SMD LED 17-215/S2C-CP2R1B/3T Datasheet - Brilliant Orange - 2.0x1.25x0.8mm - 2.35V Max - 60mW - English Technical Document

1. Product Overview

The 17-215/S2C-CP2R1B/3T is a surface-mount device (SMD) LED designed for high-density, miniature applications. It utilizes AIGaInP semiconductor technology to produce a brilliant orange light output. This component is characterized by its compact footprint, lightweight construction, and compatibility with modern automated assembly processes.

1.1 Core Advantages

The primary advantages of this LED stem from its SMD package. Its significantly smaller size compared to traditional lead-frame LEDs enables the design of more compact printed circuit boards (PCBs). This leads to higher component packing density, reduced storage space requirements for both components and finished products, and ultimately allows for the creation of smaller end-user equipment. The lightweight nature of the package makes it particularly suitable for portable and miniature electronic devices where weight is a critical factor.

1.2 Target Market and Applications

This LED is targeted at general illumination and indicator applications across consumer and industrial electronics. Specific application areas include backlighting for instrument panels, switches, and symbols; indicator and backlighting functions in telecommunication devices such as telephones and fax machines; and as a flat backlight source for liquid crystal displays (LCDs). Its general-purpose design makes it suitable for a wide range of other indicator and low-level illumination tasks.

2. Technical Specifications Deep Dive

This section provides a detailed, objective analysis of the device's key technical parameters as defined in its absolute maximum ratings and electro-optical characteristics.

2.1 Absolute Maximum Ratings

The absolute maximum ratings define the stress limits beyond which permanent damage to the device may occur. These are not recommended operating conditions.

• Reverse Voltage (V_R): 5V. Exceeding this voltage in reverse bias can cause junction breakdown.
• Continuous Forward Current (I_F): 25 mA. The maximum DC current that can be continuously applied.
• Peak Forward Current (I_FP): 60 mA. This is permissible only under pulsed conditions (duty cycle 1/10 at 1 kHz) to handle transient surges.
• Power Dissipation (P_d): 60 mW. The maximum power the package can dissipate, calculated as forward voltage multiplied by forward current, considering thermal limitations.
• Electrostatic Discharge (ESD): Human Body Model (HBM) rating of 2000V. This indicates a moderate level of ESD robustness; proper handling procedures are still essential.
• Temperature Ranges: Operating from -40°C to +85°C and storage from -40°C to +90°C, making it suitable for industrial environments.
• Soldering Temperature: Withstands reflow soldering at 260°C for 10 seconds or hand soldering at 350°C for 3 seconds, compatible with lead-free (Pb-free) processes.

2.2 Electro-Optical Characteristics

Measured at a standard test condition of 25°C and a forward current (I_F) of 20 mA, these parameters define the device's performance.

• Luminous Intensity (I_v): Ranges from a minimum of 57.00 mcd to a maximum of 140.00 mcd. The typical value is not specified, indicating performance is managed through a binning system (see Section 3).
• Viewing Angle (2θ_1/2): A typical wide viewing angle of 130 degrees, providing a broad emission pattern suitable for backlighting and indicator applications.
• Peak Wavelength (λ_p): Typically 611 nm, placing the emission in the orange region of the visible spectrum.
• Dominant Wavelength (λ_d): Ranges from 603.50 nm to 609.50 nm. This is the wavelength perceived by the human eye and is tightly controlled.
• Spectral Bandwidth (Δλ): Typically 17 nm, indicating a relatively narrow spectral emission centered around the peak wavelength.
• Forward Voltage (V_F): Ranges from 1.75V to 2.35V at 20 mA. This parameter is also binned.
• Reverse Current (I_R): Maximum of 10 μA when a 5V reverse bias is applied. The datasheet explicitly notes the device is not designed for reverse operation; this test is for quality verification only.

3. Binning System Explanation

To ensure consistent performance in production, LEDs are sorted into performance bins. This allows designers to select parts that meet specific criteria for their application.

3.1 Luminous Intensity Binning

Luminous intensity is categorized into four bins (P2, Q1, Q2, R1), with minimum and maximum values defined. For example, bin R1 contains LEDs with intensity between 112.00 mcd and 140.00 mcd. Designers can specify a bin code to guarantee a minimum brightness level for their application.

3.2 Dominant Wavelength Binning

Dominant wavelength, which correlates with perceived color, is binned into two ranges: D9 (603.50 - 606.50 nm) and D10 (606.50 - 609.50 nm). This tight control ensures color consistency across multiple LEDs in an array or display.

3.3 Forward Voltage Binning

Forward voltage is binned into three codes: 0 (1.75 - 1.95V), 1 (1.95 - 2.15V), and 2 (2.15 - 2.35V). Knowledge of the V_F bin can be important for power supply design, especially when driving multiple LEDs in series, to ensure uniform current distribution and brightness.

4. Performance Curve Analysis

While the PDF references typical electro-optical characteristic curves, the specific graphs for parameters like relative luminous intensity vs. forward current, forward voltage vs. junction temperature, and spectral distribution are not provided in the extracted content. In a full datasheet, these curves are critical for understanding device behavior under non-standard conditions (e.g., different drive currents or ambient temperatures). Designers would use the IV curve to determine the necessary current-limiting resistor value and the temperature derating curves to understand how luminous output decreases as junction temperature rises.

5. Mechanical and Package Information

5.1 Package Dimensions

The device features a standard SMD package. The key dimensions (with a typical tolerance of ±0.1mm unless otherwise noted) are approximately 2.0mm in length, 1.25mm in width, and 0.8mm in height. The datasheet includes a detailed dimensioned drawing showing pad layout, component outline, and polarity marking (typically indicated by a cathode mark on the package).

5.2 Polarity Identification and Mounting

Correct polarity is essential for operation. The package includes a visual marker to identify the cathode. The recommended PCB land pattern (pad design) is provided to ensure proper solder joint formation and mechanical stability during reflow. Adherence to this pattern is crucial for reliable automated assembly.

6. Soldering and Assembly Guidelines

Proper handling and soldering are critical to reliability.

6.1 Storage and Moisture Sensitivity

The components are packaged in a moisture-resistant bag with desiccant. The bag should not be opened until the parts are ready for use. After opening, unused LEDs must be stored at ≤30°C and ≤60% relative humidity and used within 168 hours (7 days). If this window is exceeded or the desiccant indicator shows saturation, a bake-out at 60 ±5°C for 24 hours is required before soldering to prevent \"popcorning\" damage during reflow.

6.2 Reflow Soldering Profile

A lead-free (Pb-free) reflow profile is specified:

• Pre-heating: 150-200°C for 60-120 seconds.
• Time Above Liquidus (217°C): 60-150 seconds.
• Peak Temperature: 260°C maximum, held for no more than 10 seconds.
• Heating Rate: Maximum 6°C/second up to 255°C.
• Cooling Rate: Maximum 3°C/second.

6.3 Hand Soldering and Rework

If hand soldering is necessary, the iron tip temperature must be below 350°C, applied for no more than 3 seconds per terminal. A low-power iron (<25W) is recommended. A cooling interval of at least 2 seconds should be observed between soldering each terminal. Rework is strongly discouraged. If absolutely unavoidable, a specialized double-head soldering iron must be used to simultaneously heat both terminals, and the impact on LED characteristics must be verified beforehand.

7. Packaging and Ordering Information

7.1 Tape and Reel Packaging

The LEDs are supplied in 8mm wide embossed carrier tape wound onto 7-inch diameter reels. Each reel contains 3000 pieces. Detailed dimensions for the carrier tape pockets and the reel are provided to ensure compatibility with automated pick-and-place equipment.

7.2 Label Explanation

The reel label contains critical information for traceability and correct application:

• P/N: The manufacturer's product number (17-215/S2C-CP2R1B/3T).
• CAT: The luminous intensity bin code (e.g., P2, Q1, R1).
• HUE: The dominant wavelength bin code (e.g., D9, D10).
• REF: The forward voltage bin code (e.g., 0, 1, 2).
• LOT No: Manufacturing lot number for quality tracking.

8. Application Design Considerations

8.1 Current Limiting is Mandatory

LEDs are current-driven devices. An external current-limiting resistor is absolutely required. The forward voltage has a negative temperature coefficient and a manufacturing tolerance. A slight increase in supply voltage without a series resistor will cause a large, potentially destructive increase in forward current. The resistor value (R) is calculated using Ohm's Law: R = (V_supply - V_F) / I_F, where I_F is the desired drive current (≤25 mA DC).

8.2 Thermal Management

While the package is small, power dissipation (up to 60 mW) generates heat. For optimal longevity and stable light output, ensure the PCB provides adequate thermal relief. Avoid placing the LED in enclosed spaces without ventilation. The maximum operating temperature is 85°C ambient; the actual junction temperature will be higher.

8.3 Application Restrictions

This product is designed for general commercial and industrial applications. It is not specifically qualified for high-reliability applications where failure could lead to serious injury or loss, such as automotive safety systems (airbags, braking), military/aerospace systems, or life-support medical equipment. For such applications, components with appropriate qualifications and reliability data must be sourced.

9. Technical Comparison and Differentiation

The key differentiators of this LED are its combination of a very compact SMD package (enabling miniaturization), a wide 130-degree viewing angle (good for area illumination), and the use of AIGaInP technology which typically offers higher efficiency and better color saturation in the red-orange-amber spectrum compared to older technologies like GaAsP. Its compliance with RoHS, REACH, and halogen-free standards makes it suitable for global markets with strict environmental regulations.

10. Frequently Asked Questions (FAQ)

Q: What resistor do I need for a 5V supply to drive this LED at 20mA?

A: Using the maximum V_F of 2.35V for a conservative design: R = (5V - 2.35V) / 0.020A = 132.5Ω. A standard 130Ω or 150Ω resistor would be suitable. Always confirm actual current with measurements.

Q: Can I pulse this LED at higher currents for brighter flashes?

A: Yes, but only within the Absolute Maximum Ratings. You can pulse at up to 60 mA, but the duty cycle must be 10% or less (e.g., 1ms on, 9ms off) at a frequency of 1 kHz. The average current must not exceed 25 mA.

Q: How do I ensure consistent color across multiple LEDs in my product?

A: Specify a tight dominant wavelength bin (either D9 or D10, not mixed) when ordering. For the highest consistency, order from the same manufacturing lot (LOT No.).

Q: The bag has been open for a week. Can I still use the LEDs?

A: First, check the desiccant indicator. If it has changed color, or if 168 hours have passed since opening, you must bake the LEDs at 60°C for 24 hours before attempting to solder them to prevent moisture-induced damage.

11. Design and Usage Case Study

Scenario: Designing a status indicator panel for a network router. The panel requires 10 orange LEDs to show link activity and power status. Space is limited on the PCB.

Design Choices: The 17-215 LED is selected for its small 2.0x1.25mm footprint, allowing all 10 LEDs to fit in a tight row. The wide 130-degree viewing angle ensures the indicators are visible from various angles. The designer specifies bin R1 for luminous intensity to guarantee visibility in a well-lit room and bin D10 for a consistent orange hue. A 150Ω resistor is placed in series with each LED, connected to the 3.3V system rail, resulting in a drive current of approximately 18-20 mA depending on the individual LED's V_F bin. The PCB layout follows the recommended pad pattern, and the assembly house uses the specified lead-free reflow profile.

12. Technology Principle Introduction

This LED is based on Aluminum Indium Gallium Phosphide (AIGaInP) semiconductor material grown on a substrate. When a forward voltage is applied, electrons and holes are injected into the active region where they recombine, releasing energy in the form of photons (light). The specific ratio of aluminum, indium, and gallium in the crystal lattice determines the bandgap energy, which directly defines the wavelength (color) of the emitted light—in this case, orange (~611 nm). The \"water clear\" resin lens is used to maximize light extraction from the semiconductor chip without altering the color, unlike diffused or tinted resins.

13. Industry Trends and Developments

The trend in SMD LEDs for indicator and backlight applications continues toward higher efficiency (more light output per mA of current), smaller package sizes for increased density, and improved color consistency and stability over temperature and lifetime. There is also a strong drive for broader adoption of environmentally friendly materials, as evidenced by this product's compliance with halogen-free and Pb-free standards. Furthermore, integration of features, such as built-in current-limiting resistors or IC drivers within the LED package, is a growing trend to simplify circuit design and save board space, though this particular device remains a discrete component.