High-Power Blue LED 3.45x3.45x2.20mm 2.6-3.4V 5.1W 465-475nm Technical Datasheet

1. Product Overview

This LED component utilizes InGaN technology on a substrate to deliver a high-intensity blue light source. The device is packaged in a robust ceramic housing with compact dimensions of 3.45mm x 3.45mm x 2.20mm, making it suitable for space-constrained lighting applications. The LED is designed for surface-mount technology (SMT) assembly and is compatible with standard reflow soldering processes. It is available in tape and reel packaging for automated pick-and-place equipment. The product meets RoHS compliance and is classified as moisture sensitivity level 1 (MSL-1), indicating no special moisture handling requirements before soldering.

1.1 Key Features

• Ceramic package for excellent thermal management and reliability
• Extremely wide viewing angle (120 degrees typical) for uniform light distribution
• Suitable for all SMT assembly and soldering processes
• Available on tape and reel with 1000 pieces per reel
• Moisture sensitivity level 1
• RoHS compliant, free of hazardous substances

1.2 Applications

The blue LED can be employed in a variety of general lighting and specialized applications. Typical use cases include warning lights, downlights, wall wash lights, and spot lights. The device is also suitable for decorative color lamps, LED strips, plant grow lighting, landscape illumination, stage photography lighting, and medical aesthetic equipment. Additionally, it is ideal for commercial and residential indoor environments such as hotels, markets, offices, and households. The wide operating temperature range (-40°C to +85°C) ensures reliable performance in diverse conditions.

2. Package Dimensions and Mechanical Specifications

The LED package has a length of 3.45mm, width of 3.45mm, and height of 2.20mm. The bottom view reveals a clear anode and cathode pad arrangement for easy polarity identification. The anode pad measures approximately 1.30mm x 0.85mm, while the cathode pad is slightly larger at 1.30mm x 0.65mm. Optimized soldering patterns are recommended for reliable thermal and electrical contact. The footprint dimensions for PCB design are provided in the datasheet: a rectangular anode pad of 3.25mm x 0.50mm and a cathode pad of 3.25mm x 0.45mm, with a spacing of 0.30mm between the two pads. All dimensions are in millimeters with a tolerance of ±0.2mm unless otherwise noted.

3. Electrical and Optical Characteristics

All electrical and optical parameters are measured at a test condition of IF = 350mA and a solder point temperature of Ts = 25°C, unless otherwise specified. The forward voltage ranges from 2.6V to 3.4V, with a typical value around 3.0V. The device delivers a luminous flux between 30 lumens and 50 lumens, and a total radiant flux from 400mW to 800mW. The dominant wavelength falls within the blue spectrum, from 465nm to 475nm. The reverse current is limited to 10µA maximum when reverse biased at 5V. The viewing angle is typically 120 degrees (at half intensity), providing a wide beam spread.

3.1 Absolute Maximum Ratings

The absolute maximum ratings must not be exceeded to prevent device damage. The power dissipation is rated at 5100mW (5.1W). The forward current can go up to 1500mA (1.5A) continuously, and 1600mA (1.6A) under pulsed conditions (1/10 duty cycle, 0.1ms pulse width). The reverse voltage should not exceed 5V. The device is rated for an electrostatic discharge (HBM) of 2000V. Operating temperature range is -40°C to +85°C, and storage temperature range is the same. The junction temperature must not exceed 150°C.

3.2 Binning Information

To ensure consistency, the LEDs are binned according to forward voltage, luminous flux, and dominant wavelength at the test current of 350mA. The forward voltage bins are: F0 (2.6-2.8V), G0 (2.8-3.0V), H0 (3.0-3.2V), and I0 (3.2-3.4V). Luminous flux bins are: FA3 (30-35lm), FA4 (35-40lm), FA5 (40-45lm), and FA6 (45-50lm). Wavelength bins are: D00 (465-470nm) and E00 (470-475nm). Customers should specify desired bin codes when ordering to match application requirements.

4. Typical Performance Curves

The following performance characteristics are typical values and are provided for design guidance only; they are not guaranteed specifications.

4.1 Forward Voltage vs. Forward Current

The forward voltage increases with forward current. At room temperature, the voltage is approximately 2.6V at 100mA, 3.0V at 350mA, 3.2V at 700mA, and 3.4V at 1300mA. The relationship is nearly linear within the operating range.

4.2 Relative Intensity vs. Forward Current

Relative luminous intensity rises with current but exhibits slight saturation at high currents. At 350mA the relative intensity is normalized to 1.0; at 700mA it increases to about 1.6; at 1050mA to 2.2; and at 1400mA to 2.8.

4.3 Temperature Dependence

As the solder point temperature increases from 25°C to 115°C, the relative luminous intensity decreases linearly by about 40%. Thermal management is crucial to maintain light output. Forward current derating is necessary at high ambient temperatures: at Ts=50°C the maximum forward current is about 1400mA, while at Ts=85°C it is reduced to approximately 800mA to avoid exceeding 150°C junction temperature.

4.4 Spectral Distribution

The emission spectrum has a peak wavelength around 465-475nm with a full width at half maximum (FWHM) of approximately 25-30nm. The spectrum is clean with no significant secondary peaks in the visible range.

4.5 Radiation Pattern

The angular radiation pattern is nearly Lambertian with a half-intensity angle of ±60 degrees. The relative intensity at ±75 degrees drops to approximately 0.2 of the maximum.

5. Packaging and Shipping Information

The LEDs are packaged in quantities of 1000 pieces per reel on a carrier tape. The carrier tape has a pitch of 4.0mm and a width of 12.0mm. The reel dimensions are: outer diameter 178mm ±1mm, inner diameter 59mm, and width 14.0mm ±0.5mm. Each reel is sealed in a moisture barrier bag with a desiccant and a humidity indicator card to maintain MSL-1 conditions. The label on the bag includes part number, spec number, lot number, bin code (for flux, wavelength, and voltage), quantity, and date code. The packed reels are then placed in cardboard boxes for shipment.

6. SMT Reflow Soldering Guidelines

Reflow soldering should follow the temperature profile specified in the datasheet. The preheat zone should ramp from 150°C to 200°C at a rate of 3°C/s maximum, with a soak time of 60-120 seconds. The critical zone above 217°C should last 60 seconds, with a peak temperature of 260°C for 10 seconds (maximum). The cool-down rate should not exceed 6°C/s. Only two reflow passes are allowed. If the time between two soldering operations exceeds 24 hours, the LEDs may be damaged. Hand soldering should use an iron at 300°C for less than 3 seconds, performed only once. Repair should be avoided; if necessary, use a dual-head iron and verify LED functionality after repair. The top surface of the LED is soft silicone, so picking nozzles must apply appropriate pressure to avoid damaging the encapsulant. Do not mount LEDs on warped PCB sections and avoid warping the board after soldering. Rapid cooling after soldering is not recommended.

7. Handling and Storage Precautions

The operating environment and mating materials must not contain sulfur compounds exceeding 100PPM. Bromine and chlorine contents in external materials should each be less than 900PPM, with total bromine and chlorine less than 1500PPM. Volatile organic compounds (VOCs) from fixture materials can penetrate the silicone encapsulant and cause discoloration under heat and light, leading to significant light loss. Always test materials for compatibility before use. Avoid adhesives that outgas organic vapors. The silicone lens surface is soft; always handle the component by the side surfaces using tweezers or appropriate tools. Do not touch the silicone lens directly. In circuit design, ensure that the current through each LED does not exceed the absolute maximum rating. Include current-limiting resistors to prevent thermal runaway from small voltage changes. Never apply reverse voltage (above 5V) to the LED; it can cause migration and permanent damage. Thermal design is critical: adequate heat sinking is required to maintain junction temperature below 150°C. The silicone surface attracts dust; if cleaning is necessary, use isopropyl alcohol. Ultrasonic cleaning is not recommended as it may damage the LED. Storage conditions: before opening the aluminum bag, store at ≤30°C and ≤75% RH for up to one year from the date of sealing. After opening, store at ≤30°C and ≤60% RH for no more than 168 hours. If the storage time is exceeded, bake the LEDs at 60±5°C and <5% RH for at least 24 hours. If the bag is punctured or damaged, contact your supplier.

8. Reliability Testing and Quality Assurance

The LEDs have undergone a series of reliability tests to ensure robust performance. The tests include: reflow soldering (260°C, 2 times), thermal shock (-40°C to 100°C, 500 cycles, 15min dwell), high temperature storage (100°C, 1000 hours), low temperature storage (-40°C, 1000 hours), life test (25°C, IF=350mA, 1000 hours), and high temperature high humidity life test (60°C/90%RH, IF=350mA, 1000 hours). Acceptance criteria: 0 failures out of 10 samples for each test (a 0/1 AQL). After testing, the forward voltage shift must be within specification, luminous flux maintenance at least 80% of initial value, and no open/short circuit or flickering. Note that these tests are performed under good heat dissipation conditions; actual application reliability depends on the system's thermal design.

9. Application Design Considerations

For optimal performance, the following guidelines are recommended: ensure proper heat sinking using thermal vias or metal-core PCBs. Keep the LED junction temperature below 150°C under all operating conditions. Use a constant current driver rather than a voltage source to prevent overcurrent. When connecting multiple LEDs in series, account for forward voltage binning variations. In parallel strings, use separate ballast resistors per string. For pulsed operation, adhere to the peak current limits and duty cycle restrictions. The wide viewing angle of 120 degrees is advantageous for flood lighting but may require secondary optics for narrow beam applications. The blue wavelength range (465-475nm) is suitable for plant growth lighting when combined with red LEDs, or for stage lighting and decorative effects. The ceramic package offers excellent thermal conductivity, but the external solder pads must be fully wetted to transfer heat efficiently. Avoid mechanical stress on the LED after soldering.

10. Comparison with Alternative Products

Compared to smaller package sizes (e.g., 2835 or 3030), the 3.45x3.45mm footprint of this LED allows higher current handling due to a larger thermal path. The ceramic substrate provides better thermal conductivity than conventional plastic packages, enabling operation at 1.5A forward current. The wide wavelength bin coverage (465-475nm) offers flexibility to meet specific color requirements. However, the higher thermal output necessitates more extensive heatsinking than lower-power devices. When compared to competitors' similar 3535 blue LEDs, this component offers comparable luminous efficacy (approx. 85-100 lm/W at 350mA) and stable wavelength over temperature. The MSL-1 rating simplifies storage and handling logistics.

11. Frequently Asked Questions

Q: What is the typical luminous efficacy?
A: At 350mA, the efficacy ranges from approximately 85 to 143 lm/W, depending on the flux bin. Efficacy decreases at higher currents due to efficiency droop.

Q: Can I drive this LED at 1A continuously?
A: Yes, with adequate thermal management. The absolute maximum continuous current is 1.5A, but ensure the junction temperature does not exceed 150°C.

Q: Do I need ESD protection during handling?
A: Yes, although the LED withstands 2000V HBM, ESD precautions such as grounded workstations and antistatic wrist straps are recommended.

Q: What is the storage life after opening the moisture barrier bag?
A: 168 hours (7 days) at ≤30°C and ≤60% RH. Beyond that, baking is required.

Q: Is the silicone lens compatible with common optical adhesives?
A: Some adhesives may outgas VOCs that attack the silicone. It is essential to test adhesives in the intended application environment.

12. Technical Principles

The blue LED uses an Indium Gallium Nitride (InGaN) active layer grown on a sapphire or silicon carbide substrate. When a forward bias is applied, electrons and holes recombine in the quantum well region, emitting photons with energy corresponding to the bandgap of InGaN. By adjusting the indium content in the quantum well, the emission wavelength can be tuned; for this product, the composition is set to produce blue light in the 465-475nm range. The ceramic package enhances light extraction and provides a robust thermal path to the solder pads. The viewing angle is determined by the geometry of the reflector cup and the encapsulation shape.

13. Development Trends

The LED industry continues to push for higher efficacy and lower cost. InGaN blue LEDs have achieved >200 lm/W in laboratory settings, and commercial products are steadily improving. The trend toward smaller packages with higher current capability (e.g., CSP chips) is challenging ceramic packages for some applications. However, the 3535 ceramic package remains popular for high-power applications requiring robust thermal performance and reliability. Integration with smart lighting controls and full-spectrum phosphors (to produce white light) are ongoing developments. For blue-only applications, precision binning and stable wavelength over temperature are increasingly demanded by horticultural and medical markets.