LTST-C193KGKT-2A SMD LED Datasheet - Size 1.6x0.8x0.35mm - Voltage 1.6-2.2V - Green - Technical Documentation

1. Product Overview

LTST-C193KGKT-2A is a surface-mount device (SMD) chip LED designed specifically for modern space-constrained electronic applications. Its primary function is to provide a reliable and bright green light source. The core advantage of this component lies in its ultra-thin profile of only 0.35 mm, making it exceptionally suitable for applications where vertical space is extremely valuable, such as ultra-thin displays, mobile devices, and wearable technology. It utilizes AlInGaP (aluminum indium gallium phosphide) semiconductor material for the light-emitting region, a material renowned for producing high-efficiency light in the green to amber spectral range. The device is supplied on industry-standard 8 mm carrier tape wound on 7-inch reels, ensuring compatibility with high-speed automatic pick-and-place assembly equipment. It is classified as a green product and complies with the RoHS (Restriction of Hazardous Substances) directive.

2. In-depth Interpretation of Technical Parameters

2.1 Viwango vya Juu Kabisa

These ratings define the stress limits that may cause permanent damage to the device. Operation under conditions at or beyond these limits is not guaranteed.

• Power Dissipation (Pd):75 mW. This is the maximum power that the LED package can dissipate as heat when the ambient temperature (Ta) is 25°C. Exceeding this value may cause overheating and shorten the service life.
• DC Forward Current (IF):30 mA. The maximum continuous current that can be applied to the LED.
• Peak Forward Current:80 mA, but only under pulse conditions (1/10 duty cycle, 0.1ms pulse width). This allows for higher brightness in a short time without causing thermal damage.
• Derating:Kwa kila ongezeko la joto la mazingira kwa 1°C zaidi ya 25°C, mkondo wa juu wa mbele lazima upunguzwe kwa mstari kwa 0.4 mA. Hii ni muhimu kwa usimamizi wa joto katika mazingira ya joto la juu.
• Voltage ya nyuma (VR):5 V. Kutumia voltage ya nyuma ya juu kuliko hii inaweza kusababisha kushindwa kwa ghafla kwa kiungo cha LED.
• Masafa ya joto ya uendeshaji na uhifadhi:-55°C to +85°C. The device is rated for operation and storage over this wide industrial temperature range.
• Soldering Temperature Tolerance:The LED can withstand up to 5 seconds of wave or infrared reflow soldering at 260°C and up to 3 minutes of vapor phase soldering at 215°C. This defines its compatibility with common PCB assembly processes.

2.2 Tabia za Umeme na Mwanga

These are typical performance parameters measured at Ta=25°C and a standard test current (IF) of 2mA (unless otherwise specified).

• Luminous Intensity (Iv):Anuwai kutoka kiwango cha chini cha 1.80 mcd hadi kiwango cha juu cha 11.2 mcd. Thamani halisi ya kipimo ya kitengo maalum inategemea msimbo wa kikundi kilichogawiwa (angalia Sehemu ya 3). Kipimo cha mwangaza kinatumia kichujio kinachokaribia mkunjo wa majibu ya kuona ya wazi ya jicho la mwanadamu.
• Pembe ya Mtazamo (2θ1/2):Digrii 130. Hii ni pembe pana sana ya mtazamo, ikimaanisha kuwa mionzi ya mwanga imetawanyika katika eneo pana, badala ya mwale nyembamba. Pembe hii inafafanuliwa kama mahali ambapo mwangaza wa mwanga hupungua hadi nusu ya thamani yake ya mhimili (digrii 0).
• Peak Emission Wavelength (λP):574 nm. This is the specific wavelength at which the LED emits the most optical power.
• Dominant Wavelength (λd):Inapokua kutoka 564.5 nm hadi 573.5 nm. Hii ni urefu wa wimbi moja unaotambuliwa na jicho la binadamu na unaofafanua rangi (kijani katika mfano huu). Inatokana na pato la wigo kamili na chati ya rangi ya CIE. Viwango maalum vinafafanuliwa ndani ya safu hii.
• Upana wa nusu ya mstari wa wigo (Δλ):15 nm. Hii inaashiria usafi wa wigo au upana wa ukanda wa mwanga unaotolewa. Thamani ndogo inaonyesha umoja bora wa rangi (usafi wa rangi) wa chanzo cha mwanga.
• Voltage ya mbele (VF):At IF=2mA, the range is from 1.60 V to 2.20 V. This is the voltage drop across the LED when it is conducting current. It is a key parameter for designing current-limiting circuits.
• Reverse Current (IR):At VR=5V, maximum 10 μA. This is the small leakage current that flows when the LED is reverse-biased within its maximum ratings.
• Capacitance (C):Measured 40 pF at 0V bias and 1 MHz. This parasitic capacitance may be relevant in high-frequency switching applications.
• Electrostatic Discharge (ESD) Threshold (HBM):1000 V (Human Body Model). This indicates a medium level of ESD sensitivity. Proper ESD handling procedures must be followed to prevent potential or immediate damage.

3. Grading System Description

To ensure consistency in mass production, LEDs are sorted into different performance bins based on key parameters. This allows designers to select components that meet the brightness and color requirements of specific applications.

3.1 Luminous Intensity Binning

Based on the luminous intensity measured at 2mA, the units are divided into four bins (G, H, J, K). Each bin has a minimum and maximum value, with a tolerance of +/-15% for each intensity bin.

• Bin G:1.80 - 2.80 mcd
• Gear H:2.80 - 4.50 mcd
• Gear J:4.50 - 7.10 mcd
• Gear K:7.10 - 11.20 mcd

3.2 Dominant Wavelength Binning

Units are also grouped into three bins (B, C, D) based on their dominant wavelength, which defines the precise hue of green. The tolerance for each bin is +/- 1 nm.

• Gear B:564.5 - 567.5 nm
• Gear C:567.5 - 570.5 nm
• Bin D:570.5 - 573.5 nm

The complete part number (e.g., LTST-C193KGKT-2A) includes these bin codes for precise selection. "K" indicates the intensity bin, and the following letter (implied in the datasheet example) indicates the wavelength bin.

4. Uchambuzi wa Mkunjo wa Utendaji

Ingawa maelezo ya kiufundi yanarejelea mikunjo maalum ya michoro (Mchoro 1, Mchoro 6), tabia yake ya kawaida inaweza kuelezewa kulingana na maelezo ya kiufundi.

4.1 Mkondo wa Mbele dhidi ya Voltage ya Mbele (Mkunjo wa I-V)

AlInGaP LEDs exhibit a characteristic I-V curve, with a forward voltage (VF) in the range of 1.6-2.2V at low current (2mA). As the forward current increases, VF increases logarithmically. This nonlinear relationship is why LEDs must be driven by a constant current source or with a series current-limiting resistor, and cannot be driven by a constant voltage source.

4.2 Luminous Intensity vs. Forward Current

Katika safu kubwa ya uendeshaji, pato la mwanga (nguvu ya mwangaza) ni takriban sawia na mkondo wa mbele. Hata hivyo, kwenye mikondo ya juu sana, ufanisi hupungua kwa sababu ya ongezeko la joto (athari ya kupungua kwa ufanisi). Mkondo wa kawaida wa DC wa 30mA hufafanua sehemu salama ya uendeshaji kudumisha ufanisi na maisha ya huduma.

4.3 Tabia za Joto

Voltage ya mbele ya LED (VF) ina mgawo hasi wa joto, ambayo inamaanisha kuwa hupungua kadri halijoto ya kiungo kinavyoongezeka. Kinyume chake, ukali wa mwanga na urefu wa wimbi kuu pia hubadilika na halijoto; kwa kawaida, ukali hupungua, na urefu wa wimbi unaweza kuongezeka kidogo (kuhama kwekundu). Vipimo vya kupunguza mzigo (0.4 mA/°C) ni matokeo ya moja kwa moja ya kusimamia athari hizi za joto.

5. Taarifa za Mitambo na Ufungaji

5.1 Package Dimensions

This LED adopts the EIA standard chip package outline. Key dimensions include a length of 1.6mm, a width of 0.8mm, and a critical height of 0.35mm. Unless otherwise specified, all dimensional tolerances are typically ±0.10mm. The package utilizes a water-clear lens, which does not alter the color of the underlying AlInGaP chip, allowing the intrinsic green light to pass through.

The datasheet includes the recommended PCB design solder pad layout (land pattern). Adhering to this layout is crucial for achieving reliable solder joints and proper alignment during the reflow soldering process. The LED itself has anode and cathode markings (typically a notch, bevel, or dot near the cathode). Care must be taken to ensure correct polarity during assembly, as reverse connection will cause the device to not function and may damage it if the reverse voltage rating is exceeded.

5.3 Carrier Tape and Reel Packaging

Components are supplied in 8mm wide embossed carrier tape, wound on 7-inch (178mm) diameter reels. Each reel contains 5000 pieces. The packaging conforms to the ANSI/EIA 481-1-A-1994 standard, ensuring compatibility with automatic feeders. The carrier tape is covered to protect components from contamination. The specification allows for a maximum of two consecutive missing components, with a minimum package quantity of 500 pieces for the remaining reel.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Temperature Profile

The datasheet provides recommended infrared (IR) reflow soldering temperature profiles for both conventional (SnPb) and lead-free (SnAgCu) soldering processes. Key parameters include:

Preheating:

• Gradually increase the temperature to the wetting temperature (e.g., 120-150°C) to activate the flux and minimize thermal shock.Peak Temperature:
• Haipaswi kuzidi 260°C. Muda unaozidi mstari wa kioevu (takriban 217°C kwa ala isiyo na risasi) na muda kwenye kiwango cha juu cha joto lazima udhibitiwe ili kuzuia uharibifu wa kifuniko cha plastiki cha LED na viunganisho vya ndani vya waya. Inapendekezwa muda usiozidi sekunde 5 kwenye 260°C.Kasi ya kupoa:
• Hatua ya kupoa iliyodhibitiwa pia ni muhimu kwa uaminifu wa mwunganisho wa ala.6.2 Wave Soldering and Hand Soldering

For wave soldering, it is recommended to preheat to a maximum of 100°C for up to 60 seconds, with a solder wave peak at a maximum of 260°C for up to 10 seconds. For manual repair using a soldering iron, the tip temperature should not exceed 300°C, and the contact time per solder joint should be limited to within 3 seconds, and only once, to prevent excessive heat transfer.

6.3 Cleaning

If cleaning is required after soldering, only specified alcohol-based solvents, such as ethanol or isopropanol, should be used. LEDs should be immersed at room temperature for less than one minute. Unspecified chemical cleaners may damage the epoxy lens or packaging material.

6.4 Uhifadhi na Uchakataji

LED inapaswa kuhifadhiwa katika mazingira yasiyozidi 30°C na unyevu wa jamaa wa 70%. Mara tu inapotolewa kwenye mfuko wa asili wa kuzuia unyevu, kipengele kinapaswa kuchomelewa reflow ndani ya saa 672 (siku 28) ili kuepuka kunyonya unyevu, ambayo kunaweza kusababisha "popcorn" wakati wa uchomeleaji reflow. Kwa uhifadhi wa muda mrefu zaidi nje ya mfuko wa asili, lazima ihifadhiwe kwenye chombo kilichofungwa chenye driers au katika mazingira ya nitrojeni. Ikiwa imehifadhiwa zaidi ya saa 672, inahitaji kukaushwa kwenye 60°C kwa angalau saa 24 kabla ya kusanyiko ili kuondosha unyevu.

7. Mapendekezo ya Matumizi

7.1 Typical Application Scenarios

This ultra-thin, bright green LED is ideal for:

Kiashiria cha hali:

• Viashiria vya umeme, muunganisho au hali katika vifaa vya matumizi ya kawaida (simu janja, kompyuta kibao, kompyuta ya mkononi, vifaa vinavyovaliwa).Backlighting:
• Edge lighting for ultra-thin display panels or keyboard illumination.Automotive interior lighting:
• Dash indicator lights, switch backlighting (in space-limited areas).Industrial control panels:
• Status and fault indicator lights on control units and human-machine interfaces (HMI).7.2 Design Considerations

Kuendesha kwa mkondo:

• LED is a current-driven device. To ensure uniform brightness when multiple LEDs are used in parallel, an independent current-limiting resistor must be connected in series with each LED (Circuit Model A). It is not recommended to directly connect LEDs in parallel (Circuit Model B), as differences in their forward voltage (VF) will lead to uneven current distribution and thus uneven brightness.Usimamizi wa Joto:
• Hata kwa matumizi ya nguvu ya chini, mpangilio sahihi wa PCB kwa ajili ya upotezaji wa joto ni muhimu, hasa wakati wa kufanya kazi karibu na viwango vya juu vilivyopangwa au kwa halijoto ya juu ya mazingira. Fuata mkunjo wa kupunguza mkondo.Ulinzi wa ESD:
• Ikiwa LED iko katika eneo linalo wazi (k.m., kiashiria cha paneli ya mbele), tekeleza hatua za ulinzi wa ESD kwenye mzunguko. Daima fuata taratibu salama za usindikaji wa ESD wakati wa kusanyiko: tumia mkanda wa mkono uliowekwa ardhini, mkeka wa kuzuia umeme tuli, na vifaa vilivyowekwa ardhini kwa usahihi.8. Technical Comparison and Differentiation

Sababu kuu ya tofauti ya LTST-C193KGKT-2A ni

0.35 mm height和AlInGaP TechnologyCompared to traditional standard GaP (Gallium Phosphide) green LED technology, AlInGaP offers significantly higher luminous efficiency, resulting in brighter output at the same drive current. The ultra-thin profile is a key advantage over many standard chip LEDs (typically 0.6 mm or taller), enabling its use in the design of next-generation ultra-thin devices. Its compatibility with lead-free, high-temperature reflow soldering processes also makes it suitable for modern, RoHS-compliant production lines.9. Frequently Asked Questions (Based on Technical Specifications)

Q1: Can I drive this LED directly with a 3.3V or 5V logic power supply?

A: Hapana. Ni lazima utumie upinzani uliosanidiwa mfululizo kupunguza mkondo. Kwa mfano, ukichukua chanzo cha 3.3V, na VF ya kawaida ya 1.9V kwenye 2mA, thamani ya upinzani inayohitajika ni R = (3.3V - 1.9V) / 0.002A = 700 ohms. Daima hesabu kwa kutumia VF ya juu zaidi, ili kuhakikisha mkondo hauzidi thamani unayotaka.
Q2: Kwa nini anuwai ya nguvu ya mwanga ni pana sana (1.8 hadi 11.2 mcd)?

A: Hii ni anuwai ya jumla ya usambazaji wa uzalishaji. Mfumo wa kugawa daraja (G, H, J, K) unakuruhusu uchague anuwai maalum na nyembamba zaidi ya mwangaza kwa matumizi yako, ili kuhakikisha usawa kati ya vitengo vyote katika bidhaa.
Q3: Je, LED hii inafaa kwa matumizi ya nje?

A: Anuwai ya halijoto ya uendeshaji (-55°C hadi +85°C) inasaidia mazingira mengi ya nje. Hata hivyo, ufungaji wa plastiki kwa muda mrefu unaweza kuwa rahisi kuharibika kwa mionzi ya ultraviolet na kuingia kwa unyevu. Kwa matumizi magumu ya nje, inapaswa kuzingatiwa kutumia LED zilizofungwa kwa nje na zilizothibitishwa maalum.
Q4: Nini kitatokea nikizidi kiwango cha voltage ya nyuma cha 5V?

A: The LED junction is highly likely to undergo avalanche breakdown, leading to immediate and permanent failure (open circuit or short circuit). It is essential to ensure the circuit design prevents reverse bias from exceeding this rated value.
10. Practical Design Case

Scene:

Design a status indicator light for a battery-powered IoT sensor module. The indicator must be very small, low-power, and clearly visible. Choose a green LED to indicate the "active/normal" status.Implementation Plan:

Component Selection:
1. LTST-C193KGKT-2A ilichaguliwa kwa sababu ya urefu wake wa 0.35mm na mwangaza mzuri chini ya mkondo mdogo.Ubunifu wa Saketi:
2. Moduli huu unatumia betri ya kifungo ya 3.0V. Ili kuokoa nguvu, imechaguliwa mkondo wa kuendesha wa 2mA. Imetumia muundo wa kihafidhina, ukifanya kazi na VF ya juu zaidi ya 2.20V: R = (3.0V - 2.20V) / 0.002A = 400 ohms. Inatumia kipingamizi cha kawaida cha 390 ohms.Mpangilio wa PCB:
3. Tumia vipimo vya pedi zinazopendekezwa kwenye maelezo ya ufundi. LED imewekwa karibu na ukingo wa bodi ili kuweza kuonekana. Epuka kuweka eneo kubwa la shaba ya udongo chini ya LED, ili kuzuia tatizo la kuvuta solder wakati wa upakiaji tena.Matokeo:
4. Kiashiria hiki hutoa mwangaza wa kutosha kwa matumizi ya chini ya nguvu (takriban 6mW kwa jumla ya LED na upinzani), na ufungashaji mwembamba unaofaa kwa ganda nyembamba la kifaa.11. Utangulizi wa Kanuni

The light emission in an AlInGaP LED is based on the phenomenon of electroluminescence in a semiconductor p-n junction. When a forward voltage is applied, electrons from the n-type region and holes from the p-type region are injected into the active region (quantum well). When an electron recombines with a hole, energy is released in the form of a photon. The specific wavelength (color) of this photon is determined by the bandgap energy of the AlInGaP alloy composition used in the active region. A wider bandgap produces light of shorter wavelength (bluer); the specific alloy for this LED is designed to produce green light with a peak around 574 nm. The chip is encapsulated with a water-clear epoxy resin lens, providing mechanical protection and helping to shape the light output into a wide viewing angle of 130 degrees.

12. Mwelekeo wa Maendeleo

Mwelekeo wa maendeleo ya chipu LED kwa matumizi ya elektroniki ya watumiaji na viwanda unaendelea kuelekea:

1. Kuboresha ufanisi (lm/W):
Uboreshaji endelevu wa sayansi ya nyenzo katika teknolojia za AlInGaP na InGaN (kwa nuru ya bluu/nyeupe) unachochea uzalishaji wa mwanga zaidi kwa kila kitengo cha pembejeo ya umeme, na hivyo kupunguza matumizi ya nguvu na uzalishaji wa joto.2. Miniaturization:
The pursuit of thinner and smaller devices demands LEDs with continuously decreasing footprint (XY dimensions) and critical height (Z dimension). The 0.35mm height of this LED represents this trend.3. Improved Color Consistency and Binning:
Tighter wavelength and intensity binning tolerances are becoming standard, enabling more uniform visual appearance in applications using multiple LEDs.4. Uimarishaji wa Uaminifu:
Uboreshaji wa nyenzo za kufunga (epoxy, silicone) ili kustahimili safu za joto za juu za reflow (kwa ajili ya usanikishaji bila risasi) na hali ngumu za mazingira.5. Ujumuishaji:
Ingawa LED tofauti bado ni muhimu, pia kuna mwelekeo wa kuelekea moduli za LED zilizounganishwa, ambazo hujumuisha madereva, vidhibiti, na rangi nyingi ndani ya kifurushi kimoja kwa matumizi ya taa zenye akili.While discrete LEDs remain vital, there is a parallel trend toward integrated LED modules with built-in drivers, controllers, and multiple colors in a single package for smart lighting applications.