Table of Contents
- 1. Product Overview
- 2. Technical Parameter Interpretation
- 2.1 Optical Characteristics
- 2.2 Electrical Characteristics
- 2.3 Thermal Characteristics
- 3. Binning System
- 4. Performance Curve Analysis
- 5. Mechanical and Packaging Information
- 6. Soldering and Assembly Guide
- 7. Packaging and Ordering Information
- 8. Application Recommendations
- 9. Technical Comparison
- 10. Frequently Asked Questions
- 11. Practical Application Case
- 12. Operating Principle
- 13. Development Trends
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
This blue LED features a compact PLCC-2 package with dimensions of 2.8mm x 3.5mm x 0.8mm. It is designed for surface mount technology (SMT) assembly and offers an extremely wide viewing angle of 120 degrees. The LED is based on InGaN (Indium Gallium Nitride) semiconductor technology and emits blue light with a typical dominant wavelength of 469nm. It is suitable for a variety of applications including optical indicators, indoor displays, landscape lighting, lamp belts, and general illumination. The device is RoHS compliant and has a moisture sensitivity level of 3. It is supplied in tape and reel packaging with 4000 units per reel.
2. Technical Parameter Interpretation
2.1 Optical Characteristics
The optical performance is specified at a test condition of IF=60mA and Ts=25°C. The dominant wavelength (Wld) is available in several bins: D10 (465.0-467.5nm), D20 (467.5-470.0nm), E10 (470.0-472.5nm), and E20 (472.5-475.0nm). The typical dominant wavelength is 469.1nm. Luminous flux (Φ) is binned as WGD (4.00-4.96 lm), WGE (5.00-6.00 lm), and WHA (6.00 lm and above, typical upper limit not specified but expected higher). The viewing angle (2Θ1/2) is 120 degrees, providing wide coverage.
2.2 Electrical Characteristics
Forward voltage (Vf) at 60mA ranges from 2.8V to 3.5V depending on the bin code. Bins include G1 (2.8-2.9V), G2 (2.9-3.0V), V (3.0-3.2V), I1 (3.2-3.3V), I2 (3.3-3.4V), and J1 (3.4-3.5V). The typical forward voltage is 3.2V. Reverse current (IR) at VR=5V is less than 10μA. Maximum ratings include power dissipation (Pd) of 228mW, forward current (IF) of 65mA, peak forward current (IFP) of 120mA (1/10 duty cycle, 0.1ms pulse width), reverse voltage (VR) of 5V, and ESD (HBM) of 2000V.
2.3 Thermal Characteristics
The thermal resistance from junction to solder point (Rth(j-s)) is 85°C/W. This parameter is critical for thermal management to ensure the junction temperature (Tj) does not exceed the maximum rating of 100°C. The operating temperature range is -40°C to +85°C, and storage temperature range is -40°C to +100°C. Proper heat sinking is required when operating at high currents.
3. Binning System
The LED is sorted into bins for forward voltage, dominant wavelength, and luminous flux. Voltage bins allow tight control of drive circuit design. Wavelength bins ensure color consistency for applications requiring uniform blue output. Luminous flux bins help select LEDs with specific brightness levels. The binning system is essential for manufacturers to match LEDs in arrays or backlighting systems.
4. Performance Curve Analysis
Typical optical electrical characteristics are provided in several curves. Figure 1 shows the forward voltage vs. forward current, indicating a non-linear relationship typical of LEDs. Figure 2 illustrates the relative intensity vs. forward current, showing increasing light output with current. Figures 3 and 4 show the effect of pin temperature on relative luminous flux and wavelength, respectively; as temperature rises, luminous flux decreases and wavelength shifts slightly (red shift). Figure 5 displays forward voltage vs. pin temperature, showing a negative temperature coefficient. Figure 6 shows the maximum forward current vs. pin temperature for safe operation. Figure 7 is the spectral distribution, peaking around 469nm with a full-width at half-maximum of approximately 25-30nm.
5. Mechanical and Packaging Information
The LED package has dimensions of 2.8mm (length) x 3.5mm (width) x 0.8mm (height). The polarity is marked on the package. The recommended soldering pattern is provided in the drawing to ensure proper thermal and mechanical connection. The cathode is typically smaller pad alongside the anode. All dimensions are in millimeters with a tolerance of ±0.2mm unless otherwise noted.
6. Soldering and Assembly Guide
For reflow soldering, the recommended profile includes: ramp-up rate ≤3°C/s, preheat from 150°C to 200°C for 60-120 seconds, time above 217°C (TL) of up to 60 seconds, peak temperature (Tp) of 260°C for up to 10 seconds, and cool-down rate ≤6°C/s. Total time from 25°C to peak temperature should not exceed 8 minutes. Reflow soldering should not be performed more than twice; if more than 24 hours pass between soldering processes, the LEDs may be damaged due to moisture absorption. For hand soldering, use a soldering iron at ≤300°C for less than 3 seconds per joint, and only once. Repair is discouraged; if necessary, use a double-head soldering iron. The encapsulation material is silicone, which is soft; avoid applying excessive pressure to the top surface. Do not mount on warped PCB or bend the board after soldering. Avoid rapid cooling and mechanical stress during cooling.
7. Packaging and Ordering Information
The LEDs are packaged in tape and reel format. The carrier tape dimensions are shown in the drawing, with the feed direction and polarity mark indicated. The reel dimensions are standard. Each reel contains 4000 pieces. The label includes part number, spec number, lot number, dominant wavelength (WLD), forward voltage (VF), quantity (QTY), date code (DATE), and bin code. The moisture-resistant packing process uses aluminum bags with desiccant. Storage conditions: before opening, store at ≤30°C and ≤75% RH for up to 1 year from delivery. After opening, store at ≤30°C and ≤60% RH for up to 24 hours. If moisture absorbent material has faded or storage time exceeded, bake at 60±5°C for >24 hours.
8. Application Recommendations
This blue LED is suitable for use in optical indicators, indoor display boards, landscape lighting, and decorative lamp belts. When designing the circuit, ensure that the forward current does not exceed the maximum rating (65mA continuous) and include current-limiting resistors to prevent thermal runaway. Thermal design is critical; the junction temperature must be kept below 100°C to maintain performance and reliability. Avoid exposure to sulfides (sulfur content in mating materials should be less than 100 ppm), halogens (bromine <900 ppm, chlorine <900 ppm, total <1500 ppm). Volatile organic compounds (VOCs) from fixtures can penetrate silicone and cause discoloration; verify material compatibility. For cleaning, use isopropyl alcohol; ultrasonic cleaning is not recommended as it may damage the LED. Handle LEDs by the sides using tweezers; avoid touching the silicone lens. ESD protection is required during handling and assembly.
9. Technical Comparison
Compared to other PLCC-2 blue LEDs on the market, this device offers a wide viewing angle of 120°, making it ideal for applications requiring broad illumination. The thermal resistance of 85°C/W is typical for this package size. The tight binning options for wavelength and luminous flux allow for consistent color and brightness matching. The maximum forward current of 65mA is competitive, and the ESD withstand capability of 2000V provides robust protection. The silicone encapsulation provides high light extraction efficiency but requires careful handling to avoid damage. Overall, this LED balances performance, reliability, and ease of assembly for general-purpose blue lighting.
10. Frequently Asked Questions
Q: What is the typical forward voltage at 60mA?
A: The typical forward voltage is 3.2V, but it can range from 2.8V to 3.5V depending on the bin.
Q: Can this LED be driven at higher current?
A: The absolute maximum forward current is 65mA. Operating above this may cause damage or reduce lifetime. Peak current of 120mA is allowed with a duty cycle of 1/10 and pulse width of 0.1ms.
Q: What is the shelf life?
A: Before opening the sealed package, the LEDs can be stored for up to 1 year at ≤30°C and ≤75% RH. After opening, use within 24 hours or bake before use.
Q: How should I clean the LED after soldering?
A: Use isopropyl alcohol. Do not use ultrasonic cleaning as it may damage the silicone package.
Q: Is this LED suitable for outdoor use?
A: Yes, within the operating temperature range of -40°C to +85°C. However, ensure adequate protection from moisture and UV, and verify compatibility with outdoor environments.
11. Practical Application Case
Consider an indoor display board requiring uniform blue backlighting. Using this LED with a dominant wavelength of 469nm and a viewing angle of 120°, a 2mm pitch matrix can be built. With careful binning selection (e.g., wavelength bin D20, flux bin WGE), the board achieves consistent color at high brightness. The LEDs are mounted using reflow soldering with a nitrogen atmosphere to prevent oxidation. Each LED is driven at 50mA to stay within safe limits, and the PCB incorporates copper planes for heat dissipation. The junction temperature is calculated to be 85°C under ambient 40°C, ensuring reliability over 50,000 hours of operation.
12. Operating Principle
The LED is a solid-state light source based on a p-n junction. In forward bias, electrons recombine with holes in the active region of the InGaN semiconductor, releasing energy in the form of photons. The energy bandgap of InGaN determines the wavelength of emitted light. For blue emission, the indium content is tuned to achieve a peak wavelength around 469nm. The PLCC-2 package uses a reflective cavity and silicone encapsulation to extract light efficiently while protecting the die.
13. Development Trends
Blue LEDs have evolved rapidly, with continuous improvements in luminous efficacy and reliability. Current trends include higher brightness per package, wider color gamut for displays, and lower thermal resistance. LED packages are shrinking, but power handling is increasing. The use of remote phosphors for white light generation remains common, driving demand for efficient blue LEDs. Future developments may focus on achieving higher wall-plug efficiency, improved color stability over temperature, and integration with smart lighting systems. This PLCC-2 blue LED represents a mainstream product with good performance for general and specialized applications.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |