SMD LED 12-22/BHR6C-A01/2C Datasheet - 1.2x2.2x1.1mm - Blue (2.7-3.1V) & Red (1.7-2.2V) - 40-60mW - English Technical Document

1. Product Overview

The 12-22 SMD LED is a compact, surface-mount device designed for high-density PCB applications. It is available in a multi-color configuration, specifically combining a blue LED (BH chip) and a brilliant red LED (R6 chip) within a single package. This component is significantly smaller than traditional lead-frame type LEDs, enabling substantial reductions in board size, increased packing density, minimized storage requirements, and ultimately contributing to the development of smaller end-user equipment. Its lightweight construction makes it particularly suitable for miniature and space-constrained applications.

1.1 Core Advantages

• Miniaturization: The small footprint (1.2mm x 2.2mm) allows for high-density placement on PCBs.
• Compatibility: Packaged in 8mm tape on 7-inch diameter reels, making it fully compatible with standard automatic placement (pick-and-place) equipment.
• Robust Manufacturing: Compatible with both infrared (IR) and vapor phase reflow soldering processes.
• Environmental Compliance: The product is Pb-free, compliant with RoHS, EU REACH, and halogen-free standards (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm).

1.2 Target Applications

• Automotive/Industrial: Backlighting for instrument panels, dashboards, and switches.
• Telecommunications: Status indicators and keypad backlighting in telephones and fax machines.
• Consumer Electronics: Flat backlighting for LCDs, switch illumination, and symbol lighting.
• General Purpose: Any application requiring a reliable, compact indicator light.

2. In-Depth Technical Parameter Analysis

The following sections provide a detailed breakdown of the device's electrical, optical, and thermal specifications. All parameters are measured at an ambient temperature (Ta) of 25°C unless otherwise specified.

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under or at these conditions is not guaranteed.

Parameter	Symbol	Code	Rating	Unit
Reverse Voltage	VR	-	5	V
Forward Current	IF	BH	10	mA
		R6	25	mA
Peak Forward Current (Duty 1/10 @1KHz)	IFP	BH	40	mA
		R6	50	mA
Power Dissipation	Pd	BH	40	mW
		R6	60	mW
Electrostatic Discharge (HBM)	ESD	BH	150	V
		R6	2000	V
Operating Temperature	Topr	-	-40 ~ +85	°C
Storage Temperature	Tstg	-	-40 ~ +90	°C
Soldering Temperature	Tsol	Reflow	260°C for 10 sec.	-
		Hand	350°C for 3 sec.	-

Key Observations: The red (R6) chip has a higher current and power handling capability compared to the blue (BH) chip. Notably, the ESD sensitivity differs significantly, with the BH (blue) chip being highly sensitive (150V HBM), requiring stringent ESD protection during handling, while the R6 (red) chip is more robust (2000V HBM).

2.2 Electro-Optical Characteristics

These are the typical performance parameters under normal operating conditions.

Parameter	Symbol	Code	Min.	Typ.	Max.	Unit	Condition
Luminous Intensity	Iv	BH	18.0	26.0	-----	mcd	IF=5mA
		R6	22.5	30.0	-----	mcd	IF=5mA
Viewing Angle (2θ1/2)	-	-	-----	120	-----	deg	-
Peak Wavelength	λp	BH	-----	468	-----	nm	-
		R6	-----	632	-----	nm	-
Dominant Wavelength	λd	BH	-----	470	-----	nm	-
		R6	-----	624	-----	nm	-
Spectrum Bandwidth (Δλ)	-	BH	-----	25	-----	nm	-
		R6	-----	20	-----	nm	-
Forward Voltage	VF	BH	2.7	-----	3.1	V	-
		R6	1.7	-----	2.2	V	-
Reverse Current	IR	BH	-----	-----	50	μA	VR=5V
		R6	-----	-----	10	μA	VR=5V

Notes:

1. Tolerance of Luminous Intensity is ±11%.
2. Tolerance of Forward Voltage is ±0.05V.

Analysis: The blue LED (BH) operates at a higher forward voltage (2.7-3.1V) typical of InGaN-based chips, while the red LED (R6) has a lower forward voltage (1.7-2.2V) characteristic of AlGaInP technology. The luminous intensity is specified at a low drive current of 5mA, indicating high efficiency. The wide 120-degree viewing angle provides a broad emission pattern suitable for indicator applications.

3. Performance Curve Analysis

The datasheet provides typical characteristic curves for both the BH (Blue) and R6 (Red) chips, which are crucial for understanding device behavior under varying conditions.

3.1 Relative Luminous Intensity vs. Ambient Temperature

The curves show that luminous output decreases as ambient temperature increases. This thermal quenching effect is a fundamental property of LED semiconductors. Designers must account for this derating when operating at high ambient temperatures to ensure sufficient light output.

3.2 Relative Luminous Intensity vs. Forward Current

These plots illustrate the sub-linear relationship between drive current and light output. Increasing current yields diminishing returns in brightness while generating more heat. Operating near the absolute maximum current rating is inefficient and reduces device lifetime.

3.3 Forward Current Derating Curve

This critical graph defines the maximum allowable continuous forward current as a function of ambient temperature. As temperature rises, the maximum permissible current must be reduced to prevent exceeding the device's power dissipation limit and causing thermal runaway.

3.4 Forward Voltage vs. Forward Current (I-V Curve)

The I-V curve shows the exponential relationship typical of a diode. The "knee" voltage is the approximate forward voltage (V_F). The curve's slope in the conducting region relates to the dynamic resistance of the LED.

3.5 Radiation Diagram

The polar plot visualizes the spatial distribution of light intensity, confirming the 120-degree viewing angle. The pattern is typically Lambertian or near-Lambertian for this type of LED package.

3.6 Spectrum Distribution

The spectral plots show the emission profiles:

• BH (Blue): Peak wavelength ~468nm, dominant wavelength ~470nm, with a spectral bandwidth (FWHM) of ~25nm.
• R6 (Red): Peak wavelength ~632nm, dominant wavelength ~624nm, with a narrower spectral bandwidth of ~20nm.

These characteristics determine the perceived color purity of the LED.

4. Mechanical and Package Information

4.1 Package Dimensions

The 12-22 SMD LED has a compact rectangular package. Key dimensions (in mm, tolerance ±0.1mm unless specified) include:

• Overall length: 2.2 mm
• Overall width: 1.2 mm
• Overall height: 1.1 mm
• Lead (terminal) dimensions and spacing as per the detailed drawing.

The datasheet includes a detailed dimensioned drawing specifying all critical lengths, widths, heights, and pad positions necessary for PCB footprint design.

4.2 Polarity Identification

The component features a polarity marker, typically a notch or a dot on the package or a cut corner on the carrier tape pocket, to indicate the cathode. Correct orientation is essential for circuit operation.

5. Soldering and Assembly Guidelines

Proper handling is critical for reliability. The device is moisture-sensitive (MSL) and requires specific soldering profiles.

5.1 Storage and Moisture Sensitivity

• Before Opening: Store at ≤30°C and ≤90% RH.
• After Opening (Floor Life): 1 year at ≤30°C and ≤60% RH. Unused parts must be resealed in moisture-proof packaging with desiccant.
• Baking: If the desiccant indicates moisture absorption or storage time is exceeded, bake at 60 ±5°C for 24 hours before use.

5.2 Reflow Soldering Profile (Pb-free)

The recommended profile is for lead-free solder (e.g., SAC305):

• Preheat: Gradual ramp to activate flux.
• Soak Zone: To evenly heat the board and component.
• Reflow: Peak temperature of 260°C for a maximum of 10 seconds.
• Cooling: Controlled cool-down to minimize thermal stress.

Important: Reflow soldering should not be performed more than two times. Avoid mechanical stress on the LED during heating and do not warp the PCB after soldering.

5.3 Hand Soldering

If manual soldering is unavoidable:

• Use a soldering iron with a tip temperature <350°C.
• Limit contact time to ≤3 seconds per terminal.
• Use an iron with power ≤25W.
• Allow ≥2 seconds between soldering each terminal to avoid overheating.
• Hand soldering carries a higher risk of damage.

5.4 Rework and Repair

Repair after soldering is strongly discouraged. If absolutely necessary:

• Use a specialized double-head soldering iron designed for SMD removal to apply simultaneous, balanced heat to both terminals.
• Always verify that the repair process does not degrade the LED's characteristics.

6. Packaging and Ordering Information

6.1 Standard Packaging

The LEDs are supplied in moisture-resistant packaging:

• Carrier Tape: 8mm wide tape.
• Reel: 7-inch (178mm) diameter.
• Quantity: 2000 pieces per reel.
• The packaging includes a desiccant and is sealed in an aluminum moisture-proof bag.

6.2 Label Explanation

The reel label contains several codes:

• CPN: Customer's Product Number.
• P/N: Product Number (e.g., 12-22/BHR6C-A01/2C).
• QTY: Packing Quantity.
• CAT: Luminous Intensity Rank.
• HUE: Chromaticity Coordinates & Dominant Wavelength Rank.
• REF: Forward Voltage Rank.
• LOT No: Manufacturing Lot Number for traceability.

7. Application Design Considerations

7.1 Current Limiting is Mandatory

LEDs are current-driven devices. An external current-limiting resistor (or constant current driver) is absolutely required for each chip (BH and R6). The forward voltage (V_F) has a tolerance and a negative temperature coefficient (decreases as temperature rises). Connecting an LED directly to a voltage source, even one close to its nominal V_F, can cause a small voltage increase to drive a large, uncontrolled current surge, leading to instantaneous failure (burn-out). The resistor value is calculated using Ohm's Law: R = (V_supply - V_F) / I_F.

7.2 Thermal Management

While the package is small, power dissipation (40mW for BH, 60mW for R6) generates heat. For reliable long-term operation:

• Adhere to the forward current derating curve at elevated ambient temperatures.
• Ensure adequate PCB copper area (thermal relief pads) to conduct heat away from the LED solder joints.
• Avoid placing the LED near other heat-generating components.

7.3 ESD Protection

The blue (BH) chip is highly ESD sensitive (150V HBM). Implement ESD safeguards throughout the production process:

• Use grounded workstations and wrist straps during handling and assembly.
• Consider adding transient voltage suppression (TVS) diodes or other protection circuits on the PCB if the LED is connected to external interfaces prone to ESD events.

8. Technical Comparison and Positioning

The 12-22/BHR6C-A01/2C offers a specific combination of features:

• vs. Larger SMD LEDs (e.g., 3528, 5050): It provides a much smaller footprint for ultra-compact designs but with correspondingly lower maximum light output and power handling.
• vs. Single-Color 12-22 LEDs: The multi-color (blue+red) configuration in one package saves board space compared to using two separate single-color LEDs, simplifying assembly and inventory.
• vs. Leaded LEDs: It eliminates the need for through-holes, enables automated assembly, and reduces overall product size and weight.

Its primary advantage is enabling miniaturization in cost-sensitive, space-constrained indicator and backlight applications.

9. Frequently Asked Questions (FAQs)

9.1 Can I drive the blue and red chips simultaneously from the same power source?

Not directly in a simple series or parallel configuration due to their different forward voltages (V_F). The blue chip requires ~3V, while the red chip requires ~2V. If connected in parallel to a 3V source, the red chip would experience excessive current. If connected in series, a 5V+ source would be needed, and current matching would be poor. The recommended approach is to use separate current-limiting resistors for each chip, even if they share a common voltage rail, or to drive them independently.

9.2 Why is the ESD rating so different between the blue and red chips?

This is due to fundamental differences in semiconductor material technology. The blue LED uses an InGaN (Indium Gallium Nitride) structure grown on substrates like sapphire or silicon carbide, which can be more susceptible to electrostatic discharge damage at the microscopic junction level. The red LED uses an AlGaInP (Aluminum Gallium Indium Phosphide) structure, which is inherently more robust against ESD. This necessitates extra care when handling the blue component.

9.3 What does the "A01/2C" in the part number signify?

While the full internal coding isn't detailed in this excerpt, suffixes like these typically denote specific bins for key parameters such as luminous intensity (CAT), dominant wavelength/chromaticity (HUE), and forward voltage (REF). "A01" and "2C" likely specify the exact performance bins for the blue and red chips, respectively, ensuring color and brightness consistency within a production run.

10. Practical Design Example

Scenario: Design a bi-color status indicator using the 12-22/BHR6C-A01/2C. The LED will be powered from a 5V microcontroller GPIO pin. The goal is to drive each chip at approximately 5mA.

Calculation for Current-Limiting Resistors:

• For Blue Chip (BH, V_F ≈ 2.9V typ): R_blue = (5V - 2.9V) / 0.005A = 420 Ω. Use a standard 430 Ω resistor. Power dissipation in resistor: P = I²R = (0.005)² * 430 = 0.01075W (a 1/10W or 1/8W resistor is sufficient).
• For Red Chip (R6, V_F ≈ 1.95V typ): R_red = (5V - 1.95V) / 0.005A = 610 Ω. Use a standard 620 Ω resistor. Power dissipation: (0.005)² * 620 = 0.0155W.

Circuit: Connect the anode of each LED chip to the 5V supply via its respective calculated resistor. Connect the cathodes to separate GPIO pins of the microcontroller configured as open-drain/low outputs. To illuminate the blue LED, set its corresponding GPIO pin low. To illuminate the red, set its pin low. Ensure the microcontroller pin can sink the 5mA current.

11. Operating Principle

Light Emitting Diodes (LEDs) are semiconductor p-n junction devices. When a forward voltage exceeding the junction's built-in potential is applied, electrons from the n-type region recombine with holes from the p-type region within the active layer. This recombination process releases energy in the form of photons (light). The specific wavelength (color) of the emitted light is determined by the bandgap energy of the semiconductor materials used in the active region. The blue LED (BH) utilizes an InGaN compound, which has a larger bandgap, emitting higher-energy photons in the blue spectrum. The red LED (R6) utilizes an AlGaInP compound, which has a smaller bandgap, emitting lower-energy photons in the red spectrum. The epoxy resin lens shapes the light output and provides mechanical and environmental protection.

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