334-15/T1 C3-2TVA LED Datasheet - T-1 3/4 Package - Max 3.6V - 30mA - White Light - Technical Documentation

1. Mchanganuo wa Bidhaa

本文档详细阐述了一款高亮度白光LED灯珠的技术规格。该器件采用InGaN半导体芯片和荧光粉转换系统，封装于业界通用的T-1 3/4圆形封装内。其主要设计目标是提供适用于各类指示灯及照明应用的高发光强度。本产品符合多项环境与安全标准，包括RoHS指令、欧盟REACH法规以及无卤要求（溴<900 ppm，氯<900 ppm，溴+氯<1500 ppm）。此外，其具备高达4KV（人体模型）的稳健抗静电能力。

2. Ufafanuzi wa Vigezo vya Kiufundi

2.1 Absolute Maximum Ratings

The operating limits of the device are defined under the ambient temperature condition of Ta=25°C. Exceeding these ratings may cause permanent damage.

• Continuous Forward Current (I_F):30 mA
• Peak Forward Current (I_FP):100 mA (Duty Cycle 1/10 @ 1KHz)
• Reverse Voltage (V_R):5 V
• Power Dissipation (P_d):110 mW
• Operating Temperature (T_opr):-40°C to +85°C
• Storage temperature (T_stg):-40°C to +100°C
• Electrostatic Discharge (Human Body Model):4000 V
• Zener reverse current (I_z):100 mA
• Welding temperature (T_sol):260°C for 5 seconds.

2.2 Electro-Optical Characteristics

Key performance parameters are measured at Ta=25°C and a standard test current I_F=20mA.

• Forward Voltage (V_F):Minimum 2.8V, typical --, maximum 3.6V. This parameter defines the voltage drop across the LED during operation.
• Zener Reverse Voltage (V_z):Typical 5.2V (at I_z=5mA condition), indicating it has integrated protection function.
• Reverse current (I_R):Maximum 50 µA (at V_R=5V condition).
• Luminous intensity (I_V):Minimum 7150 mcd, typical value --, maximum 14250 mcd. This is the primary indicator for measuring light output.
• Angle (2θ)_1/2):Typical value 30 degrees. This parameter defines the angular range within which the luminous intensity is not less than half of the peak value.
• Chromaticity coordinates (CIE 1931):Typical values x=0.26, y=0.27. This indicates that the white light output is located in a specific region on the chromaticity diagram.

3. Maelezo ya Mfumo wa Kugawa Daraja

To ensure consistency across production batches, LEDs are sorted into different bins based on key parameters.

3.1 Luminous Intensity Binning

LED imegawanywa_F=20mA, imegawanywa katika viwango vitatu (T, U, V), na uvumilivu wa kawaida ni ±10%.

• T grade:7150 mcd (minimum) to 9000 mcd (maximum)
• U grade:9000 mcd (minimum) to 11250 mcd (maximum)
• V bin:11250 mcd (minimum) to 14250 mcd (maximum)

3.2 Forward Voltage Binning

Forward voltage is divided into four codes (0, 1, 2, 3), with a measurement uncertainty of ±0.1V.

• Grade 0:2.8V (minimum) to 3.0V (maximum)
• Level 1:3.0V (minimum) to 3.2V (maximum)
• Level 2:3.2V (minimum) to 3.4V (maximum)
• Gear 3:3.4V (minimum) to 3.6V (maximum)

3.3 Color Binning

Color is defined within specific chromaticity coordinate boundaries. The specification references groups that combine specific grades (e.g., Group 1: A1+A0). Color grades A1 and A0 have defined coordinate boxes on the CIE 1931 chromaticity diagram, with a measurement uncertainty of ±0.01 for both x and y coordinates.

4. Performance Curve Analysis

Mwongozo una mikunjo mingi ya sifa, inayoelezea tabia ya kifaa chini ya hali tofauti.

• Nguvu ya Uhusiano vs. Urefu wa Wimbi:Inaonyesha usambazaji wa nguvu ya wigo wa mwanga mweupe, ambao ni mchanganyiko wa mionzi ya chini ya bluu ya InGaN na mionzi pana ya njano inayobadilishwa na fosforasi.
• Mchoro wa mwelekeo:Mchoro wa polar unaonyesha kwa urahisi pembe ya mtazamo ya kawaida ya digrii 30, ikionyesha jinsi nguvu ya mwanga inavyopungua kutoka kwa mhimili wa kati.
• Mkondo wa mbele dhidi ya Voltage ya mbele (Mkunjo wa I-V):It demonstrates an exponential relationship, which is crucial for designing current-limiting circuits.
• Relative Intensity vs. Forward Current:It shows how the light output increases with the drive current, which is important for brightness control and understanding efficiency.
• Chromaticity Coordinates vs. Forward Current:It indicates that the perceived color of white light may shift slightly with variations in operating current.
• Forward Current vs. Ambient Temperature:Inaelezea hali ya kupunguzwa kwa mkondo wa juu unaoruhusiwa unapoinuka halijoto ya mazingira, jambo muhimu kwa usimamizi wa joto.

5. Taarifa za Mitambo na Ufungashaji

Kifaa hiki kinatumia ufungaji wa kawaida wa duara T-1 3/4 (takriban 5mm), wenye pini mbili za axial. Maelezo muhimu ya vipimo yanajumuisha:

• All dimensions are in millimeters (mm).
• Unless otherwise specified, the general tolerance is ±0.25mm.
• Pin pitch is measured at the point where the pins exit the package body.
• The maximum resin protrusion under the flange is 1.5mm.
• The package drawing provides detailed dimensions for lens diameter, body length, pin length and diameter, and the mounting plane.

6. Mwongozo wa Uchomeaji na Usanikishaji

6.1 Uundaji wa Pini

• Sehemu ya kupinda lazima iwe umbali wa angalau 3mm kutoka chini ya taa ya epoxy.
• Umbo la pini linapaswa kukamilika kabla ya kuchomelea.
• Epuka kutumia mkazo kwenye kifuniko wakati wa kupinda, ili kuzuia uharibifu wa ndani au kuvunjika.
• Kata pinzi kwenye joto la kawaida; kukata kwenye joto la juu kunaweza kusababisha kushindwa.
• Hakikisha mashimo ya PCB yanalingana kikamilifu na pinzi za LED, ili kuepuka mkazo wa usakinishaji.

6.2 Storage

• Masharti yaliyopendekezwa ya uhifadhi: Joto ≤30°C, unyevunyevu wa hewa ≤70%.
• Uhai wa kawaida wa uhifadhi baada ya usafirishaji: Miezi 3.
• Kwa uhifadhi wa muda mrefu (hadi mwaka 1), tumia chombo kilichotiwa mabomba ya nitrojeni na kikaushi.
• Epuka mabadiliko ya ghafla ya joto katika mazingira yenye unyevu mwingi ili kuzuia umande.

6.3 Soldering

A minimum distance of at least 3mm must be maintained between the solder joint and the epoxy resin LED.

Manual Soldering:Upeo wa joto la chuma cha kulehemu ni 300°C (inatumika kwa chuma cha kulehemu chenye nguvu zaidi ya 30W), muda wa juu wa kulehemu ni sekunde 3.

Ulehemu wa wimbi/ulehemu wa kuzamishwa:Joto la juu la kukausha kabla ni 100°C (muda wa juu sekunde 60), joto la juu la chombo cha sindano ni 260°C, kwa sekunde 5.

7. Packaging and Ordering Information

7.1 Packaging Specifications

• Packaging Method:LEDs are placed in anti-static bags, then into inner boxes, and finally packed into master cartons.
• Packaging Quantity:200-500 pieces per bag. 5 bags per inner box. 10 inner boxes per master carton.

7.2 Labeling Instructions

Lebo ya ufungaji inajumuisha: Nambari ya Bidhaa ya Mteja (CPN), Nambari ya Bidhaa (P/N), Idadi (QTY), Ngazi ya Nguvu ya Mwanga na Voltage ya Mbele (CAT), Ngazi ya Rangi (HUE), Nambari ya Rejea (REF) na Nambari ya Kundi (LOT No.).

7.3 Upeaji Majina ya Bidhaa / Uundaji wa Nambari ya Sehemu

Nambari ya sehemu inafuata muundo ufuatao:334-15/T1C3- □ □ □ □Mraba tupu (□) ni kishika nafasi kinachotumiwa kujaza msimbo maalum wa kiwango unaohusiana na kikundi cha rangi, kiwango cha mwangaza na kikundi cha voltage, ili kuchagua kwa usahihi sifa za utendaji.

8. Mapendekezo ya Utumiaji

8.1 Mandhari ya Kawaida ya Utumizi

• Bodi ya Habari na Kiashiria cha Mwanga:Inapatikana kwa kuangaza kwa nguvu kwa kuonekana bora.
• Taa ya nyuma:Inafaa kwa paneli ndogo au alama za taa ya nyuma.
• Taa ya alama:Chaguo bora kwa kuonyesha hali au msimamo.

8.2 Design Considerations

• Kikomo cha mkondo:It is essential to use a series resistor or constant current driver to limit I_Fto 30mA or below.
• Thermal Management:Rejea curve ya kupunguza (mstari wa moja kwa moja dhidi ya joto la mazingira). Katika mazingira ya joto la juu au nafasi iliyofungwa, inapaswa kupunguza sasa ya kuendesha ili kudumisha uaminifu.
• Kinga dhidi ya umeme tuli:Ingawa uwezo wa kukinga umeme tuli ni 4KV (mfano wa mwili wa binadamu), utekelezaji wa hatua za kawaida za kinga dhidi ya umeme tuli kwenye PCB bado ni mazoezi mazuri, haswa wakati wa usindikaji na usanikishaji.
• Usanifu wa macho:The 30-degree viewing angle provides a relatively focused beam. For a wider illumination range, secondary optical elements (lenses, diffusers) may be required.

9. Technical Comparison and Differentiation

The key differentiating advantages of this LED within its category (T-1 3/4 White LED) include:

• Ukali mkubwa wa mwanga:Kwa saizi hii ya kifuniko, mwangaza wa chini kabisa wa 7150 mcd ni wa juu sana, ukitoa mwangaza bora.
• Ulinzi wa zener uliojumuishwa:The specified Zener reverse voltage (Vz) indicates built-in reverse voltage protection, which is not common in basic LEDs, enhancing the robustness of circuit design.
• Comprehensive Binning:Detailed binning for intensity, voltage, and color facilitates precise matching in applications requiring consistency across multiple devices.
• Usawa wa Mazingira:Inakidhi viwango vya kisasa kama vile halogen-free na REACH, ambavyo vinaweza kuwa muhimu kwa soko maalum na miundo inayozingatia mazingira.

10. Maswali Yanayoulizwa Mara kwa Mara (Kulingana na Vigezo vya Kiufundi)

Q1: Nipekeelewa ya mkondo wa kazi inapendekezwa ni nini?
A1: Upeo mkubwa kabisa wa mkondo endelevu ni 30mA. Sehemu ya kawaida ya kufanya kazi ni 20mA, ambayo pia ni hali ya kawaida ya majaribio ya viwango vya macho vilivyoorodheshwa (nguvu ya mwanga, rangi). Kufanya kazi kwa 20mA hutoa usawa mzuri kati ya mwangaza, ufanisi na maisha ya huduma.

Q2: Je, vipimo vya nguvu ya mwanga (T, U, V) yanaeleweka vipi?
A2: Hizi viwango vinahakikisha mwanga wa chini kabisa unaotolewa. Kwa mfano, kuagiza kiwango cha V kunahakikisha kila LED ina angalau 11250 mcd kwenye 20mA. Hii ni muhimu kwa matumizi ambayo lazima yafikie kiwango cha chini cha mwangaza. Viwango vinaruhusu mbuni kuchagua kiwango cha utendaji kinachofaa kwa gharama.

Q3: Naweza kutumia chanzo cha umeme cha 5V kuendesha LED hii?
A3: Haiwezi kuendeshwa moja kwa moja bila kipingamizi cha kudhibiti mkondo. Voltage ya mbele (Vf) iko kati ya 2.8V hadi 3.6V. Kuunganisha moja kwa moja kwenye 5V kutasababisha mkondo mwingi kupita kiasi na kuharibu LED. Lazima uhesabu na utumie kipingamizi kinachounganishwa mfululizo: R = (Chanzo cha Voltage - Vf) / I_F. Kuchukulia Vf ya kawaida ni 3.2V, I_F=20mA, using a 5V power supply: R = (5 - 3.2) / 0.02 = 90 ohms.

Q4: What does an ESD rating of 4KV mean for operation?
A4: This means the LED can typically withstand an electrostatic discharge of 4000V under the Human Body Model (HBM) without damage. While this is robust, it remains crucial to follow standard ESD prevention measures (e.g., using grounded workstations, wrist straps) during handling and assembly to prevent cumulative damage or potential latent defects.

Q5: How critical is the 3mm minimum distance for soldering/pin bending?
A5: It is extremely critical. The epoxy near the bottom of the package and the internal bond wires are sensitive to thermal and mechanical stress. Violating this distance may lead to immediate failure (resin cracking, bond wire breakage) or long-term reliability issues (light output attenuation, premature failure).

11. Mifano ya Matumizi Halisi

Scenario: Designing a High-Visibility Status Indicator Panel
A designer requires 20 high-brightness white LEDs for a control panel that must be clearly visible under high ambient light. They selected LEDs from the highest luminous intensity bin (V) to ensure sufficient brightness. To guarantee uniform appearance, they also specified a tight color bin (e.g., Group 1). A simple drive circuit using a 5V power rail was designed. For each LED, a 100-ohm, 1/8W resistor was calculated (using a conservative Vf of 3.4V for the 2/3 bin: (5-3.4)/0.02=80 ohms; 100 ohms is a standard value, providing approximately 16mA current, which is a safe and bright operating point). The PCB layout ensures a 3mm gap between the pads and the LED body outline. During assembly, a soldering jig is used to maintain a 3mm lead bend distance before inserting into the board.

12. Utangulizi wa Kanuni ya Kazi

This is a phosphor-converted white LED. Its core is a semiconductor chip made of indium gallium nitride (InGaN). When forward current is applied, electrons and holes recombine within the chip, emitting photons in the blue region of the spectrum (typically around 450-455nm). This blue light does not exit directly. Instead, it strikes a layer of yellow (or yellow-red) phosphor material deposited within the reflector cup surrounding the chip. The phosphor absorbs a portion of the blue light and re-emits it as light with a broader spectrum and longer wavelength (yellow). The remaining unabsorbed blue light mixes with the yellow phosphorescence, and the human eye perceives this combination as white light. The exact hue or "color temperature" of the white light is determined by the ratio of blue to yellow light, which is controlled by the phosphor composition and concentration.

13. Mwenendo ya Teknolojia na Mazingira

Kifuniko cha T-1 3/4 kinawakilisha teknolojia ya kupenya mashimo iliyokomaa, imetumika sana kwa maombi ya viashiria vya mwaka kwa miongo kadhaa. Matumizi ya chipu ya InGaN pamoja na ubadilishaji wa fosforesheni ni njia ya kawaida ya kuzalisha LED nyeupe tangu uvumbuzi wa LED ya bluu. Mwelekeo wa sasa wa sekta pana ya LED unaelekea kwenye maelekezo yafuatayo:

• Surface Mount Device (SMD):To achieve automated assembly and a smaller form factor, packages such as 3528, 5050, or 2835 have largely replaced through-hole LEDs in new high-volume designs.
• Higher Efficiency:The continuous development focus is on improving lumens per watt (lm/W), reducing the electrical power required for the same light output.
• Improving Color Rendering Index (CRI):Using multi-phosphor mixtures or violet/blue chips combined with red/green phosphors to produce white light that can more accurately reproduce object colors.
• Integrated Solutions:LED zilizo na kiwango cha umeme kilichojengwa ndani, kudhibiti, na hata utendaji kamili wa kuchanganya rangi za RGB.

Licha ya mielekeo hii, LED za aina ya "through-hole" kama bidhaa hii bado zina thamani katika utengenezaji wa vielelezo, ukarabati, udumishaji wa mifumo ya zamani, madhumuni ya elimu, na matumizi yanayohitaji usanikishaji wa mikono au uimara wa hali ya juu. Ukali wao unaopatikana katika kifurushi rahisi na thabiti, unahakikisha nafasi yao endelevu katika soko la vipengele vya elektroniki.