SMD LED 12-22/G6R8C-A30/2C Specification - 2.0x1.25x1.1mm - 2.0V - 60mW - Brilliant Yellow/Red - English Technical Document

1. Product Overview

The 12-22 SMD LED is a compact, surface-mount device designed for applications requiring reliable indicator lighting and backlighting in a minimal footprint. This multi-color variant features two distinct chip materials: the G6 for Brilliant Yellow emission and the R8 for Brilliant Red emission, both housed in a water-clear resin package. Its primary advantage lies in its significantly reduced size compared to traditional lead-frame LEDs, enabling higher board packing density, reduced storage requirements, and ultimately contributing to the miniaturization of end equipment. The lightweight construction further makes it ideal for space-constrained and portable applications.

2. Key Features and Compliance

This LED component is supplied on 8mm tape mounted on 7-inch diameter reels, ensuring compatibility with standard automated pick-and-place assembly equipment. It is designed for use with both infrared and vapor phase reflow soldering processes. The product is manufactured as Pb-free and is compliant with key environmental and safety regulations, including the EU RoHS directive, EU REACH, and halogen-free requirements (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm).

3. Absolute Maximum Ratings

The device's operational limits must not be exceeded to ensure reliability and prevent permanent damage. All ratings are specified at an ambient temperature (Ta) of 25°C.

• Reverse Voltage (V_R): 5 V
• Forward Current (I_F): 25 mA (Continuous for both G6 and R8)
• Peak Forward Current (I_FP): 60 mA (Duty cycle 1/10 @ 1kHz for both G6 and R8)
• Power Dissipation (P_d): 60 mW (for both G6 and R8)
• Operating Temperature (T_opr): -40°C to +85°C
• Storage Temperature (T_stg): -40°C to +90°C
• Electrostatic Discharge (ESD) Human Body Model: 2000 V (for both G6 and R8)
• Soldering Temperature: Reflow: 260°C max for 10 seconds; Hand Soldering: 350°C max for 3 seconds.

4. Electro-Optical Characteristics

The following parameters define the light output and electrical performance under standard test conditions (Ta=25°C, I_F=20mA unless noted).

4.1 Luminous Intensity and Angular Characteristics

The luminous intensity (I_v) for both the G6 (Yellow) and R8 (Red) LEDs has a typical range. The minimum is 28.5 mcd, and the maximum is 72.0 mcd. A tolerance of ±11% applies to the luminous intensity. The device features a wide viewing angle (2θ_1/2) of 120 degrees, providing broad, even illumination suitable for indicator applications.

4.2 Spectral Characteristics

• G6 (Brilliant Yellow): Peak Wavelength (λ_p): 575 nm (Typical). Dominant Wavelength (λ_d): 573 nm (Typical). Spectral Bandwidth (Δλ): 20 nm (Typical).
• R8 (Brilliant Red): Peak Wavelength (λ_p): 650 nm (Typical). Dominant Wavelength (λ_d): 639 nm (Typical). Spectral Bandwidth (Δλ): 20 nm (Typical).

4.3 Electrical Characteristics

• Forward Voltage (V_F): For both G6 and R8 types, the forward voltage typically measures 2.0V, with a range from 1.7V (Min) to 2.4V (Max) at I_F=20mA.
• Reverse Current (I_R): The maximum reverse current is 10 μA for both types when a reverse voltage (V_R) of 5V is applied.

5. Binning System for Luminous Intensity

The LEDs are sorted into bins based on their measured luminous intensity at 20mA to provide consistency in application design. The binning is identical for both the G6 and R8 variants.

• Bin Code N: Luminous Intensity range from 28.5 mcd (Min) to 45.0 mcd (Max).
• Bin Code P: Luminous Intensity range from 45.0 mcd (Min) to 72.0 mcd (Max).

The tolerance of ±11% applies within each bin.

6. Typical Performance Curves

The datasheet includes separate sets of characteristic curves for the G6 and R8 LEDs. These graphs visually represent the relationship between key parameters, aiding in circuit design and performance prediction. While the specific curves are not detailed in the text, they typically include plots of Relative Luminous Intensity vs. Forward Current, Forward Voltage vs. Forward Current, and Relative Luminous Intensity vs. Ambient Temperature. Analyzing these curves allows designers to understand how the LED's light output and voltage drop change with operating current and how its efficiency is affected by temperature, which is crucial for thermal management and ensuring consistent brightness over the device's operating range.

7. Mechanical and Package Information

7.1 Package Dimensions

The 12-22 SMD LED has a compact footprint. Key dimensions (in mm, with a general tolerance of ±0.1mm unless specified) include a package length of 2.0 mm, a width of 1.25 mm, and a height of 1.1 mm. The detailed dimensioned drawing specifies pad layout, cathode/anode marking, and lens geometry, which are critical for PCB land pattern design and ensuring proper soldering and alignment.

7.2 Polarity Identification

The component features a polarity indicator, typically a notch or a marked corner on the package, to distinguish the cathode. Correct orientation during assembly is essential for proper circuit function.

8. Soldering, Assembly, and Storage Guidelines

8.1 Current Protection and Storage

Over-current Protection: An external current-limiting resistor is mandatory. LEDs are current-driven devices, and a small change in forward voltage can cause a large, potentially destructive change in current. The resistor value must be calculated based on the supply voltage and the LED's forward voltage/current characteristics.

Storage Conditions: The LEDs are packaged in moisture-sensitive barrier bags with desiccant.

• Before Opening: Store at ≤30°C and ≤90% Relative Humidity (RH).
• After Opening: The "floor life" (time components can be exposed to ambient factory air) is 168 hours at ≤30°C and ≤60% RH.
• Rebaking: If the desiccant indicator shows saturation or the floor life is exceeded, a rebake at 60°C ±5°C for 24 hours is required before reflow soldering.

8.2 Soldering Process Parameters

Reflow Soldering (Pb-free profile):

• Pre-heating: 150-200°C for 60-120 seconds.
• Time above liquidus (217°C): 60-150 seconds.
• Peak Temperature: 260°C maximum, held for no more than 10 seconds.
• Heating Rate: Maximum 6°C/second up to 255°C.
• Cooling Rate: Maximum 3°C/second.

A maximum of two reflow cycles is permitted. Stress should not be applied to the LED body during heating, and the PCB should not be warped after soldering.

8.3 Hand Soldering and Rework

Hand soldering should be performed with an iron tip temperature below 350°C, applied for no more than 3 seconds per terminal. The soldering iron power should be 25W or less. A minimum interval of 2 seconds should be left between soldering each terminal. Rework is strongly discouraged after the initial soldering. If absolutely necessary, a specialized double-head soldering iron must be used to simultaneously heat both terminals and avoid mechanical stress. The potential for damage must be assessed beforehand.

9. Packaging and Ordering Information

9.1 Tape and Reel Specifications

The components are supplied in moisture-resistant packaging. They are loaded into carrier tape with pockets sized for the 12-22 package. The standard loaded quantity is 2000 pieces per 7-inch diameter reel. Detailed reel and carrier tape dimensions are provided to ensure compatibility with automated assembly equipment feeders.

9.2 Label Explanation

The packaging label contains several codes:

• CPN: Customer's Product Number
• P/N: Manufacturer's Product Number (e.g., 12-22/G6R8C-A30/2C)
• QTY: Packing Quantity
• CAT: Luminous Intensity Rank (Bin Code, e.g., N, P)
• HUE: Chromaticity Coordinates & Dominant Wavelength Rank
• REF: Forward Voltage Rank
• LOT No: Traceable Manufacturing Lot Number

10. Application Notes and Design Considerations

10.1 Typical Applications

This LED is well-suited for a variety of low-power indicator and backlighting roles:

• Automotive/Industrial: Backlighting for dashboard instruments, switches, and control panels.
• Telecommunications: Status indicators and keypad backlighting in telephones and fax machines.
• Consumer Electronics: Flat backlighting for small LCDs, switch illumination, and symbol lighting.
• General Purpose: Any application requiring a compact, reliable, multi-color indicator.

10.2 Critical Design Considerations

Thermal Management: Although power dissipation is low (60mW max), maintaining the junction temperature within limits is vital for long-term reliability and stable light output. Ensure adequate PCB copper area or thermal vias if operating at high ambient temperatures or high currents.

Drive Circuit: Always use a constant-current driver or a voltage source with a series resistor. The resistor value (R) can be approximated as R = (V_supply - V_F) / I_F. Use the maximum V_F from the datasheet for a conservative design to ensure the current does not exceed the maximum rating.

ESD Protection: While the device has a 2000V HBM ESD rating, standard ESD handling precautions should be observed during assembly and handling to prevent latent damage.

11. Application Restrictions and Reliability Note

This product is intended for general commercial and industrial applications. It is not specifically designed or qualified for high-reliability applications where failure could lead to serious safety or security consequences. Such applications include, but are not limited to, military/aerospace systems, automotive safety-critical systems (e.g., airbags, braking), and life-supporting medical equipment. For these applications, products with different specifications, qualification levels, and reliability data are required. The performance and quality guarantees provided in this datasheet apply to the component as an individual part under the specified conditions. Using the product outside these specifications voids such guarantees and may lead to premature failure.

12. Technical Deep Dive: AlGaInP Chip Technology

The G6 and R8 LEDs utilize Aluminum Gallium Indium Phosphide (AlGaInP) semiconductor material. This compound semiconductor is particularly efficient for producing high-brightness light in the amber, yellow, orange, and red regions of the visible spectrum. The "Brilliant" designation often refers to a specific formulation and epitaxial structure that enhances luminous efficacy and color purity compared to standard AlGaInP or older GaAsP technologies. The water-clear resin package, as opposed to a diffused or tinted resin, allows the intrinsic, saturated color of the chip to be emitted directly, resulting in high chromaticity and a well-defined spectral peak. This makes these LEDs excellent for color-coded status indicators where distinct color recognition is important.

13. Comparison with Alternative LED Technologies

Compared to other SMD LED packages, the 12-22 format offers a balance between size and ease of handling/manufacturing. It is larger than ultra-miniature packages like 0402 but provides a more robust target for soldering and inspection. Its 120-degree viewing angle is typical for a standard LED dome lens, providing a good compromise between focused beam and wide area illumination. For applications requiring even wider angles (140-160 degrees), LEDs with a different lens shape would be more suitable. The forward voltage of ~2.0V is standard for AlGaInP LEDs, which is higher than infrared LEDs but lower than blue/white InGaN LEDs (typically ~3.0V+). This voltage must be considered when designing for battery-powered devices.

14. Frequently Asked Questions (FAQ)

Q: Can I drive this LED directly from a 3.3V or 5V logic line?
A: No. You must use a series current-limiting resistor. For example, with a 5V supply and a typical V_F of 2.0V at 20mA, the resistor value would be R = (5V - 2.0V) / 0.020A = 150 Ohms. A 150Ω or 160Ω resistor would be appropriate.

Q: What is the difference between Peak Wavelength and Dominant Wavelength?
A: Peak Wavelength (λ_p) is the wavelength at which the spectral power distribution is maximum. Dominant Wavelength (λ_d) is the single wavelength of monochromatic light that matches the perceived color of the LED. For LEDs with a narrow spectrum, like these, the two values are very close.

Q: Why is the storage and baking procedure so important?
A: SMD packages can absorb moisture from the air. During the high-temperature reflow soldering process, this trapped moisture can rapidly expand, causing internal delamination or "popcorning" that cracks the package or breaks the wire bonds, leading to immediate or latent failure.

Q: How do I interpret the Bin Codes (N, P) in my design?
A: If consistent brightness across multiple LEDs in an array is critical, specify a single bin code (e.g., all "P" bin) when ordering. For less critical applications, mixing bins may be acceptable but could lead to visible brightness variations.