkanda wa Kubeba: Umetengenezwa kwa aloi ya polystyrene nyeusi inayoweza kuongoza, na unene wa 0.50 ±0.06 mm. Uwezo wa Reel: Vipande 400 kwa kila reel ya inchi 13. Ufungaji wa Kikasha: Reel 1 imefungwa pamoja na kikaushi na kadi ya kiashiria cha unyevu kwenye Mfuko wa Kizuizi cha Unyevu (MBB). MBB 2 (jumla ya vipande 800) zimefungwa kwenye Kikasha cha Ndani. Vikasha 10 vya Ndani (jumla ya vipande 8,000) vimefungwa kwenye Kikasha cha Nje.

6. Miongozo ya Kuuza na Usanikishaji

6.1 Uhifadhi na Ushughulikiaji Kifurushi Kilichotiwa Muhuri: Hifadhi kwa ≤30°C na ≤70% RH. Tumia ndani ya mwaka mmoja baada ya kufungua mfuko wa kinga ya unyevu. Kifurushi Kilichofunguliwa: Hifadhi kwa ≤30°C na ≤60% RH. Vipengele vinapaswa kurejeshwa kwa IR ndani ya masaa 168 (wiki 1) baada ya kufichuliwa. Kwa uhifadhi zaidi ya masaa 168, choma kwa 60°C kwa angalau masaa 48 kabla ya kuuza ili kuzuia uharibifu unaosababishwa na unyevu ("popcorning") wakati wa kurejesha.

• 6.2 Mchakato wa Kuuza Umbali wa chini wa 2mm lazima udumishwe kati ya msingi wa lenzi/kishikio na sehemu ya kuuza. Chuma cha Kuuza: Joto la juu kabisa 350°C, wakati wa juu kabisa sekunde 3 kwa kila kiungo. Tumia mara moja tu. Kuuza kwa Wimbi: Joto la juu kabisa la kuchoma kabla 120°C kwa hadi sekunde 100. Joto la juu kabisa la wimbi la kuuza 260°C kwa kiwango cha juu cha sekunde 5. Usafishaji: Tumia vimumunyisho vya kwa msingi wa pombe kama vile pombe ya isopropili ikiwa ni lazima. Epuka kemikali kali.6.3 Tahadhari za Matumizi LED hii inafaa kwa ishara za ndani/nje na vifaa vya kawaida vya umeme. Epuka kutumia mkazo wa nje kwa risasi wakati wa kuuza wakati LED iko moto. Tumia nguvu ya chini ya kufunga wakati wa usanikishaji wa PCB ili kuepuka mkazo wa mitambo kwenye kipengele. Joto la kupita kiasi la kuuza au wakati linaweza kuharibu umbo la lenzi ya LED na kuharibu die ya ndani.
• 7. Mazingatio ya Ubunifu na Vidokezo vya Matumizi7.1 Ubunifu wa Saketi Daima tumia kizuizi cha mkondo cha mfululizo au saketi ya dereva ya mkondo wa mara kwa mara. Hesabu thamani ya kizuizi kwa kutumia fomula: R = (Vsupply - VF) / IF, ambapo VF inapaswa kuchukuliwa kama thamani ya juu kutoka kwa waraka wa maelezo (3.3V) ili kuhakikisha mkondo hauzidi kikomo hata kwa LED ya VF ya chini. Kwa usambazaji wa 5V na mkondo lengwa wa 10mA, kizuizi kitakuwa takriban (5V - 3.3V) / 0.01A = 170 Ω. Kizuizi cha kawaida cha 180 Ω kitakuwa chaguo salama.
• 7.2 Usimamizi wa Joto Ingawa matumizi ya nguvu ni ya chini (64mW kiwango cha juu), kuhakikisha utawanyiko wa joto wa kutosha kutoka kwa kiunganishi cha LED huongeza maisha na kudumisha uthabiti wa mwangaza. Kishikio cha pembe-mraba cha plastiki kinatoa utengano fulani, lakini mpangilio wa PCB unapaswa kuepuka kuweka LED karibu na vyanzo vingine muhimu vya joto. Kwa matumizi yanayofanya kazi kwa mkondo wa juu kabisa wa DC (20mA), mazingatio ya joto yanakuwa muhimu zaidi.7.3 Ujumuishaji wa Optiki Pembe ya kuona ya digrii 100 na lenzi iliyotawanyika hutoa utoaji wa mwanga mpana na laini unaofaa kwa viashiria vya hali vinavyohitaji kuonekana kutoka kwa pembe mbalimbali. Kwa matumizi yanayohitaji boriti iliyolengwa zaidi, optiki ya sekondari itahitajika. Rangi ya kijani (525-535nm) iko katika eneo la unyeti wa juu kwa jicho la binadamu, na kufanya iwe na ufanisi mkubwa kwa viashiria vinavyovutia umakini.
• 8. Ulinganisho wa Kiufundi na Tofauti LED hii ya kupenyeza shimo inajitofautisha kupitia ujumuishaji wake na kishikio maalum cha pembe-mraba (CBI), ikitoa suluhisho kamili la kiashiria rahisi kusanikisha. Ikilinganishwa na LED za kusakinisha kwenye uso, toleo la kupenyeza shimo kama hili mara nyingi hutoa nguvu bora ya mitambo kwa matumizi yanayokabiliwa na mtikisiko au ushughulikiaji wa mkono. Muundo maalum wa kugawanya kwenye makundi kwa nguvu na urefu wa wimbi huruhusu kuendana kwa rangi na mwangaza kwa usahihi katika paneli za viashiria vingi, faida kuu ikilinganishwa na LED za bidhaa ambazo hazijagawanywa kwenye makundi au zimegawanywa kwa upana. Miongozo kamili ya unyeti wa unyevu na kuuza pia inaonyesha bidhaa iliyoundwa kwa michakato imara na ya kuaminika ya utengenezaji.9. Maswali Yanayoulizwa Mara kwa Mara (FAQ)
• 9.1 Kuna tofauti gani kati ya Wimbi la Kilele na Wimbi Kuu la Mwanga? Wimbi la Kilele (λP) ni urefu wa wimbi wa kimwili ambapo LED hutoa nguvu nyingi zaidi ya optiki. Wimbi Kuu la Mwanga (λd) ni thamani iliyohesabiwa kulingana na mtazamo wa rangi wa binadamu (chati ya CIE) inayowakilisha urefu wa wimbi mmoja tunauona mwanga kuwa. Kwa LED za kijani, mara nyingi ziko karibu, lakini λd ni kigezo muhimu zaidi kwa ubainishaji wa rangi.9.2 Je, naweza kuendesha LED hii kwa 20mA kila wakati? Ndio, 20mA ndiyo mkondo wa mbele wa juu kabisa wa DC unaopendekezwa. Hata hivyo, kufanya kazi kwa kiwango hiki cha juu kabisa kutaongeza joto na kunaweza kupunguza maisha ya LED ikilinganishwa na kufanya kazi kwa mkondo wa chini kama 10mA. Hakikisha joto la mazingira liko ndani ya maelezo na zingatia ubunifu wa joto ikiwa LED nyingi zimetumika.
• 9.3 Kwa nini safu ya nguvu ya mwanga ni pana sana (180-880 mcd)? Hii ndiyo safu ya jumla inayowezekana katika uzalishaji wote. Mfumo wa kugawanya kwenye makundi (HJ, KL, MN) hugawanya safu hii katika vikundi vidogo zaidi na thabiti zaidi. Lazima ubainishe misimbo ya kikundi unayohitaji unapoagiza ili kupata LED ndani ya safu ya mwangaza inayotabirika kwa matumizi yako.9.4 Je, kuchoma daima kunahitajika ikiwa mfuko umefunguliwa kwa zaidi ya masaa 168? Ndio, kuchoma kwa 60°C kwa masaa 48 kunapendekezwa sana ili kutoa unyevu uliokwama. Kupuuza hatua hii kuna hatari ya kujenga shinikizo la mvuke wakati wa mchakato wa kuuza wa joto la juu, ambayo inaweza kusababisha kutenganisha kwa ndani au ufa ("popcorning"), na kusababisha kushindwa mara moja au baadaye.

10. Mfano wa Matumizi ya Vitendo Hali: Kubuni paneli ya viashiria vya hali nyingi kwa kidhibiti cha viwanda. Mfanyabiashara anahitaji viashiria vya kijani vya "Mfumo wa Kawaida" kwenye paneli ya wima. Wanachagua LED hii na kishikio cha pembe-mraba kwa urahisi wa kusanikisha PCB na mtazamo wazi wa upande. Ili kuhakikisha muonekano sawa, wanabainisha Kikundi KL kwa nguvu (310-520 mcd) na Kikundi G10 kwa urefu wa wimbi (520-527 nm) katika agizo lao la ununuzi. Kwenye PCB, wanaweka LED zilizo na nafasi ya katikati-hadi-katikati inayolingana na alama ya kishikio. Saketi ya kuendesha hutumia reli ya 5V na vizuizi vya mkondo vya 180Ω kwa kila LED, na kuweka mkondo kwa ~10mA. Wakati wa usanikishaji, timu ya uzalishaji hufuata sheria ya maisha ya sakafu ya masaa 168, ikichoma reeli zozote zilizofichuliwa kabla ya kuuza bodi kwa wimbi. Matokeo yake ni paneli yenye viashiria thabiti vya kijani vya kung'aa vinavyoonekana wazi kutoka kwa msimamo wa mwendeshaji.

11. Kanuni ya Uendeshaji Hii ni diode inayotoa mwanga ya semikondukta (LED). Wakati voltage ya mbele inayozidi voltage yake ya tabia ya mbele (VF) inatumika, elektroni na mashimo hujumuishwa tena ndani ya eneo lenye shughuli la nyenzo ya semikondukta ya InGaN (Indiamu Galiamu Nitraidi). Mchakato huu wa kujumuishwa tena hutoa nishati kwa namna ya fotoni (mwanga). Muundo maalum wa aloi ya InGaN huamua nishati ya pengo la bendi, ambayo inabainisha moja kwa moja urefu wa wimbi (rangi) ya mwanga unaotolewa—katika kesi hii, kijani kwa takriban 525-535 nm. Lenzi iliyotawanyika ya epoksi hufunga die ya semikondukta, hutoa kinga ya mitambo, na huunda utoaji wa mwanga kuwa pembe pana ya kuona.

• 12. Mienendo ya Teknolojia Ingawa LED za kupenyeza shimo bado ni muhimu kwa uthabiti na aina fulani za usanikishaji, mwelekeo mpana wa tasnia unaelekea kwenye vifaa vya kusakinisha kwenye uso (SMD) LED kutokana na ukubwa wao mdogo, ufaao kwa kuchukua-na-kuweka otomatiki, na njia bora ya joto kwa PCB. Hata hivyo, toleo la kupenyeza shimo kama hili linaendelea kutumika kwa matumizi yanayohitaji nguvu ya juu ya kiunganishi cha mitambo, urahisi wa kufanya mfano wa mkono, au aina maalum za optiki (kama vile kuona kwa pembe-mraba). Maendeleo katika nyenzo za semikondukta zilizobadilishwa na fosforasi na rangi ya moja kwa moja yanaendelea kuboresha ufanisi, uonyeshaji wa rangi, na mwangaza wa juu kabisa wa aina zote za LED, zikiwemo vifurushi vya kupenyeza shimo. Msisitizo juu ya kugawanya kwa usahihi kwenye makundi na usimamizi wa unyeti wa unyevu, kama inavyoonekana kwenye waraka huu wa maelezo, unaonyesha juhudi za tasnia kuelekea kuaminika zaidi na uthabiti katika umeme wa watumiaji na viwanda. to 880 mcd. This wide range is managed through a binning system (see Section 4). The measurement uses a sensor/filter approximating the CIE photopic eye-response curve.
• Viewing Angle (2θ1/2): degrees. This is the full angle at which the luminous intensity drops to half of its axial (on-axis) value, indicating a relatively wide viewing pattern typical for a diffused lens.
• Peak Emission Wavelength (λP): nm (typical). The wavelength at which the spectral power distribution is maximum.
• Dominant Wavelength (λd): to 535 nm. This is the single wavelength perceived by the human eye that defines the color of the LED, derived from the CIE chromaticity diagram.
• Spectral Line Half-Width (Δλ): nm (typical). The spectral bandwidth measured at half the maximum intensity, indicating the color purity.
• Forward Voltage (VF):.4 to 3.3 V at 10mA. This range must be considered when designing the current-limiting circuit.
• Reverse Current (IR): μA maximum at VR=5V.Important:The device is not designed for reverse bias operation; this test condition is for characterization only.

. Binning System Specification

To ensure color and brightness consistency in production, LEDs are sorted into bins. Designers must specify bin codes when ordering to guarantee performance within a defined range.

.1 Luminous Intensity Binning

Binning is performed at a forward current of 10mA. The tolerance for each bin limit is ±15%.

• Bin HJ: mcd (Min) to 310 mcd (Max)
• Bin KL: mcd (Min) to 520 mcd (Max)
• Bin MN: mcd (Min) to 880 mcd (Max)

.2 Dominant Wavelength Binning

Binning is performed at a forward current of 10mA. The tolerance for each bin limit is ±1nm.

• Bin G09:.0 nm (Min) to 520.0 nm (Max)
• Bin G10:.0 nm (Min) to 527.0 nm (Max)
• Bin G11:.0 nm (Min) to 535.0 nm (Max)

. Performance Curve Analysis

While specific graphical curves are referenced in the datasheet, the following interpretations are based on standard LED behavior and the provided parameters:

.1 Forward Current vs. Forward Voltage (I-V Curve)

The forward voltage (VF) has a specified range of 2.4V to 3.3V at 10mA. The I-V characteristic is exponential. Operating the LED above its rated current will cause a significant increase in forward voltage and power dissipation, potentially exceeding the maximum ratings. A constant current driver is strongly recommended over a constant voltage source to ensure stable luminous output and longevity.

.2 Luminous Intensity vs. Forward Current

Luminous intensity is approximately proportional to the forward current within the recommended operating range. However, efficiency may decrease at very high currents due to increased thermal effects. The specified Iv values are at 10mA; driving at the maximum DC current of 20mA will yield higher intensity but must be done with careful thermal management.

.3 Temperature Dependence

The luminous intensity of LEDs typically decreases as the junction temperature increases. While the datasheet provides operating temperature limits (-30°C to +85°C), the actual light output at the upper limit will be lower than at 25°C. For applications requiring stable brightness over a wide temperature range, thermal design on the PCB and potential brightness compensation in the drive circuit should be considered.

. Mechanical & Packaging Information

.1 Outline Dimensions and Assembly

The LED is designed to mate with a specific right-angle black plastic holder. Key mechanical notes include:

• All dimensions are in millimeters, with a general tolerance of ±0.25mm unless otherwise specified.
• The holder material is black plastic.
• The LED lamp itself features a green diffused lens.
• For assembly, the leads must be bent at a point at least 3mm from the base of the LED lens. The base of the lead frame should not be used as a fulcrum during bending.

.2 Packaging Specification

The device is supplied in an industry-standard tape and reel format.

• Carrier Tape:Made of black conductive polystyrene alloy, with a thickness of 0.50 ±0.06 mm.
• Reel Capacity: pieces per 13-inch reel.
• Carton Packaging:
  • reel is packed with a desiccant and humidity indicator card in a Moisture Barrier Bag (MBB).
  • MBBs (800 pcs total) are packed in an Inner Carton.
  • Inner Cartons (8,000 pcs total) are packed in an Outer Carton.

. Soldering & Assembly Guidelines

.1 Storage and Handling

• Sealed Package:Store at ≤30°C and ≤70% RH. Use within one year of opening the moisture-proof bag.
• Opened Package:Store at ≤30°C and ≤60% RH. Components should be IR-reflowed within 168 hours (1 week) of exposure. For storage beyond 168 hours, bake at 60°C for at least 48 hours before soldering to prevent moisture-induced damage ("popcorning") during reflow.

.2 Soldering Process

A minimum clearance of 2mm must be maintained between the base of the lens/holder and the solder point.

• Soldering Iron:Maximum temperature 350°C, maximum time 3 seconds per joint. Apply only once.
• Wave Soldering:Maximum pre-heat temperature 120°C for up to 100 seconds. Maximum solder wave temperature 260°C for a maximum of 5 seconds.
• Cleaning:Use alcohol-based solvents like isopropyl alcohol if necessary. Avoid harsh chemicals.

.3 Application Cautions

• This LED is suitable for indoor/outdoor signage and general electronic equipment.
• Avoid applying external stress to the leads during soldering while the LED is hot.
• Use minimum clinch force during PCB assembly to avoid mechanical stress on the component.
• Excessive soldering temperature or time can deform the LED lens and damage the internal die.

. Design Considerations & Application Notes

.1 Circuit Design

Always use a series current-limiting resistor or a constant-current driver circuit. Calculate the resistor value using the formula: R = (Vsupply - VF) / IF, where VF should be taken as the maximum value from the datasheet (3.3V) to ensure the current does not exceed the limit even with a low-VF LED. For a 5V supply and 10mA target current, the resistor would be approximately (5V - 3.3V) / 0.01A = 170 Ω. A standard 180 Ω resistor would be a safe choice.

.2 Thermal Management

Although power dissipation is low (64mW max), ensuring adequate heat dissipation from the LED junction extends lifespan and maintains brightness stability. The right-angle plastic holder provides some isolation, but the PCB layout should avoid placing the LED near other significant heat sources. For applications running at the maximum DC current (20mA), thermal considerations become more important.

.3 Optical Integration

The 100-degree viewing angle and diffused lens provide a wide, soft light emission suitable for status indicators that need to be visible from various angles. For applications requiring a more focused beam, secondary optics would be necessary. The green color (525-535nm) is in a region of high sensitivity for the human eye, making it highly effective for attention-grabbing indicators.

. Technical Comparison & Differentiation

This through-hole LED differentiates itself through its integration with a dedicated right-angle holder (CBI), offering a complete, easy-to-assemble indicator solution. Compared to surface-mount LEDs, through-hole versions like this one often provide superior mechanical strength for applications subject to vibration or manual handling. The specific binning structure for both intensity and wavelength allows for precise color and brightness matching in multi-indicator panels, a key advantage over unbinned or broadly binned commodity LEDs. The comprehensive moisture sensitivity and soldering guidelines also indicate a product designed for robust, reliable manufacturing processes.

. Frequently Asked Questions (FAQ)

.1 What is the difference between Peak Wavelength and Dominant Wavelength?

Peak Wavelength (λP) is the physical wavelength at which the LED emits the most optical power. Dominant Wavelength (λd) is a calculated value based on human color perception (CIE chart) that represents the single wavelength we perceive the light to be. For green LEDs, they are often close, but λd is the more relevant parameter for color specification.

.2 Can I drive this LED at 20mA continuously?

Yes, 20mA is the maximum recommended DC forward current. However, operating at this maximum will generate more heat and may reduce the LED's lifespan compared to operating at a lower current like 10mA. Ensure the ambient temperature is within spec and consider thermal design if many LEDs are used.

.3 Why is the luminous intensity range so wide (180-880 mcd)?

This is the total possible range across all production. The binning system (HJ, KL, MN) divides this range into smaller, more consistent groups. You must specify your required bin code(s) when ordering to get LEDs within a predictable brightness range for your application.

.4 Is baking always required if the bag is opened for more than 168 hours?

Yes, baking at 60°C for 48 hours is strongly recommended to drive out absorbed moisture. Skipping this step risks vapor pressure buildup during the high-temperature soldering process, which can cause internal delamination or cracking ("popcorning"), leading to immediate or latent failure.

. Practical Application Example

Scenario: Designing a multi-status indicator panel for an industrial controller.

A designer needs green "System Normal" indicators on a vertical panel. They choose this LED with the right-angle holder for easy PCB mounting and a clear side-view. To ensure uniform appearance, they specify Bin KL for intensity (310-520 mcd) and Bin G10 for wavelength (520-527 nm) in their purchase order. On the PCB, they place the LEDs with a center-to-center spacing that matches the holder's footprint. The drive circuit uses a 5V rail and 180Ω current-limiting resistors for each LED, setting the current to ~10mA. During assembly, the production team follows the 168-hour floor life rule, baking any exposed reels before wave soldering the board. The result is a panel with consistent, bright green indicators that are clearly visible from the operator's position.

. Operating Principle

This is a semiconductor light-emitting diode (LED). When a forward voltage exceeding its characteristic forward voltage (VF) is applied, electrons and holes recombine within the active region of the InGaN (Indium Gallium Nitride) semiconductor material. This recombination process releases energy in the form of photons (light). The specific composition of the InGaN alloy determines the bandgap energy, which directly defines the wavelength (color) of the emitted light—in this case, green at approximately 525-535 nm. The diffused epoxy lens encapsulates the semiconductor die, provides mechanical protection, and shapes the light output into a wide viewing angle.

. Technology Trends

While through-hole LEDs remain vital for robustness and certain assembly types, the broader industry trend is toward surface-mount device (SMD) LEDs due to their smaller size, suitability for automated pick-and-place, and better thermal path to the PCB. However, through-hole versions like this one continue to serve applications requiring higher mechanical bond strength, easier manual prototyping, or specific optical formats (like right-angle viewing). Advancements in phosphor-converted and direct-color semiconductor materials continue to improve the efficiency, color rendering, and maximum brightness of all LED types, including through-hole packages. The emphasis on precise binning and moisture sensitivity handling, as seen in this datasheet, reflects the industry's drive toward higher reliability and consistency in both consumer and industrial electronics.