Table of Contents
- 1. Product Overview
- 2. Key Features and Core Advantages
- 3. Soko Lengwa na Matumizi
- 4. Uchambuzi wa kina wa Vigezo vya Kiufundi
- 4.1 Absolute Maximum Ratings
- 4.2 Electrical and Optical Characteristics
- 4.2.1 Input (Infrared LED) Characteristics
- 4.2.2 Sifa za Pato (Transista ya Fotoelektriki)
- 4.2.3 Sifa za Usafirishaji
- 5. Mechanical and Packaging Information
- 5.1 Package Dimensions and Outline Drawing
- 5.2 Pin Configuration and Polarity
- 5.3 Recommended PCB Land Pattern
- 5.4 Device Marking
- 6. Soldering and Assembly Guide
- 7. Ufungaji na Taarifa za Kuagiza
- 7.1 Kanuni za Uteuzi wa Majina ya Aina
- 7.2 Vipimo vya Ufungaji
- 8. Uzingatiaji wa Ubunifu wa Matumizi
- 8.1 Saketi ya Kawaida ya Matumizi
- 8.2 Design Essentials and Best Practices
- 9. Technical Comparison and Differentiation
- 10. Maswali Yanayoulizwa Mara kwa Mara
- 10.1 Kasi ya juu ya data inayoweza kutekelezwa na vifungu hivi vya mwanga ni nini?
- 10.2 How do I select the correct Current Transfer Ratio grade for my application?
- 10.3 Can these devices be used to isolate analog signals?
- 10.4 What is the purpose of the isolation voltage rating, and how is it tested?
- 11. Practical Design Example
- 12. Working Principle
- 13. Mienendo na Maendeleo ya Sekta
1. Product Overview
ELD3H7 and ELQ3H7 are phototransistor-based optocouplers designed for electrical signal isolation. They consist of an infrared light-emitting diode optically coupled to a silicon phototransistor, all housed in a compact surface-mount package. Their primary function is to transfer electrical signals between two circuits while maintaining high electrical isolation, preventing the propagation of noise, ground loops, and voltage spikes.
The ELD3H7 integrates 2 independent isolation channels in an 8-pin SSOP (Shrink Small Outline Package). The ELQ3H7 integrates 4 independent channels in a 16-pin SSOP. Both models feature an ultra-thin profile of 2.0 mm, making them ideal for space-constrained applications. The devices use halogen-free, green molding compound and comply with lead-free and RoHS directives.
2. Key Features and Core Advantages
- Voltage ya Utofautishaji wa Juu:Rated value is 3750 Vrms(for 1 minute), ensuring reliable protection and safety in high-voltage environments.
- Wide current transfer ratio:At IF= 5mA, VCEUnder 5V conditions, the range from 50% to 600% provides design flexibility for different signal amplification requirements.
- Compact Form Factor:The SSOP package with a profile height of 2.0 mm is an ideal choice for high-density PCB design.
- Comprehensive Safety Certifications:Imepata uthibitisho wa UL (E214129), VDE (40028116), SEMKO, NEMKO, DEMKO, FIMKO na CQC, inarahisisha matumizi katika vifaa vinavyodhibitiwa ulimwenguni.
- Sifa za Kubadilisha Haraka:Chini ya masharti maalum ya majaribio, wakati wa kupanda kwa kawaida (tr) ni 5 µs, wakati wa kushuka (tf) ni 3 µs, inafaa kwa usambazaji wa ishara ya dijiti.
3. Soko Lengwa na Matumizi
Vichanganyaji vya mwanga hivi vimeundwa kwa matumizi yanayohitaji kutengwa kwa ishara kwa uaminifu na upinzani dhidi ya usumbufu wa kelele.
- DC-DC Converter:Inatoa utengano wa kitanzi cha maoni katika vifaa vya usambazaji wa umeme vya kubadili-badili.
- Programmable Logic Controllers na Uotomatiki wa Viwanda:Isolate digital I/O signals between the controller and field devices.
- Telecommunications Equipment:Isolate signal lines in modems, interfaces, and network hardware.
- Ujumla wa Mzunguko wa Kutengwa:Kusafirisha ishara kati ya nyaya zenye viwango tofauti vya uwezo wa ardhi au upinzani.
4. Uchambuzi wa kina wa Vigezo vya Kiufundi
4.1 Absolute Maximum Ratings
These are stress limits that must not be exceeded under any conditions to prevent permanent damage to the device.
- Input (LED side):Forward current (IF) 60 mA; Peak forward current (IFP) 1 A (pulse ya 1 µs); voltage ya nyuma (VR) 6 V; nguvu inayotumika (PD) 70 mW.
- Pato (upande wa transistor):Collector current (IC) 50 mA; Collector-emitter voltage (VCEO) 80 V; Emitter-collector voltage (VECO) 7 V; Power Consumption (PC) 150 mW.
- Overall Device:Total power consumption (PTOT) 200 mW; Isolation voltage (VISO)3750 Vrms.
- Joto:Operating range -55°C to +110°C; storage range -55°C to +125°C; soldering temperature 260°C (for 10 seconds).
4.2 Electrical and Optical Characteristics
Typical performance parameters measured at 25°C.
4.2.1 Input (Infrared LED) Characteristics
- Voltage ya Mwelekeo Sahihi (VF):Thamani ya kawaida 1.2V, kwa IFMaximum 1.4V at =20mA. This parameter is crucial for designing LED drive circuits.
- Reverse current (IR):At VRMaximum 10 µA at =4V, indicating the diode has good reverse blocking characteristics.
- Input capacitance (Cin):Typical value 30 pF, affecting high-frequency switching performance.
4.2.2 Sifa za Pato (Transista ya Fotoelektriki)
- Dark current (ICEO):At VCE=20V, IFMaximum 100 nA at =0mA. This is the leakage current when the LED is off, affecting signal integrity in the off state.
- Breakdown voltage: BVCEO≥ 80V, BVECO≥ 7V, defines the maximum allowable voltage across the transistor.
- Collector-emitter saturation voltage (VCE(sat)):Typical value 0.1V, at IF=10mA, IC=1mA maximum 0.2V. For logic level output, lower VCE(sat)Ni bora.
4.2.3 Sifa za Usafirishaji
- Uwiano wa Usafirishaji wa Umeme:Defined as (IC/ IF) * 100%. At IF=5mA, VCEUnder the condition of =5V, the specified range is from 50% to 600%. This broad grading allows for selection based on the required gain.
- Isolation resistance (RIO):Minimum of 5×10 at 500V DC10Ω, ensuring excellent DC isolation.
- Isolation capacitance (CIO):Typical 0.3 pF, maximum 1.0 pF. Low capacitance minimizes capacitive coupling of high-frequency noise across the isolation barrier.
- Switching time:Under test conditions (Vr=2V, If=2mA, RCE=100Ω), rise time (tC) typical value 5 µs, fall time (tL) typical value 3 µs. These values determine the maximum usable data rate.
5. Mechanical and Packaging Information
5.1 Package Dimensions and Outline Drawing
The device adopts an SSOP package. The ELD3H7 (2-channel) uses an 8-pin SSOP, while the ELQ3H7 (4-channel) uses a 16-pin SSOP. Both share a common low-profile height of 2.0 mm. The datasheet provides a detailed dimension drawing containing all key dimensions (body size, lead pitch, standoff height) for PCB pad design.
5.2 Pin Configuration and Polarity
For ELD3H7 (8-pin):
- Pins 1, 3: Anodes for Channel 1 and Channel 2 LEDs, respectively.
- Pini 2, 4: Ni cathode za LED za Channel 1 na Channel 2 kwa mtiririko huo.
- Pini 5, 7: Ni emitter za phototransistor za Channel 1 na Channel 2 kwa mtiririko huo.
- Pini 6, 8: Ni collector za phototransistor za Channel 1 na Channel 2 kwa mtiririko huo.
- Pini 1, 3, 5, 7: Anodi za LED za kituo 1 hadi 4.
- Pini 2, 4, 6, 8: Kathodi ya LED za Kituo 1 hadi 4.
- Pini 9, 11, 13, 15: Emita ya Transista ya Mwanga ya Kituo 1 hadi 4.
- Pini 10, 12, 14, 16: Kolekta ya Transista ya Mwanga ya Kituo 1 hadi 4.
5.3 Recommended PCB Land Pattern
Karatasi ya Data ina muundo ulipendekezwa wa picha ya pad kwa ufungaji wa SSOP wenye pini 8 na 16. Kufuata mapendekezo haya kuhakikisha muundo thabiti wa mnyororo wakati wa upakiaji tena na utulivu unaofaa wa mitambo.
5.4 Device Marking
The device is marked on the top side. The marking includes:
- "EL": Manufacturer identifier.
- "D3H7" or "Q3H7": Model numbers for 2-channel or 4-channel devices.
- "Y": A single-digit year code.
- "WW": A two-digit week code.
- "V": Alama ya hiari, inayoashiria uthibitisho wa VDE.
6. Soldering and Assembly Guide
Vifaa hivi vinatumika kwa usakinishaji wa kusakinishwa kwenye uso kwa kutumia mbinu ya kuunganisha kwa kuyeyusha tena.
- Kuunganisha kwa kuyeyusha tena:Joto la juu linaruhusiwa la kuunganisha kwenye kiwiko cha kifurushi ni 260°C, kwa muda usiozidi sekunde 10. Mkunjo wa kawaida wa kuunganisha kwa kuyeyusha tena bila risasi (IPC/JEDEC J-STD-020) unatumika.
- Operation:Standard ESD (Electrostatic Discharge) precautions should be followed as the device contains static-sensitive semiconductors.
- Cleaning:Fuata taratibu za kawaida za usafishaji wa PCB zinazolingana na misombo ya kijani ya epoksi ya umbo.
- Uhifadhi:Hifadhi katika mazingira yaliyokauka yenye halijoto kati ya -55°C hadi +125°C. Shauri litumike ndani ya miezi 12 baada ya tarehe ya msimbo kwa ununuzi bora.
7. Ufungaji na Taarifa za Kuagiza
7.1 Kanuni za Uteuzi wa Majina ya Aina
The part number follows the format:EL[D3H7/Q3H7](Z)-V
- EL:Series prefix.
- D3H7 / Q3H7:Indicates a 2-channel or 4-channel device.
- (Z):Tape and reel packaging option. "TA" indicates tape and reel packaging; absence of this marking indicates tube packaging.
- V:Optional suffix, indicating VDE certification.
7.2 Vipimo vya Ufungaji
- ELD3H7 (Tube):80 pieces per tube.
- ELD3H7 (Tape and Reel):1000 per reel.
- ELQ3H7 (Tube):40 per tube.
- ELQ3H7 (Tape & Reel):1000 per reel.
Tape and reel specifications, including carrier tape width, pocket size, and reel diameter, are detailed to facilitate automatic placement machine setup.
8. Uzingatiaji wa Ubunifu wa Matumizi
8.1 Saketi ya Kawaida ya Matumizi
The most common application is digital signal isolation. A current-limiting resistor must be connected in series with the LED anode to set the required forward current (IF). Its resistance is calculated by the formula: Rlimit= (VCC_input- VF) / IF. On the output side, a pull-up resistor (RL) is connected between the collector and the output side power supply voltage (VCC_output) kati, hutumika kufafanua viwango vya mantiki ya pato na kupunguza mkondo wa kolekta ya fototransista.
8.2 Design Essentials and Best Practices
- Uchaguzi wa Uwiano wa Uhamishaji wa Mkondo:Chagua kiwango cha uwiano wa uhamishaji wa umeme kulingana na umeme unaoendesha na umeme unaohitajika kutoka. Uwiano wa juu wa uhamishaji wa umeme huruhusu kutumia I ya chini kwa pato sawa.F, hivyo kupunguza matumizi ya nguvu ya pembejeo.
- Usawa kati ya kasi na umeme:Kasi ya kubadili (tr, tf) kawaida huongezeka kwa kuongezeka kwa IFna kupungua kwa RL, lakini hii itaongeza matumizi ya nguvu. Mzunguko wa majaribio (IFmsukumo, VCE=2V, IC=2mA, RL=100Ω) inatoa marejeleo ya utendaji unaotarajiwa.
- Ukinzani wa kelele:High isolation resistance (RIO) and low isolation capacitance (CIO) are key to suppressing common-mode noise. Ensure proper PCB layout to avoid creepage and clearance issues that could affect the rated isolation voltage.
- Thermal considerations:Haipaswi kuzidi matumizi ya jumla ya nguvu ya kifaa (PTOT= 200 mW). Matumizi ya jumla ya nguvu ni matumizi ya nguvu ya LED ya kuingiza (IF*VF) pamoja na matumizi ya nguvu ya transistor ya kutolea (IC*VCE) sum.
9. Technical Comparison and Differentiation
Compared to standard DIP-4 or DIP-6 optocouplers, the ELD3H7/ELQ3H7 series offers significant advantages:
- Kupunguza ukubwa:Kwa vifaa vya njia 2, kifurushi cha SSOP kinachukua eneo la bodi ya mzunguko chini ya 25% ya kifurushi cha kawaida cha DIP-8, na kufikia ukubwa mdogo.
- Ujumuishaji wa njia nyingi:Inapendekeza chaguzi za njia 2 na njia 4 kwenye kifurushi kimoja, hupunguza idadi ya vipengele na nafasi inayochukuliwa na bodi ya mzunguko katika matumizi mengi ya kutengwa.
- Urefu wa Umbo:Urefu wa milimita 2.0 ni muhimu kwa muundo ulio nyembamba sana.
- Utendaji:Licha ya ukubwa mdogo, bado inaweza kudumisha voltage ya kutengwa ya juu na uwango mpana wa uwiano wa uhamishaji wa mkondo, ambayo ni tofauti muhimu ikilinganishwa na njia mbadala nyingi za kufanya vidogo.
10. Maswali Yanayoulizwa Mara kwa Mara
10.1 Kasi ya juu ya data inayoweza kutekelezwa na vifungu hivi vya mwanga ni nini?
Kulingana na nyakati za kawaida za kupanda/kushuka za 5 µs na 3 µs, kwa ishara safi ya dijiti, kiwango cha juu cha vitendo cha data ni takriban 1/(tr+tf) ≈ 125 kHz. Kwa uendeshaji thabiti, lengo la muundo la kihafidhina la 50-100 kHz linapendekezwa.
10.2 How do I select the correct Current Transfer Ratio grade for my application?
If your design requires a guaranteed minimum output current (IC) at a specific input current (IF), calculate the required minimum current transfer ratio: CTRmin_req= (IC/ IF) * 100%. Chagua kifaa ambacho uwiano wa chini wa uhakika wa uhamishaji wa mkondo (kwa mfano 50%) unafikia au kuzidi thamani hii. Kutumia kiwango cha juu cha uwiano wa uhamishaji wa mkondo kunatoa ukingo mkubwa wa muundo.
10.3 Can these devices be used to isolate analog signals?
Although primarily designed for digital isolation, they can also be used for low-frequency, low-precision analog applications (e.g., feedback in isolated power supplies). However, the current transfer ratio has a strong temperature dependence and a nonlinear relationship with IF, making them unsuitable for precision analog signal transmission without extensive calibration or compensation circuitry. Dedicated linear optocouplers are more suitable for analog isolation.
10.4 What is the purpose of the isolation voltage rating, and how is it tested?
3750 VrmsThe rating (for 1 minute) is a safety specification indicating the dielectric strength of the insulation between the input and output sides. During testing, all pins on the LED side are shorted together, and all pins on the transistor side are also shorted together. A high AC voltage is applied between these two groups. This rating ensures protection against high-voltage transients that may occur in industrial or mains-connected equipment.
11. Practical Design Example
Scene:Isolate the 3.3V digital signal of the microcontroller to a 5V system.
- Input side: VCC_input= 3.3V. Target IF= 5 mA, to achieve good speed and current transfer ratio. Assuming VF≈ 1.2V, then Rlimit= (3.3V - 1.2V) / 0.005A = 420Ω. Tumia upinzani wa kawaida wa 430Ω.
- Upande wa pato: VCC_output= 5V. Chagua RLKwa kuzuia ICna kuweka viwango vya mantiki. Kwa IF=5mA wakati uwiano wa uhamishaji wa sasa ni 100%, IC≈ 5mA. Wakati transistor inawasha (kujaa), VCE≈ 0.1V, kwa hivyo pato ni la chini (takriban 0.1V). Wakati imezimwa, pato linainuliwa hadi kiwango cha juu cha 5V. Wakati inawasha, RLThe power consumption on it is (5V - 0.1V) * 5mA ≈ 24.5 mW, which is completely within the rated range. A standard 1 kΩ resistor will give IC≈ (5V - 0.1V)/1kΩ = 4.9mA, which is also acceptable.
- Layout:Place the device close to the isolation barrier on the PCB. Maintain the recommended creepage and clearance distances (refer to safety standards such as IEC 60950-1) between the input and output copper traces, especially for high isolation voltage ratings.
12. Working Principle
Optocoupler hufanya kazi kwa kubadilisha ishara ya umeme kuwa mwanga, kuipitisha kwenye pengo la kutengeneza umeme, na kisha kubadilisha mwanga huo tena kuwa ishara ya umeme. Katika ELD3H7/ELQ3H7:
- Mkondo (IF) unapita kwenye LED ya infrared, na kuisababisha kutolea fotoni.
- Photoni hizi hupita kwenye kati ya insulator ya uwazi (mchanganyiko wa umbo), na kugonga eneo la msingi la transistor ya fotoni ya silikoni.
- Nishati ya fotoni huzalisha jozi za elektroni-na-shimo katika eneo la msingi, kwa ufanisi kuzalisha mkondo wa msingi, na kuifanya transistor iweze kufanya kazi.
- Transistor inaongoza mkondo wa kolekta (IC), ambayo ni sawia na ukubwa wa mwanga uliopokelewa, na hivyo pia na pembejeo IFni sawia. Uwiano wa mara kwa mara ni uwiano wa uhamishaji wa mkondo.
13. Mienendo na Maendeleo ya Sekta
Mwenendo wa teknolojia ya optocoupler inaendeshwa na mahitaji ya kasi ya juu zaidi, ukubwa mdogo, matumizi ya nguvu ya chini, na ujumuishaji wa kazi zaidi. Ingawa optocoupler za jadi za phototransistor kama ELD3H7/ELQ3H7 zinaonyesha ufanisi wa gharama, uthabiti, na voltage ya juu ya kutengwa, teknolojia mpya zinaendelea kutokea:
- Optocoupler za dijiti za kasi ya juu:Kwa kutumia teknolojia ya CMOS na LED zilizojumuishwa, kufikia viwango vya data vya mamia ya Mbps, vinavyozidi vifaa vya msingi wa phototransistor.
- Ujumuishaji wa kazi ya kutengwa:Vifaa vinavyounganisha kutengwa na kazi kama vile madereva ya lango ya kutengwa, ADC za kutengwa, au vyanzo vya nguvu vilivyotengwa.
- Usalimu na Uthabiti Ulioimarishwa:Mwelekeo endelevu wa maendeleo unalenga kuboresha uimara wa nyenzo za kutengwa, uwezo wa kukabiliana na mawimbi ya ghafla, na kufikia viwango vya juu vya voltage vya uendeshaji ndani ya kifurushi kidogo, ili kukidhi viwango vya kimataifa vya usalimu vinavyokua.
Detailed Explanation of LED Specification Terminology
Complete Explanation of LED Technical Terminology
I. Viashiria vikuu vya utendaji wa umeme na nuru
| Istilahi | Vitengo/Uwasilishaji | Popular Explanation | Why It Is Important |
|---|---|---|---|
| Ufanisi wa Mwanga (Luminous Efficacy) | lm/W (lumen/watt) | Mwangaza unaotolewa kwa kila watt ya umeme, unavyozidi kuwa mkubwa ndivyo unavyozidi kuwa wa kutumia nishati kwa ufanisi. | Huamua moja kwa moja kiwango cha ufanisi wa taa na gharama za umeme. |
| Luminous Flux | lm (lumen) | Jumla ya mwanga unaotolewa na chanzo cha mwanga, unaojulikana kwa jina la "mwangaza". | Huamua kama taa inatosheleza kwa mwangaza. |
| Pembe ya kuona (Viewing Angle) | ° (digrii), kama 120° | Pembe ambapo ukali wa mwanga hupungua hadi nusu, huamua upana wa boriti ya mwanga. | Huathiri eneo la mwangaza na usawa wake. |
| Joto la rangi (CCT) | K (Kelvin), k.m. 2700K/6500K | Joto la rangi ya mwanga, thamani ya chini inaelekea manjano/joto, thamani ya juu inaelekea nyeupe/baridi. | Inaamua mazingira ya taa na matumizi yanayofaa. |
| Kielelezo cha Uonyeshaji Rangi (CRI / Ra) | Hakuna kitengo, 0–100 | Uwezo wa chanzo cha mwanga kurejesha rangi halisi ya kitu, Ra≥80 ni bora. | Huathiri ukweli wa rangi, hutumika katika maeneo yenye mahitaji makubwa kama maduka makubwa, majumba ya sanaa n.k. |
| Color Tolerance (SDCM) | MacAdam Ellipse Steps, e.g., "5-step" | A quantitative indicator of color consistency; a smaller step number indicates higher color consistency. | Kuhakikisha hakuna tofauti ya rangi kati ya taa za kundi moja. |
| Dominant Wavelength | nm (nanometer), kama 620nm (nyekundu) | Thamani ya urefu wa wimbi inayolingana na rangi ya LED zenye rangi. | Inaamua hue ya LED ya rangi moja kama nyekundu, manjano, kijani, n.k. |
| Usambazaji wa Wigo (Spectral Distribution) | Mkunjo wa Wimbi la Mwinda dhidi ya Nguvu | Inaonyesha usambazaji wa nguvu za mwanga unaotolewa na LED katika kila urefu wa wimbi. | Huathiri ubora wa kuonyesha rangi na ubora wa rangi. |
II. Vigezo vya Umeme
| Istilahi | Ishara | Popular Explanation | Mazingatio ya Ubunifu |
|---|---|---|---|
| Voltage ya Mbele (Forward Voltage) | Vf | Voltage ya chini inayohitajika kuwasha LED, kama "kizingiti cha kuanzisha". | Voltage ya chanzo cha umeme inahitaji kuwa ≥ Vf, voltage inajumlishwa wakati LED nyingi zimeunganishwa mfululizo. |
| Forward Current | If | The current value that makes the LED emit light normally. | Constant current drive is often used, as the current determines brightness and lifespan. |
| Mkondo wa juu zaidi wa msukumo (Pulse Current) | Ifp | Peak current that can be withstood for a short period, used for dimming or flashing. | Pulse width and duty cycle must be strictly controlled to prevent overheating damage. |
| Reverse Voltage | Vr | The maximum reverse voltage that an LED can withstand; exceeding it may cause breakdown. | Mzunguko unahitaji kuzuia uunganishaji kinyume au mshtuko wa voltage. |
| Thermal Resistance | Rth(°C/W) | Upinzani wa joto kutoka kwenye chip hadi kwenye mnyororo wa kuuzi, thamani ya chini inaonyesha usambazaji bora wa joto. | Upinzani wa juu wa joto unahitaji muundo wenye nguvu zaidi wa usambazaji wa joto, vinginevyo joto la kiungo litaongezeka. |
| Uvumilivu wa Kutokwa na Umeme wa Tuli (ESD Immunity) | V (HBM), k.m. 1000V | Uwezo wa kukabiliana na mshtuko wa umeme wa tuli, thamani ya juu zaidi inamaanisha uwezo mkubwa wa kuepusha uharibifu wa umeme wa tuli. | Hatua za kuzuia umeme wa tuli zinahitajika katika uzalishaji, hasa kwa LED zenye unyeti wa juu. |
III. Usimamizi wa Joto na Uthabiti
| Istilahi | Viashiria Muhimu | Popular Explanation | Athari |
|---|---|---|---|
| Junction Temperature | Tj (°C) | The actual operating temperature inside the LED chip. | Kila kupungua kwa joto kwa 10°C, maisha ya taa yanaweza kuongezeka mara mbili; joto la juu sana linasababisha kupungua kwa mwanga na kugeuka kwa rangi. |
| Kupungua kwa Mwanga (Lumen Depreciation) | L70 / L80 (saa) | Muda unaohitajika ili mwangaza upunguke hadi 70% au 80% ya thamani ya awali. | Inafafanua moja kwa moja "maisha ya huduma" ya LED. |
| Lumen Maintenance | % (e.g., 70%) | The percentage of remaining brightness after a period of use. | Inaonyesha uwezo wa kudumisha mwangaza baada ya matumizi ya muda mrefu. |
| Color Shift | Δu′v′ or MacAdam ellipse | The degree of color change during use. | Affects the color consistency of the lighting scene. |
| Uzeefu wa joto (Thermal Aging) | Kupungua kwa utendaji wa nyenzo | Deterioration of packaging materials due to prolonged high temperatures. | May lead to decreased brightness, color shift, or open-circuit failure. |
IV. Packaging and Materials
| Istilahi | Aina za Kawaida | Popular Explanation | Sifa na Matumizi |
|---|---|---|---|
| Packaging Type | EMC, PPA, Ceramic | A housing material that protects the chip and provides optical and thermal interfaces. | EMC offers good heat resistance and low cost; ceramics provide excellent heat dissipation and long lifespan. |
| Chip structure | Face-up, Flip Chip | Chip electrode arrangement method. | Flip Chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications. |
| Phosphor coating | YAG, silicate, nitride | Inayofunikwa kwenye chip ya mwanga wa bluu, sehemu hubadilishwa kuwa mwanga wa manjano/nyekundu, na kuchanganywa kuwa mwanga mweupe. | Fosfori tofauti huathiri ufanisi wa mwanga, halijoto ya rangi na ubora wa kuonyesha rangi. |
| Lenzi/Usanifu wa Optics | Flat, Microlens, Total Internal Reflection | Optical structures on the encapsulation surface to control light distribution. | Determine the light emission angle and light distribution curve. |
V. Quality Control and Binning
| Istilahi | Binning Content | Popular Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Binning | Codes such as 2G, 2H | Group by brightness level, each group has a minimum/maximum lumen value. | Ensure consistent brightness for products within the same batch. |
| Kugawanya kwa kiwango cha voltage | Msimbo kama vile 6W, 6X | Group by forward voltage range. | Facilitates driver matching and improves system efficiency. |
| Color binning. | 5-step MacAdam Ellipse | Group by color coordinates to ensure colors fall within a minimal range. | Hakikisha usawa wa rangi, epuka kutofautiana kwa rangi ndani ya taa moja. |
| Mgawanyo wa joto la rangi | 2700K, 3000K, n.k. | Pangawiani kulingana na joto la rangi, kila kikundi kina anuwai ya kuratibu inayolingana. | Kukidhi mahitaji ya joto tofauti la rangi kwa matukio mbalimbali. |
VI. Upimaji na Uthibitishaji
| Istilahi | Viwango/Upimaji | Popular Explanation | Maana |
|---|---|---|---|
| LM-80 | Upimaji wa Kudumisha Lumeni | Kurekebisha kwa muda mrefu chini ya hali ya joto la kudumu, kurekodi data ya kupungua kwa mwangaza. | Kutumia kukadiria maisha ya LED (kwa kuchanganya TM-21). |
| TM-21 | Lifespan Projection Standard | Estimating lifespan under actual operating conditions based on LM-80 data. | Toa utabiri wa kisayansi wa maisha ya taa. |
| IESNA Standard | Illuminating Engineering Society Standard | Covers optical, electrical, and thermal testing methods. | Industry-recognized testing basis. |
| RoHS / REACH | Environmental Certification | Ensure products are free from hazardous substances (e.g., lead, mercury). | Masharti ya kuingia katika soko la kimataifa. |
| ENERGY STAR / DLC | Uthibitisho wa Ufanisi wa Nishati | Uthibitisho wa Ufanisi wa Nishati na Utendaji kwa Bidhaa za Taa. | Hutumiwa mara nyingi katika ununuzi wa serikali na miradi ya ruzuku, kuimarisha ushindani wa soko. |