3020 Series Single Chip 0.2W White LED Datasheet - Dimensions 3.0x2.0mm - Voltage 3.2V - Power 0.2W - English Technical Documentation

1. Product Overview

The 3020 series is a compact, high-performance surface-mount device (SMD) LED designed for general lighting applications requiring reliable, energy-efficient white light sources. This single-chip, 0.2W white LED offers a balance of luminous efficacy, thermal performance, and cost-effectiveness, making it suitable for a wide range of commercial and industrial lighting products.

Its core advantages include a compact footprint of 3.0mm x 2.0mm, a wide viewing angle of 110 degrees, and robust construction suitable for standard reflow soldering processes. The target market encompasses backlighting units, decorative lighting, indicator lights, and integration into various consumer electronics and signage.

2. Technical Parameters and Specifications

2.1 Absolute Maximum Ratings (T_s=25°C)

The following parameters define the limits beyond which permanent damage to the LED may occur. Operation under these conditions is not guaranteed.

• Forward Current (I_F): 80 mA (Continuous)
• Forward Pulse Current (I_FP): 120 mA (Pulse width ≤10ms, Duty cycle ≤1/10)
• Power Dissipation (P_D): 280 mW
• Operating Temperature (T_opr): -40°C to +80°C
• Storage Temperature (T_stg): -40°C to +80°C
• Junction Temperature (T_j): 125°C
• Soldering Temperature (T_sld): 230°C or 260°C for 10 seconds (Reflow)

2.2 Electro-Optical Characteristics (T_s=25°C, I_F=60mA)

These are the typical performance parameters under standard test conditions.

• Forward Voltage (V_F): Typical 3.2V, Maximum 3.5V
• Reverse Voltage (V_R): 5V
• Reverse Current (I_R): Maximum 10 µA
• Viewing Angle (2θ_1/2): 110°

3. Binning System Explanation

The product is classified into bins to ensure color and brightness consistency within an application. The ordering code defines these bins.

3.1 Model Numbering Rule

The part number structure is: T [Shape Code] [Chip Count] [Lens Code] [Internal Code] - [Flux Code] [CCT Code]. For example, T3400SLA corresponds to a 3020 shape (34), single small-power chip (S), no lens (00), internal code A, with specific flux and CCT bins defined by the final suffix.

3.2 Correlated Color Temperature (CCT) Binning

LEDs are binned into specific chromaticity ellipses on the CIE diagram to guarantee color uniformity. The standard ordering bins are:

• 2725K ±145K (Bin 27M5)
• 3045K ±175K (Bin 30M5)
• 3985K ±275K (Bin 40M5)
• 5028K ±283K (Bin 50M5)
• 5665K ±355K (Bin 57M7)
• 6530K ±510K (Bin 65M7)

Each bin is defined by an ellipse center point (x, y), major/minor axis radii, and rotation angle, conforming to 5-step or 7-step MacAdam ellipse standards for tight color control.

3.3 Luminous Flux Binning

Flux is binned by minimum value at 60mA. The tables define minimum and typical flux ranges for Warm White (2700-3700K), Neutral White (3700-5000K), and Cool White (5000-7000K), each available in standard (CRI≥70) and high-color-rendering (CRI≥80) versions. Codes range from D1 (e.g., 18-19 lm min) to D8 (e.g., 25-26 lm min).

3.4 Forward Voltage Binning

To aid in current matching in multi-LED designs, V_F is binned in 0.1V steps. The bins are: B (2.8-2.9V), C (2.9-3.0V), D (3.0-3.1V), E (3.1-3.2V), F (3.2-3.3V), G (3.3-3.4V), H (3.5-3.6V).

3.5 Measurement Tolerances

• Luminous Flux: ±7%
• Forward Voltage: ±0.08V
• Color Rendering Index (CRI): ±2
• Chromaticity Coordinates: ±0.005

4. Performance Curve Analysis

4.1 Current-Voltage (I-V) Characteristic Curve

The graph shows the relationship between forward voltage and forward current. The curve is typical for a GaN-based LED, exhibiting an exponential rise after the turn-on voltage (~2.7V). Operating at the recommended 60mA ensures optimal efficiency and longevity, avoiding the high-current region where efficiency drops and heat generation increases significantly.

4.2 Relative Luminous Flux vs. Forward Current

This curve demonstrates the light output's dependence on drive current. While flux increases with current, it becomes sub-linear at higher currents due to efficiency droop and increased junction temperature. The 60mA operating point is chosen to balance output and efficacy. Driving above the absolute maximum rating (80mA continuous) drastically reduces lifetime and reliability.

4.3 Spectral Power Distribution (SPD)

The relative spectral energy curve shows the emission spectrum for different CCT ranges (2600-3700K, 3700-5000K, 5000-10000K). Cool white LEDs have a stronger blue peak from the chip and less phosphor-converted yellow/red light, while warm white LEDs show a more pronounced broad phosphor emission, resulting in a higher red spectral content and lower correlated color temperature.

4.4 Junction Temperature vs. Relative Spectral Energy

This graph illustrates the effect of junction temperature (T_j) on the LED's spectrum. As T_j increases, the overall spectral output typically decreases (efficiency drop), and the peak wavelength may shift slightly. Effective thermal management is crucial to maintain consistent color point and light output over the product's lifetime.

5. Mechanical and Package Information

5.1 Outline Dimensions

The LED package has dimensions of 3.0mm (length) x 2.0mm (width). The dimensional drawing specifies all critical measurements, including lens height and pad locations. Tolerances are defined as ±0.10mm for .X dimensions and ±0.05mm for .XX dimensions.

5.2 Pad Layout and Stencil Design

Separate diagrams are provided for the recommended PCB land pattern (pad layout) and the solder paste stencil design. The land pattern ensures proper solder joint formation and mechanical stability. The stencil design controls the volume of solder paste deposited, which is critical for achieving reliable solder joints without bridging or insufficient solder. Following these guidelines is essential for high-yield assembly.

5.3 Polarity Identification

The cathode is typically marked on the LED package. The pad layout diagram also indicates the anode and cathode connections. Correct polarity must be observed during assembly to prevent reverse bias, which can damage the LED at voltages exceeding the reverse voltage rating (5V).

6. Soldering and Assembly Guidelines

6.1 Moisture Sensitivity and Baking

The 3020 LED package is moisture-sensitive (MSL classified per IPC/JEDEC J-STD-020C). Exposure to ambient humidity after opening the moisture barrier bag can lead to popcorn cracking or delamination during reflow soldering due to rapid vapor expansion.

• Storage: Unopened bags should be stored below 30°C/85% RH. After opening, store at 5-30°C with humidity as low as possible (<20% RH recommended).
• Floor Life: The time between bag opening and reflow must be controlled. Check the humidity indicator card inside the bag immediately upon opening.
• Baking Conditions: If LEDs have been exposed to humidity beyond specifications, they must be baked before reflow. Recommended bake: 60°C for 24 hours on the original reel. Do not exceed 60°C. Use within 1 hour after baking or store in a dry cabinet (<20% RH).

6.2 Reflow Soldering Profile

The LED can withstand a peak reflow temperature of 230°C or 260°C for a maximum of 10 seconds. A standard lead-free (SAC305) reflow profile is applicable. Ensure the temperature ramp rate is controlled to minimize thermal shock. The provided maximum soldering temperature rating must not be exceeded to avoid damaging the epoxy lens, phosphor, or wire bonds.

7. Packaging and Ordering Information

The LEDs are typically supplied on tape and reel for automated pick-and-place assembly. The specific reel size and packing quantity should be confirmed with the supplier. Ordering is done using the complete model number, which specifies all binned parameters: shape, chip count, lens, CCT, and luminous flux. Custom bin combinations outside the standard offering may be available upon request.

8. Application Suggestions and Design Considerations

8.1 Typical Application Scenarios

• Backlighting: Edge-lit or direct-lit panels for LCDs, signage, and displays.
• Decorative Lighting: Accent lighting, contour lighting, and mood lighting.
• General Illumination: Integrated into bulbs, tubes, and panels as an array.
• Indicator Lights: Status indicators on appliances and electronics.

8.2 Design Considerations

• Current Drive: Use a constant current driver, not a constant voltage source, for stable and consistent light output. The recommended operating current is 60mA.
• Thermal Management: Despite its low power, effective heat sinking is vital for maintaining luminous flux, color stability, and long lifetime. Ensure the PCB has adequate thermal vias and copper area connected to the LED's thermal pad (if applicable) or the cathode pads.
• Optical Design: The 110-degree viewing angle provides wide, diffuse illumination. For focused beams, secondary optics (lenses, reflectors) are required.
• Electrical Layout: Keep drive traces short and wide to minimize voltage drop. In arrays, consider connecting LEDs in series where possible to ensure identical current, or use parallel strings with individual current-limiting resistors, selecting LEDs from the same V_F bin for better current balance.

9. Technical Comparison and Differentiation

Compared to older packages like 3528, the 3020 offers a more compact footprint, potentially higher design density. Its single-chip, 0.2W design provides a good balance for applications needing more light than a typical 0.1W LED but where the thermal challenge of a 0.5W or 1W LED is prohibitive. The wide 110-degree beam angle is a key differentiator from narrower-angle LEDs, eliminating the need for diffusers in many applications and providing more uniform illumination.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 What is the difference between the typical and maximum forward voltage?

The typical V_F (3.2V) is the expected value for most units under test conditions. The maximum V_F (3.5V) is the upper limit guaranteed by the specification. Your driver circuit must be designed to supply the required current even if the LED's V_F is at the maximum value, especially when LEDs are connected in series.

10.2 Can I drive this LED at 80mA continuously?

While 80mA is the absolute maximum continuous current rating, operating at this limit will generate more heat, reduce luminous efficacy (lm/W), accelerate lumen depreciation, and potentially shorten the LED's lifespan. For optimal performance and reliability, the recommended operating current of 60mA should be used.

10.3 Why is baking necessary, and how do I know if my LEDs need it?

Baking removes absorbed moisture from the plastic package to prevent damage during the high-temperature reflow soldering process. Check the humidity indicator card inside the sealed moisture barrier bag immediately upon opening. If the card shows that the humidity exposure limit has been exceeded (e.g., the pink dot is darker than the reference), or if the bag has been open in a humid environment beyond the allowed floor life, baking is required.

10.4 How do I interpret the luminous flux bin code (e.g., D5)?

The flux code (D5) corresponds to a minimum luminous flux value at 60mA for a given CCT and CRI bin. For example, a Cool White (5000-7000K), CRI≥70 LED with code D5 has a minimum flux of 22 lumens and a typical maximum of 23 lumens. You should design your system based on the minimum value to ensure performance targets are met even with lower-binning units.

11. Practical Application Case Study

Scenario: Design of a Linear LED Light Bar. A designer is creating a 24V, 0.6-meter light bar using the 3020 LED. Targeting a specific illuminance, they calculate needing 60 LEDs. To power from 24V, they decide on 7 LEDs in series (7 * 3.2V_typ = 22.4V), leaving headroom for the current regulator. They would create 8 parallel strings of 7-series LEDs (56 total LEDs). To ensure even brightness, they specify all LEDs from the same CCT bin (e.g., 4000K Neutral White, bin 40M5) and a tight flux bin (e.g., D5). They also specify the same V_F bin (e.g., F bin: 3.2-3.3V) to improve current balance between the 8 parallel strings. The PCB is designed with a 2-oz copper layer and thermal vias under the LED pads connected to an aluminum substrate for heat dissipation. The assembly instructions mandate baking the reels if the factory floor humidity is high, followed by a controlled reflow process using the recommended profile.

12. Operating Principle Introduction

A white LED is fundamentally a semiconductor diode. When a forward voltage exceeding its bandgap energy is applied, electrons and holes recombine in the active region (the chip), releasing energy in the form of photons. This primary emission is typically in the blue or ultraviolet spectrum for GaN-based chips. To produce white light, a portion of this primary light is absorbed by a phosphor coating (cerium-doped yttrium aluminum garnet - YAG:Ce is common) deposited on or around the chip. The phosphor down-converts the high-energy blue/UV photons into a broad spectrum of lower-energy yellow light. The mixture of the remaining blue light from the chip and the converted yellow light from the phosphor appears white to the human eye. By adjusting the phosphor composition and thickness, different Correlated Color Temperatures (CCTs) from warm white to cool white can be achieved.

13. Technology Trends and Developments

The general trend in SMD LEDs like the 3020 is towards higher luminous efficacy (more lumens per watt), improved color rendering (higher CRI and R9 values for red rendition), and greater color consistency (tighter binning). There is also a focus on enhanced reliability and longevity under higher operating temperatures, driven by demands for more compact luminaires. Furthermore, the industry continues to develop more robust and moisture-resistant package materials to simplify handling and assembly processes. The push for "human-centric" lighting is leading to LEDs with tunable CCT and spectral optimization to support circadian rhythms. While this datasheet describes a standard white LED, the underlying package technology is a platform that can be adapted for these advancing performance characteristics.