Table of Contents
- 1. Mchanganuo wa Bidhaa
- 2. Vigezo vya Kiufundi
- 2.1 Absolute Maximum Ratings
- 2.2 Electro-Optical Characteristics (Ta = 25°C)
- 3. Binning System
- 3.1 Luminous Intensity Binning
- 3.2 Dominant Wavelength Binning
- 3.3 Forward Voltage Binning
- 4. Performance Curve Analysis
- 4.1 Uhusiano wa Ukubwa wa Mwanga wa Jamaa na Umeme wa Mbele
- 4.2 Uhusiano wa Nguvu ya Mwanga na Joto la Mazingira
- 4.3 Uhusiano wa Sasa ya Mbele na Voltage ya Mbele (I-V Curve)
- 4.4 Usambazaji wa Wigo
- 4.5 Mchoro wa Mfumo wa Mionzi
- 4.6 Mkunjo wa Kupunguza Mkondo wa Mbele
- 5. Mechanical and Packaging Information
- 5.1 Package Dimensions
- 5.2 Polarity Identification
- 6. Soldering and Assembly Guide
- 6.1 Mkunjo wa Joto wa Reflow Soldering
- 6.2 Manual Soldering
- 6.3 Moisture Sensitivity and Storage
- 7. Ufungaji na Taarifa za Kuagiza
- 7.1 Vipimo vya Ukanda wa Kubeba na Reel
- 7.2 Label Description
- 8. Mapendekezo ya Utumizi
- 8.1 Mandhari ya Kawaida ya Utumizi
- 8.2 Design Considerations
- 9. Reliability and Quality Assurance
- 10. Ulinganishi wa Kiteknolojia na Tofauti
- 11. Maswali Yanayoulizwa Mara kwa Mara (FAQ)
- 11.1 Ni mkondo gani wa kazi unaopendekezwa?
- 11.2 Je, msimbo wa kiwango kwenye lebo unasomwaje?
- 11.3 Je, LED hii inaweza kuendeshwa bila kutumia kipingamkondo?
- 11.4 Je, LED hii inafaa kwa matumizi ya nje?
- 12. Uchambuzi wa Kesi ya Uundaji Halisi
- 13. Kanuni ya Uendeshaji
- 14. Mwelekeo wa Teknolojia
1. Mchanganuo wa Bidhaa
This document details the specifications of a surface-mount top-view LED in a P-LCC-2 package. The device features a white package body and a colorless transparent window, offering a wide viewing angle, making it highly suitable for indicator applications. Its design is compatible with modern assembly processes, including vapor phase reflow, infrared reflow, and wave soldering, and is suitable for automatic placement equipment. The product is supplied on 8mm carrier tape reels and complies with lead-free and RoHS requirements.
The primary application direction for this series of LEDs is as optical indicators. Their wide viewing angle and optimized light coupling achieved through internal reflector design make them particularly suitable for use with light pipes. The low forward current requirement also makes them an excellent choice for battery-powered or power-sensitive portable electronic devices.
2. Vigezo vya Kiufundi
2.1 Absolute Maximum Ratings
The device must not be operated beyond these limits, as doing so may cause permanent damage.
- Voltage ya nyuma (VR):5 V
- Mkondo endelevu wa mbele (IF):50 mA
- Peak Forward Current (IFP):100 mA (Duty Cycle 1/10, 1 kHz)
- Power Consumption (Pd):120 mW
- Electrostatic Discharge (ESD) HBM:2000 V
- Operating Temperature (Topr):-40°C to +85°C
- Storage Temperature (Tstg):-40°C to +90°C
- Welding temperature (Tsol):Reflow soldering: 260°C for 10 seconds; Hand soldering: 350°C for 3 seconds.
2.2 Electro-Optical Characteristics (Ta= 25°C)
Typical performance parameters measured under standard test conditions.
- Luminous intensity (Iv):360 - 900 mcd (IF= 20mA)
- Viewing angle (2θ1/2):120° (IF= 20mA)
- Peak wavelength (λp):632 nm (IF= 20mA)
- Wavelength kuu (λd):621 - 631 nm (IF= 20mA)
- Spectral bandwidth (Δλ):20 nm (IF= 20mA)
- Forward Voltage (VF):1.75 - 2.35 V (IF= 20mA)
- Reverse Current (IR):Max 10 μA (VR= 5V)
Remarks:The tolerances are specified as follows: luminous intensity ±11%, dominant wavelength ±1nm, forward voltage ±0.1V.
3. Binning System
Ili kuhakikisha uthabiti wa rangi na mwangaza katika uzalishaji, vifaa vinagawanywa katika viwango tofauti kulingana na vigezo muhimu.
3.1 Luminous Intensity Binning
Viwango vinafafanuliwa na msimbo (k.m. T2, U1), vinavyolingana na IFThamani ya chini na ya juu zaidi ya mwangaza wakati =20mA.
- T2:360 - 450 mcd
- U1:450 - 565 mcd
- U2:565 - 715 mcd
- V1:715 - 900 mcd
3.2 Dominant Wavelength Binning
Wavelength grouping is used to control the subjective color (hue) of red light.
- Group F, code FF1:621 - 626 nm
- Kundi F, Msimbo FF2:626 - 631 nm
3.3 Forward Voltage Binning
Forward voltage binning facilitates circuit design for current regulation.
- Group B, Code 0:1.75 - 1.95 V
- Kikundi B, Msimbo 1:1.95 - 2.15 V
- Kikundi B, Msimbo 2:2.15 - 2.35 V
4. Performance Curve Analysis
Data ya michoro inafunua tabia ya kifaa chini ya hali tofauti.
4.1 Uhusiano wa Ukubwa wa Mwanga wa Jamaa na Umeme wa Mbele
Mkunjo huu unaonyesha jinsi pato la mwanga linavyoongezeka kadri umeme wa mwelekeo unavyoongezeka. Kwa kawaida haufuati mstari wa moja kwa moja, na ufanisi unaweza kupungua kwa viwango vya juu sana vya umeme. Mhandisi anapaswa kuchagua sehemu ya kufanya kazi inayolingana ukali, matumizi ya nguvu, na maisha ya kifaa.
4.2 Uhusiano wa Nguvu ya Mwanga na Joto la Mazingira
Mkunjo huu unaonyesha sifa za kupungua kwa mwanga kwa joto. Kwa kawaida, nguvu ya mwanga hupungua kadiri joto la mazingira linavyoongezeka. Kwa matumizi katika mazingira yenye joto la juu, lazima izingatiwe athari hii ya kupungua ili kuhakikisha mwangaza wa kutosha.
4.3 Uhusiano wa Sasa ya Mbele na Voltage ya Mbele (I-V Curve)
I-V curve ni sifa ya kawaida ya diode. Voltage ya mbele ina mgawo chanya wa joto, ambayo inamaanisha kuwa kwa mkondo uliopewa, itapungua kidogo kadri joto linavyoongezeka.
4.4 Usambazaji wa Wigo
Mchoro wa wigo unathibitisha umonokromia wa mwanga, na kilele chake kikiwa katikati ya urefu wa wimbi wa 632 nm, katika eneo la nyekundu angavu la wigo unaoonekana. Upana mwembamba unaonyesha uchafu mzuri wa rangi.
4.5 Mchoro wa Mfumo wa Mionzi
Mchoro wa kuratibu polar unaonyesha pembe ya maono ya 120°, ukionyesha sifa za utoaji zinazokaribia Lambertian. Hii inathibitisha kifaa hiki kinafaa kwa matumizi yanayohitaji kuonekana kwa pembe pana.
4.6 Mkunjo wa Kupunguza Mkondo wa Mbele
This graph defines the maximum allowable continuous forward current as a function of ambient temperature. To prevent overheating, the current must be reduced when the operating temperature exceeds a specific value (typically starting around 60-70°C).
5. Mechanical and Packaging Information
5.1 Package Dimensions
The P-LCC-2 package has a specific mechanical outline and pad layout. Key dimensions include overall length, width, height, and the location of the cathode identification mark. All unspecified tolerances are ±0.1 mm. Designers must refer to the detailed dimensioning drawing to create the PCB footprint.
5.2 Polarity Identification
The cathode is typically identified by visual markers on the package, such as a notch, dot, or beveled corner. Correct orientation is crucial for circuit operation.
6. Soldering and Assembly Guide
6.1 Mkunjo wa Joto wa Reflow Soldering
Kifaa hiki kimepimwa kwa kiwango cha juu cha joto cha reflow soldering cha 260°C, kwa muda wa sekunde 10 kwa upeo. Inafaa kwa mkunjo wa kawaida wa joto wa IPC/JEDEC J-STD-020 kwa usanikishaji usio na risasi. Ni lazima kudhibiti kwa usahihi muda ulio juu ya mstari wa kioevu ili kuzuia uharibifu wa joto kwa kifuniko cha epoxy.
6.2 Manual Soldering
If manual soldering is required, the temperature of the soldering iron tip should not exceed 350°C, and the contact time for each pin should be limited to 3 seconds or less.
6.3 Moisture Sensitivity and Storage
The product is shipped in moisture barrier packaging (aluminum foil bag with desiccant). Once the sealed bag is opened, components should be used within the specified time frame (not explicitly stated, but standard practice is 168 hours at ≤30°C/60%RH for Level 3 devices) or baked according to standard procedures before reflow soldering to prevent "popcorn" effect.
7. Ufungaji na Taarifa za Kuagiza
7.1 Vipimo vya Ukanda wa Kubeba na Reel
The device is supplied in 8mm tape format. The standard reel quantity is 2000 pieces. Other minimum packaging quantities include 250, 500, and 1000 pieces per reel. Detailed tape and reel dimensions are provided to facilitate the setup of automated handling equipment.
7.2 Label Description
Lebo ya reel ina misimbo mingi:
- CAT:Inalingana na msimbo wa kiwango cha nguvu ya mwanga (kwa mfano V1).
- HUE:Code ya kikundi cha urefu wa mawimbi makuu yanayolingana (mfano FF1).
- REF:Inayolingana na msimbo wa kikundi cha voltage chanya (mfano 1).
8. Mapendekezo ya Utumizi
8.1 Mandhari ya Kawaida ya Utumizi
- Communication Equipment:Status indicator lights in telephones, fax machines, routers, and backlights for buttons or displays.
- Consumer Electronics:Taa za Kiashiria cha Nguvu, Ukimya au Hali ya Muunganisho katika Vifaa vya Sauti na Video, Kompyuta na Vifaa vya Nje.
- Udhibiti wa Viwanda:Taa za Kiashiria kwenye Paneli zinazotumika kwa Hali ya Mashine, Kengele ya Hitilafu au Hali ya Uendeshaji.
- Application ya Miongozo ya Mwanga:Mtazamo wake mpana na sifa zake bora za kuunganisha, hufanya iwe bora kutumika na miongozo ya mwanga iliyoinjizwa, kuhamisha mwanga kutoka PCB hadi paneli ya mbele au skrini.
- Onyo la Jumla:Maombi yoyote yanayohitaji kiashiria cha kuona kilichoangavu, cha kuaminika na chenye matumizi ya nguvu ya chini.
8.2 Design Considerations
- Current limit:Hakikisha unatumia upinzani wa mfululizo au kichocheo cha mkondo thabiti kupunguza mkondo wa mbele kwa thamani salama, kawaida 20mA kwenye mwangaza wa kawaida, usizidi kiwango cha juu kabisa cha 50mA.
- Udhibiti wa joto:Katika hali ya joto kali ya mazingira au unapotumia mkondo wa juu, hakikisha una eneo la kutosha la shaba kwenye PCB au hatua zingine za kupoza joto ili kuweka joto la kiungo ndani ya mipaka, tazama mkunjo wa kupunguza mzigo.
- Ulinzi wa ESD:Ingawa kimepimwa kwa 2000V HBM, bado zinapaswa kuzingwa hatua za kawaida za kinga ya ESD wakati wa usanikishaji na usindikaji.
- Usanifu wa Kioo:Kwa matumizi ya mfereji wa mwanga, mfumo wa mionzi wa LED na muundo wa sehemu ya kuingilia ya mfereji yanapaswa kuzingatiwa ili kuongeza ufanisi wa kuunganisha.
9. Reliability and Quality Assurance
Bidhaa imepitia mfululizo wa majaribio kamili ya kuaminika, kwa kiwango cha uaminifu cha 90% na LTPD ya 10%. Miradi ya majaribio na masharti ni pamoja na:
- Uvumilivu wa Uwekaji tena wa Solder:260°C ±5°C, minimum 10 seconds.
- Temperature Cycling:300 cycles between -40°C and +100°C.
- Thermal Shock:300 cycles between -10°C and +100°C.
- High and Low Temperature Storage:Stored for 1000 hours at +100°C and -40°C respectively.
- DC Operating Life:Operated for 1000 hours under conditions of 20mA, 25°C.
- High Temperature High Humidity (85/85):Operate for 1000 hours under conditions of 85°C and 85% relative humidity.
These tests verify the robustness of the device under typical environmental and operational stresses encountered in electronic products.
10. Ulinganishi wa Kiteknolojia na Tofauti
The P-LCC-2 LED offers differentiated advantages in several key areas for indicator light applications. Compared to simpler chip LEDs, the molded P-LCC package provides superior mechanical protection, easier handling for pick-and-place machines, and a more consistent optical interface. Its wide 120-degree viewing angle is a significant advantage over narrow-viewing-angle LEDs when off-axis visibility is required. The use of AlGaInP semiconductor material for the red chip offers higher luminous efficiency and better temperature stability compared to older technologies like GaAsP, resulting in brighter and more consistent red light output. A comprehensive binning system for intensity, wavelength, and voltage enables more precise color and brightness matching in the final product, which is crucial for multi-indicator panels or aesthetic applications.
11. Maswali Yanayoulizwa Mara kwa Mara (FAQ)
11.1 Ni mkondo gani wa kazi unaopendekezwa?
Hali za kawaida za majaribio na mkondo wa kawaida wa matumizi ni 20mA. Hii inatoa usawa mzuri wa mwangaza na ufanisi. Kifaa kinaweza kufanya kazi kwenye thamani yake kamili ya juu zaidi ya 50mA, lakini hii itazalisha joto zaidi na kupunguza uimara wa muda mrefu, isipokuwa usimamizi unaofaa wa joto umetekelezwa.
11.2 Je, msimbo wa kiwango kwenye lebo unasomwaje?
The CAT code (e.g., V1) indicates the luminous intensity range. The HUE code (e.g., FF1) indicates the dominant wavelength range, controlling the specific hue of red. The REF code (e.g., 1) indicates the forward voltage range. To ensure consistent performance of multiple devices in an assembly, components with the same binning codes should be specified or required.
11.3 Je, LED hii inaweza kuendeshwa bila kutumia kipingamkondo?
No.LED ni kifaa kinachodhibitiwa na mkondo. Kuunganisha moja kwa moja kwenye chanzo cha voltage kutasababisha mkondo mkubwa kupita, ambao unaweza kuharibu LED mara moja. Ni lazima kutumia upinzani wa mfululizo au mzunguko wa mkondo wa kudumu wenye nguvu.
11.4 Je, LED hii inafaa kwa matumizi ya nje?
Upeo wa joto la uendeshaji umepanuliwa hadi -40°C hadi +85°C, ukijumuisha hali nyingi za nje. Hata hivyo, haijabainishwa kuwa inaweza kukabiliwa moja kwa moja kwa muda mrefu na mionzi ya ultraviolet ya jua na hali ya hewa (mvua, unyevu). Kwa matumizi ya nje, LED inapaswa kuwekwa nyuma ya lenzi ya ulinzi au kifuniko, na sehemu nzima inapaswa kufungwa ipasavyo na kuwa na kiwango kinachofaa cha mazingira cha kukabiliwa.
12. Uchambuzi wa Kesi ya Uundaji Halisi
Tukio:Design a status indicator panel for a network switch with 24 ports, each requiring a red link/activity LED. The LEDs must have wide viewing angle visibility, consistent color and brightness, and the design must be energy efficient.
Implementation Plan:
- Component Selection:P-LCC-2 LED nyekundu angavu hii imechaguliwa kwa sababu ina pembe ya kuona ya upana wa digrii 120, mkondo wa chini wa kuendesha wa 20mA, na inatoa mgawanyo mkali wa utendaji.
- Ubunifu wa Sakiti:Kila LED inaendeshwa na pini ya GPIO ya microcontroller kupitia upinzani wa mfululizo wa 100Ω (kulingana na usambazaji wa umeme wa 3.3V na kawaida ya VFCalculated for 2.0V, the current is approximately 13mA. This is below the 20mA test point but provides sufficient brightness while saving power.
- PCB Layout:LEDs are placed in a grid pattern. The PCB footprint recommended in the datasheet was used. A small keep-out area is maintained beneath the LED to prevent solder wicking.
- Usanifu wa Kioo:A custom injection-molded light guide array was designed to direct light from each SMD LED on the PCB to individual transparent windows on the front panel. The wide viewing angle of the LEDs ensures efficient coupling into the light guides.
- Binning:To ensure uniform appearance, a single luminous intensity bin (e.g., U2) and a single dominant wavelength bin (e.g., FF1) are specified for the LEDs in the purchase order.
- Thermal Considerations:Kwa kuwa LED 24 zinaweza kuwaka wakati mmoja, matumizi ya jumla ya nguvu ni ya chini (takriban 0.75W). Hakuna hitaji la usimamizi maalum wa joto kwenye PCB.
13. Kanuni ya Uendeshaji
LED hii ni kifaa cha fotoni cha semiconductor. Kiini chake ni chipi iliyotengenezwa kwa safu ya epitaxial ya alumini-gali-indiamu-fosforasi (AlGaInP) iliyokua kwenye kioo cha msingi. Unapotumia voltage chanya inayozidi kizingiti cha kuwasha diode (takriban 1.8V), elektroni na mashimo huingizwa kuvuka makutano ya p-n. Vibeba malipo hivi hurejeshana ndani ya eneo lenye shughuli la semiconductor, huku wakitolea nishati kwa njia ya fotoni. Muundo maalum wa aloi ya AlGaInP huamua nishati ya pengo la bendi, na hivyo kuamua moja kwa moja urefu wa wimbi la mwanga unaotolewa (rangi) — katika mfano huu, nyekundu mkali wa takriban 632 nm. Mwanga unaotokana huondolewa kupitia uso wa chipi, kisha umbo na uelekezwe na kioakisi cha ndani cha kifurushi cha P-LCC na lenzi wazi ya epoksi ili kufikia pembe ya mtazamo mpana inayohitajika.
14. Mwelekeo wa Teknolojia
Soko la LED za kiashiria linaendelea kukua. Mwelekeo wa jumla unajumuisha kutafuta ufanisi wa juu wa kutolea mwanga (kutolea mwanga zaidi kwa kila wati ya umeme inayoingia), na hivyo kufanya viashiria vyangavu zaidi kwa mkondo wa chini katika vifaa vya mkononi na IoT, na kuboresha ufanisi wa nishati. Udogo pia ni mwelekeo mmoja, kwa matumizi yenye nafasi ndogo, vifurushi vidogo kuliko P-LCC-2 vinakuwa kawaida. Uthabiti ulioimarishwa chini ya mikondo ya juu ya joto ya reflow ni eneo lingine la umakini, ili kukabiliana na michakato ya kisasa ya usanikishaji wa PCB. Zaidi ya hayo, kuunganisha vifaa vya udhibiti vya elektroniki (kama vile madereva ya mkondo wa mara kwa mara hata saketi rahisi za mantiki) moja kwa moja kwenye kifurushi cha LED ("Smart LED") ni mwelekeo unaokua, ambao unarahisisha muundo wa saketi kwa mtumiaji wa mwisho. Ingawa kifaa hiki maalum kinawakilisha teknolojia imara na ya kuaminika, maendeleo haya yanayoendelea katika nyenzo, ufunga, na ushirikiano yanaunda hali ya baadaye ya vipengele vya kiashiria.
Detailed Explanation of LED Specification Terminology
Complete Explanation of LED Technical Terminology
I. Core Indicators of Photoelectric Performance
| Istilahi | Kipimo/Uwakilishi | Mafasiri ya Kawaida | Kwa Nini Ni Muhimu |
|---|---|---|---|
| Ufanisi wa Mwanga (Luminous Efficacy) | lm/W (lumen/watt) | Mwanga unaotolewa kwa kila watt ya umeme, unavyozidi kuwa mkubwa ndivyo unavyozidi kuokoa nishati. | Inaamua moja kwa moja kiwango cha ufanisi wa nishati na gharama za umeme za taa. |
| Flux ya Mwanga (Luminous Flux) | lm (lumen) | Jumla ya mwanga unaotolewa na chanzo cha mwanga, unaojulikana kwa kawaida kama "mwangaza". | Huamua kama taa inatosha kuwa na mwangaza. |
| Pembe ya Kuangazia (Viewing Angle) | ° (digrii), k.m. 120° | Pembe ambapo nguvu ya mwanga hupungua hadi nusu, inayoamua upana wa boriti ya mwanga. | Huathiri eneo linaloangaziwa na usawa wa mwanga. |
| Joto la rangi (CCT) | K (Kelvin), kama 2700K/6500K | Joto la rangi ya mwanga, thamani ya chini inaelekea manjano/joto, thamani ya juu inaelekea nyeupe/baridi. | Huamua mazingira ya taa na matumizi yanayofaa. |
| Kielelezo cha Uonyeshaji Rangi (CRI / Ra) | Hakuna kitengo, 0–100 | Uwezo wa chanzo cha mwanga kurejesha rangi halisi ya kitu, Ra≥80 ni bora. | Huathiri ukweli wa rangi, hutumika katika maeneo yenye mahitaji makubwa kama maduka makubwa, majumba ya sanaa, n.k. |
| Tofauti ya uvumilivu wa rangi (SDCM) | MacAdam Ellipse Steps, e.g., "5-step" | A quantitative metric for color consistency; a smaller step number indicates better color consistency. | Hakikisha rangi ya taa za kundi moja hazina tofauti. |
| Urefu wa wimbi kuu (Dominant Wavelength) | nm (nanomita), k.m. 620nm (nyekundu) | Thamani ya urefu wa wimbi inayolingana na rangi ya LED zenye rangi. | Huamua hue ya LED za rangi moja kama nyekundu, manjano, kijani, n.k. |
| Usambazaji wa Wigo (Spectral Distribution) | Mkunjo wa Urefu wa Mawimbi dhidi ya Ukubwa | Inaonyesha usambazaji wa ukubwa wa mwanga unaotolewa na LED katika urefu wa mawimbi tofauti. | Inaathiri ubora wa kuonyesha rangi na ubora wa rangi. |
II. Vigezo vya Umeme
| Istilahi | Ishara | Mafasiri ya Kawaida | Vidokezo vya Ubunifu |
|---|---|---|---|
| Forward Voltage | Vf | The minimum voltage required to light up an LED, similar to a "starting threshold". | Voltage ya chanjo ya umeme lazima iwe ≥ Vf, voltage inaongezeka wakati LED nyingi zimeunganishwa mfululizo. |
| Forward Current | If | Thamani ya mkondo inayofanya LED ionekane kwa kawaida. | Kwa kawaida hutumia udhibiti wa mkondo wa kudumu, mkondo huamua mwangaza na maisha ya taa. |
| Maksimum ya mkondo wa msukumo (Pulse Current) | Ifp | Mkondo wa kilele unaoweza kustahimili kwa muda mfupi, unaotumika kwa kudimisha au kumulika. | Pulse width and duty cycle must be strictly controlled to prevent overheating damage. |
| Reverse Voltage | Vr | The maximum reverse voltage that an LED can withstand; exceeding this may cause breakdown. | The circuit must be protected against reverse connection or voltage surges. |
| Thermal Resistance | Rth (°C/W) | Upinzani wa joto kutoka kwenye chip hadi kwenye sehemu ya kuunganishia, thamani ya chini inaonyesha usambazaji bora wa joto. | Upinzani wa joto wa juu unahitaji muundo wenye nguvu zaidi wa usambazaji wa joto, vinginevyo joto la kiungo litaongezeka. |
| ESD Immunity | V (HBM), k.m. 1000V | Uwezo wa kukabiliana na mshtuko wa umeme tuli, thamani ya juu zaidi inaonyesha uwezo mkubwa wa kuepusha uharibifu kutokana na umeme tuli. | Antistatic measures must be implemented during production, especially for high-sensitivity LEDs. |
III. Thermal Management and Reliability
| Istilahi | Key Indicators | Mafasiri ya Kawaida | Athari |
|---|---|---|---|
| Junction Temperature | Tj (°C) | The actual operating temperature inside the LED chip. | For every 10°C reduction, the lifespan may double; excessively high temperatures cause lumen depreciation and color shift. |
| Kupungua kwa Mwanga (Lumen Depreciation) | L70 / L80 (saa) | Muda unaohitajika ili mwangaza upunguke hadi 70% au 80% ya thamani ya awali. | Kufafanua moja kwa moja "maisha ya huduma" ya LED. |
| Lumen Maintenance | % (e.g., 70%) | The percentage of remaining luminous flux after a period of use. | Characterizes the ability to maintain brightness after long-term use. |
| Color Shift | Δu′v′ or MacAdam Ellipse | Kiwango cha mabadiliko ya rangi wakati wa matumizi. | Inaathiri uthabiti wa rangi katika eneo la taa. |
| Uchakavu wa Joto (Thermal Aging) | Kupungua kwa Utendaji wa Nyenzo | Uharibifu wa nyenzo za ufungaji kutokana na joto la juu la muda mrefu. | Inaweza kusababisha kupungua kwa mwangaza, mabadiliko ya rangi, au kushindwa kwa mzunguko wazi. |
Nne. Ufungaji na Nyenzo
| Istilahi | Aina za Kawaida | Mafasiri ya Kawaida | Sifa na Matumizi |
|---|---|---|---|
| Aina za Ufungaji | EMC, PPA, Ceramic | The housing material that protects the chip and provides optical and thermal interfaces. | EMC ina mzuri kwa upinzani wa joto na gharama nafuu; kauri ina usambazaji bora wa joto na maisha marefu. |
| Muundo wa Chip | Usakinishaji wa Kawaida, Usakinishaji wa Kichupo (Flip Chip) | Chip electrode arrangement method. | Flip-chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications. |
| Phosphor coating | YAG, silicate, nitride | Coated on the blue LED chip, partially converted to yellow/red light, mixed to form white light. | Fosfori tofauti huathiri ufanisi wa mwanga, halijoto ya rangi na ubora wa kuonyesha rangi. |
| Lenzi/Usanifu wa Optics | Planar, microlens, total internal reflection | The optical structure on the package surface controls light distribution. | Determines the emission angle and light distribution curve. |
Tano, Udhibiti wa Ubora na Uainishaji
| Istilahi | Yaliyomo ya Uainishaji | Mafasiri ya Kawaida | Kusudi |
|---|---|---|---|
| Kikomo cha Flux ya Mwanga | Kificho kama 2G, 2H | Group by brightness level, each group has a minimum/maximum lumen value. | Ensure consistent brightness for products within the same batch. |
| Voltage binning | Codes such as 6W, 6X | Grouped according to forward voltage range. | Facilitates driver power matching and improves system efficiency. |
| Color binning. | 5-step MacAdam ellipse | Group by color coordinates to ensure colors fall within an extremely small range. | Ensure color consistency and avoid color unevenness within the same luminaire. |
| Color temperature binning | 2700K, 3000K, etc. | Group by color temperature, each group has a corresponding coordinate range. | Meet the color temperature requirements of different scenarios. |
VI. Testing and Certification
| Istilahi | Kigezo/Uchunguzi | Mafasiri ya Kawaida | Maana |
|---|---|---|---|
| LM-80 | Lumen Maintenance Test | Long-term operation under constant temperature conditions to record brightness attenuation data. | Inatumika kukadiria maisha ya LED (kwa kuchanganya TM-21). |
| TM-21 | Standard ya Kukadiria Maisha | Kukadiria maisha chini ya hali halisi za matumizi kulingana na data ya LM-80. | Kutoa utabiri wa kisayansi wa maisha. |
| IESNA Standard | Illuminating Engineering Society Standard | Inashughuli na mbinu za uchunguzi wa mwanga, umeme na joto. | Msingi wa uchunguzi unaokubaliwa na tasnia. |
| RoHS / REACH | Uthibitisho wa kiwango cha mazingira | Hakikisha bidhaa haina vitu hatari (kama risasi, zebaki). | Masharti ya kuingia kwenye soko la kimataifa. |
| ENERGY STAR / DLC | Uthibitisho wa ufanisi wa nishati. | Uthibitishaji wa Ufanisi na Utendaji kwa Bidhaa za Taa. | Hutumiwa kwa mradi wa ununuzi wa serikali, ruzuku, na kuimarisha ushindani wa soko. |