White LED LTW-008ZDCG Datasheet - InGaN White Light - 20mA - 3.6V - 120mW - Technical Documentation

1. Product Overview

Waraka huu unaelezea kwa kina vipimo vya kiufundi vya Taa ya Mwanga wa Nyeupe (LED) yenye mwangaza mkali iliyoundwa kwa matumizi ya Teknolojia ya Kukarabati Uso (SMT). Kifaa hiki hutumia nyenzo za kisemikondakta za Indiamu-Galiamu-Nitrati (InGaN) kutoa mwanga mweupe, na huchujwa kupitia lenzi ya manjano. Inafungwa kwenye mkanda wa milimita 8 na inasambazwa kwenye reeli yenye kipenyo cha inchi 7, ikilingana kabisa na vifaa vya kukusanyia kiotomatiki. Bidhaa hii imeainishwa kuwa ya kirafiki kwa mazingira na inafuata Maagizo ya Kuzuia Vitu Vinavyoweza Kudhuru (RoHS), ikionyesha kuwa haina risasi. Kusudi lake kuu la muundo ni kukidhi mahitaji ya matumizi yanayohitaji mwanga mweupe wa kuaminika, thabiti na unaokubalika.

2. In-depth and Objective Interpretation of Technical Parameters

2.1 Viwango vya juu kabisa

Hizo viwango vinavyobainisha mipaka ya mkazo inayoweza kusababisha uharibifu wa kudumu wa kifaa. Uendeshaji chini ya hali hizi hauhakikishi utendaji.

• Matumizi ya nguvu (Pd):120 mW. Hii ndiyo nguvu ya juu ambayo kifuniko cha LED kinaweza kutawanya kwa namna ya joto bila kuzidi kikomo chake cha joto.
• Peak Forward Current (I_FP):100 mA. This is the maximum instantaneous forward current allowed, typically specified under pulse conditions (1/10 duty cycle, 0.1ms pulse width) to prevent overheating.
• Direct forward current (I_F):30 mA. This is the recommended maximum continuous forward current to ensure long-term reliable operation.
• Reverse voltage (V_R):5 V. Applying a reverse voltage exceeding this value may cause breakdown and damage the LED junction. Continuous reverse voltage operation is prohibited.
• Operating temperature range (T_opr):-30°C to +85°C. This is the ambient temperature range within which the LED is designed to operate normally.
• Storage temperature range (T_stg):-40°C to +100°C. This is the storage temperature range for the device in a non-operating state.
• Reflow soldering conditions:Can withstand 260°C for 10 seconds, which complies with typical lead-free solder reflow temperature profiles (e.g., J-STD-020D).

2.2 Sifa za umeme na za nuru

These parameters are measured under standard test conditions of Ta=25°C and I_F= 20 mA, unless otherwise specified.

• Luminous intensity (I_V):Mbalimbali kutoka kiwango cha chini cha 860 mcd hadi kiwango cha kawaida cha 1720 mcd. Hii hupima nguvu inayohisiwa ya mwanga unaotolewa katika mwelekeo maalum. Thamani halisi imepangwa katika makundi (tazama Sehemu ya 3). Upimaji unafuata mkunjo wa majibu ya jicho la CIE.
• Pembe ya mtazamo (2θ_1/2):Digrii 110. Hii ndio pembe kamili wakati nguvu ya mwanga inapungua hadi nusu ya thamani yake ya juu zaidi (axial). Hii inaonyesha muundo wa boriti ya mwanga pana kiasi.
• Chromaticity coordinates (x, y):On the CIE 1931 chromaticity diagram, typical values are x=0.295, y=0.280, defining the white point color. The tolerance for these coordinates is ±0.01.
• Forward voltage (V_F):At 20mA, the range is from 2.9V to 3.6V. This is the voltage drop across the LED during operation. Actual values are binned (see Section 3).
• ESD Withstand Voltage:2000V (Human Body Model, HBM). This specifies the device's sensitivity to electrostatic discharge, indicating it has a standard level of protection. It is strongly recommended to take appropriate ESD precautions during handling (such as wearing an anti-static wrist strap, using grounded equipment).

3. Grading System Description

Ili kuhakikisha uthabiti wa rangi na utendaji katika uzalishaji, LED zinagawanywa katika vikundi tofauti kulingana na vigezo muhimu.

3.1 Forward Voltage (V_F) Binning

LED zinagawanywa kulingana na I_FForward voltage at = 20 mA is classified into bins (V0 to V6). Each bin has a range of 0.1V, from V0 (2.9-3.0V) to V6 (3.5-3.6V). A tolerance of ±0.10V is applied within each bin. This allows designers to select LEDs with closely matched voltage drops for current sharing applications in parallel circuits.

3.2 Luminous Intensity (I_V) Binning

LED zinagawanywa kulingana na I_FLuminous intensity at = 20 mA is binned (S, T, A, B, C, D). Bin ranges from S (860-1000 mcd) to D (1580-1720 mcd). Each bin specifies a ±10% tolerance. This allows selection for applications requiring specific brightness levels or brightness uniformity among multiple LEDs.

3.3 Chromaticity Coordinate Binning (Color Region)

The document provides a detailed chromaticity zone table (e.g., A52, A53, BE1, BG3), defining specific quadrilateral or triangular regions on the CIE 1931 chromaticity diagram. Each "chromaticity zone" specifies the permissible (x, y) coordinate boundaries for white light output. This precise binning is crucial for applications where color consistency is paramount, such as backlighting or signage. The measurement tolerance for these coordinates is ±0.01.

4. Performance Curve Analysis

4.1 Uhusiano wa Nguvu ya Jamaa na Urefu wa Wimbi

Kielelezo 1 katika hati ya maelezo ya maelezo ya kiufundi (specification sheet) kinaonyesha usambazaji wa nguvu ya wigo (SPD) wa mwanga unaotolewa. Kwa LED nyeupe inayotumia chip ya bluu ya InGaN na poda ya rangi ya manjano (yellow phosphor), mkunjo kwa kawaida unaonyesha kilele kikuu kinachotokana na chip katika eneo la bluu (takriban 450-460 nm), na kilele au nundu pana zaidi kinachozalishwa na poda ya rangi ya manjano katika eneo la manjano/kijani kibichi (takriban 550-600 nm). Mchanganyiko wa wigo huu hutoa mtazamo wa mwanga mweupe. Upana kamili wa mkunjo unatawanyika takriban kutoka 400 nm hadi 750 nm, ukiifunika wigo unaoonekana.

5. Mechanical and Packaging Information

5.1 Package Dimensions and Tolerances

This LED conforms to the EIA standard SMD package outline. All critical dimensions are provided in millimeters, with a standard tolerance of ±0.05 mm unless otherwise specified. Key mechanical definitions include:

• Distance A:Umbali wima kati ya chini ya pedi na kioakisi. Thamani ya chini ni 0.05mm.
• Toleo B:Toleo la usawazishaji kati ya pedi za kushoto na kulia. Thamani ya juu ni 0.03mm.
• Umbali kutoka C:Umbali wa upande kati ya pedi ya chuma na ukuta wa kioo cha kuakisi. Thamani ya chini ni 0.05mm.

Vipimo hivi ni muhimu kwa muundo wa pedi za PCB na kuhakikisha kuundwa kwa mwamba mzuri wa kuunganisha na uchimbaji mzuri wa mwanga.

5.2 Tape and Reel Packaging Dimensions

Detailed drawings specify carrier tape dimensions (pocket size, pitch, etc.) and reel dimensions (7-inch diameter). Packaging complies with the EIA-481-1-B standard. Key considerations include: 2000 pieces per reel, a maximum of two consecutive missing components allowed, and specified leader/trailer tape lengths (minimum 20 cm at the start, minimum 50 cm at the end).

6. Soldering and Assembly Guide

6.1 Mkunjo wa Joto wa Reflow Soldering

LED hii inaendana na mchakato wa reflow soldering wa infrared (IR) na wa gesi. Imetumia mkunjo wa joto wa reflow soldering usio na risasi unaokubaliana na J-STD-020D. Kigezo muhimu ni kifaa kinachoweza kustahimili joto la kilele la 260°C kwa sekunde 10. Kufuata viwango vilivyopendekezwa vya kupanda kwa joto, kudumisha joto, na kuzima joto ni muhimu ili kuzuia mshtuko wa joto na kuhakikisha mwambao wa solder unaotegemewa.

6.2 Kusafisha

Iwapo unahitaji kusafisha baada ya kulehemu, tumia kemikali maalum tu ili kuepuka kuharibu kifurushi cha LED. Mwongozo unapendekeza kuchovya kwenye ethanol au isopropanol kwa si zaidi ya dakika moja kwenye joto la kawaida. Kwa makusudio kukatazwa kutumia kemikali zisizotajwa.

6.3 Uhifadhi na Unyeti wa Unyevu

Kulingana na JEDEC J-STD-020, kiwango cha unyevunyevu (MSL) cha bidhaa hii ni cha 3.

• Ufungashaji uliowekwa muhuri:Hifadhi chini ya hali ya ≤30°C na ≤90% RH. Maisha ya rafu ni mwaka mmoja wakati imehifadhiwa kwenye mfuko wa asili wa kuzuia unyevunyevu ulio na kivukizi.
• Mfuko Uliofunguliwa:Hifadhi chini ya hali ya ≤30°C na ≤60% RH. Vipengee lazima vikamilishwe kwa kuchomelea ndani ya masaa 168 (siku 7) baada ya kufichuliwa kwa mazingira.
• Kupasha Joto:如果湿度指示卡变粉红色（表明RH >10%）或超出168小时车间寿命，建议在重新密封或使用前，在60°C下烘烤至少48小时。

7. Mapendekezo ya Utumiaji

7.1 Mazingira ya Kawaida ya Utumiaji

LED hii ya nyeupe ya SMD inafaa kwa matumizi mbalimbali yanayohitaji mwanga mweupe mwepesi na wenye ufanisi, ikiwa ni pamoja na lakini sio tu:

• Vionyeshi vya hali na taa za nyuma kwenye vifaa vya matumizi ya kawaida (kama vile vifaa vya nyumbani, vifaa vya sauti).
• Panel indicator lights and switch backlighting in industrial control systems.
• General illumination in portable devices.
• Decorative lighting and signage.

Ujumbe Muhimu:Spec inaelezea wazi kuwa LED hizi zinatumika kwa vifaa vya kawaida vya elektroniki. Kwa matumizi yanayohitaji uaminifu maalum au ambapo kushindwa kunaweza kudhuru maisha au afya (anga, vifaa vya matibabu, mifumo ya usalama), shauri la mtengenezaji linahitajika kabla ya kubuni.

7.2 Mambo ya Kuzingatia katika Uundaji

• Current Limiting:Always use a series current-limiting resistor or a constant-current drive circuit. Do not connect directly to a voltage source. Operate at or below the recommended 30 mA DC forward current.
• Thermal Management:Hakikisha PCB inatoa utoaji wa joto wa kutosha, hasa wakati wa kufanya kazi kwenye sasa kubwa au hali ya joto ya mazingira ya juu, ili kudumisha ndani ya kikomo cha matumizi ya nguvu ya 120 mW.
• Ulinzi wa ESD:Tekeleza taratibu za kawaida za usindikaji wa ESD wakati wa usanikishaji. Ikiwa LED iko katika eneo lililo wazi, zingatia kuongeza diode ya kukandamiza ya voltage ya muda mfupi (TVS) au hatua zingine za kinga kwenye bodi ya mzunguko.
• Optical Design:A 110-degree viewing angle provides a wide beam. For more focused light, secondary optics (lenses) may be required.

8. Ulinganisho wa Kiufundi na Tofauti

Ingawa maelezo haya ya pekee hayatoi kulinganisha moja kwa moja na aina nyingine, lakini inaweza kudokezwa sifa muhimu za utofautishaji wa LED hii:

• Pembe pana ya mtazamo (110°):Ikilinganishwa na LED yenye pembe nyembamba ya mtazamo, hutoa mwanga mpana zaidi, inafaa kwa taa ya eneo badala ya taa ya kukusanya mwanga.
• Detailed Binning:Extensive V_F, I_Vand chromaticity coordinate binning provide high consistency for applications requiring performance matching across multiple units.
• Imara ya ufungaji:Inapatana na usakinishaji wa kiotomatiki na mkunjo wa joto wa kawaida wa kufunga bati isiyo na risasi (kilele cha 260°C), inarahisisha utengenezaji wa wingi na unaotegemewa.
• InGaN technology:Inatoa uwezo wa kawaida wa uzalishaji wa mwanga mweupe wa juu wa kisasa wa LED yenye mwangaza mkubwa.

9. Maswali Yanayoulizwa Mara kwa Mara (Kulingana na Vigezo vya Kiufundi)

9.1 What is the difference between Peak Forward Current (100mA) and DC Forward Current (30mA)?

DC forward current (30mA) is the maximum current for continuous, steady-state operation. Peak forward current (100mA) is a higher current that the LED can only withstand under very short pulses (0.1ms width) and low duty cycle (10%). This is useful for applications such as multiplexing or PWM dimming, where brief high-current pulses can achieve higher instantaneous brightness without overheating the LED. Sustained operation above the DC current rating will lead to overheating and rapid performance degradation.

9.2 How to interpret the Chromaticity Coordinates (x=0.295, y=0.280)?

These coordinates plot the color of the white light on the CIE 1931 chromaticity diagram. This specific point typically corresponds to a "cool white" or "daylight white" color temperature, usually in the range of 6000K-7000K. The tolerance of ±0.01 defines a small area on the chart; the color of any individual LED from this batch should fall within this area to ensure color uniformity.

9.3 Why are the storage conditions so strict (MSL 3)? What happens if the 168-hour floor life is exceeded?

SMD packages absorb moisture from the air. During the high-temperature reflow soldering process, this trapped moisture rapidly turns to steam, causing delamination, cracking, or "popcorning" inside the plastic package, which can damage the LED. The MSL 3 and 168-hour limits define the safe exposure time for the package's specific moisture absorption rate. If exceeded, baking (60°C, 48 hours) can remove the absorbed moisture, restoring the component to a dry state suitable for reflow.

10. Design Use Cases

10.1 Design a Status Indicator Panel

Scenario:Design a control panel with 10 uniform white LED status indicators.

Design Steps:

1. Current setting:Select an operating point, e.g., I_F= 20 mA, to achieve reliable operation and directly use the binning data from the datasheet.
2. Voltage calculation:Chukulia voltage ya umeme ni 5V (V_CC). Kutoka kwa V ile ile_FChagua LED kwenye safu, kwa mfano V3 (3.2-3.3V). Tumia thamani ya kawaida (3.25V) kwa hesabu. Upinzani wa mfululizo unaohitajika R = (V_CC- V_F) / I_F= (5 - 3.25) / 0.020 = 87.5 Ω. Upinzani wa kawaida wa 91 Ω au 82 Ω unaweza kutumika, kurekebisha kidogo mkondo.
3. Usawa wa mwangaza:Designate LEDs from the same I_Vbin (e.g., Bin C: 1440-1580 mcd) to ensure all indicator lights have similar perceived brightness.
4. Uniformity of Color:Chagua LED kutoka kwenye ukanda wa rangi sawa (mfano, A63), ili kuhakikisha taa zote zatoa mwangaza mweupe sawa kabisa, jambo muhimu kwa usawaziko wa urembo.
5. Muundo wa PCB:Fuata vipimo vya pedi vilivyopendekezwa kwenye maelezo ya kiufundi. Hakikisha muundo wa pedi unazingatia umbali wa chini (A, C) kutoka kwa LED yenyewe/kikokotoo, ili kuzuia mzunguko mfupi na kuruhusu umbo sahihi la pembe ya mshumaa.
6. Usanikishaji:Tumia mkunjo wa joto wa kuchochea kwa mionzi ya infrared iliyopendekezwa. Weka LED ndani ya mfuko uliofungwa kabla ya kujiandaa kwa kukusanyika. Ikiwa mfuko umefunguliwa, kamilisha uuzaji wa LED zote 10 ndani ya masaa 168.

11. Introduction to Working Principles

LED hii ya mwanga mweupe inafanya kazi kulingana na kanuni ya mwanga wa umeme katika semikondukta. Kiini chake ni chipi iliyotengenezwa kwa Indium Gallium Nitride (InGaN), ambayo inatoa mwanga wa bluu wakati voltage chanya (kawaida 2.9-3.6V) inapotumiwa, na elektroni na mashimo hujumuishwa kwenye pengo la bendi yake. Ili kutoa mwanga mweupe, chipi inayotoa mwanga wa bluu imepakwa na fosforasi ya Yttrium Aluminium Garnet iliyochanganywa na Cerium (YAG:Ce). Sehemu ya fotoni za bluu zenye nguvu kutoka kwa chipi hunyonywa na fosforasi, kisha hutolewa tena kama mwanga wa manjano wenye nishati ndogo kupitia mchakato unaoitwa photoluminescence. Mwanga wa bluu uliobaki usiofyonzwa huchanganywa na mwanga wa manjano unaotolewa, na jicho la mwanadamu huhisi mchanganyiko huu kama mwanga mweupe. Lens ya manjano inaeneza zaidi na kuunda pato la mwisho la mwanga.

12. Technical Trends

Teknolojia iliyoelezewa katika maelezo huu ya vipimo inawakilisha njia imara na inayotumika sana ya kutoa mwanga mweupe kwa kutumia LED. Katika tasnia pana zaidi ya LED, mwelekeo muhimu unaoendelea unaohusiana na vipengele kama hivi ni pamoja na:

• Uboreshaji wa ufanisi (lm/W):Uboreshaji endelevu katika muundo wa chip ya InGaN, ufanisi wa fosforasi na usanifu wa ufungaji umeleta ufanisi mkubwa wa kutolea mwanga, ambayo inamaanisha pato la mwanga zaidi kwa nguvu sawa ya umeme ya pembejeo.
• Uboreshaji wa ubora wa rangi:Kukuza mchanganyiko wa fosforasi zenye mnururisho mbalimbali (mfano, kuongeza fosforasi nyekundu) ili kuboresha faharasa ya uakisi wa rangi (CRI), kutoa uakisi wa rangi sahihi zaidi na wenye kupendeza chini ya mwanga wa LED.
• Kupunguza ukubwa:Msukumo wa vifaa vidogo zaidi katika bidhaa za kielektroniki za watumiaji, unalazimisha LED kutumia vipimo vidogo vya ufungashaji, huku ukidumisha au kuongeza pato la mwanga.
• Uthabiti wa juu na maisha marefu:Maendeleo katika nyenzo (epoxy resin, phosphor, substrate) na usimamizi wa joto yanapanua maisha ya huduma ya LED (L70, L90), na kupunguza gharama za matengenezo ya muda mrefu.
• Taa za Kisasa na Zilizounganishwa:Ingawa hiki ni kijenzi cha msingi, mfumo mzima unaelekea kufanya LED kuwa sehemu muhimu ya mfumo mzima wa kisasa, ambayo mara nyingi huhitaji madereva yanayolingana kwa ajili ya kupunguza mwanga, kurekebisha rangi, na uwezo wa kuunganishwa.