RF-W3HV32DS-EF-G2 White LED Datasheet - 2.8x3.5x0.7mm - 17.4-19.0V Forward Voltage - 1140mW Power - 3000K/4000K/6500K CCT

1. Product Overview

1.1 General Description

The RF-W3HV32DS-EF-G2 series is a white LED fabricated using a blue chip combined with phosphor conversion. The package dimensions are 2.8mm x 3.5mm x 0.7mm, making it suitable for compact lighting applications. The device is housed in a PLCC-2 package, offering excellent solder joint reliability and wide viewing angle. This LED is designed for general indoor lighting, including bulb lighting and other indoor luminaires.

1.2 Features

• PLCC-2 package for surface mount assembly
• Extremely wide viewing angle (120 degrees typical)
• Suitable for all SMT assembly and solder processes
• Available on tape and reel for automated handling
• Moisture sensitivity level: Level 3 (168 hours floor life)
• RoHS compliant
• High color rendering index (CRI typ. 80)
• Low thermal resistance (27°C/W) for efficient heat dissipation

1.3 Applications

• Indoor lighting fixtures
• Bulb lighting (A-lamps, decorative bulbs)
• General indoor applications where high efficiency and good color quality are required

2. Technical Parameters Deep Analysis

2.1 Electrical Characteristics

The forward voltage (VF) of the LED is measured at a test current of 50mA at 25°C. The device is binned into four voltage ranks: U3 (17.4-17.8V), VW3 (17.8-18.2V), W3 (18.2-18.6V), and X3 (18.6-19.0V). The typical VF is around 18V. The reverse current at 30V is less than 10µA. The absolute maximum ratings include a forward current of 60mA, peak forward current of 100mA (1/10 duty, 0.1ms), power dissipation of 1140mW, and reverse voltage of 30V. ESD rating is 2000V HBM. Operating temperature range is -40°C to +105°C, and junction temperature must not exceed 125°C.

2.2 Optical Characteristics

The luminous flux (Φ) is binned into ranks FC2 (100-110 lm), FC3 (110-120 lm), FC4 (120-130 lm), and FC5 (130-140 lm) depending on the CCT. For 3000K, the bins are FC2, FC3, FC4; for 4000K and 6500K, bins FC3, FC4, FC5. The typical flux is 117 lm for 3000K and 125 lm for 4000K/6500K. The viewing angle (2θ1/2) is 120 degrees. The color rendering index (CRI) is typically 80. The device is available in three correlated color temperatures: 3000K (30M), 4000K (40M), and 6500K (65M), each with a 6-step MacAdam ellipse bin definition.

2.3 Thermal Characteristics

The thermal resistance between junction and solder point (RthJ-S) is 27°C/W typical. This low thermal resistance helps maintain junction temperature within limits under normal operating conditions. Proper thermal management on the PCB is essential to avoid exceeding the maximum junction temperature of 125°C.

3. Binning System

3.1 Forward Voltage Bins

As shown in Table 1-3, the forward voltage bins are:

3.2 Luminous Flux Bins

Luminous flux bins vary by CCT:

3.3 Chromaticity Bins

Each CCT has a defined 6-step MacAdam ellipse with specific chromaticity coordinates (x,y). For example, 3000K bin 30M has the corner points as listed in the datasheet. This ensures color consistency within the bin.

4. Performance Curves Analysis

4.1 Forward Voltage vs. Forward Current

The IV curve (Fig 1-7) shows a typical exponential relationship. At low currents, the voltage increases rapidly, while at higher currents the voltage increases more slowly. The curve allows designers to predict the voltage at different drive currents.

4.2 Forward Current vs. Relative Intensity

Fig 1-8 indicates that the relative luminous intensity increases with forward current, approximately linearly up to the maximum rated current. This enables brightness control through current adjustment.

4.3 Solder Temperature vs. Relative Intensity and Forward Current

Figures 1-9 and 1-10 show that as the solder point temperature rises, the relative intensity decreases and the allowable forward current must be derated to keep the junction temperature below 125°C.

4.4 Forward Voltage vs. Solder Temperature

The forward voltage decreases linearly with increasing temperature (Fig 1-11), with a typical coefficient of about -2 mV/°C. This characteristic must be considered in constant-current drive design.

4.5 Radiation Pattern

The radiation diagram (Fig 1-12) shows a wide, Lambertian-like distribution with a half-angle of approximately 60° (120° viewing angle). This is suitable for uniform illumination.

4.6 Spectrum Distribution

The spectrum (Fig 1-13) shows a typical blue peak around 450nm and a broad yellow phosphor emission from 500-700nm. The exact spectral shape varies with CCT, with warmer CCT having more red content.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED package has dimensions 2.8mm (length) × 3.5mm (width) × 0.7mm (height). The bottom view shows the anode and cathode pads with polarity marking. Recommended soldering patterns (Fig 1-5) provide pads of 2.10mm × 0.50mm and 1.10mm × 2.10mm with appropriate spacing. All dimensions are in millimeters with tolerances ±0.05mm unless noted.

5.2 Polarity Marking

Polarity is indicated on the bottom side: a "+" symbol near the anode pad and a larger pad for the cathode as shown in Fig 1-4. Correct orientation is essential for proper operation.

5.3 Carrier Tape and Reel

The carrier tape has dimensions: pitch 4.00mm, width 8mm, with a pocket size accommodating the LED. The reel has an outer diameter of 290±2mm, hub diameter 79.6±0.2mm, and width 12.2±0.3mm. Each reel contains 12,000 pieces.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The recommended reflow soldering profile follows the conditions in Table 3-1. The average ramp-up rate from 150°C to 200°C (preheat zone) should not exceed 3°C/s. Preheat time between 150°C and 200°C is 60-120 seconds. The temperature must rise to 217°C (TL) and stay above 217°C for a maximum of 60 seconds (tL). The peak temperature (TP) is 260°C with a maximum dwell time of 10 seconds. Cooling rate should not exceed 6°C/s. Total time from 25°C to peak must be less than 8 minutes. Reflow soldering should not be performed more than twice. If more than 24 hours pass after the first reflow, the LEDs may absorb moisture and require baking.

6.2 Hand Soldering

Hand soldering should be done with a soldering iron temperature below 300°C for less than 3 seconds. Only one hand soldering operation is allowed.

6.3 Repair

Repair is not recommended after soldering. If unavoidable, use a double-head soldering iron and verify no damage to the LED characteristics.

6.4 Handling Precautions

The silicone encapsulant is soft; avoid applying strong pressure on the top surface. Use appropriate pickup nozzles. Do not mount LEDs on warped PCBs. Avoid mechanical stress or vibration during cooling. Do not rapidly cool after soldering.

7. Packaging and Ordering Information

7.1 Packaging Details

Each reel contains 12,000 pieces packaged in a moisture barrier bag with desiccant and a humidity indicator card. The label includes part number, spec number, lot number, bin code (luminous flux, chromaticity, forward voltage), quantity, and date code. The bag should be stored at ≤30°C and ≤75% RH before opening. After opening, the LEDs must be used within 24 hours at ≤30°C and ≤60% RH, otherwise baking at 60±5°C for ≥24 hours is required.

7.2 Ordering Information

The product selection table shows three models: RF-W3HV32DS-EF-G2 (3000K), RF-W4HV32DS-EF-G2 (4000K), RF-W6HV32DS-EF-G2 (6500K). The part number may include bin codes for ordering specific luminous flux and voltage ranks.

8. Application Suggestions

8.1 Design Recommendations

When designing with this LED, consider the following: Use a constant-current driver to maintain stable brightness. Include a series resistor to limit current in case of voltage variations. Ensure adequate heat sinking to keep the solder point temperature below 85°C for optimal lifetime. Avoid environments with high sulfur content (>100ppm) as sulfur can degrade the LED. Use materials that do not emit volatile organic compounds (VOCs) that can discolor the silicone. For cleaning, isopropyl alcohol is recommended; ultrasonic cleaning is not advised.

8.2 Typical Applications

Due to its wide viewing angle, good CRI, and compact size, this LED is ideal for indoor downlights, panel lights, linear fixtures, and retrofit bulbs. The high voltage (17-19V) allows for efficient driver design with fewer LEDs in series.

9. Frequently Asked Questions

9.1 What is the storage condition for these LEDs?

Store unopened bags at ≤30°C and ≤75%RH for up to one year. After opening, use within 24 hours at ≤30°C and ≤60%RH; otherwise bake at 60±5°C for ≥24 hours.

9.2 How many reflow cycles can the LED withstand?

Up to two reflow cycles are allowed. If more than 24 hours elapse between cycles, baking is required.

9.3 Is the LED sensitive to electrostatic discharge?

Yes, ESD rating is 2000V HBM. Proper ESD precautions must be taken during handling and assembly.

9.4 Can I use ultrasonic cleaning?

No, ultrasonic cleaning is not recommended as it may damage the LED. Use isopropyl alcohol instead.

9.5 What is the maximum current I can apply?

The absolute maximum forward current is 60mA. However, the actual operating current should be determined based on thermal management to keep the junction temperature below 125°C.

10. Principle Introduction

This white LED operates on the principle of phosphor-conversion. A blue InGaN (indium gallium nitride) LED chip emits blue light at around 450nm. This blue light excites a yellow-emitting phosphor (typically YAG:Ce) that is coated on the chip. The combination of the blue light and the yellow light produces white light. By adjusting the phosphor composition and concentration, different correlated color temperatures (CCTs) can be achieved, from warm white (3000K) to cool white (6500K). The color rendering index (CRI) indicates how faithfully the light renders colors compared to a reference source; a CRI of 80 is suitable for general indoor lighting.

11. Development Trends

The LED lighting industry continues to push toward higher efficacy, better color quality, and smaller packages. This product features a high-voltage (17-19V) design that allows for reduced current and lower resistive losses in the driver, improving overall system efficiency. Advances in phosphor technology are enabling higher CRI values (>90) and better color consistency. The trend toward miniaturization is evident in the 2.8x3.5mm footprint, which fits compact luminaires. Additionally, improved thermal management through low thermal resistance packages (27°C/W) supports higher drive currents and longer lifetimes.