Table of Contents
- 1. Product Overview
- 1.1 Key Features and Target Market
- 2. Uchambuzi wa kina wa Vigezo vya Kiufundi
- 2.1 Viwango vya Juu Kabisa
- 2.2 Electrical and Optical Characteristics
- 3. Mfumo wa Uainishaji Maelezo
- 4. Uchambuzi wa Mkunjo wa Utendaji
- 4.1 Forward Current vs. Forward Voltage (I-V Curve)
- 4.2 Luminous Intensity vs. Forward Current
- 4.3 Utegemezi wa Joto
- 5. Mechanical and Packaging Information
- 5.1 Package Dimensions and Polarity
- 5.2 Recommended Pad Design
- 6. Soldering and Assembly Guide
- 6.1 Mkunjo wa Uchomeaji wa Reflow
- 6.2 Mazingatio ya Uhifadhi na Usindikaji
- 6.3 Usafishaji
- 7. Ufungaji na Taarifa za Kuagiza
- 8. Mapendekezo ya Ubunifu wa Matumizi
- 8.1 Ubunifu wa Saketi ya Kuendesha
- 8.2 Thermal Management
- 8.3 ESD Protection
- 9. Ulinganishi wa Kiufundi na Tofauti
- 10. Maswali Yanayoulizwa Mara kwa Mara (FAQ)
- 11. Mifano ya Uundaji na Matumizi Halisi
- 12. Ufupisho wa Kanuni za Teknolojia
- 13. Mwelekeo na Maendeleo ya Sekta
1. Product Overview
Waraka huu unatoa maelezo kamili ya kitaalamu ya LTST-C193KRKT-2A, ambayo ni LED ya chip yenye utendaji bora ya kukandamiza uso, iliyoundwa mahsusi kwa matumizi ya kisasa ya elektroniki yanayohitaji urefu mdogo sana wa vipengele na utendaji thabiti. Kifaa hiki kinatumia teknolojia ya kisasa ya semiconductor ya AlInGaP (Aluminium Indium Gallium Phosphide) na ni LED nyembamba sana inayotoa mwanga mwekundu mkali. Lengo kuu la muundo wake ni kuwezesha ujumuishwaji wake katika vifaa vilivyo na nafasi ndogo, bila kukataa utendaji wa macho au uwezo wa kutengenezwa.
The core advantage of this component includes its extremely low profile height of only 0.35mm, which is a critical parameter for slim consumer electronics, displays, and indicator light applications. It is meticulously designed to be compatible with standard automated SMT production lines and high-volume reflow soldering processes, including infrared (IR) and vapor phase soldering methods. This product is classified as a green product, compliant with the RoHS (Restriction of Hazardous Substances) directive, making it suitable for environmentally conscious designs and the global market.
1.1 Key Features and Target Market
The LTST-C193KRKT-2A possesses several key features that define its application areas. The use of an AlInGaP chip is central to its performance, offering higher luminous efficiency and better temperature stability compared to traditional red LED materials. Its package adheres to the EIA (Electronic Industries Alliance) standard, ensuring broad compatibility with industry design libraries and assembly equipment.
Soko lengwa la LED hii linajumuisha vifaa vya elektroniki mbalimbali. Maeneo yake makuu ya matumizi ni pamoja na vifaa vya otomatiki za ofisi (printa, skana, nakala), vifaa vya mawasiliano (ruta, modem, swichi) na vifaa vya nyumbani vinavyohitaji kiashiria cha hali, mwanga wa nyuma wa vitufe au taa za kazi. Tabia yake nyembamba sana inafanya iwe ya kuvutia hasa katika vifaa vya kubebebebwa, kingo nyembamba sana za skrini na televisheni, na matumizi yoyote ambapo urefu wa Z-axis ni kikwazo muhimu cha kubuni. Ustahamilifu wake na usakinishaji wa otomatiki na kuunganishwa kwa kuchoma tena, unaufanya kuwa chaguo bora kwa uzalishaji wa wingi na wa gharama nafuu.
2. Uchambuzi wa kina wa Vigezo vya Kiufundi
Kuelewa kwa kina vigezo vya umeme, mwanga na joto ni muhimu kwa muundo thabiti wa saketi na ushirikishaji wa mfumo. Isipokuwa imeelezwa vinginevyo, vipimo vyote vinafafanuliwa kwa joto la mazingira (Ta) la 25°C.
2.1 Viwango vya Juu Kabisa
Absolute Maximum Ratings hufafanua mipaka ya mkazo ambayo inaweza kusababisha uharibifu wa kudumu wa kifaa. Hizi sio hali za uendeshaji.
- Power Dissipation (Pd):75 mW. This is the maximum power that the LED package can dissipate as heat. Exceeding this limit may cause thermal damage to the semiconductor junction and the epoxy lens.
- DC Forward Current (IF):30 mA. The maximum continuous forward current that can be applied. For pulsed operation, a peak forward current of up to 80 mA is permitted under specific conditions (1/10 duty cycle, 0.1ms pulse width).
- Forward Current Derating:Linear derating of 0.4 mA/°C starting from 25°C. This is a key parameter for thermal management. When the ambient temperature exceeds 25°C, the maximum allowable continuous current must be reduced. For example, at 50°C, the maximum current is 30 mA - [0.4 mA/°C * (50-25)°C] = 20 mA.
- Reverse Voltage (VR):5 V. Applying a reverse bias exceeding this value may cause junction breakdown.
- Operating and Storage Temperature Range:-55°C hadi +85°C. Upeo huu mpana unahakikisha uimara katika mazingira magumu.
- Uvumilivu wa joto la kulehemu:Kifaa hiki kinaweza kustahimili kulehemu kwa wimbi la 260°C kwa sekunde 5, kulehemu kwa kujirudisha kwa infrared ya 260°C kwa sekunde 5, na kulehemu kwa kujirudisha kwa mvuke ya 215°C kwa dakika 3. Vigezo hivi ni muhimu kwa kufafanua dirisha la mchakato wa usanikishaji.
2.2 Electrical and Optical Characteristics
These parameters define the typical performance of the LED under normal operating conditions.
- Luminous Intensity (Iv):At a test current (IF) of 2 mA, the range is from a minimum of 1.80 mcd to a maximum of 11.2 mcd. The intensity of a specific unit is determined by its binning code (see Section 3). Measurement is performed using a sensor filtered to approximate the CIE photopic response curve.
- Viewing Angle (2θ1/2):130 degrees. This is the full angle at which the luminous intensity drops to half of its value on the central axis (0 degrees). Such a wide viewing angle is suitable for applications requiring broad, diffuse illumination rather than a focused beam.
- Peak Wavelength (λP):639 nm. This is the wavelength at which the spectral power output reaches its maximum. It defines the perceived hue of the red light.
- Dominant Wavelength (λd):629 nm. Derived from the CIE chromaticity diagram, this is the single wavelength that best represents the color perceived by the human eye. For red AlInGaP LEDs, it is typically slightly shorter than the peak wavelength.
- Spectral line half-width (Δλ):20 nm. This indicates the spectral purity or bandwidth of the emitted light. A smaller value signifies better monochromaticity of the light source.
- Forward voltage (VF):At IF = 2 mA, it ranges from 1.60 V to 2.20 V. This is the voltage drop across the LED during operation. It is crucial for designing current-limiting circuits. This variation stems from normal semiconductor manufacturing tolerances.
- Reverse Current (IR):At VR = 5 V, it is a maximum of 10 µA. This is the small leakage current that flows when the device is reverse-biased within its maximum ratings.
- Capacitance (C):At VF = 0V, f = 1 MHz, the typical value is 40 pF. This parasitic capacitance may be relevant in high-frequency switching applications.
- ESD Threshold (HBM):1000 V. This Human Body Model rating indicates the LED's sensitivity to electrostatic discharge. It is classified as moderately sensitive; proper ESD handling procedures must be followed.
3. Mfumo wa Uainishaji Maelezo
Ili kudhibiti tofauti za asili katika utengenezaji wa semiconductor, LED hutengwa kwa makundi kulingana na utendaji. LTST-C193KRKT-2A hutumia mfumo wa kugawanya makundi hasa kwa nguvu ya mwanga.
Nguvu hupimwa chini ya hali ya kawaida ya majaribio IF = 2 mA. Sehemu hutengwa katika makundi yafuatayo:
- Bin G:1.80 mcd (minimum) to 2.80 mcd (maximum)
- Bin H:2.80 mcd to 4.50 mcd
- J Grade:4.50 mcd to 7.10 mcd
- K Grade:7.10 mcd to 11.20 mcd
The limits for each grade incorporate a +/-15% tolerance. This binning allows designers to select LEDs with a guaranteed minimum brightness for their application, ensuring consistency in the final product's appearance, especially when multiple LEDs are used side-by-side. For critical color matching applications, it is recommended to consult the manufacturer for specific chromaticity binning information, as this datasheet primarily details the intensity binning.
4. Uchambuzi wa Mkunjo wa Utendaji
Although datasheets provide tabular data, understanding the relationship between parameters through characteristic curves is crucial for robust design.
4.1 Forward Current vs. Forward Voltage (I-V Curve)
The relationship between forward current (IF) and forward voltage (VF) is nonlinear and exponential, which is a typical characteristic of diodes. The VF range of 1.6V-2.2V specified at 2mA in the datasheet provides a key operating point. Designers must note that for a given current, VF decreases as temperature increases, which, if not properly considered, may affect the current drawn in simple resistor current-limiting circuits.
4.2 Luminous Intensity vs. Forward Current
Katika safu ya kawaida ya uendeshaji, pato la mwanga (nguvu ya mwanga) ni sawia na mkondo wa mbele. Hata hivyo, ufanisi (lumeni kwa kila watt) unaweza kufikia kilele katika thamani fulani ya mkondo, kisha kupungua kutokana na athari za joto na umeme. Kufanya kazi kwenye mkondo wa DC uliopendekezwa au chini yake kuhakikisha ufanisi bora na maisha ya huduma.
4.3 Utegemezi wa Joto
Utendaji wa LED unaathiriwa kwa kiasi kikubwa na joto. Athari kuu ni pamoja na:
- Luminous intensity:Output decreases as junction temperature rises. The derating of forward current is directly related to managing this thermal effect to maintain brightness and reliability.
- Forward voltage:VF kawaida hupungua kwa kuongezeka kwa joto (mgawo hasi wa joto).
- Urefu wa wimbi:Urefu wa wimbi wa kilele na ule mkuu hubadilika kidogo kwa kuongezeka kwa joto (kwa kawaida kuelekea urefu mrefu zaidi), jambo linaloweza kuathiri mtazamo wa rangi katika matumizi magumu.
5. Mechanical and Packaging Information
5.1 Package Dimensions and Polarity
The LED is packaged in a very compact surface-mount device (SMD) package. Its defining mechanical characteristic is a height of only 0.35 mm. The datasheet provides a detailed dimensional drawing, including length, width, and the position of the optical lens. This package follows the standard chip LED form factor. Polarity is indicated by a marking or a notch on the package. Correct orientation during assembly is critical, as applying reverse bias may damage the device.
5.2 Recommended Pad Design
Ili kuhakikisha viunganisho salama vya kuuzwa na uelekezaji sahihi wakati wa upakiaji wa reflow, usanidi maalum wa pad (muundo wa pad) unapendekezwa. Vigezo hivi vinapewa katika maelezo ya spec. Kufuata muundo huu husaidia kuzuia matatizo kama vile "kujenga mnara" (kipengee kinainuka kutoka kwenye pad upande mmoja) au kupotoka. Unene wa stensi uliopendekezwa wa 0.10mm upeo umeainishwa ili kudhibiti kiasi cha solder paste kinachowekwa.
6. Soldering and Assembly Guide
6.1 Mkunjo wa Uchomeaji wa Reflow
Mwongozo huo unatoa mikunjo miwili ya pendekezo ya uchimbaji wa reflow wa infrared (IR): moja kwa mchakato wa kawaida wa uchimbaji (tin-lead) na nyingine kwa mchakato wa uchimbaji usio na risasi. Mkunjo usio na risasi kwa kawaida una kiwango cha juu cha joto (k.m. 260°C) ili kukabiliana na kiwango cha juu cha kuyeyuka cha aloi zisizo na risasi kama vile SAC (tin-silver-copper). Mikunjo yote miwili inajumuisha vigezo muhimu:
- Joto la awali/Kuongezeka kwa joto:A controlled heating phase that gradually increases the temperature of the circuit board and components, minimizing thermal shock and preventing solder paste splatter.
- Soaking/Pre-reflow:A temperature plateau stage that activates the flux in the solder paste, allows volatiles to escape, and equalizes the temperature across the entire assembly.
- Reflow/Peak:The temperature exceeds the solder's liquidus, causing it to melt, wet the pads and component terminations, and form a proper metallurgical bond. The Time Above Liquidus (TAL) and peak temperature must be controlled within the LED's tolerance range (maximum 260°C for 5 seconds).
- Cooling:Mchakato wa kupoza unaodhibitiwa, unaowasha sehemu ya mshono na kupunguza kwa kiwango cha juu mkazo wa joto.
6.2 Mazingatio ya Uhifadhi na Usindikaji
Uhifadhi sahihi ni muhimu sana kudumisha uwezo wa kuuziwa. LED zilizotolewa kutoka kwenye mfuko asilia wa kuzuia unyevunyevu zina tabia ya kunyonya unyevunyevu na hivyo kunyonya unyevu. Ikiwa zitawekwa nje ya mfuko huu wa kukausha kwa muda mrefu (zaidi ya saa 672 au siku 28), lazima zipikwe kabla ya mchakato wa reflow (kwa mfano, kwa joto la 60°C kwa saa 24) ili kuondoa unyevu na kuzuia tukio la "popcorn" au ufa wa kifurushi wakati wa mchakato wa kuuzia kwa joto la juu. Kwa uhifadhi wa muda mrefu, tumia chombo kilichofungwa kwa usawa chenye dawa ya kukausha au mazingira ya nitrojeni.
6.3 Usafishaji
Ikiwa unahitaji kusafisha baada ya kuchomea, tumia tu vilainishi vilivyobainishwa. Uainishaji unapendekeza kuzamishwa kwenye ethanol au isopropanol kwa si zaidi ya dakika moja kwa joto la kawaida. Matumizi ya kemikali kali au zisizobainishwa yanaweza kuharibu nyenzo za lenzi za epoxy, na kusababisha kuwa na ukungu, kuvunjika au kubadilisha rangi.
7. Ufungaji na Taarifa za Kuagiza
LTST-C193KRKT-2A is supplied in industry-standard packaging suitable for automated assembly.
- Tape and Reel:Components are placed in embossed carrier tape and then sealed with cover tape. The carrier tape width is 8mm.
- Reel dimensions:Diameter 7 inches.
- Quantity per reel:5000 pieces.
- Minimum Order Quantity (MOQ):Remaining quantity is 500 pieces.
- Kigezo cha Ufungaji:Inakidhi viwango vya ANSI/EIA-481-1-A, kuhakikisha utangamano na vifaa vya kawaida vya usambazaji kwenye mashine ya kushona vipande.
Nambari ya sehemu LTST-C193KRKT-2A yenyewe inaweka sifa maalum za bidhaa, ingawa maelezo kamili ya mkataba wa kutaja majina kwa kawaida hupatikana katika mwongozo tofauti wa uteuzi wa bidhaa.
8. Mapendekezo ya Ubunifu wa Matumizi
8.1 Ubunifu wa Saketi ya Kuendesha
LED ni kifaa kinachoendeshwa na mkondo. Sehemu muhimu zaidi ya saketi ya kuendesha ni udhibiti wa mkondo. Upinzani wa mfululizo ndio njia ya kawaida zaidi, lakini usanifu wake unahitaji uangalifu.
Kuhesabu upinzani wa mfululizo (RS):
RS= (Vchanzo- VF) / IF
Where:
Vchanzo= Power supply voltage
VF= LED forward voltage (for conservative design, use the maximum value 2.2V from the datasheet)
IF= Required forward current (must be ≤ 30 mA DC)
Example:For a 5V power supply and a target current of 20 mA:
RS= (5V - 2.2V) / 0.020 A = 140 Ω. The closest standard value (e.g., 150 Ω) will be selected, which results in a slightly lower current.
Important Consideration – Parallel Connection:It is not recommended to directly connect multiple LEDs in parallel using only one current-limiting resistor (Circuit B in the datasheet). Due to natural variations in the I-V characteristics of individual LEDs (even from the same bin), one LED may draw significantly more current than others, leading to uneven brightness and potential overloading of a single device. The recommended practice is to use a separate series resistor for each LED (Circuit A). For efficiently driving multiple LEDs, constant-current driver ICs or dedicated LED driver circuits are preferred.
8.2 Thermal Management
Ingawa nguvu ni ya chini, usimamizi bora wa joto ni muhimu kwa kuongeza maisha na utendakazi thabiti. Katika miundo ambapo joto la mazingira karibu na LED linatarajiwa kupanda sana (k.m., ndani ya kifuniko kilichofungwa, karibu na vipengele vingine vinavyotoa joto), lazima kutumie kipengele cha kupunguza cha 0.4 mA/°C. Kuhakikisha mtiririko wa hewa wa kutosha au muundo wa upitishaji joto katika mpangilio wa PCB husaidia kupunguza kupanda kwa joto.
8.3 ESD Protection
Kwa kuwa kizingiti cha ESD ni 1000V (HBM), LED hii inaweza kuharibika kwa urahisi na kutokwa kwa umeme wa kawaida. Utekelezaji wa hatua za ulinzi dhidi ya ESD ni lazima:
- Tumia kituo cha kazi kilichogunduliwa, mkeka wa sakafu unaoendesha umeme na mkanda wa mkono.
- Hifadhi na usafirishe vipengele kwenye mfuko wa kinga dhidi ya umeme tuli.
- If the LED is connected to an external interface that may be exposed to ESD events, consider adding a Transient Voltage Suppression (TVS) diode or other protection circuits on the PCB.
9. Ulinganishi wa Kiufundi na Tofauti
The LTST-C193KRKT-2A primarily stands out in the market due to its ultra-thin profile of 0.35mm. Compared to standard chip LEDs, which typically have heights of 0.6mm or 1.0mm, this represents a reduction of 40-65%, enabling new industrial design possibilities. The use of AlInGaP technology offers advantages over older GaAsP (Gallium Arsenide Phosphide) red LEDs, providing higher efficiency (more light output per mA), better temperature stability, and a more saturated, "purer" red color. Its compatibility with lead-free, high-temperature reflow processes makes it compliant with regulatory requirements and modern production lines, giving it a forward-looking advantage.
10. Maswali Yanayoulizwa Mara kwa Mara (FAQ)
Q1: Naweza kudhibiti LED hii moja kwa moja kwa kutumia pini ya 3.3V ya microcontroller?
A: Inawezekana, lakini inahitaji kuhesabiwa. Kwa VF ya kawaida ya takriban 1.9V, unahitaji upinzani wa mfululizo ili kudhibiti mkondo. Hata hivyo, lazima uhakikishe pini ya MCU inaweza kutoa mkondo unaohitajika (mfano 20mA), na usizidi vipimo vyake mwenyewe. Kutumia transistor kama swichi kwa kawaida ni njia salama zaidi na rahisi zaidi.
Q2: Kwa nini nguvu ya mwanga imebainishwa kwa mkondo mdogo sana (2mA)?
A: 2mA ni hali ya kawaida ya majaribio ya LED ya kiashiria cha mkondo mdogo. Ni rahisi kwa kulinganisha kati ya bidhaa tofauti, na hutoa kigezo cha msingi. Nguvu itakuwa kubwa zaidi kwa mikondo ya juu, lakini uhusiano sio mstari kabisa, na ufanisi unaweza kupungua.
Q3: Spec sheet inaonyesha pembe ya mtazamo pana (130°). Nini kama nahitaji boriti ya mwanga iliyolengwa zaidi?
A: Denna specifika förpackning är designad för vidvinkelutsändning. För en smalare stråle behöver du välja en LED med en annan förpackning (t.ex. en med mindre lins eller inbyggd reflektor), eller använda externa sekundära optiska element som kollimeringslinser.
Q4: Hur tolkar man sorteringskoden vid beställning?
A: Specificera den intensitetsklass (G, H, J eller K) du behöver baserat på den lägsta ljusstyrkan din applikation kräver. Till exempel, om din design kräver minst 5.0 mcd, måste du beställa klass J (4.50-7.10 mcd) eller klass K (7.10-11.20 mcd). Att beställa "standardljusstyrka" kan resultera i vilken klass som helst, vilket kan leda till ojämn ljusstyrka i din produkt.
11. Mifano ya Uundaji na Matumizi Halisi
Example 1: Status Indicator Light on Portable Devices
In slim smartphones or tablets, the space behind the glass or plastic panel is extremely limited. The LED's 0.35mm height allows it to be placed directly on the main PCB under a thin light guide plate or diffusion film, indicating charging status, notification alerts, or serving as backlight for capacitive buttons without increasing the device's thickness.
Mfano 2: Nyuma ya Mwanga wa Kitufe cha Filamu Nyembamba
Kwa paneli za udhibiti wa viwanda au vifaa vya matibabu vyenye kibodi nyembamba, mwanga sawa chini ya kila kitufe ni muhimu sana. LED nyingi za LTST-C193KRKT-2A zinaweza kuwekwa kuzunguka ukingo wa paneli ya kubadilisha. Mtazamo wake mpana husaidia kuunda mwanga wa nyuma sawa katika eneo lote la vitufe. Njia ya kuendesha ambayo kila LED hutumia upinzani pekee yake inahakikisha kuwa vitufe vyote vina mwangaza thabiti, bila kuathiriwa na tofauti za VF.
Mfano 3: Ujumuishaji ndani ya Onyesho la Mipaka Nyembamba Sana
Moderni monitoorit ja televiisorid püüdlevad vaid mõne millimeetri laiuste raamide järele. See LED saab paigaldada paindlikule trükitud plaadile (FPC) piki kuva paneeli serva, et pakkuda ümbritsevat õhkkonna valgustust või peent toite indikaatorit, aidates saavutada stiilse ja esteetilise välimuse, ilma et kahjustaks õhukest silueti.
12. Ufupisho wa Kanuni za Teknolojia
LTST-C193KRKT-2A põhineb AlInGaP pooljuhttehnoloogial. See materjalide süsteem kasvatatakse epitaksiaalselt substraadile. Kui p-n ristmikule rakendatakse edasipinge, süstitakse elektronid ja augud aktiivpiirkonda, kus nad rekombineeruvad. AlInGaP-is vabastab see rekombinatsioon energia peamiselt footonite (valguse) kujul nähtava spektri punasest kollakasoranžini ulatuvas osas. Alumiiniumi, indiumi, galliumi ja fosfori spetsiifiline suhe võres määrab keelutsooni energia ja seega ka kiiratava valguse lainepikkuse. "Veeselge" lääts on tavaliselt valmistatud epoksüvaigust või silikoongummist, mis on läbipaistev kiirguse lainepikkusele, ja vormitud konkreetseks valguse väljundmustriks (antud juhul laia vaatenurgaga).
13. Mwelekeo na Maendeleo ya Sekta
Mwenendo wa LED za Kiashiria na Taa za Utendaji unaendelea kuelekea upungufu wa ukubwa, ufanisi bora zaidi, na ushirikiano mkubwa zaidi. Urefu wa kipengele hiki wa 0.35mm unawakilisha juhudi zinazoendelea za kukuza vifurushi nyembamba zaidi. Maendeleo ya baadaye yanaweza kujumuisha Chip Scale Package (CSP) nyembamba zaidi, ambapo chipi ya LED imesakinishwa moja kwa moja, bila ya vifurushi vya jadi vya plastiki. Kusukumwa na matumizi ya magari na viwanda, kufikia uaminifu wa juu zaidi na maisha marefu zaidi chini ya hali ya kazi ya joto la juu pia ni mwenendo wenye nguvu. Zaidi ya hayo, kwa matumizi ambapo mechi ya rangi ni muhimu sana, kama vile taa za nyuma za maonyesho na taa za majengo, mahitaji ya usawa kamili wa rangi na uvumilivu mgumu zaidi wa kugawanya yanaongezeka. Teknolojia ya msingi ya AlInGaP inaboreshwa kila wakati ili kuboresha ufanisi, na inatarajiwa kupunguza matumizi ya nishati kwa pato la mwanga fulani katika vizazi vijavyo vya bidhaa.
Ufafanuzi wa Istilahi za Vigezo vya LED
Ufafanuzi Kamili wa Istilahi za Teknolojia ya LED
I. Viashiria Muhimu vya Utendaji wa Kielektroniki na Mwanga
| Terminology | Unit/Representation | Layman's Explanation | Kwa Nini Ni Muhimu |
|---|---|---|---|
| Ufanisi wa Mwanga (Luminous Efficacy) | lm/W (lumens per watt) | The luminous flux emitted per watt of electrical power; the higher the value, the more energy-efficient. | It directly determines the energy efficiency rating of the luminaire and the electricity cost. |
| Mfereji wa Mwanga (Luminous Flux) | lm (lumeni) | Jumla ya mwanga unaotolewa na chanzo cha mwanga, unaojulikana kwa kawaida kama "mwangaza". | Huamua kama taa inatosha kuwa na mwangaza. |
| Pembe ya kuona mwanga (Viewing Angle) | ° (digrii), kama 120° | Pembe ambayo nguvu ya mwanga hupungua hadi nusu, inayoamua upana wa boriti ya mwanga. | Inayoathiri eneo la mwanga na usawa wake. |
| Joto la rangi (CCT) | K (Kelvin), kama 2700K/6500K | Joto la rangi ya mwanga, thamani ya chini inaelekea manjano/joto, thamani ya juu inaelekea nyeupe/baridi. | Huamua mazingira ya taa na matumizi yanayofaa. |
| Color Rendering Index (CRI / Ra) | Unitless, 0–100 | The ability of a light source to reproduce the true colors of objects, with Ra≥80 being preferable. | Inaathiri ukweli wa rangi, hutumika katika maeneo yenye mahitaji makubwa kama maduka makubwa, majumba ya sanaa. |
| Tofauti ya uvumilivu wa rangi (SDCM) | MacAdam ellipse steps, such as "5-step" | A quantitative indicator of color consistency; the smaller the step number, the better the color consistency. | Ensure no color difference among luminaires from the same batch. |
| Mdomo Mkuu (Dominant Wavelength) | nm (nanomita), k.m. 620nm (nyekundu) | Wavelength values corresponding to the colors of colored LEDs. | Determines the hue of monochromatic LEDs such as red, yellow, and green. |
| Spectral Distribution | Mkunjo wa Urefu wa Mawimbi dhidi ya Ukubwa | Inaonyesha usambazaji wa ukubwa wa mwanga unaotolewa na LED katika urefu wa mawimbi tofauti. | Inapotosha uhalisia wa rangi na ubora wa rangi. |
II. Vigezo vya Umeme
| Terminology | Ishara | Layman's Explanation | Mazingatio ya Ubunifu |
|---|---|---|---|
| Forward Voltage (Forward Voltage) | Vf | The minimum voltage required to light up an LED, similar to a "starting threshold". | The driving power supply voltage must be ≥ Vf; the voltages add up when multiple LEDs are connected in series. |
| Mwendo wa Mbele (Forward Current) | If | The current value that makes the LED emit light normally. | Constant current drive is often used, as the current determines brightness and lifespan. |
| Maximum Pulse Current | Ifp | Kilele cha mkondo kinachoweza kustahimili kwa muda mfupi, kinachotumika kwa kudimisha au kumulika kwa taa. | Upanaaji wa upana wa msukumo na uwiano wa kazi lazima udhibitiwe kwa uangalifu, vinginevyo kunaweza kuharibika kwa joto kupita kiasi. |
| Reverse Voltage | Vr | Upeo wa voltage ya nyuma ambayo LED inaweza kustahimili, inapozidi inaweza kuharibika. | Katika mzunguko, ni muhimu kuzuia kuzingirwa kwa njia tofauti au mshtuko wa voltage. |
| Upinzani wa Joto (Thermal Resistance) | Rth (°C/W) | Upinzani wa joto unaposogea kutoka kwenye chip hadi kwenye sehemu ya kuunganishia, thamani ya chini inaonyesha usambazaji bora wa joto. | Upinzani wa juu wa joto unahitaji muundo wa nguvu zaidi wa usambazaji joto, vinginevyo joto la kiungo litaongezeka. |
| ESD Immunity | V (HBM), kama 1000V | Uwezo wa kukabiliana na mshtuko wa umeme wa tuli, thamani ya juu zaidi inaonyesha uwezo mkubwa wa kuepusha uharibifu. | Katika uzalishaji, ni muhimu kuchukua hatua za kinga dhidi ya umeme wa tuli, hasa kwa LED zenye usikivu mkubwa. |
III. Thermal Management and Reliability
| Terminology | Key Indicators | Layman's Explanation | Athari |
|---|---|---|---|
| Joto la Kiungo (Junction Temperature) | Tj (°C) | Halisi ya joto la kufanya kazi ndani ya chip ya LED. | Kwa kila kupungua kwa 10°C, maisha yanaweza kuongezeka mara mbili; joto la juu sana husababisha kupungua kwa mwanga na kuhamia kwa rangi. |
| Lumen Depreciation | L70 / L80 (hours) | The time required for the brightness to drop to 70% or 80% of its initial value. | Kufafanua moja kwa moja "maisha ya huduma" ya LED. |
| Lumen Maintenance | % (e.g., 70%) | The percentage of remaining brightness after a period of use. | Characterizes the ability to maintain brightness after long-term use. |
| Mabadiliko ya rangi (Color Shift) | Δu′v′ au MacAdam ellipse | Kiwango cha mabadiliko ya rangi wakati wa matumizi. | Huathiri uthabiti wa rangi katika eneo la taa. |
| Thermal Aging | Kupungua kwa Utendaji wa Nyenzo | Uharibifu wa nyenzo za kufunga kwa sababu ya joto la juu kwa muda mrefu. | Inaweza kusababisha kupungua kwa mwangaza, mabadiliko ya rangi au kushindwa kwa mzunguko wazi. |
Nne. Ufungaji na Nyenzo
| Terminology | Aina za Kawaida | Layman's Explanation | Sifa na Matumizi |
|---|---|---|---|
| Aina ya Ufungaji | EMC, PPA, Ceramic | A housing material that protects the chip and provides optical and thermal interfaces. | EMC offers good heat resistance and low cost; ceramic provides superior heat dissipation and long lifespan. |
| Muundo wa Chip | Usakinishaji wa Kawaida, Usakinishaji wa Kichwa-chini (Flip Chip) | Chip electrode arrangement method. | Flip-chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications. |
| Phosphor coating. | YAG, silicate, nitride | Coated on the blue LED chip, partially converted to yellow/red light, mixed to form white light. | Different phosphors affect luminous efficacy, color temperature, and color rendering. |
| Lens/Optical Design | Planar, microlens, total internal reflection | The optical structure on the packaging surface controls the light distribution. | Determines the emission angle and light distribution curve. |
V. Udhibiti wa Ubora na Uainishaji
| Terminology | Yaliyomo katika Uainishaji | Layman's Explanation | Kusudi |
|---|---|---|---|
| Kugawanya kwa mwanga | Msimbo kama 2G, 2H | Group by brightness level, each group has a minimum/maximum lumen value. | Ensure consistent brightness for products within the same batch. |
| Voltage binning | Codes such as 6W, 6X | Grouped by forward voltage range. | Inafaa kwa usawazishaji wa chanzo cha umeme, kuongeza ufanisi wa mfumo. |
| Kugawanya kwa makundi kulingana na rangi | 5-step MacAdam ellipse | Group by color coordinates to ensure colors fall within an extremely small range. | Ensure color consistency to avoid color unevenness within the same luminaire. |
| Kugawa joto | 2700K, 3000K, n.k. | Pangwa kulingana na joto la rangi, kila kikundi kina anuwai maalum ya kuratibu. | Kukidhi mahitaji ya joto la rangi katika hali mbalimbali. |
Sita, Uchunguzi na Uthibitishaji
| Terminology | Standard/Test | Layman's Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumens Maintenance Test | Long-term operation under constant temperature conditions, recording luminance attenuation data. | For projecting LED lifetime (in conjunction with TM-21). |
| TM-21 | Lifetime projection standard | Projecting lifespan under actual use conditions based on LM-80 data. | Providing scientific life prediction. |
| IESNA Standard | Illuminating Engineering Society Standard | Covers optical, electrical, and thermal testing methods. | Msingi wa upimaji unaokubaliwa na tasnia. |
| RoHS / REACH | Uthibitisho wa Mazingira | Hakikisha bidhaa hazina vitu hatari (kama risasi, zebaki). | Masharti ya kuingia kwenye soko la kimataifa. |
| ENERGY STAR / DLC | Uthibitisho wa ufanisi wa nishati | Certification for energy efficiency and performance of lighting products. | Commonly used in government procurement and subsidy programs to enhance market competitiveness. |