SMD LED 23-22B/R7G6C-A30/2T Datasheet - Multi-Color - 2.0V - 60mW - English Technical Document

1. Product Overview

The 23-22B/R7G6C-A30/2T is a multi-color Surface Mount Device (SMD) LED designed for modern, compact electronic applications. This component integrates two distinct chip types within a single package: the R7 chip emitting a dark red color and the G6 chip emitting a brilliant yellow-green color. Its primary advantage lies in its miniature size, which facilitates higher packing density on printed circuit boards (PCBs), leading to reduced overall equipment size and weight. This makes it particularly suitable for applications where space and weight are critical constraints.

The LED is packaged on 8mm tape wound onto a 7-inch diameter reel, making it fully compatible with high-speed automatic pick-and-place equipment used in volume manufacturing. It is constructed using lead-free (Pb-free) materials and complies with key environmental regulations including RoHS, EU REACH, and halogen-free standards (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm). The device is also qualified for standard infrared and vapor phase reflow soldering processes.

1.1 Core Advantages and Target Market

The core advantages of this SMD LED stem from its small form factor and dual-color capability. By being significantly smaller than traditional lead-frame LEDs, it enables designers to create more compact products. The reduced storage space for components and the final assembled product offers logistical and cost benefits. Its lightweight nature is ideal for portable and miniature devices.

The target applications are diverse, focusing on indicator and backlighting functions. Key markets include automotive interiors (e.g., dashboard and switch backlighting), telecommunications equipment (e.g., indicator and backlighting in telephones and fax machines), and consumer electronics (e.g., flat backlighting for LCDs, switches, and symbols). It is also suitable for general-purpose indicator use where reliable, multi-color signaling is required.

2. Technical Parameter Analysis

2.1 Absolute Maximum Ratings

Operating the device beyond these limits may cause permanent damage. The absolute maximum ratings are specified at an ambient temperature (Ta) of 25°C.

• Reverse Voltage (VR): 5 V. Exceeding this voltage in reverse bias can damage the LED's semiconductor junction.
• Forward Current (IF): 25 mA for both R7 and G6 chips. This is the maximum continuous DC current.
• Peak Forward Current (IFP): 60 mA for both chips, permissible only under pulsed conditions (duty cycle 1/10 @ 1 kHz).
• Power Dissipation (Pd): 60 mW for each chip. This is the maximum power the package can dissipate.
• Operating Temperature (Topr): -40 to +85 °C. The device is rated for industrial temperature ranges.
• Storage Temperature (Tstg): -40 to +90 °C.
• Electrostatic Discharge (ESD): 2000 V (Human Body Model). Proper ESD handling procedures are mandatory.
• Soldering Temperature (Tsol): For reflow soldering, a peak temperature of 260°C for up to 10 seconds is allowed. For hand soldering, the iron tip temperature must be below 350°C for a maximum of 3 seconds per terminal.

2.2 Electro-Optical Characteristics

The typical performance is measured at Ta=25°C and IF=20mA, unless otherwise stated. A viewing angle (2θ1/2) of 130 degrees is typical for this package.

For the R7 (Dark Red) Chip:

• Luminous Intensity (Iv): Ranges from 18.0 mcd (minimum) to 72.0 mcd (maximum), with a typical tolerance of ±11%.
• Peak Wavelength (λp): Typically 639 nm.
• Dominant Wavelength (λd): Typically 631 nm.
• Spectrum Bandwidth (Δλ): Typically 20 nm.
• Forward Voltage (VF): Ranges from 1.70 V (min) to 2.40 V (max), with a typical value of 2.00 V.

For the G6 (Brilliant Yellow Green) Chip:

• Luminous Intensity (Iv): Ranges from 14.5 mcd (min) to 45.0 mcd (max), with a typical tolerance of ±11%.
• Peak Wavelength (λp): Typically 575 nm.
• Dominant Wavelength (λd): Typically 573 nm.
• Spectrum Bandwidth (Δλ): Typically 20 nm.
• Forward Voltage (VF): Ranges from 1.70 V (min) to 2.40 V (max), with a typical value of 2.00 V.

Common Parameter:

• Reverse Current (IR): Maximum of 10 µA for both chips when a reverse voltage of 5V is applied.

3. Binning System Explanation

The luminous intensity of the LEDs is sorted into bins to ensure consistency within a production batch. This allows designers to select components that meet specific brightness requirements.

3.1 R7 Chip Binning

The R7 dark red LEDs are categorized into three bins based on their luminous intensity measured at IF=20mA.

• Bin Code 1: 18.0 mcd (Min) to 28.5 mcd (Max)
• Bin Code 2: 28.5 mcd (Min) to 45.0 mcd (Max)
• Bin Code 3: 45.0 mcd (Min) to 72.0 mcd (Max)

3.2 G6 Chip Binning

The G6 brilliant yellow-green LEDs are also categorized into three bins.

• Bin Code 1: 14.5 mcd (Min) to 18.0 mcd (Max)
• Bin Code 2: 18.0 mcd (Min) to 28.5 mcd (Max)
• Bin Code 3: 28.5 mcd (Min) to 45.0 mcd (Max)

The bin code is indicated on the product packaging label (under \"CAT\"). Designers should specify the required bin code when ordering to guarantee the desired brightness level for their application.

4. Performance Curve Analysis

The datasheet includes typical electro-optical characteristic curves for both the R7 and G6 chips. While the specific graphical data is not provided in text form, these curves typically illustrate the relationship between forward current (IF) and luminous intensity (Iv), forward voltage (VF), and the effect of ambient temperature on light output.

Key Inferences from Typical Curves: For both LED types, the luminous intensity increases with forward current but not linearly, especially as current approaches the maximum rating. The forward voltage has a negative temperature coefficient, meaning it decreases slightly as the junction temperature rises. Understanding these curves is crucial for designing appropriate current-limiting circuits and for thermal management to maintain consistent optical performance over the operating temperature range.

5. Mechanical and Package Information

5.1 Package Outline Dimensions

The 23-22B SMD LED has a specific physical footprint. The package outline drawing provides critical dimensions for PCB land pattern design. Key dimensions include the overall length, width, and height, as well as the placement and size of the solder pads. The cathode (negative terminal) is typically identified by a marking on the package. All tolerances are ±0.1mm unless otherwise specified. Designers must adhere to these dimensions to ensure proper soldering and mechanical stability.

5.2 Moisture Resistant Packaging

The components are shipped in moisture-sensitive packaging to prevent damage from ambient humidity. The package consists of a carrier tape loaded with LEDs, placed inside an aluminum moisture-proof bag along with a desiccant and a humidity indicator card. The reel dimensions and carrier tape pocket dimensions are specified to ensure compatibility with automated assembly equipment. Each reel contains 2000 pieces.

6. Soldering and Assembly Guidelines

6.1 Storage and Handling

• Do not open the moisture-proof bag until ready for use.
• Before opening: Store at ≤ 30°C and ≤ 90% RH.
• After opening: The \"floor life\" is 1 year at ≤ 30°C and ≤ 60% RH. Unused parts must be resealed in a dry package.
• If the desiccant indicates moisture exposure or the storage time is exceeded, a baking treatment (60 ± 5°C for 24 hours) is required before soldering.

6.2 Reflow Soldering Profile

A lead-free (Pb-free) reflow profile is recommended:

• Pre-heating: 150–200°C for 60–120 seconds.
• Time above 217°C (Liquidus): 60–150 seconds.
• Peak Temperature: 260°C maximum, held for a maximum of 10 seconds.
• Heating Rate: Maximum 6°C/sec above 255°C.
• Cooling Rate: Maximum 3°C/sec.
• Reflow soldering should not be performed more than two times.

6.3 Hand Soldering and Repair

• Use a soldering iron with a tip temperature < 350°C and capacity < 25W.
• Limit soldering time to 3 seconds per terminal.
• Avoid stress on the LED during heating and do not warp the PCB after soldering.
• Repair after soldering is not recommended. If unavoidable, use a specialized double-head soldering iron to simultaneously heat both terminals and confirm that the LED's characteristics are not degraded.

7. Packaging and Ordering Information

The product label on the reel provides essential information for traceability and correct application:

• CPN: Customer's Product Number
• P/N: Product Number (e.g., 23-22B/R7G6C-A30/2T)
• QTY: Packing Quantity (2000 pcs/reel)
• CAT: Luminous Intensity Rank (Bin Code)
• HUE: Chromaticity Coordinates & Dominant Wavelength Rank
• REF: Forward Voltage Rank
• LOT No: Manufacturing Lot Number

8. Application Design Considerations

8.1 Circuit Protection

Critical: An external current-limiting resistor must always be used in series with the LED. The forward voltage has a range (1.7V to 2.4V), and the IV characteristic is steep. A small change in supply voltage can cause a large, potentially destructive change in forward current if no resistor is present. The resistor value should be calculated based on the maximum supply voltage and the LED's maximum forward current rating, considering the worst-case forward voltage.

8.2 Thermal Management

While the power dissipation is low (60mW), maintaining the junction temperature within the specified operating range is vital for long-term reliability and stable light output. Ensure adequate PCB copper area or thermal vias are used, especially if multiple LEDs are placed closely together or if the ambient temperature is high.

8.3 Application Restrictions

This product is designed for general commercial and industrial applications. It is not specifically qualified for high-reliability applications such as military/aerospace, automotive safety/security systems (e.g., airbags, braking), or life-critical medical equipment without prior consultation and potential additional qualification.

9. Technical Comparison and Differentiation

The 23-22B's primary differentiation lies in its multi-color capability within a single, very compact SMD package. Compared to using two separate single-color LEDs, it saves PCB space and simplifies assembly. The use of AlGaInP material for both colors offers good luminous efficiency and color purity. Its compatibility with standard, high-volume SMT processes makes it a cost-effective solution for mass-produced consumer and automotive interior electronics.

10. Frequently Asked Questions (FAQ)

10.1 Can I drive the R7 and G6 chips independently?

Yes, the 23-22B package contains two electrically isolated LED chips. They have separate anode and cathode connections, allowing them to be driven independently by separate current-limiting circuits. This enables dynamic color mixing or independent signaling.

10.2 What is the purpose of the binning system?

Binning ensures brightness consistency within a production run. For applications requiring uniform appearance (e.g., backlighting an array of indicators), specifying and using LEDs from the same bin code is essential to avoid visible brightness variations.

10.3 Why is moisture-sensitive packaging necessary?

SMD packages can absorb moisture from the air. During the high-temperature reflow soldering process, this trapped moisture can rapidly expand, causing internal delamination or \"popcorning,\" which cracks the package and destroys the device. The moisture-barrier bag and desiccant prevent this during storage and transport.

11. Design and Usage Case Study

Scenario: Designing a Multi-Function Status Indicator for a Network Router. A designer needs a single component to show power (steady red), network activity (blinking green), and a fault condition (alternating red/green). The 23-22B is an ideal choice. Its small size fits the limited front-panel space. The independent red (R7) and green (G6) chips can be controlled by a simple microcontroller GPIO pins via transistor drivers. By specifying Bin Code 2 for both colors, consistent brightness is achieved across all manufactured units. The designer follows the reflow profile guidelines and includes appropriate series resistors (e.g., 150 Ohm for a 5V supply, calculated for worst-case Vf) to ensure reliable operation over the product's lifespan.

12. Operating Principle

Light Emitting Diodes (LEDs) are semiconductor devices that emit light when an electric current passes through them. This phenomenon is called electroluminescence. In the 23-22B, the R7 chip uses an AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor structure optimized to emit light in the red portion of the spectrum (around 631nm dominant wavelength). The G6 chip uses a different composition of AlGaInP to emit light in the yellow-green region (around 573nm). When a forward voltage exceeding the chip's bandgap energy is applied, electrons and holes recombine in the active region of the semiconductor, releasing energy in the form of photons (light). The specific material composition determines the wavelength (color) of the emitted light.

13. Technology Trends

The trend in indicator and backlight LEDs continues toward higher efficiency (more light output per watt of electrical input), smaller package sizes for greater design flexibility, and improved color consistency and stability over temperature and lifetime. Multi-chip packages like the 23-22B represent an integration trend, reducing component count on the PCB. Furthermore, environmental compliance (Pb-free, halogen-free) is now a standard requirement driven by global regulations. Future developments may include even thinner packages and integration with control circuitry for \"smart LED\" modules.